PC924L0NSZ0F Series

PC924L0NSZ0F Series
PC924L0NSZ0F
Series
Gate Drive DIP 8 pin
∗OPIC Photocoupler
■ Description
■ Agency approvals/Compliance
PC924L0NSZ0F Series contains an IRED optically
coupled to an OPIC chip.
It is packaged in a 8 pin DIP, available in SMT
gullwing lead form option.
Input-output isolation voltage(rms) is 5.0kV.
CMR is MIN. 15kV/µs.
1. Recognized by UL1577 (Double protection isolation),
file No. E64380 (as model No. PC924L)
2. Approved by VDE, DIN EN60747-5-2 (∗) (as an
option), file No. 40008898 (as model No. PC924L)
3. Package resin : UL flammability grade (94V-0)
(∗)
■ Features
DIN EN60747-5-2 : successor standard of DIN VDE0884
■ Applications
1. 8 pin DIP package
2. Double transfer mold package
(Ideal for Flow Soldering)
3. Built-in direct drive circuit for IGBT drive
(IO1P, IO2P : 0.6A)
4. Wide operating supply voltage range
(VCC : 15 to 30V)
5. High noise immunity due to high instantaneous
common mode rejection voltage
(CMH : MIN. −15kV/µs, CML : MIN. 15kV/µs)
6. High isolation voltage between input and output
(Viso(rms) : 5.0 kV)
7. Lead-free and RoHS directive compliant
1. IGBT/MOSFET gate drive for inverter control
∗ "OPIC"(Optical IC) is a trademark of the SHARP Corporation. An OPIC consists of a light-detecting element and a signal-processing
circuit integrated onto a single chip.
Notice The content of data sheet is subject to change without prior notice.
In the absence of confirmation by device specification sheets, SHARP takes no responsibility for any defects that may occur in equipment using any SHARP
devices shown in catalogs, data books, etc. Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device.
1
Sheet No.: D2-A06102EN
Date Jun. 30. 2005
© SHARP Corporation
PC924L0NSZ0F Series
■ Internal Connection Diagram
8
7
6
5
Tr.2
Tr.1
1
2
3
Interface
4
Anode
Cathode
NC
NC
5
6
7
8
O1
O2
GND
VCC
Amp.
1
2
3
4
■ Truth table
Input
ON
OFF
O2 Terminal Output
High level
Low level
Tr.1
ON
OFF
Tr.2
OFF
ON
■ Outline Dimensions
(Unit : mm)
1. Through-Hole [ex. PC924L0NSZ0F]
6
2
3
1
4
2
3
5
4
VDE Identification mark
Date code
Primary side
mark
7.62±0.3
TYP.
3.05±0.5
0.5
3.4±0.5 3.5±0.5
3.05±0.5
Date code
2.54±0.25
6
9.66±0.5
9.66±0.5
Primary side
mark
7
PC924L
4
6.5±0.5
PC924L
1
8
5
Epoxy resin
0.26±0.1
0.5±0.1
θ
θ:0 to 13˚
2.54±0.25
7.62±0.3
0.5TYP.
7
0.85±0.2
3.4±0.5 3.5±0.5
8
1.2±0.3
0.85±0.2
6.5±0.5
1.2±0.3
2. Through-Hole (VDE option) [ex. PC924L0YIZ0F]
Epoxy resin
0.26±0.1
0.5±0.1
θ
θ
Product mass : approx. 0.55g
θ:0 to 13˚
θ
Product mass : approx. 0.55g
Sheet No.: D2-A06102EN
2
PC924L0NSZ0F Series
(Unit : mm)
3. SMT Gullwing Lead-Form [ex. PC924L0NIP0F]
6
5
Primary
side
mark
1
2
3
7
4
1
2
3
9.66±0.5
Date code
VDE Identification mark
Epoxy resin
7.62±0.3
0.26±0.1
0.35±0.25
0.26±0.1
7.62
1.0+0.4
−0
4
Date code
±0.3
3.5±0.5
5
4
Primary
side
mark
9.66±0.5
2.54±0.25
6
PC924L
6.5±0.5
PC924L
8
2.54±0.25
1.0+0.4
−0
1.0+0.4
−0
10.0+0
−0.5
Epoxy resin
0.35±0.25
7
0.85±0.2
3.5±0.5
8
1.2±0.3
0.85±0.2
6.5±0.5
1.2±0.3
4. SMT Gullwing Lead-Form (VDE option)
[ex. PC924L0YIP0F]
1.0+0.4
−0
10.0+0
−0.5
Product mass : approx. 0.51g
Product mass : approx. 0.51g
Plating material : SnCu (Cu : TYP. 2%)
Sheet No.: D2-A06102EN
3
PC924L0NSZ0F Series
Date code (3 digit)
A.D.
1990
1991
1992
1993
1994
1995
1996
1997
1998
1999
2000
2001
1st digit
Year of production
A.D
Mark
2002
A
2003
B
2004
C
2005
D
2006
E
2007
F
2008
H
2009
J
2010
K
2011
L
2012
M
··
N
·
Mark
P
R
S
T
U
V
W
X
A
B
C
··
·
2nd digit
Month of production
Month
Mark
January
1
February
2
March
3
April
4
May
5
June
6
July
7
August
8
September
9
October
O
November
N
December
D
3rd digit
Week of production
Week
Mark
1st
1
2nd
2
3rd
3
4th
4
5.6th
5
repeats in a 20 year cycle
Country of origin
Japan
Rank mark
There is no rank mark indicator.
Sheet No.: D2-A06102EN
4
PC924L0NSZ0F Series
■ Absolute Maximum Ratings
Output
Input
Parameter
*1
Forward current
Reverse voltage
Supply voltage
O1 output current
*2
O1 peak output current
O2 output current
*2
O2 peak output current
O1 output voltage
*3
Power dissipation
*4
Total power dissipation
*5
Isolation voltage
Operating temperature
Storage temperature
*6
Soldering temperature
Symbol
IF
VR
VCC
IO1
IO1P
IO2
IO2P
VO1
PO
Ptot
Viso (rms)
Topr
Tstg
Tsol
Rating
25
6
35
0.1
0.6
0.1
0.6
35
500
550
5.0
−40 to +100
−55 to +125
270
(Ta=25˚C)
Unit
mA
V
V
A
A
A
A
V
mW
mW
kV
˚C
˚C
˚C
*1 The derating factors of a absolute maximum ratings due to ambient temperature
are shown in Fig.10
*2 Pulse width≤0.15µs, Duty ratio : 0.01
*3, 4 The derating factors of a absolute maximum ratings due to ambient temperature
are shown in Fig.11
*5 AC for 1minute, 40 to 60%RH, f=60Hz
*6 For 10s
■ Electro-optical Characteristics*7
Parameter
Output
Input
Forward voltage
Reverse current
Terminal capacitance
Supply voltage
Symbol
VF1
VF2
IR
Ct
VCC
O1 low level output voltage
VO1L
O2 high level output voltage
O2 low level output voltage
O1 leak current
O2 leak current
*9
High level supply current
*9
Low level supply current
VO2H
VO2L
IO1L
IO2L
ICCH
ICCL
Transfer characteristics
Response time
*8
"Low→High" input threshold current
IFLH
Isolation resistance
"Low→High" propagation delay time
"High→Low" propagation delay time
Rise time
Fall time
RISO
tPLH
tPHL
tr
tf
Instantaneous common mode rejection
voltage (High level output)
CMH
Instantaneous common mode rejection
voltage (Low level output)
CML
(Unless otherwise specified Ta=Topr)
MIN.
TYP. MAX.
Unit
Conditions
1.2
−
Ta=25˚C, IF=20mA
1.4
V
0.9
0.6
−
Ta=25˚C, IF=0.2mA
V
−
Ta=25˚C, VR=4V
10
µA
−
−
250
Ta=25˚C, V=0, f=1kHz
pF
30
15
−
30
V
−
VCC1=12V, VCC2=−12V
−
0.4
V
0.2
IO1=0.1A, IF=10mA
20
−
VCC=VO1=24V, IO2=−0.1A, IF=10mA
V
22
−
0.8
V
0.5
VCC=24V, IO2=0.1A, IF=0
−
500
µA
−
VCC=VO1=35V, IF=0
−
500
µA
−
VCC=VO2=35V, IF=10mA
−
3.0
VCC=24V, IF=10mA
mA
1.3
−
3.0
mA
1.3
VCC=24V, IF=0
4.0
1.0
mA
Ta=25˚C, VCC=24V
7.0
−
0.6
mA
VCC=24V
10.0
10
11
5×10
10
−
Ω
Ta=25˚C, DC500V, 40 to 60%RH
1.0
−
µs
2.0
1.0
−
µs
Ta=25˚C, VCC=24V, IF=10mA
2.0
−
0.5
RG=47Ω, CG=3 000pF
µs
0.2
−
0.5
µs
0.2
Ta=25˚C, VCM=1.5kV(p-p)
−
−15
−
kV/µs
IF=10mA, VCC=24V, ∆VO2H=2.0V
Ta=25˚C, VCM=1.5kV(p-p)
−
15
−
kV/µs
IF=0, VCC=24V, ∆VO2L=2.0V
*7 It shall connect a by-pass capacitor of 0.01µF or more between VCC (pin 8 ) and GND (pin 7 ) near the device, when it measures the transfer characteristics and the output side
characteristics
*8 IFLH represents forward current when output goes from "Low" to "High"
*9 O2 output terminal is set to open
Sheet No.: D2-A06102EN
5
PC924L0NSZ0F Series
■ Model Line-up
Lead Form
Through-Hole
SMT Gullwing
Sleeve
Package
50pcs/sleeve
DIN EN60747-5-2
−−−−−−
Approved
−−−−−−
Model No.
PC924L0NSZ0F PC924L0YSZ0F PC924L0NIZ0F
Approved
PC924L0YIZ0F
Taping
1 000pcs/reel
−−−−−−
Approved
PC924L0NIP0F PC924L0YIP0F
Please contact a local SHARP sales representative to inquire about production status.
Sheet No.: D2-A06102EN
6
PC924L0NSZ0F Series
Fig.1 Test Circuit for O1 Low Level Output
Voltage
Fig.2 Test Circuit for O2 High Level Output
Voltage
8
8
1
VCC1
5
IF
6
1
V VO1L
5
VCC
6
VCC2
2
2
7
7
Fig.3 Test Circuit for O2 Low Level Output
Voltage
A IO1L
1
5
5
VCC
IF
IF
VCC
6
6
V VO2L
IO2
2
7
7
Fig.5 Test Circuit for O2 Leak Current
Fig.6 Test Circuit for High Level / Low Level
Supply Current
8
8
1
1
5
V
8
8
IF
VO2H
Fig.4 Test Circuit for O1 Leak Current
1
2
IO2
IF
IO1
A IO2L
5
IF
VCC
A
ICC
VCC
6
6
2
2
7
7
Sheet No.: D2-A06102EN
7
PC924L0NSZ0F Series
Fig.7 Test Circuit for "Low→High" Input Threshold Current
8
1
5
IF
Variable
VCC
6
V
2
7
Fig.8 Test Circuit for Response Time
50%
8
VIN wave form
1
VIN
tr=tf=0.01µs
Pulse width 5µs
Duty ratio 50%
5
6
2
RG
VOUT
tPHL
tPLH
VCC
90%
CG
50%
10%
7
VOUT wave form
tr
tf
Fig.9 Test Circuit for Instantaneous Common Mode Rejection Voltage
VCM
(Peak)
8
A
SW
B
VCM wave form
1
GND
5
VCC
6
V VO2
2
7
+
−
VCM
CMH, VO2 wave form
SW at A, IF=10mA
CML, VO2 wave form
SW at B, IF=0
VO2H
∆VO2L
∆VO2H
VO2L
GND
Sheet No.: D2-A06102EN
8
PC924L0NSZ0F Series
Fig.11 Power Dissipation vs. Ambient
Temperature
60
600
50
500
Power dissipation Po, Ptot (mW)
Forward current IF (mA)
Fig.10 Forward Current vs. Ambient
Temperature
40
30
20
10
Ptot
PO
400
300
200
100
0
−40 −25
0
25
50
75
100
0
−40 −25
125
0
Ambient temperature Ta (°C)
25
50
75
100
125
Ambient temperature Ta (°C)
Fig.12 Forward Current vs. Forward Voltage
Fig.13 "Low→High" Relative Input Threshold
Current vs. Supply Voltage
120
100
10
Relative input threshold current (%)
Forward current IF (mA)
Ta=25˚C
25°C
Ta=100°C
0°C
75°C
−40°C
50°C
1
0.1
0.5
0.75
1
1.25
1.5
1.75
110
Value of VCC=24V
assume 100
100
90
80
70
15
2
18
Fig.14 "Low→High" Relative Input Threshold
Current vs. Ambient Temperature
27
30
Fig.15 O1 Low Level Output Voltage vs.
O1 Output Current
3
160
O1 low level output voltage VO1L (V)
VCC=24V
Relative input threshold current (%)
24
Supply voltage VCC (V)
Forward voltage VF (V)
140
120
IFLH=100% at Ta=25˚C
100
80
60
−40
21
−20
0
20
40
60
80
Ta=25°C
VCC1=12V
VCC2=−12V
IF=10mA
2
1
0
0.0
100
0.1
0.2
0.3
0.4
0.5
0.6
O1 output current IO1 (A)
Ambient temperature Ta (°C)
Sheet No.: D2-A06102EN
9
PC924L0NSZ0F Series
Fig.16 O1 Low Level Output Voltage vs.
Ambient Temperature
Fig.17 O2 Output Voltage Drop vs.
O2 Output Current
0
VCC1=12V
VCC2=−12V
IF=10mA
IO2=0.1A
0.25
High output voltage drop (VO2H-VCC) (V)
O1 low level output voltage VO1L (V)
0.3
0.2
0.15
0.1
0.05
0
−40
−20
0
20
40
60
80
−1
−2
−3
−4
−5
0.0
100
Ta=25°C
VCC=VO1=24V
IF=10mA
0.1
0.2
Ambient temperature Ta (˚C)
0.6
24
Ta=25°C
IF=10mA
O2 high level output voltage VO2H (V)
O2 high level output voltage VO2H (V)
0.5
Fig.19 O2 High Level Output Voltage vs.
Ambient Temperature
30
24
21
18
15
12
15
18
21
24
27
VCC=24V
IF=10mA
IO2 Nearly=0A
23
21
20
−40
30
IO2=−0.1A
22
−20
Supply voltage VCC (V)
3
O2 low level output voltage VO2L (V)
1
0.2
0.3
0.4
40
60
80
100
0.8
Ta=25°C
VCC=VO1=24V
IF=0
0.1
20
Fig.21 O2 Low Level Output Voltage vs.
Ambient Temperature
2
0
0.0
0
Ambient temperature Ta (°C)
Fig.20 O2 Low Level Output Voltage vs.
O2 Output Current
O2 low level output voltage VO2L (V)
0.4
O2 output current IO2 (A)
Fig.18 O2 High Level Output Voltage vs.
Supply Voltage
27
0.3
0.5
0.6
0.5
0.4
0.3
0.2
−40
0.6
VCC=24V
IF=0
IO2=0.1A
0.7
−20
0
20
40
60
80
100
Ambient temperature Ta (°C)
O2 output current IO2 (A)
Sheet No.: D2-A06102EN
10
PC924L0NSZ0F Series
Fig.22 High Level Supply Current vs.
Supply Voltage
Fig.23 Low Level Supply Current vs.
Supply Voltage
3
Ta=25˚C
IF=0
Ta=25˚C
IF=10mA
2.5
Low level supply current ICCL (mA)
High level supply current ICCH (mA)
3
2
1.5
1
0.5
0
15
18
21
24
27
2 .5
2
1 .5
1
0 .5
0
15
30
18
21
24
27
30
Supply voltage VCC (V)
Supply voltage VCC (V)
Fig.24 High Level Supply Current vs. Ambient Fig.25 Low Level Supply Current vs.
Temperature
Ambient Temperature
3
3
VCC=24V
IF=0
2.5
Low level supply current ICCL (mA)
High level supply current ICCH (mA)
VCC=24V
IF=10mA
2
1.5
1
0.5
0
−40
−20
0
20
40
60
80
2 .5
2
1 .5
1
0 .5
0
−40
100
−20
Fig.26 Propagation Delay Time vs. Forward
Current
20
40
2 .5
Propagation delay time tPHL, tPLH (µs)
VCC=VO1=24V
RG=47Ω
CG=3 000pF
tPHL
tPLH
2
1.5
Ta=85˚C
25˚C
−40˚C
1
0.5
25˚C
−40˚C
5
10
80
100
VCC=VO1=24V
RG=47Ω
CG=3 000pF
IF=10mA
2
1 .5
1
t PHL
0 .5
t PLH
85˚C
0
0
60
Fig.27 Propagation Delay Time vs. Ambient
Temperature
2.5
Propagation delay time tPHL, tPLH (µs)
0
Ambient temperature Ta (˚C)
Ambient temperature Ta (˚C)
15
20
0
−40
25
Forward current IF (mA)
−20
0
20
40
60
80
100
Ambient temperature Ta (˚C)
Remarks : Please be aware that all data in the graph are just for reference and not for guarantee.
Sheet No.: D2-A06102EN
11
PC924L0NSZ0F Series
■ Design Considerations
● Recommended operating conditions
Parameter
Forward current
Supply voltage
Operating temperature
Symbol
IF
VCC
Topr
MIN.
14
15
−40
TYP.
−
−
−
MAX.
20
30
70
Unit
mA
V
˚C
● Notes about static electricity
Transistor of detector side in bipolar configuration may be damaged by static electricity due to its minute
design.
When handling these devices, general countermeasure against static electricity should be taken to avoid
breakdown of devices or degradation of characteristics.
● Design guide
In order to stabilize power supply line, we should certainly recommend to connect a by-pass capacitor of
0.01µF or more between VCC and GND near the device.
In case that some sudden big noise caused by voltage variation is provided between primary and secondary
terminals of photocoupler some current caused by it is floating capacitance may be generated and result in
false operation since current may go through IRED or current may change.
If the photocoupler may be used under the circumstances where noise will be generated we recommend to
use the bypass capacitors at the both ends of IRED.
The detector which is used in this device, has parasitic diode between each pins and GND.
There are cases that miss operation or destruction possibly may be occurred if electric potential of any pin
becomes below GND level even for instant.
Therefore it shall be recommended to design the circuit that electric potential of any pin does not become
below GND level.
This product is not designed against irradiation and incorporates non-coherent IRED.
This photocoupler is dedicated to the use for IGBT or MOSFET Gate Drive.
Please do not use this for the other application.
As mentioned below, when the input is on, if DC load (resistor etc.) is connected between O2 output pin 6
and GND pin 7 and if the electric potential V O2 goes approx. 2V below than electric potential V CC pin 8
continuously, supply current ICC may flow more than usually and go beyond power dissipation.
8
A
1
2V or more
5
IF
VCC
6
2
7
Sheet No.: D2-A06102EN
12
PC924L0NSZ0F Series
● Degradation
In general, the emission of the IRED used in photocouplers will degrade over time.
In the case of long term operation, please take the general IRED degradation (50% degradation over 5
years) into the design consideration.
Please decide the input current which become 2 times of MAX. IFLH.
● Recommended Foot Print (reference)
1.7
2.54
2.54
2.54
8.2
2.2
(Unit : mm)
✩ For additional design assistance, please review our corresponding Optoelectronic Application Notes.
Sheet No.: D2-A06102EN
13
PC924L0NSZ0F Series
■ Manufacturing Guidelines
● Soldering Method
Reflow Soldering:
Reflow soldering should follow the temperature profile shown below.
Soldering should not exceed the curve of temperature profile and time.
Please don't solder more than twice.
(˚C)
300
Terminal : 260˚C peak
( package surface : 250˚C peak)
200
Reflow
220˚C or more, 60s or less
Preheat
150 to 180˚C, 120s or less
100
0
0
1
2
3
4
(min)
Flow Soldering :
Due to SHARP's double transfer mold construction submersion in flow solder bath is allowed under the below
listed guidelines.
Flow soldering should be completed below 270˚C and within 10s.
Preheating is within the bounds of 100 to 150˚C and 30 to 80s.
Please don't solder more than twice.
Hand soldering
Hand soldering should be completed within 3s when the point of solder iron is below 400˚C.
Please don't solder more than twice.
Other notices
Please test the soldering method in actual condition and make sure the soldering works fine, since the impact
on the junction between the device and PCB varies depending on the tooling and soldering conditions.
Sheet No.: D2-A06102EN
14
PC924L0NSZ0F Series
● Cleaning instructions
Solvent cleaning:
Solvent temperature should be 45˚C or below Immersion time should be 3 minutes or less
Ultrasonic cleaning:
The impact on the device varies depending on the size of the cleaning bath, ultrasonic output, cleaning time,
size of PCB and mounting method of the device.
Therefore, please make sure the device withstands the ultrasonic cleaning in actual conditions in advance of
mass production.
Recommended solvent materials:
Ethyl alcohol, Methyl alcohol and Isopropyl alcohol
In case the other type of solvent materials are intended to be used, please make sure they work fine in
actual using conditions since some materials may erode the packaging resin.
● Presence of ODC
This product shall not contain the following materials.
And they are not used in the production process for this product.
Regulation substances : CFCs, Halon, Carbon tetrachloride, 1.1.1-Trichloroethane (Methylchloroform)
Specific brominated flame retardants such as the PBBOs and PBBs are not used in this product at all.
This product shall not contain the following materials banned in the RoHS Directive (2002/95/EC).
•Lead, Mercury, Cadmium, Hexavalent chromium, Polybrominated biphenyls (PBB), Polybrominated
diphenyl ethers (PBDE).
Sheet No.: D2-A06102EN
15
PC924L0NSZ0F Series
■ Package specification
● Sleeve package
Package materials
Sleeve : HIPS (with anti-static material)
Stopper : Styrene-Elastomer
Package method
MAX. 50 pcs. of products shall be packaged in a sleeve.
Both ends shall be closed by tabbed and tabless stoppers.
The product shall be arranged in the sleeve with its primary side mark on the tabless stopper side.
MAX. 20 sleeves in one case.
Sleeve outline dimensions
12.0
±2
5.8
10.8
520
6.7
(Unit : mm)
Sheet No.: D2-A06102EN
16
PC924L0NSZ0F Series
● Tape and Reel package
Package materials
Carrier tape : A-PET (with anti-static material)
Cover tape : PET (three layer system)
Reel : PS
Carrier tape structure and Dimensions
F
J
D
E
G
MA
X.
H
H
A
B
C
I
5˚
K
Dimensions List
A
B
16.0±0.3
7.5±0.1
H
I
±0.1
10.4
0.4±0.05
C
1.75±0.1
J
4.2±0.1
D
12.0±0.1
K
10.2±0.1
E
2.0±0.1
(Unit : mm)
F
G
+0.1
4.0±0.1
φ1.5−0
Reel structure and Dimensions
e
d
c
g
Dimensions List
a
b
330
e
23±1.0
f
a
b
17.5±1.5
f
2.0±0.5
(Unit : mm)
c
d
±1.0
100
13±0.5
g
2.0±0.5
Direction of product insertion
Pull-out direction
[Packing : 1 000pcs/reel]
Sheet No.: D2-A06102EN
17
PC924L0NSZ0F Series
■ Important Notices
with equipment that requires higher reliability such as:
--- Transportation control and safety equipment (i.e.,
aircraft, trains, automobiles, etc.)
--- Traffic signals
--- Gas leakage sensor breakers
--- Alarm equipment
--- Various safety devices, etc.
(iii) SHARP devices shall not be used for or in
connection with equipment that requires an extremely
high level of reliability and safety such as:
--- Space applications
--- Telecommunication equipment [trunk lines]
--- Nuclear power control equipment
--- Medical and other life support equipment (e.g.,
scuba).
· The circuit application examples in this publication are
provided to explain representative applications of
SHARP devices and are not intended to guarantee any
circuit design or license any intellectual property rights.
SHARP takes no responsibility for any problems
related to any intellectual property right of a third party
resulting from the use of SHARP's devices.
· Contact SHARP in order to obtain the latest device
specification sheets before using any SHARP device.
SHARP reserves the right to make changes in the
specifications, characteristics, data, materials,
structure, and other contents described herein at any
time without notice in order to improve design or
reliability. Manufacturing locations are also subject to
change without notice.
· If the SHARP devices listed in this publication fall
within the scope of strategic products described in the
Foreign Exchange and Foreign Trade Law of Japan, it
is necessary to obtain approval to export such SHARP
devices.
· Observe the following points when using any devices
in this publication. SHARP takes no responsibility for
damage caused by improper use of the devices which
does not meet the conditions and absolute maximum
ratings to be used specified in the relevant specification
sheet nor meet the following conditions:
(i) The devices in this publication are designed for use
in general electronic equipment designs such as:
--- Personal computers
--- Office automation equipment
--- Telecommunication equipment [terminal]
--- Test and measurement equipment
--- Industrial control
--- Audio visual equipment
--- Consumer electronics
(ii) Measures such as fail-safe function and redundant
design should be taken to ensure reliability and safety
when SHARP devices are used for or in connection
· This publication is the proprietary product of SHARP
and is copyrighted, with all rights reserved. Under the
copyright laws, no part of this publication may be
reproduced or transmitted in any form or by any
means, electronic or mechanical, for any purpose, in
whole or in part, without the express written permission
of SHARP. Express written permission is also required
before any use of this publication may be made by a
third party.
· Contact and consult with a SHARP representative if
there are any questions about the contents of this
publication.
[E232]
Sheet No.: D2-A06102EN
18