THV6530_Rev.1.00_E THV6530 Boost converter / 2 channel charge pump Description Features THV6530 is a controller IC power supply system with boost converter and 2 channel charge pump circuit. The positive and negative charge pumps provide regulated TFT LCD gate-on and gate-off supplies. The chip includes a VCOM buffer. Soft start / Over current protection / Vout short circuit protection / Under voltage lock out protection / Thermal shut down are built in. Mounted area is reducible by 16-pin QFN. ・Input voltage range : 2.5V – 5.5V ・Boost converter Maximum output voltage : 16V Switching limit current : 1.4A Feedback voltage accuracy : +/-1% Switching frequency : 1.2MHz ・Positive charge pump Feedback voltage accuracy : +/-2% Switching frequency : 600kHz ・Negative charge pump Feedback voltage accuracy : +/-11% Switching frequency : 600kHz ・Buffer amplifier Output short-circuit current : +/-100mA ・Protection circuit Soft start Over current protection Under voltage lock out protection Thermal shut down ・3mm x 3mm QFN 16pin package Application ･Mobile phone display ・Car Navigator display ･Laptop/Netbook/Tablet PC display VGL_OUT VGH_OUT VGH_FB PC Block Diagram VGL_FB Pin Configuration 16 15 14 13 VLS VIN 1 FB 12 PC LX Boost FB PGND OSC VIN VCC UVLO VREF 2 11 VCC AVDD RST Exposed Thermal Pad AGND (Top view) 3 10 17 GNDEXP 4 9 VGH_OUT 1/2OSC EN LX VGH_FB VREF RST VGH Detector PGND OSC VREF OSC 1/2OSC VLS AVDD VGL_FB AMP_NON 8 VGL AVDD VGL_OUT AVDD 7 AMP_OUT 6 AMP_NON EN 5 AMP_OUT VCOM 1/2OSC AGND Copyright© 2013 THine Electronics, Inc. All rights reserved. 1/11 THine Electronics, Inc. THL6530_Rev.1.00_E Absolute Maximum Ratings Parameter Symbol VCC VH VL Pd Tj Tstg VCC voltage AVDD, LX voltage EN, RST voltage Power dissipation Junction temperature (*1) Storage temperature range Rating 6.5 22 6.5 1.47 125 -55 to +150 Units V V V W ℃ ℃ *1. The operating temperature range should perform a thermal design, after consulting the thermal characteristic. Please use it in the range which does not exceed junction temperature. Recommended Operating Conditions Parameter Min 2.5 6 VCC voltage AVDD voltage Typ - Max 5.5 16 Units V V Power Dissipation 1600 Power Dissipation [mW] 1400 1200 1000 800 600 400 200 0 -40 -20 0 20 40 60 80 100 120 140 Operating Temperature [℃] Copyright© 2013 THine Electronics, Inc. All rights reserved. 2/11 THine Electronics, Inc. THL6530_Rev.1.00_E Pin Description Number Name 1 VGL_OUT 2 VREF 3 4 5 AGND RST EN 6 AMP_NON 7 AMP_OUT 8 AVDD 9 PGND 10 LX 11 VCC 12 FB 13 PC 14 VGH_FB 15 VGH_OUT 16 VGL_FB 17 GND EXP Function Negative charge pump output pin Reference output voltage pin Analog ground pin Reset output pin Enable pin Operational amplifier non-inverting input pin Operational amplifier output pin Charge pump supply and operational amplifier supply pin Power ground pins Boost converter switching output pin Supply voltage pin Boost converter feedback voltage sense input pin Boost converter error amplifier output pin Positive charge pump feedback sense input pin Positive charge pump output pin Negative charge pump feedback sense input pin Back side Description This pin is output for negative charge pump. This pin is reference voltage for negative charge pump. Please connect capacitor to GND for stable voltage． Analog ground of PMIC Voltage detector output. RST is an open-drain output. If low level voltage is impressed, PMIC is shutdown. This pin is the non-inverting input of operational amplifier. This pin is output of operational amplifier. This pin is input supply for operational amplifier, positive charge pump. Power ground of boost converter. This pin is switching output of boost converter. Power supply pin. This pin is feedback input for boost converter. This pin is the boost converter error amplifier output. Please connect resistance and capacitor to GND for phase compensation. This pin is feedback input for positive charge pump. This pin is output for positive charge pump. This pin is feedback input for negative charge pump. GND EXP should be soldered to GND to improve the thermal characteristics. Copyright© 2013 THine Electronics, Inc. All rights reserved. 3/11 THine Electronics, Inc. THL6530_Rev.1.00_E Electrical Characteristics （at VCC＝3.3V , AVDD=8.5V , Ta=25℃, unless otherwise noted） Parameter Symbol Test Conditions Min Typ Max Units System supply Input quiescent Current 1 Icc1 Vfb=1.35V(No switching) - 0.3 - mA Input quiescent Current 2 Icc2 Vfb=1.15V(Switching) - 0.8 - mA Reference voltage Vref Iref=-50uA 1.176 1.200 1.224 V dVref1 Iref=0uA to -100uA - 1 5 mV - 2 5 mV 1.8 2.0 2.2 V - 0.1 - V Reference Load Regulation Line Regulation voltage Reference voltage dVref2 Iref=-100uA VCC=2.5V to 5.5V UVLO threshold voltage Vuvlo UVLO hysteresis voltage Vuvloh Short circuit delay time Tscp - 100 - msec Venh 2 - - V Venl - - 0.8 V Vfb 1.188 1.200 1.212 V Ifb -40 0 40 nA Fosc1 900 1200 1500 kHz Dmax 85 90 94 % EN threshold voltage VCC rising Boost converter FB voltage FB input bias current Boost converter switching frequency Boost converter maximum duty cycle LX ON-resistance Ron1 LX leakage current Ileak LX current limit Ilim Vlx=16V - 700 - mΩ - - 10 uA 1.4 1.8 2 A FB soft start Tss1 - 7 - msec FB short circuit voltage Vuvp1 - 0.95 - V 1.176 1.200 1.224 V -40 0 40 nA Positive charge pump Regulator FBP voltage Vfbp FBP input bias current Ifbp_bias FBP switching frequency Fosc2 FBP high-side ON-resistance Ron2h Vavdd=10V - 20 - Ω FBP low-side ON-resistance Ron2l Vavdd=10V - 20 - Ω 1/2xFosc1 kHz FBP soft start Tss2 - 5 - msec FBP short circuit voltage Vuvp2 - 0.95 - V 0.210 0.240 0.270 V -40 0 40 nA Negative charge pump Regulator FBN voltage Vfbn FBN input bias current Ifbn_bias FBN Switching frequency Fosc3 FBN high-side ON-resistance Ron3h Vavdd=10V - 20 - Ω FBN low-side ON-resistance Ron3l Vavdd=10V - 20 - Ω 1/2xFosc1 kHz FBN soft start Tss3 - 5 - msec FBN short circuit voltage Vuvp3 – 0.45 - V Copyright© 2013 THine Electronics, Inc. All rights reserved. 4/11 THine Electronics, Inc. THL6530_Rev.1.00_E Parameter Buffer amplifier Symbol AVDD quiescent Current Iavdd Input offset voltage Voff Input bias current Input common-mode voltage Test Conditions Vamp_non=1/2AVDD Iamp_non Vamp_non Vout_h Iamp_out=5mA Output low voltage Vout_l Iamp_out=-5mA SR Typ Max Vamp_out=20% to 80% CL=10pF, RL=10kΩ Units - 0.6 1.2 mA –15 0 15 mV -100 0 100 nA -0.3 Output high voltage Slew rate Min AVDD0.2 - - AVDD+ 0.3V - - - 0.2 8 12 - V V V V/ usec Short circuit high current Iamp_h Vamp_out=0V 100 150 - mA Short circuit low current Iamp_l Vamp_out=AVDD 100 150 - mA Reset Reset threshold voltage Vrst - 2.6 - V Reset hysteresis voltage Vrsth - 0.1 - V Reset output voltage Vrst_o - - 0.4 V - 120 - msec Reset output delay time Irst=1mA Trst Copyright© 2013 THine Electronics, Inc. All rights reserved. 5/11 THine Electronics, Inc. THL6530_Rev.1.00_E current through the inductor equals to the current Function computed by the compensator. This loop acts within one Boost converter switching cycle. A slope compensation ramp is added to The LCD panel VLS supply is generated from a suppress sub-harmonic oscillations. An outer voltage high-efficiency PWM boost converter operating with feedback loop subtracts the voltage on the FB pin from current mode control, and the switching frequency is the internal reference voltage and feeds the difference to 1.2MHz. During the on-period, TON, the synchronous the compensator operational transconductance amplifier. FET connects one end of the inductor to ground, This amplifier is compensated by an external R-C therefore increasing the inductor current. After the FET network to allow the user to optimize the transient turns off, the inductor switching node, LX, is charged to response and loop stability for the specific application a positive voltage by the inductor current. The conditions. freewheeling diode turns on and the inductor current The output voltage VLS can be set by external resistor flows to the output capacitor. divider R1 and R2 connected to FB. The converter operates in continuous conduction mode R VLS VFB 1 1 R2 when the load current IVLS is at least one-half of the inductor ripple current ΔIrip. I IN I rip I rip VLS 2 (VLS VIN ) VIN L FOSC VLS LX R1 FB The output voltage (VLS) is determined by the duty R2 cycle(D) of the power FET on-time and the input voltage, VIN. VLS VIN 1 D Fig. 1 FB setup The average load current, IVLS, can be calculated from [Compensator selection] the power conservation law. This current mode boost converter has a current sense V IN I IN VLS I VLS loop and a voltage feedback loop. The where η is the power conversion efficiency. For a lower loop does not need any load current, the inductor current would decay to zero feedback loop is during the free-wheeling period and the R-C network would be disconnected from the output node current sense compensation. The voltage compensated by an external series RPC and CPC from PC pin to ground. inductor for the RCOMP is set to define the high frequency integrator gain remaining portion of the switching period. The converter for loop bandwidth which relates to the transient would operate in the response. CPC is set to ensure the loop stability. discontinuous conduction mode . Current mode control is well known for its robustness and fast transient response. An inner current feedback [Output capacitor selection] loop sets the on-time and the duty cycle such that the The output voltage ripple due to converter switching is Copyright© 2013 THine Electronics, Inc. All rights reserved. 6/11 THine Electronics, Inc. THL6530_Rev.1.00_E determined by the output capacitor total capacitance, of the capacitors. The ripple current COUT, and the output VLS rip the largest possible while at the same time not degrading D I OUT I peak ESR FOSC C OUT I peak I IN ΔIrip is then chosen the maximum input and output current that the converter can operate with before reaching the current limit of the I rip chip or the rated current of the inductor. 2 I peak I IN The first ripple component can be reduced by increasing COUT since FOSC is fixed 1.2MHz(typ). Changing COUT I rip 2 I MAX For example, ΔIrip could be set to 20% of IMAX may require adjustment of compensation R and C in order to provide adequate phase margin and loop Voltage detector circuit bandwidth. The internal voltage detector circuit monitors the chip ut The second ripple component can be reduced by voltage VIN. The chip can either drive RST pin low or selecting low-ESR ceramic capacitors and using several leave it floating. While floating, RST is pulled high by smaller capacitors in parallel instead of just one large an external pull up resistor. When VIN drops below 2.6V capacitor. the chip pulls RST pin low. In order to release RST the VIN voltage must rise above 2.7V. The voltage detector circuit is disabled and RST is floating while the chip is [Inductor selection] disabled and for 120ms from the time the chip is enabled To prevent magnetic saturation of the inductor core the (VIN>UVLO and EN is high). inductor has to be rated for a maximum current larger than IPK in a given application. Since the chip provides current limit protection of 1.8A, it is generally Positive charge pump (VGH) recommended that the inductor be rated at least for 1.8A. The positive charge pump is used to generate the TFT Selection of the inductor requires trade-off between the LCD gate on voltage. The output voltage, VGH, can be physical size (footprint x height) and its electrical set by an external resistive divider. properties (current rating, inductance, resistance). Within Voltage VVGH_FB is typically 1.2V. A single stage charge a given footprint and height, an inductor with larger pump can produce an output voltage less than inductance typically comes with lower current rating and approximately twice the charge pump input voltage VLS. often larger series resistance. Larger inductance typically The output voltage VGH is regulated as the following requires more turns on the winding, a smaller core gap or equation. a core material with a larger relative permeability. An VGH VVGH _ FB inductor with a larger physical size has better electrical properties than a smaller inductor. R5 R6 R5 It is desirable to reduce the ripple current ΔIrip in order to reduce voltage noise on the input and output capacitors. In practice, the inductor is often much larger than the capacitors and it is easier and cheaper to increase the size Copyright© 2013 THine Electronics, Inc. All rights reserved. 7/11 THine Electronics, Inc. THL6530_Rev.1.00_E VLS VCOM buffer The VCOM buffer generates the bias supply for the back plane of an LCD screen which is capacitively coupled to VGH_OUT the pixel drive voltage. The purpose of the VCOM buffer VGH is to hold the bias voltage steady while pixel voltage changes dynamically. The buffer is designed to sustain R6 up to ±75mA of output current. In transients, it can VGH_FB deliver up to 150mA at which point the over current R5 protection circuit limits the output current. Excessive Fig. 2 current draw over a period of time may cause the chip VGH setup temperature to rise and set off the over temperature protection circuit. Negative charge pump (VGL) The negative charge pump is used to generate the TFT LCD gate off voltage. The output voltage, VGL, is set Protection circuits with an external resistive divider from its output to Under voltage lock out protection (UVLO) VREF with the midpoint connected to VGL_FB. The The UVLO function is carried in order to prevent error amplifier compares the feedback signal from malfunction in the state where input voltage is low. A VGL_FB with an internal reference 240mV. The output boost converter is suspended to the power supply voltage voltage VGL is regulated as the following equation. The which can carry out operational stability. UVLO is output voltage VGL is regulated as the following released by more than 1.8V input voltage. And a boost equation. VREF is 1.2V. converter carries out, after starting soft start operation. VGL VVGL _ FB R8 (VVREF VVGL _ FB ) R7 During normal operation (after completing the soft start sequence) THV6530 constantly monitors feedback pins VGL FB, VGH_FB and VGL_FB. A fault condition occurs if FB falls below 0.95V or VGH_FB falls below 0.95V or VGL_FB rises above 0.45V. If any of the fault VGL_OUT conditions persist for longer than 100ms, the chip sets a R8 VGL_FB fault latch and shuts down. To turn the power supplies back on requires cycling of VIN supply below the UVLO R7 level or toggling the EN pin low and high. This will clear VREF the fault latch and restore normal operation. Fig. 3 VGL setup Copyright© 2013 THine Electronics, Inc. All rights reserved. 8/11 THine Electronics, Inc. THL6530_Rev.1.00_E Soft start (SS) The boost converter carries the soft start function in order to prevent the rush current at a start-up. This function is to raise output voltage slowly. It is because overshooting and rush current occur when input voltage is inputted. The soft-start time of the boost controller is 7ms, and the soft-start time of positive and negative charge pump is 5ms. Over current protection (OCP) In order to restrict the over-current by the abnormalities of load, etc., the over-current protection circuit is built in. Over-current detection of pulse-by-pulse system is adopted. An output transistor is turned off if the current which flows into an output transistor reaches boost converter limit current (Ilim). An over-current protection circuit detects the peak current of an inductor. Input-and-output voltage and ripple current is taken into consideration. Thermal shut down (TSD) In order to prevent destruction by heat, the thermal shutdown circuit is built in. If the junction temperature Tj is 125oC or more, the thermal shutdown circuit will operate and it will stop switching operation. Moreover, the hysteresis of a thermal shutdown circuit is 15oC. If Tj falls, output voltage will return. Copyright© 2013 THine Electronics, Inc. All rights reserved. 9/11 THine Electronics, Inc. THL6530_Rev.1.00_E Package Dimensions QFN 16-pin Recommend connecting Back Exposed Pad with GND for a thermal characteristic improvement. Copyright© 2013 THine Electronics, Inc. All rights reserved. 10/11 THine Electronics, Inc. THL6530_Rev.1.00_E Notices and Requests 1. The product specifications described in this material are subject to change without prior notice. 2. The circuit diagrams described in this material are examples of the application which may not always apply to the customer’s design. We are not responsible for possible errors and omissions in this material. Please note if errors or omissions should be found in this material, we may not be able to correct them immediately. 3. This material contains our copyright, know-how or other proprietary. Copying or disclosing to third parties the contents of this material without our prior permission is prohibited. 4. Note that if infringement of any third party's industrial ownership should occur by using this product, we will be exempted from the responsibility unless it directly relates to the production process or functions of the product. 5. This product is presumed to be used for general electric equipment, not for the applications which require very high reliability (including medical equipment directly concerning people's life, aerospace equipment, or nuclear control equipment). Also, when using this product for the equipment concerned with the control and safety of the transportation means, the traffic signal equipment, or various Types of safety equipment, please do it after applying appropriate measures to the product. 6. Despite our utmost efforts to improve the quality and reliability of the product, faults will occur with a certain small probability, which is inevitable to a semi-conductor product. Therefore, you are encouraged to have sufficiently redundant or error preventive design applied to the use of the product so as not to have our product cause any social or public damage. 7. Please note that this product is not designed to be radiation-proof. 8. Customers are asked, if required, to judge by themselves if this product falls under the category of strategic goods under the Foreign Exchange and Foreign Trade Control Law. 9. The product or peripheral parts may be damaged by a surge in voltage over the absolute maximum ratings or malfunction, if pins of the product are shorted by such as foreign substance. The damageｓ may cause a smoking and ignition. Therefore, you are encouraged to implement safety measures by adding protection devices, such as fuses. THine Electronics, Inc. [email protected] Copyright© 2013 THine Electronics, Inc. All rights reserved. 11/11 THine Electronics, Inc.