Datasheet

THV6530_Rev.1.00_E
THV6530
Boost converter / 2 channel charge pump
Description
Features
THV6530 is a controller IC power supply system with
boost converter and 2 channel charge pump circuit.
The positive and negative charge pumps provide
regulated TFT LCD gate-on and gate-off supplies. The
chip includes a VCOM buffer.
Soft start / Over current protection / Vout short circuit
protection / Under voltage lock out protection / Thermal
shut down are built in.
Mounted area is reducible by 16-pin QFN.
・Input voltage range : 2.5V – 5.5V
・Boost converter
Maximum output voltage : 16V
Switching limit current : 1.4A
Feedback voltage accuracy : +/-1%
Switching frequency : 1.2MHz
・Positive charge pump
Feedback voltage accuracy : +/-2%
Switching frequency : 600kHz
・Negative charge pump
Feedback voltage accuracy : +/-11%
Switching frequency : 600kHz
・Buffer amplifier
Output short-circuit current : +/-100mA
・Protection circuit
Soft start
Over current protection
Under voltage lock out protection
Thermal shut down
・3mm x 3mm QFN 16pin package
Application
・Mobile phone display
・Car Navigator display
・Laptop/Netbook/Tablet PC display
VGL_OUT
VGH_OUT
VGH_FB
PC
Block Diagram
VGL_FB
Pin Configuration
16
15
14
13
VLS
VIN
1
FB
12
PC
LX
Boost
FB
PGND
OSC
VIN
VCC
UVLO
VREF
2
11
VCC
AVDD
RST
Exposed Thermal Pad
AGND
(Top view)
3
10
17 GNDEXP
4
9
VGH_OUT
1/2OSC
EN
LX
VGH_FB
VREF
RST
VGH
Detector
PGND
OSC
VREF
OSC
1/2OSC
VLS
AVDD
VGL_FB
AMP_NON
8
VGL
AVDD
VGL_OUT
AVDD
7
AMP_OUT
6
AMP_NON
EN
5
AMP_OUT
VCOM
1/2OSC
AGND
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THL6530_Rev.1.00_E
Absolute Maximum Ratings
Parameter
Symbol
VCC
VH
VL
Pd
Tj
Tstg
VCC voltage
AVDD, LX voltage
EN, RST voltage
Power dissipation
Junction temperature (*1)
Storage temperature range
Rating
6.5
22
6.5
1.47
125
-55 to +150
Units
V
V
V
W
℃
℃
*1. The operating temperature range should perform a thermal design, after consulting the thermal characteristic. Please use it in the range which
does not exceed junction temperature.
Recommended Operating Conditions
Parameter
Min
2.5
6
VCC voltage
AVDD voltage
Typ
-
Max
5.5
16
Units
V
V
Power Dissipation
1600
Power Dissipation [mW]
1400
1200
1000
800
600
400
200
0
-40
-20
0
20
40
60
80
100
120
140
Operating Temperature [℃]
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THL6530_Rev.1.00_E
Pin Description
Number
Name
1
VGL_OUT
2
VREF
3
4
5
AGND
RST
EN
6
AMP_NON
7
AMP_OUT
8
AVDD
9
PGND
10
LX
11
VCC
12
FB
13
PC
14
VGH_FB
15
VGH_OUT
16
VGL_FB
17
GND EXP
Function
Negative charge pump
output pin
Reference output voltage
pin
Analog ground pin
Reset output pin
Enable pin
Operational amplifier
non-inverting input pin
Operational amplifier
output pin
Charge pump supply and
operational amplifier
supply pin
Power ground pins
Boost converter switching
output pin
Supply voltage pin
Boost converter feedback
voltage sense input pin
Boost converter error
amplifier output pin
Positive charge pump
feedback sense input pin
Positive charge pump
output pin
Negative charge pump
feedback sense input pin
Back side
Description
This pin is output for negative charge pump.
This pin is reference voltage for negative charge pump.
Please connect capacitor to GND for stable voltage.
Analog ground of PMIC
Voltage detector output. RST is an open-drain output.
If low level voltage is impressed, PMIC is shutdown.
This pin is the non-inverting input of operational amplifier.
This pin is output of operational amplifier.
This pin is input supply for operational amplifier, positive
charge pump.
Power ground of boost converter.
This pin is switching output of boost converter.
Power supply pin.
This pin is feedback input for boost converter.
This pin is the boost converter error amplifier output.
Please connect resistance and capacitor to GND for phase
compensation.
This pin is feedback input for positive charge pump.
This pin is output for positive charge pump.
This pin is feedback input for negative charge pump.
GND EXP should be soldered to GND to improve the
thermal characteristics.
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THL6530_Rev.1.00_E
Electrical Characteristics
(at VCC=3.3V , AVDD=8.5V , Ta=25℃, unless otherwise noted)
Parameter
Symbol
Test Conditions
Min
Typ
Max
Units
System supply
Input quiescent Current 1
Icc1
Vfb=1.35V(No switching)
-
0.3
-
mA
Input quiescent Current 2
Icc2
Vfb=1.15V(Switching)
-
0.8
-
mA
Reference voltage
Vref
Iref=-50uA
1.176
1.200
1.224
V
dVref1
Iref=0uA to -100uA
-
1
5
mV
-
2
5
mV
1.8
2.0
2.2
V
-
0.1
-
V
Reference
Load
Regulation
Line
Regulation
voltage
Reference
voltage
dVref2
Iref=-100uA
VCC=2.5V to 5.5V
UVLO threshold voltage
Vuvlo
UVLO hysteresis voltage
Vuvloh
Short circuit delay time
Tscp
-
100
-
msec
Venh
2
-
-
V
Venl
-
-
0.8
V
Vfb
1.188
1.200
1.212
V
Ifb
-40
0
40
nA
Fosc1
900
1200
1500
kHz
Dmax
85
90
94
%
EN threshold voltage
VCC rising
Boost converter
FB voltage
FB input bias current
Boost
converter
switching
frequency
Boost converter maximum duty
cycle
LX ON-resistance
Ron1
LX leakage current
Ileak
LX current limit
Ilim
Vlx=16V
-
700
-
mΩ
-
-
10
uA
1.4
1.8
2
A
FB soft start
Tss1
-
7
-
msec
FB short circuit voltage
Vuvp1
-
0.95
-
V
1.176
1.200
1.224
V
-40
0
40
nA
Positive charge pump Regulator
FBP voltage
Vfbp
FBP input bias current
Ifbp_bias
FBP switching frequency
Fosc2
FBP high-side ON-resistance
Ron2h
Vavdd=10V
-
20
-
Ω
FBP low-side ON-resistance
Ron2l
Vavdd=10V
-
20
-
Ω
1/2xFosc1
kHz
FBP soft start
Tss2
-
5
-
msec
FBP short circuit voltage
Vuvp2
-
0.95
-
V
0.210
0.240
0.270
V
-40
0
40
nA
Negative charge pump Regulator
FBN voltage
Vfbn
FBN input bias current
Ifbn_bias
FBN Switching frequency
Fosc3
FBN high-side ON-resistance
Ron3h
Vavdd=10V
-
20
-
Ω
FBN low-side ON-resistance
Ron3l
Vavdd=10V
-
20
-
Ω
1/2xFosc1
kHz
FBN soft start
Tss3
-
5
-
msec
FBN short circuit voltage
Vuvp3
–
0.45
-
V
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THL6530_Rev.1.00_E
Parameter
Buffer amplifier
Symbol
AVDD quiescent Current
Iavdd
Input offset voltage
Voff
Input bias current
Input common-mode voltage
Test Conditions
Vamp_non=1/2AVDD
Iamp_non
Vamp_non
Vout_h
Iamp_out=5mA
Output low voltage
Vout_l
Iamp_out=-5mA
SR
Typ
Max
Vamp_out=20% to 80%
CL=10pF, RL=10kΩ
Units
-
0.6
1.2
mA
–15
0
15
mV
-100
0
100
nA
-0.3
Output high voltage
Slew rate
Min
AVDD0.2
-
-
AVDD+
0.3V
-
-
-
0.2
8
12
-
V
V
V
V/
usec
Short circuit high current
Iamp_h
Vamp_out=0V
100
150
-
mA
Short circuit low current
Iamp_l
Vamp_out=AVDD
100
150
-
mA
Reset
Reset threshold voltage
Vrst
-
2.6
-
V
Reset hysteresis voltage
Vrsth
-
0.1
-
V
Reset output voltage
Vrst_o
-
-
0.4
V
-
120
-
msec
Reset output delay time
Irst=1mA
Trst
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THL6530_Rev.1.00_E
current through the inductor equals to the current
Function
computed by the compensator. This loop acts within one
Boost converter
switching cycle. A slope compensation ramp is added to
The LCD panel VLS supply is generated from a
suppress sub-harmonic oscillations. An outer voltage
high-efficiency PWM boost converter operating with
feedback loop subtracts the voltage on the FB pin from
current mode control, and the switching frequency is
the internal reference voltage and feeds the difference to
1.2MHz. During the on-period, TON, the synchronous
the compensator operational transconductance amplifier.
FET connects one end of the inductor to ground,
This amplifier is compensated by an external R-C
therefore increasing the inductor current. After the FET
network to allow the user to optimize the transient
turns off, the inductor switching node, LX, is charged to
response and loop stability for the specific application
a positive voltage by the inductor current. The
conditions.
freewheeling diode turns on and the inductor current
The output voltage VLS can be set by external resistor
flows to the output capacitor.
divider R1 and R2 connected to FB.
The converter operates in continuous conduction mode
 R 
VLS  VFB  1  1 
 R2 
when the load current IVLS is at least one-half of the
inductor ripple current ΔIrip.
I IN 
I rip
I rip
VLS
2
(VLS  VIN )  VIN

L  FOSC  VLS
LX
R1
FB
The output voltage (VLS) is determined by the duty
R2
cycle(D) of the power FET on-time and the input
voltage, VIN.
VLS 
VIN
1 D
Fig. 1
FB setup
The average load current, IVLS, can be calculated from
[Compensator selection]
the power conservation law.
This current mode boost converter has a current sense
  V IN I IN  VLS  I VLS
loop and a voltage feedback loop. The
where η is the power conversion efficiency. For a lower
loop does not need any
load current, the inductor current would decay to zero
feedback loop is
during the free-wheeling period and the
R-C network
would be disconnected
from the
output node
current sense
compensation. The voltage
compensated by an external series
RPC and CPC from PC pin to ground.
inductor for the
RCOMP is set to define the high frequency integrator gain
remaining portion of the switching period. The converter
for loop bandwidth which relates to the transient
would operate in the
response. CPC is set to ensure the loop stability.
discontinuous conduction mode .
Current mode control is well known for its robustness
and fast transient response. An inner current feedback
[Output capacitor selection]
loop sets the on-time and the duty cycle such that the
The output voltage ripple due to converter switching is
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THL6530_Rev.1.00_E
determined by the output capacitor
total capacitance,
of the capacitors. The ripple current
COUT, and the output
VLS rip 
the largest possible while at the same time not degrading
D  I OUT
 I peak  ESR
FOSC  C OUT
I peak  I IN 
ΔIrip is then chosen
the maximum input and output current that the converter
can operate with before reaching the current limit of the
I rip
chip or the rated current of the inductor.
2
I peak  I IN 
The first ripple component can be reduced by increasing
COUT since FOSC is fixed 1.2MHz(typ). Changing COUT
I rip
2
 I MAX
For example, ΔIrip could be set to 20% of IMAX
may require adjustment of compensation R and C in
order to provide adequate phase margin and loop
Voltage detector circuit
bandwidth.
The internal voltage detector circuit monitors the chip ut
The second ripple component can be reduced by
voltage VIN. The chip can either drive RST pin low or
selecting low-ESR ceramic capacitors and using several
leave it floating. While floating, RST is pulled high by
smaller capacitors in parallel instead of just one large
an external pull up resistor. When VIN drops below 2.6V
capacitor.
the chip pulls RST pin low. In order to release RST the
VIN voltage must rise above 2.7V. The voltage detector
circuit is disabled and RST is floating while the chip is
[Inductor selection]
disabled and for 120ms from the time the chip is enabled
To prevent magnetic saturation of the inductor core the
(VIN>UVLO and EN is high).
inductor has to be rated for a maximum current larger
than IPK in a given application. Since the chip provides
current limit protection of 1.8A, it is generally
Positive charge pump (VGH)
recommended that the inductor be rated at least for 1.8A.
The positive charge pump is used to generate the TFT
Selection of the inductor requires trade-off between the
LCD gate on voltage. The output voltage, VGH, can be
physical size (footprint x height) and its electrical
set by an external resistive divider.
properties (current rating, inductance, resistance). Within
Voltage VVGH_FB is typically 1.2V. A single stage charge
a given footprint and height, an inductor with larger
pump can produce an output voltage less than
inductance typically comes with lower current rating and
approximately twice the charge pump input voltage VLS.
often larger series resistance. Larger inductance typically
The output voltage VGH is regulated as the following
requires more turns on the winding, a smaller core gap or
equation.
a core material with a larger relative permeability. An
VGH  VVGH _ FB 
inductor with a larger physical size has better electrical
properties than a smaller inductor.
R5  R6
R5
It is desirable to reduce the ripple current ΔIrip in order to
reduce voltage noise on the input and output capacitors.
In practice, the inductor is often much larger than the
capacitors and it is easier and cheaper to increase the size
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THL6530_Rev.1.00_E
VLS
VCOM buffer
The VCOM buffer generates the bias supply for the back
plane of an LCD screen which is capacitively coupled to
VGH_OUT
the pixel drive voltage. The purpose of the VCOM buffer
VGH
is to hold the bias voltage steady while pixel voltage
changes dynamically. The buffer is designed to sustain
R6
up to ±75mA of output current. In transients, it can
VGH_FB
deliver up to 150mA at which point the over current
R5
protection circuit limits the output current. Excessive
Fig. 2
current draw over a period of time may cause the chip
VGH setup
temperature to rise and set off the over temperature
protection circuit.
Negative charge pump (VGL)
The negative charge pump is used to generate the TFT
LCD gate off voltage. The output voltage, VGL, is set
Protection circuits
with an external resistive divider from its output to
Under voltage lock out protection (UVLO)
VREF with the midpoint connected to VGL_FB. The
The UVLO function is carried in order to prevent
error amplifier compares the feedback signal from
malfunction in the state where input voltage is low. A
VGL_FB with an internal reference 240mV. The output
boost converter is suspended to the power supply voltage
voltage VGL is regulated as the following equation. The
which can carry out operational stability. UVLO is
output voltage VGL is regulated as the following
released by more than 1.8V input voltage. And a boost
equation. VREF is 1.2V.
converter carries out, after starting soft start operation.
VGL  VVGL _ FB 
R8
(VVREF  VVGL _ FB )
R7
During normal operation (after completing the soft start
sequence) THV6530 constantly monitors feedback pins
VGL
FB, VGH_FB and VGL_FB. A fault condition occurs if
FB falls below 0.95V or VGH_FB falls below 0.95V or
VGL_FB rises above 0.45V. If any of the fault
VGL_OUT
conditions persist for longer than 100ms, the chip sets a
R8
VGL_FB
fault latch and shuts down. To turn the power supplies
back on requires cycling of VIN supply below the UVLO
R7
level or toggling the EN pin low and high. This will clear
VREF
the fault latch and restore normal operation.
Fig. 3
VGL setup
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THL6530_Rev.1.00_E
Soft start (SS)
The boost converter carries the soft start function in
order to prevent the rush current at a start-up. This
function is to raise output voltage slowly. It is because
overshooting and rush current occur when input voltage
is inputted.
The soft-start time of the boost controller is 7ms, and the
soft-start time of positive and negative charge pump is
5ms.
Over current protection (OCP)
In order to restrict the over-current by the abnormalities
of load, etc., the over-current protection circuit is built in.
Over-current detection of pulse-by-pulse system is
adopted. An output transistor is turned off if the current
which flows into an output transistor reaches boost
converter limit current (Ilim). An over-current protection
circuit detects the peak current of an inductor.
Input-and-output voltage and ripple current is taken into
consideration.
Thermal shut down (TSD)
In order to prevent destruction by heat, the thermal
shutdown circuit is built in. If the junction temperature
Tj is 125oC or more, the thermal shutdown circuit will
operate and it will stop switching operation. Moreover,
the hysteresis of a thermal shutdown circuit is 15oC. If Tj
falls, output voltage will return.
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THL6530_Rev.1.00_E
Package Dimensions
QFN 16-pin
Recommend connecting Back Exposed Pad with GND for a thermal characteristic improvement.
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THL6530_Rev.1.00_E
Notices and Requests
1. The product specifications described in this material are subject to change without prior notice.
2. The circuit diagrams described in this material are examples of the application which may not always apply to the
customer’s design. We are not responsible for possible errors and omissions in this material. Please note if errors or
omissions should be found in this material, we may not be able to correct them immediately.
3. This material contains our copyright, know-how or other proprietary. Copying or disclosing to third parties the
contents of this material without our prior permission is prohibited.
4. Note that if infringement of any third party's industrial ownership should occur by using this product, we will be
exempted from the responsibility unless it directly relates to the production process or functions of the product.
5. This product is presumed to be used for general electric equipment, not for the applications which require very high
reliability (including medical equipment directly concerning people's life, aerospace equipment, or nuclear control
equipment). Also, when using this product for the equipment concerned with the control and safety of the
transportation means, the traffic signal equipment, or various Types of safety equipment, please do it after applying
appropriate measures to the product.
6. Despite our utmost efforts to improve the quality and reliability of the product, faults will occur with a certain small
probability, which is inevitable to a semi-conductor product. Therefore, you are encouraged to have sufficiently
redundant or error preventive design applied to the use of the product so as not to have our product cause any social
or public damage.
7. Please note that this product is not designed to be radiation-proof.
8. Customers are asked, if required, to judge by themselves if this product falls under the category of strategic goods
under the Foreign Exchange and Foreign Trade Control Law.
9. The product or peripheral parts may be damaged by a surge in voltage over the absolute maximum ratings or
malfunction, if pins of the product are shorted by such as foreign substance. The damages may cause a smoking
and ignition. Therefore, you are encouraged to implement safety measures by adding protection devices, such as
fuses.
THine Electronics, Inc.
sales@thine.co.jp
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