THC63LVDF84B

THC63LVDF84B_Rev.5.01_E
THC63LVDF84B
24bit COLOR LVDS RECEIVER (Falling Edge Clock)
General Description
Features
The THC63LVDF84B receiver supports wide VCC range as
2.5 to 3.6V. At single 2.5V supply, the THC63LVDF84B
reduces EMI and power consumption.
The THC63LVDF84B converts the four LVDS data streams
back into 24bits of LVCMOS/LVTTL data with falling edge
clock. At a transmit clock frequency of 85MHz, 24bits of
RGB data and 4bits of timing and control data (HSYNC,
VSYNC, DE, CNTL1, CNTL2) are transmitted at an effective
rate of 2.38Gbps.
･1:7 LVDS to LVCMOS De-Serializer
･Operating Temperature Range : -10 to +70C
･No Special Start-up Sequence Required
･Spread Spectrum Clocking Tolerant up to 100kHz Frequency
Modulation and +/-2.5% Deviations.
･Dot Clock Range: 15 to 85MHz Suited for VGA, SVGA,
XGA, WXGA, 720p and 1080i.
･56pin TSSOP Package
･PLL requires no external components.
･Power Down Mode.
Application
･Falling Edge Clock
･EU RoHS Compliant.
･Medium and Small Size Panel
･Tablet PC / Notebook PC
･Security Camera / Industrial Camera
･Multi Function Printer
･Industrial Equipment
･Medical Equipment Monitor
Block Diagram
Figure 1. Block Diagram
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THC63LVDF84B_Rev.5.01_E
Pin Diagram
Figure 2. Pin Diagram
Pin Description
Pin Name
RA+, RARB+, RBRC+, RCRD+, RDRCLK+,
RCLKRA0 ~ RA6
RB0 ~ RB6
RC0 ~ RC6
RD0 ~ RD6
CLKOUT
Pin #
10, 9
12, 11
16, 15
20, 19
18, 17
Direction
Type
Input
LVDS
27, 29, 30, 32, 33, 35, 37
38, 39, 43, 45, 46, 47, 51
53, 54, 55, 1, 3, 5, 6
7, 34, 41, 42, 49, 50, 2
26
Output
/PDWN
25
Input
VCC
31, 40, 48, 56
GND
LVDS VCC
LVDS GND
PLL VCC
PLL GND
4, 28, 36, 44, 52
13
8, 14, 21
23
22, 24
Description
LVDS Data Inputs
LVDS Clock Inputs
Pixel Data Outputs
LVCOMS
/ TTL
Power
-
Pixel Clock Output
H : Normal Operation
L : Power Down (all outputs are pulled to ground)
Power Supply Pins for TTL outputs and digital
circuitry
Ground Pins for TTL outputs and digital circuitry.
Power Supply Pins for LVDS inputs.
Ground Pins for LVDS inputs.
Power Supply Pins for PLL circuitry.
Ground Pins for PLL circuitry.
Table 1. Pin Description
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THC63LVDF84B_Rev.5.01_E
Absolute Maximum Ratings
Parameter
Supply Voltage (VCC)
LVCMOS/TTL Input Voltage
LVCMOS/TTL Output Voltage
LVDS Input Pin
Junction Temperature
Storage Temperature
Reflow Peak Temperature
Reflow Peak Temperature Time
Maximum Power Dissipation @+25C
Min
-0.3
-0.3
-0.3
-0.3
-55
-
Max
+4.0
VCC + 0.3
VCC + 0.3
VCC + 0.3
+125
+150
+260
10
1.9
Unit
V
V
V
V
C
C
C
sec
W
Table 2. Absolute Maximum Ratings
Recommended Operating Conditions
Symbol
Ta
-
Parameter
All Supply Voltage
Operating Ambient Temperature
VCC = 2.5V to 2.7V
Clock Frequency
VCC = 2.7V to 3.0V
VCC = 3.0V to 3.6V
Min
2.5
-10
20
15
15
Typ
+25
-
Max
3.6
+70
70
70
85
Unit
V
C
MHz
MHz
MHz
Table 3. Recommended Operating Conditions
“Absolute Maximum Ratings” are those values beyond which the safety of the device can not be guaranteed.
They are not meant to imply that the device should be operated at these limits. The tables of “Electrical
Characteristics Table4, 5, 6, 7” specify conditions for device operation.
“Absolute Maximum Rating” value also includes behavior of overshooting and undershooting.
Equivalent LVDS Input Schematic Diagram
LVDS_InP
AMP
LVDS_InN
Figure 3. LVDS Input Schematic Diagram
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THC63LVDF84B_Rev.5.01_E
Power Consumption
Over recommended operating supply and temperature range unless otherwise specified
Parameter
Conditions
Typ*
Max
Unit
Symbol
RL=100, CL=8pF, f=65MHz, VCC=3.3V
41
53
mA
RL=100, CL=8pF, f=85MHz, VCC=3.3V
52
64
mA
RL=100, CL=8pF, f=65MHz, VCC=2.5V
30
42
mA
LVDS Receiver
RL=100, CL=8pF, f=65MHz, VCC=3.3V
Operating Current
IRCCW
RL=100, CL=8pF, f=85MHz, VCC=3.3V
Worst Case Pattern
(Fig.5)
RL=100, CL=8pF, f=65MHz, VCC=2.5V
LVDS Receiver
IRCCS
/PDWN=L
Power Down Current
*Typ values are at the conditions of Ta = +25ºC
Table 4. Power Consumption
72
94
mA
84
96
mA
42
64
mA
-
10
µA
IRCCG
LVDS Receiver
Operating Current
Gray Scale Pattern 16
(Fig.4)
16 Grayscale Pattern
CLKIN
f
TA0, TB1, TC2
f/16
TA1, TB2, TC3
f/8
TA2, TB3, TC4
f/4
TA3, TB4, TC5
f/2
TA4-6, TB0,5,6
TC0,1,6, TD0-2
Steady State Low
TD3-6
Steady State High
Figure 4. 16 Grayscale Pattern
Worst Case Pattern
CLKIN
Tx0-6
x=A,B,C,D
Figure 5. Worst Case Pattern
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THC63LVDF84B_Rev.5.01_E
Electrical Characteristics
LVCMOS/TTL DC Specifications
Symbol
VIH
VIL
VOH1
VOL1
VOH2
VOL2
IIN
Over recommended operating supply and temperature range unless otherwise specified
Parameter
Conditions
Min
Typ*
Max
Unit
High Level Input Voltage
2.0
VCC
V
Low Level Input Voltage
GND
0.8
V
VCC = 3.0V to 3.6V
High Level Output Voltage
2.4
V
IOH = -4mA
VCC = 3.0V to 3.6V
Low Level Output Voltage
0.4
V
IOL = 4mA
VCC = 2.5V to 3.0V
High Level Output Voltage
2.1
V
IOH = -2mA
VCC = 2.5V to 3.0V
Low Level Output Voltage
0.4
V
IOL = 2mA
Input Current
GND  VIN  VCC
10
A
Table 5. LV-CMOS/TTL DC Specifications
LVDS Receiver DC Specifications
Symbol
VTH
VTL
IIN
Over recommended operating supply and temperature range unless otherwise specified
Parameter
Conditions
Min
Typ*
Max
Unit
Differential Input High Threshold
100
mV
RL=100Ω,
VIC=+1.2V
Differential Input Low Threshold
-100
mV
VIN = +2.4 / 0V
Input Current
10
A
VCC = 3.6V
Table 6. LVDS Transmitter DC Specifications
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THC63LVDF84B_Rev.5.01_E
LVCMOS/TTL & LVDS Receiver AC Specifications
Over recommended operating supply and temperature range unless otherwise specified
Parameter
Min
Typ
Max
Unit
VCC = 2.5V to 2.7V
14.3
T
50.0
CLKOUT
tRCP
VCC = 2.7V to 3.0V
14.3
T
66.6
ns
Transition Time
VCC = 3.0V to 3.6V
11.8
T
66.6
tRCH
CLKOUT High Time
4T/7
ns
tRCL
CLKOUT Low Time
3T/7
ns
tRCD
RCLK IN to CLK OUT +/- Delay
5T/7
ns
tRS
LVCMOS/TTL Data Setup to CLK OUT
0.35T - 0.3
ns
tRH
LVCMOS/TTL Data Hold from CLK OUT
0.45T – 1.6
ns
tTLH
LVCMOS/TTL Low to High Transition Time
2.0
3.0
ns
tTHL
LVCMOS/TTL High to Low Transition Time
1.8
3.0
ns
tRIP1
Input Data Position0 (T=11.76ns)
-0.4
0.0
+0.4
ns
tRIP0
Input Data Position1 (T=11.76ns)
T/7-0.4
T/7
T/7+0.4
ns
tRIP6
Input Data Position2 (T=11.76ns)
2T/7-0.4
2T/7
2T/7+0.4
ns
tRIP5
Input Data Position3 (T=11.76ns)
3T/7-0.4
3T/7
3T/7+0.4
ns
tRIP4
Input Data Position4 (T=11.76ns)
4T/7-0.4
4T/7
4T/7+0.4
ns
tRIP3
Input Data Position5 (T=11.76ns)
5T/7-0.4
5T/7
5T/7+0.4
ns
tRIP2
Input Data Position6 (T=11.76ns)
6T/7-0.4
6T/7
6T/7+0.4
ns
tRPLL
Phase Lock Loop Set
10.0
ms
*Typ values are at the conditions of VCC=3.3V and Ta = +25ºC
Table 7. LVCMOS/TTL & LVDS Transmitter AC Specifications
Symbol
LVCMOS/TTL Output
Figure 6. CLKIN Transmission Time
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THC63LVDF84B_Rev.5.01_E
AC Timing Diagrams
LVDS Input Data Position
/-
Figure 7. LVDS Input Data Position
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THC63LVDF84B_Rev.5.01_E
Phase Lock Loop Set Time
/PDWN
Figure 8. PLL Lock Loop Set Time
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THC63LVDF84B_Rev.5.01_E
LVDS Data Timing Diagram
Figure 9. LVDS Data Timing Diagram
Pixel Data Mapping for JEIDA Format (6bit, 8bit Application)
TX Pin
TA0
TA1
TA2
TA3
TA4
TA5
TA6
TB0
TB1
TB2
TB3
TB4
TB5
TB6
TC0
TC1
TC2
TC3
TC4
TC5
TC6
TD0
TD1
TD2
TD3
TD4
TD5
TD6
6bit
R2
R3
R4
R5
R6
R7
G2
G3
G4
G5
G6
G7
B2
B3
B4
B5
B6
B7
Hsync
Vsync
DE
-
8bit
R2
R3
R4
R5
R6
R7
G2
G3
G4
G5
G6
G7
B2
B3
B4
B5
B6
B7
Hsync
Vsync
DE
R0
R1
G0
G1
B0
B1
N/A
RX Pin
RA0
RA1
RA2
RA3
RA4
RA5
RA6
RB0
RB1
RB2
RB3
RB4
RB5
RB6
RC0
RC1
RC2
RC3
RC4
RC5
RC6
RD0
RD1
RD2
RD3
RD4
RD5
RD6
Note : Use TA to TC channels and open TD channel for 6bit application.
Table 8. Data Mapping for JEIDA Format
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THC63LVDF84B_Rev.5.01_E
Pixel Data Mapping for VESA Format (6bit, 8bit Application)
TX Pin
TA0
TA1
TA2
TA3
TA4
TA5
TA6
TB0
TB1
TB2
TB3
TB4
TB5
TB6
TC0
TC1
TC2
TC3
TC4
TC5
TC6
TD0
TD1
TD2
TD3
TD4
TD5
TD6
6bit
R0
R1
R2
R3
R4
R5
G0
G1
G2
G3
G4
G5
B0
B1
B2
B3
B4
B5
Hsync
Vsync
DE
-
8bit
R0
R1
R2
R3
R4
R5
G0
G1
G2
G3
G4
G5
B0
B1
B2
B3
B4
B5
Hsync
Vsync
DE
R6
R7
G6
G7
B6
B7
N/A
RX Pin
RA0
RA1
RA2
RA3
RA4
RA5
RA6
RB0
RB1
RB2
RB3
RB4
RB5
RB6
RC0
RC1
RC2
RC3
RC4
RC5
RC6
RD0
RD1
RD2
RD3
RD4
RD5
RD6
Note : Use TA to TC channels and open TD channel for 6bit application.
Table 9. Data Mapping for VESA Format
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THC63LVDF84B_Rev.5.01_E
Normal Connection with JEIDA Format
Figure 10. Typical Connection Diagram
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THC63LVDF84B_Rev.5.01_E
Notes
1) Cable Connection and Disconnection
Do not connect and disconnect the LVDS cable, when the power is supplied to the system.
2) GND Connection
Connect each GND of the PCB which THC63LVDM83D and LVDS-Rx on it.
reduction to place GND cable as close to LVDS cable as possible.
It is better for EMI
3) Multi Drop Connection
Multi drop connection is not recommended.
Figure 11. Multi Drop Connection
4) Asynchronous use
Asynchronous using such as following systems is not recommended.
Figure 12. Asynchronous Use
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THC63LVDF84B_Rev.5.01_E
Package
Figure 13. Package Diagram
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THC63LVDF84B_Rev.5.01_E
Reference Land Pattern
CY1=
9.44
HE=
e=
8.100
0.500
E=
6.10
Package
Land pattern
Ttyp.=
0.60
Gmin=
6.60
1.05
b=
0.200
Zmax=
Xmax=
0.370
8.70
Zmax/2
Unit : [mm]
Figure 14. Reference of Land Pattern
The recommendation mounting method of THine device is reflow soldering.
The reference pattern is using the calculation result on condition of reflow soldering.
Notes
This land pattern design is a calculated value based on JEITA ET-7501.
Please take into consideration in an actual substrate design about enough the ease of mounting, the intensity of
connection, the density of mounting, and the solder paste used, etc… The optimal land pattern size changes
with these parameters. Please use the value shown by the land pattern as reference data.
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THC63LVDF84B_Rev.5.01_E
Notices and Requests
1. The product specifications described in this material are subject to change without prior notice.
2. The circuit diagrams described in this material are examples of the application which may not always apply to
the customer's design. We are not responsible for possible errors and omissions in this material. Please note if
errors or omissions should be found in this material, we may not be able to correct them immediately.
3. This material contains our copyright, know-how or other proprietary. Copying or disclosing to third parties
the contents of this material without our prior permission is prohibited.
4. Note that if infringement of any third party's industrial ownership should occur by using this product, we will
be exempted from the responsibility unless it directly relates to the production process or functions of the
product.
5. This product is presumed to be used for general electric equipment, not for the applications which require
very high reliability (including medical equipment directly concerning people's life, aerospace equipment, or
nuclear control equipment). Also, when using this product for the equipment concerned with the control and
safety of the transportation means, the traffic signal equipment, or various Types of safety equipment, please
do it after applying appropriate measures to the product.
6. Despite our utmost efforts to improve the quality and reliability of the product, faults will occur with a certain
small probability, which is inevitable to a semi-conductor product. Therefore, you are encouraged to have
sufficiently redundant or error preventive design applied to the use of the product so as not to have our
product cause any social or public damage.
7. Please note that this product is not designed to be radiation-proof.
8. Customers are asked, if required, to judge by themselves if this product falls under the category of strategic
goods under the Foreign Exchange and Foreign Trade Control Law.
THine Electronics, Inc.
[email protected]
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