PC923L0NSZ0F Series PC923L0NSZ0F Series High Speed, Gate Drive DIP 8 pin ∗OPIC Photocoupler ■ Description ■ Agency approvals/Compliance PC923L0NSZ0F Series contains a LED optically coupled to an OPIC chip. It is packaged in a 8 pin DIP, available in SMT gullwing lead form option. Input-output isolation voltage(rms) is 5.0 kV, High speed response (tPHL, tPLH : MAX. 0.5 µs). 1. Recognized by UL1577 (Double protection isolation), file No. E64380 (as model No. PC923L) 2. Approved by VDE, DIN EN60747-5-2 (∗) (as an option), file No. 40008898 (as model No. PC923L) 3. Package resin : UL flammability grade (94V-0) (∗) ■ Features DIN EN60747-5-2 : successor standard of DIN VDE0884 ■ Applications 1. 8 pin DIP package 2. Double transfer mold package (Ideal for Flow Soldering) 3. Built-in direct drive circuit for MOSFET / IGBT drive (IO1P, IO2P : 0.6 A) 4. High speed response (tPHL, tPLH : MAX. 0.5 µs) 5. Wide operating supply voltage range (VCC=15 to 30 V) 6. High noise immunity due to high instantaneous common mode rejection voltage (CM H : MIN. − 15kV/µs, CML : MIN. 15kV/µs) 7. High isolation voltage between input and output (Viso(rms) : 5.0 kV) 8. Lead-free and RoHS directive compliant 1. IGBT/MOSFET gate drive for inverter control ∗ "OPIC"(Optical IC) is a trademark of the SHARP Corporation. An OPIC consists of a light-detecting element and a signal-processing circuit integrated onto a single chip. Notice The content of data sheet is subject to change without prior notice. In the absence of confirmation by device specification sheets, SHARP takes no responsibility for any defects that may occur in equipment using any SHARP devices shown in catalogs, data books, etc. Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device. 1 Sheet No.: D2-A06002EN Date Jun. 30. 2005 © SHARP Corporation PC923L0NSZ0F Series ■ Internal Connection Diagram 8 7 6 5 Tr.2 Tr.1 1 2 3 Interface 4 NC Anode Cathode NC 5 6 7 8 O1 O2 GND VCC Amp. 1 2 3 4 ■ Truth table Input ON OFF O2 Terminal output High level Low level Tr. 1 ON OFF Tr. 2 OFF ON ■ Outline Dimensions (Unit : mm) 1. Through-Hole [ex. PC923L0NSZ0F] 6 5 1 2 3 9.66±0.5 1 4 5 3 0.5TYP. 7.62 Epoxy resin 0.26±0.1 0.5±0.1 θ θ:0 to 13˚ 4 VDE Identification mark Date code Primary side mark ±0.3 3.4±0.5 3.5±0.5 2 9.66±0.5 Date code Product mass : approx. 0.55g 6 4 Primary side mark 2.54±0.25 7 PC923L 6.5±0.5 PC923L 8 7.62±0.3 2.54±0.25 0.5 7 0.85±0.2 6.5±0.5 8 SHARP mark "S" 3.4±0.5 3.5±0.5 SHARP mark "S" 1.2±0.3 0.85±0.2 TYP. 1.2±0.3 2. Through-Hole (VDE option) [ex. PC923L0YSZ0F] Epoxy resin 0.26±0.1 0.5±0.1 θ θ Product mass : approx. 0.55g θ:0 to 13˚ θ Sheet No.: D2-A06002EN 2 PC923L0NSZ0F Series (Unit : mm) 3. SMT Gullwing Lead-Form [ex. PC923L0NIP0F] SHARP mark "S" 8 7 1.2±0.3 0.85±0.2 6 SHARP mark "S" 5 7 6 5 PC923L 6.5±0.5 PC923L 8 0.85±0.2 6.5±0.5 1.2±0.3 4. SMT Gullwing Lead-Form (VDE option) [ex. PC923L0YIP0F] 4 VDE Identification mark 1 Date code Primary side mark ±0.3 0.26±0.1 3.5±0.5 1.0+0.4 −0 3 9.66±0.5 7.62 2.54±0.25 2 Epoxy resin 4 Date code Primary side mark 7.62±0.3 2.54±0.25 1.0+0.4 −0 1.0+0.4 −0 10.0+0 −0.5 Epoxy resin 0.35±0.25 9.66±0.5 4 0.26±0.1 3 3.5±0.5 2 0.35±0.25 1 1.0+0.4 −0 10.0+0 −0.5 Product mass : approx. 0.51g Product mass : approx. 0.51g Plating material : SnCu (Cu : TYP. 2%) Sheet No.: D2-A06002EN 3 PC923L0NSZ0F Series Date code (3 digit) A.D. 1990 1991 1992 1993 1994 1995 1996 1997 1998 1999 2000 2001 1st digit Year of production A.D Mark 2002 A 2003 B 2004 C 2005 D 2006 E 2007 F 2008 H 2009 J 2010 K 2011 L 2012 M ·· N · Mark P R S T U V W X A B C ·· · 2nd digit Month of production Month Mark January 1 February 2 March 3 April 4 May 5 June 6 July 7 August 8 September 9 October O November N December D 3rd digit Week of production Mark Week 1st 1 2nd 2 3rd 3 4th 4 5.6th 5 repeats in a 20 year cycle Country of origin Japan Rank mark There is no rank mark indicator. Sheet No.: D2-A06002EN 4 PC923L0NSZ0F Series ■ Absolute Maximum Ratings Parameter Symbol *1 IF Forward current Input Reverse voltage VR Supply voltage VCC O1 output current IO1 *2 O1 Peak output current IO1P IO2 Output O2 output current *2 O2 Peak output current IO2P O1 output voltage VO1 *3 PO Power dissipation *4 Ptot Total power dissipation *5 Isolation voltage Viso (rms) Operating temperature Topr Storage temperature Tstg *6 Soldering temperature Tsol Rating 20 5 35 0.1 0.6 0.1 0.6 35 500 550 5.0 −40 to +85 −55 to +125 270 (Ta=25˚C) Unit mA V V A A A A V mW mW kV ˚C ˚C ˚C *1 The derating factors of a absolute maximum ratings due to ambient temperature are shown in Fig.10 *2 Pulse width≤0.15µs, Duty ratio : 0.01 *3, 4 The derating factors of a absolute maximum ratings due to ambient temperature are shown in Fig.11 *5 AC for 1minute, 40 to 60 %RH, f=60Hz *6 For 10s ■ Electro-optical Characteristics*7 Parameter Output Input Forward voltage *9 *9 Isolation resistance "Low→High" propagation delay time "High→Low" propagation delay time Rise time Fall time Instantaneous common mode rejection voltage (High level output) Response time Transfer characteristics *8 Reverse current Terminal capacitance Supply voltage O1 Low level output voltage O2 High level output voltage O2 Low level output voltage O1 leak current O2 leak current High level supply current Low level supply current "Low→High" input threshold current Instantaneous common mode rejection voltage (Low level output) Symbol VF1 VF2 IR Ct VCC VO1L VO2H VO2L IO1L IO2L ICCH ICCL IFLH RISO tPLH tPHL tr tf CMH CML Conditions Ta=25˚C, IF=10mA Ta=25˚C, IF=0.2mA Ta=25˚C, VR=5V Ta=25˚C, V=0, f=1MHz − VCC1=12V, VCC2=−12V, IO1=0.1A, IF=5mA VCC=VO1=24V, IO2=−0.1A, IF=5mA VCC=24V, IO2=0.1A, IF=0 VCC=VO1=35V, IF=0 VCC=VO2=35V, IF=5mA VCC=24V, IF=5mA VCC=24V, IF=0 Ta=25˚C, VCC=24V VCC=24V Ta=25˚C, DC500V, 40 to 60%RH Ta=25˚C, VCC=24V, IF=5mA RG=47Ω, CG=3 000pF Ta=25˚C, VCM=1.5kV(p-p) IF=5mA, VCC=24V, ∆VO2H=2.0V Ta=25˚C, VCM=1.5kV(p-p) IF=0, VCC=24V, ∆VO2L=2.0V (Unless otherwise specified Ta=Topr) MIN. MAX. Unit TYP. V − 1.75 1.6 − 1.2 V 1.5 µA − 10 − 60 pF − 150 − V 15 30 0.2 − 0.4 V 20 22 − V − 0.5 0.8 V − − 500 µA − − 500 µA − 1.3 3.0 mA − 1.3 3.0 mA 1.5 mA 3.0 0.3 mA − 5.0 0.2 10 11 Ω 5×10 − 10 0.3 µs − 0.5 0.3 µs − 0.5 µs 0.2 − 0.5 µs 0.2 − 0.5 -15 − − kV/µs 15 − − kV/µs *7 It shall connect a by-pass capacitor of 0.01µF or more between VCC (pin 8 ) and GND (pin 7 ) near the device, when it measures the transfer characteristics and the output side characteristics *9 O2 output terminal is set open *8 IFLH represents forward current when output goes from "Low" to "High" Sheet No.: D2-A06002EN 5 PC923L0NSZ0F Series ■ Model Line-up Lead Form Through-Hole SMT Gullwing Sleeve Package 50pcs/sleeve DIN EN60747-5-2 −−−−−− Approved −−−−−− Model No. PC923L0NSZ0F PC923L0YSZ0F PC923L0NIZ0F Approved PC923L0YIZ0F Taping 1 000pcs/reel −−−−−− Approved PC923L0NIP0F PC923L0YIP0F Please contact a local SHARP sales representative to inquire about production status. Sheet No.: D2-A06002EN 6 PC923L0NSZ0F Series Fig.1 Test Circuit for O1 Low Level Output Voltage Fig.2 Test Circuit for O2 High Level Output Voltage 8 8 2 5 IF 6 2 VCC1 V VO1L 5 VCC 6 VCC2 3 3 7 7 Fig.3 Test Circuit for O2 Low Level Output Voltage A IO1L 2 5 5 VCC IF IF VCC 6 6 V VO2L 3 IO2 7 7 Fig.5 Test Circuit for O2 Leak Current Fig.6 Test Circuit for High Level / Low Level Supply Current 8 8 2 2 5 V 8 8 IF VO2H Fig.4 Test Circuit for O1 Leak Current 2 3 IO2 IF IO1 A IO2L 5 IF VCC A ICC VCC 6 6 3 3 7 7 Sheet No.: D2-A06002EN 7 PC923L0NSZ0F Series Fig.7 Test Circuit for "Low→High" Input Threshold Current 8 2 5 IF Variable VCC 6 V 3 7 Fig.8 Test Circuit for Response Time 50% 8 VIN wave form 2 VIN tr=tf=0.01µs Pulse width 5µs Duty ratio 50% 5 6 3 RG VOUT tPHL tPLH VCC 90% CG 50% 10% 7 VOUT wave form tr tf Fig.9 Test Circuit for Instantaneous Common Mode Rejection Voltage VCM (Peak) 8 A SW B VCM wave form 2 GND 5 VCC 6 V VO2 3 7 + − VCM CMH, VO2 wave form SW at A, IF=5mA CML, VO2 wave form SW at B, IF=0 VO2H ∆VO2L ∆VO2H VO2L GND Sheet No.: D2-A06002EN 8 PC923L0NSZ0F Series Fig.11 Power Dissipation vs. Ambient Temperature 60 600 50 500 Power dissipation PO, Ptot (mW) Forward current IF (mA) Fig.10 Forward Current vs. Ambient Temperature 40 30 20 10 Ptot PO 400 300 200 100 0 −40 −25 0 25 50 75 85 100 0 −40 −25 125 0 Ambient temperature Ta (°C) 25 50 75 85 100 125 Ambient temperature Ta (°C) Fig.13 "Low→High" Relative Input Threshold Current vs. Supply Voltage Fig.12 Forward Current vs. Forward Voltage 100 120 10 Relative input threshold current (%) Forward current IF (mA) Ta=25°C 0˚C Ta=85˚C −20˚C 50˚C −40˚C 25˚C 1 0.1 1.0 1.2 1.4 1.6 1.8 2.0 110 100 90 IFLH=100% at VCC=24V 80 70 15 2.2 18 Forward voltage VF (V) 27 30 Fig.15 O1 Low Level Output Voltage vs. O1 Output Current 3 120 O1 low level output voltage VO1L (V) VCC=24V Relative input threshold current (%) 24 Supply voltage VCC (V) Fig.14 "Low→High" Relative Input Threshold Current vs. Ambient Temperature 110 100 90 IFLH=100% at Ta=25˚C 80 70 60 −40 21 −20 0 20 40 60 80 Ta=25°C VCC1=12V VCC2=−12V IF=5mA 2 1 0 0.0 100 0.1 0.2 0.3 0.4 0.5 0.6 O1 output current IO1 (A) Ambient temperature Ta (˚C) Sheet No.: D2-A06002EN 9 PC923L0NSZ0F Series Fig.16 O1 Low Level Output Voltage vs. Ambient Temperature Fig.17 O2 Output Voltage Drop vs. O2 Output Current 0 VCC1=12V VCC2=−12V IF=5mA IO2=0.1A 0.25 High output voltage drop (VO2H-VCC) (V) O1 low level output voltage VO1L (V) 0.3 0.2 0.15 0.1 0.05 0 −40 −20 0 20 40 60 80 −1 −2 −3 −4 −5 0.0 100 Ta=25°C VCC=VO1=24V IF=5mA 0.1 0.2 Fig.18 O2 High Level Output Voltage vs. Supply Voltage 0.6 24 Ta=25°C IF=5mA O2 high level output voltage VO2H (V) O2 high level output voltage VO2H (V) 0.5 Fig.19 O2 High Level Output Voltage vs. Ambient Temperature 30 24 21 18 15 12 15 18 21 24 27 VCC=24V IF=5mA IO2=nearly 0A 23 21 20 −40 30 IO2=−0.1A 22 −20 Supply voltage VCC (V) 3 O2 low level output voltage VO2L (V) 1 0.2 0.3 0.4 40 60 80 100 0.8 Ta=25°C VCC=VO1=24V IF=0 0.1 20 Fig.21 O2 Low Level Output Voltage vs. Ambient Temperature 2 0 0.0 0 Ambient temperature Ta (°C) Fig.20 O2 Low Level Output Voltage vs. O2 Output Current O2 low level output voltage VO2L (V) 0.4 O2 output current IO2 (A) Ambient temperature Ta (°C) 27 0.3 0.5 0.6 0.5 0.4 0.3 0.2 −40 0.6 O2 output current IO2 (A) VCC=24V IF=0 IO2=0.1A 0.7 −20 0 20 40 60 80 100 Ambient temperature Ta (˚C) Sheet No.: D2-A06002EN 10 PC923L0NSZ0F Series Fig.22 High Level Supply Current vs. Supply Voltage Fig.23 Low Level Supply Current vs. Supply Voltage 3 Ta=25°C IF=0 Ta=25°C IF=5mA 2.5 Low level supply current ICCL (mA) High level supply current ICCH (mA) 3 2 1.5 1 0.5 0 15 18 21 24 27 2 .5 2 1 .5 1 0 .5 0 15 30 18 21 24 27 Supply voltage VCC (V) Supply voltage VCC (V) Fig.24 High Level Supply Current vs. Ambient Temperature Fig.25 Low Level Supply Current vs. Ambient Temperature 3 3 VCC=24V IF=0 2.5 Low level supply current ICCL (mA) High level supply current ICCH (mA) VCC=24V IF=5mA 2 1.5 1 0.5 0 −40 −20 0 20 40 60 80 2 .5 2 1 .5 1 0 .5 0 −40 100 −20 Ambient temperature Ta (˚C) 1 0.6 Ta=85˚C Ta=25˚C Ta=−40˚C 0.4 0.2 Ta=85˚C Ta=25˚C Ta=−40˚C 0 0 5 10 15 20 40 1 Propagation delay time tPHL, tPLH (µs) 0.8 20 60 80 100 Fig.27 Propagation Delay Time vs. Ambient Temperature VCC=VO1=24V RG=47Ω CG=3 000pF tPHL tPLH 0 Ambient temperature Ta (˚C) Fig.26 Propagation Delay Time vs. Forward Current Propagation delay time tPHL, tPLH (µs) 30 0 .8 0 .6 t PLH 0 .4 t PHL 0 .2 0 −40 25 VCC=VO1=24V RG=47Ω CG=3 000pF IF=5mA −20 0 20 40 60 80 100 Ambient temperature Ta (°C) Forward current IF (mA) Remarks : Please be aware that all data in the graph are just for reference and not for guarantee. Sheet No.: D2-A06002EN 11 PC923L0NSZ0F Series ■ Design Considerations ● Recommended operating conditions Parameter Forward current Supply voltage Operating temperature Symbol IF VCC Topr MIN. 10 15 −40 TYP. − − − MAX. 20 30 70 Unit mA V ˚C ● Notes about static electricity Transistor of detector side in bipolar configuration may be damaged by static electricity due to its minute design. When handling these devices, general countermeasure against static electricity should be taken to avoid breakdown of devices or degradation of characteristics. ● Design guide In order to stabilize power supply line, we should certainly recommend to connect a by-pass capacitor of 0.01µF or more between VCC and GND near the device. In case that some sudden big noise caused by voltage variation is provided between primary and secondary terminals of photocoupler some current caused by it is floating capacitance may be generated and result in false operation since current may go through LED or current may change. If the photocoupler may be used under the circumstances where noise will be generated we recommend to use the bypass capacitors at the both ends of LED. The detector which is used in this device, has parasitic diode between each pins and GND. There are cases that miss operation or destruction possibly may be occurred if electric potential of any pin becomes below GND level even for instant. Therefore it shall be recommended to design the circuit that electric potential of any pin does not become below GND level. This product is not designed against irradiation and incorporates non-coherent LED. This photocoupler is dedicated to the use for IGBT or MOSFET Gate Drive. Please do not use this for the other application. As mentioned below, when the input is on, if DC load (resistor etc.) is connected between O2 output pin 6 and GND pin 7 and if the electric potential V O2 goes approx. 2V below than electric potential V CC pin 8 continuously, supply current ICC may flow more than usually and go beyond power dissipation. 8 A 2 2V or more 5 IF VCC 6 3 7 Sheet No.: D2-A06002EN 12 PC923L0NSZ0F Series ● Degradation In general, the emission of the LED used in photocouplers will degrade over time. In the case of long term operation, please take the general LED degradation (50% degradation over 5 years) into the design consideration. Please decide the input current which become 2 times of MAX. IFLH. ● Recommended Foot Print (reference) 1.7 2.54 2.54 2.54 8.2 2.2 (Unit : mm) ✩ For additional design assistance, please review our corresponding Optoelectronic Application Notes. Sheet No.: D2-A06002EN 13 PC923L0NSZ0F Series ■ Manufacturing Guidelines ● Soldering Method Reflow Soldering: Reflow soldering should follow the temperature profile shown below. Soldering should not exceed the curve of temperature profile and time. Please don't solder more than twice. (˚C) 300 Terminal : 260˚C peak ( package surface : 250˚C peak) 200 Reflow 220˚C or more, 60s or less Preheat 150 to 180˚C, 120s or less 100 0 0 1 2 3 4 (min) Flow Soldering : Due to SHARP's double transfer mold construction submersion in flow solder bath is allowed under the below listed guidelines. Flow soldering should be completed below 270˚C and within 10s. Preheating is within the bounds of 100 to 150˚C and 30 to 80s. Please don't solder more than twice. Hand soldering Hand soldering should be completed within 3s when the point of solder iron is below 400˚C. Please don't solder more than twice. Other notices Please test the soldering method in actual condition and make sure the soldering works fine, since the impact on the junction between the device and PCB varies depending on the tooling and soldering conditions. Sheet No.: D2-A06002EN 14 PC923L0NSZ0F Series ● Cleaning instructions Solvent cleaning: Solvent temperature should be 45˚C or below Immersion time should be 3 minutes or less Ultrasonic cleaning: The impact on the device varies depending on the size of the cleaning bath, ultrasonic output, cleaning time, size of PCB and mounting method of the device. Therefore, please make sure the device withstands the ultrasonic cleaning in actual conditions in advance of mass production. Recommended solvent materials: Ethyl alcohol, Methyl alcohol and Isopropyl alcohol In case the other type of solvent materials are intended to be used, please make sure they work fine in actual using conditions since some materials may erode the packaging resin. ● Presence of ODC This product shall not contain the following materials. And they are not used in the production process for this product. Regulation substances : CFCs, Halon, Carbon tetrachloride, 1.1.1-Trichloroethane (Methylchloroform) Specific brominated flame retardants such as the PBBOs and PBBs are not used in this product at all. This product shall not contain the following materials banned in the RoHS Directive (2002/95/EC). •Lead, Mercury, Cadmium, Hexavalent chromium, Polybrominated biphenyls (PBB), Polybrominated diphenyl ethers (PBDE). Sheet No.: D2-A06002EN 15 PC923L0NSZ0F Series ■ Package specification ● Sleeve package Package materials Sleeve : HIPS (with anti-static material) Stopper : Styrene-Elastomer Package method MAX. 50 pcs. of products shall be packaged in a sleeve. Both ends shall be closed by tabbed and tabless stoppers. The product shall be arranged in the sleeve with its primary side mark on the tabless stopper side. MAX. 20 sleeves in one case. Sleeve outline dimensions 12.0 ±2 5.8 10.8 520 6.7 (Unit : mm) Sheet No.: D2-A06002EN 16 PC923L0NSZ0F Series ● Tape and Reel package Package materials Carrier tape : A-PET (with anti-static material) Cover tape : PET (three layer system) Reel : PS Carrier tape structure and Dimensions F J D E G MA X. H H A B C I 5˚ K Dimensions List A B 16.0±0.3 7.5±0.1 H I ±0.1 10.4 0.4±0.05 C 1.75±0.1 J 4.2±0.1 D 12.0±0.1 K 10.2±0.1 E 2.0±0.1 (Unit : mm) F G +0.1 4.0±0.1 φ1.5−0 Reel structure and Dimensions e d c g Dimensions List a b 330 e 23±1.0 f a b 17.5±1.5 f 2.0±0.5 (Unit : mm) c d ±1.0 100 13±0.5 g 2.0±0.5 Direction of product insertion Pull-out direction [Packing : 1 000pcs/reel] Sheet No.: D2-A06002EN 17 PC923L0NSZ0F Series ■ Important Notices with equipment that requires higher reliability such as: --- Transportation control and safety equipment (i.e., aircraft, trains, automobiles, etc.) --- Traffic signals --- Gas leakage sensor breakers --- Alarm equipment --- Various safety devices, etc. (iii) SHARP devices shall not be used for or in connection with equipment that requires an extremely high level of reliability and safety such as: --- Space applications --- Telecommunication equipment [trunk lines] --- Nuclear power control equipment --- Medical and other life support equipment (e.g., scuba). · The circuit application examples in this publication are provided to explain representative applications of SHARP devices and are not intended to guarantee any circuit design or license any intellectual property rights. SHARP takes no responsibility for any problems related to any intellectual property right of a third party resulting from the use of SHARP's devices. · Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device. SHARP reserves the right to make changes in the specifications, characteristics, data, materials, structure, and other contents described herein at any time without notice in order to improve design or reliability. Manufacturing locations are also subject to change without notice. · If the SHARP devices listed in this publication fall within the scope of strategic products described in the Foreign Exchange and Foreign Trade Law of Japan, it is necessary to obtain approval to export such SHARP devices. · Observe the following points when using any devices in this publication. SHARP takes no responsibility for damage caused by improper use of the devices which does not meet the conditions and absolute maximum ratings to be used specified in the relevant specification sheet nor meet the following conditions: (i) The devices in this publication are designed for use in general electronic equipment designs such as: --- Personal computers --- Office automation equipment --- Telecommunication equipment [terminal] --- Test and measurement equipment --- Industrial control --- Audio visual equipment --- Consumer electronics (ii) Measures such as fail-safe function and redundant design should be taken to ensure reliability and safety when SHARP devices are used for or in connection · This publication is the proprietary product of SHARP and is copyrighted, with all rights reserved. Under the copyright laws, no part of this publication may be reproduced or transmitted in any form or by any means, electronic or mechanical, for any purpose, in whole or in part, without the express written permission of SHARP. Express written permission is also required before any use of this publication may be made by a third party. · Contact and consult with a SHARP representative if there are any questions about the contents of this publication. [E234] Sheet No.: D2-A06002EN 18