PC715V0NSZXF Series

PC715V0NSZXF Series
PC715V0NSZXF
Series
DIP 6 pin Darlington Phototransistor
Output Photocoupler
■ Description
■ Agency approvals/Compliance
PC715V0NSZXF Series contains an IRED optically
coupled to a phototransistor.
It is packaged in a 6 pin DIP.
Input-output isolation voltage(rms) is 5.0kV.
CTR is MIN. 600% at input current of 1mA.
1. Recognized by UL1577 (Double protection isolation),
file No. E64380 (as model No. PC715V)
2. Approved by VDE, DIN EN60747-5-2 (∗) (as an
option), file No. 40008565 (as model No. PC715V)
3. Package resin : UL flammability grade (94V-0)
(∗)
DIN EN60747-5-2 : successor standard of DIN VDE0884
■ Features
1. 6 pin DIP package
2. Double transfer mold package (Ideal for Flow
Soldering)
3. Darlington phototransistor output (CTR : MIN. 600%
at IF=1mA, VCE=2V)
4. High isolation voltage between input and output
(Viso(rms) : 5.0kV)
5. RoHS directive compliant
■ Applications
1. Home appliances
2. Programmable controllers
3. Personal computer peripherals
Notice The content of data sheet is subject to change without prior notice.
In the absence of confirmation by device specification sheets, SHARP takes no responsibility for any defects that may occur in equipment using any SHARP
devices shown in catalogs, data books, etc. Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device.
1
Sheet No.: D2-A04402FEN
Date Jun. 30. 2005
© SHARP Corporation
PC715V0NSZXF Series
■ Internal Connection Diagram
1
1
6
2
5
2
3
4
3
5
4
6
Anode
Cathode
NC
Emitter
Collector
NC
■ Outline Dimensions
(Unit : mm)
1. Through-Hole [ex. PC715V0NSZXF]
2. Through-Hole (VDE option) [ex. PC715V0YSZXF]
1.2±0.3
1.2±0.3
0.6±0.2
6
5
PC715V
Anode
mark
7.12±0.5
1
2
Factory
identification mark
4
3
SHARP
mark
"S"
6.5±0.5
SHARP
mark
"S"
6
5
Factory
identification mark
PC715V
Anode
mark
Date code
VDE
Identification mark
4
6.5±0.5
0.6±0.2
4
1
2
3
±0.3
Date code
7.12
7.62±0.3
0.5TYP.
3.5±0.5
2.9±0.5
0.5TYP.
3.5±0.5
2.9±0.5
7.62±0.3
Epoxy resin
0.5±0.1
θ
2.54±0.25
θ
θ : 0 to 13˚
Product mass : approx. 0.36g
0.5±0.1
3.25±0.5
2.54±0.25
3.25±0.5
Epoxy resin
θ
θ
θ : 0 to 13˚
Product mass : approx. 0.36g
Plating material : SnCu (Cu : TYP. 2%)
Sheet No.: D2-A04402FEN
2
PC715V0NSZXF Series
Date code (2 digit)
A.D.
1990
1991
1992
1993
1994
1995
1996
1997
1998
1999
2000
2001
1st digit
Year of production
A.D
Mark
2002
A
2003
B
2004
C
2005
D
2006
E
2007
F
2008
H
2009
J
2010
K
2011
L
2012
M
··
N
·
2nd digit
Month of production
Month
Mark
January
1
February
2
March
3
April
4
May
5
June
6
July
7
August
8
September
9
October
O
November
N
December
D
Mark
P
R
S
T
U
V
W
X
A
B
C
··
·
repeats in a 20 year cycle
Factory identification mark
Factory identification Mark
Country of origin
no mark
Japan
Indonesia
China
* This factory marking is for identification purpose only.
Please Contact the local SHARP sales reprsentative to see the actual status of
the production.
Rank mark
There is no rank mark indicator.
Sheet No.: D2-A04402FEN
3
PC715V0NSZXF Series
■ Absolute Maximum Ratings
Output
Input
Parameter
Symbol
IF
Forward current
*1
Peak forward current
IFM
VR
Reverse voltage
P
Power dissipation
Collector-emitter voltage VCEO
Emitter-collector voltage VECO
Collector current
IC
Collector power dissipation
PC
Total power dissipation
Ptot
Operating temperature
Topr
Tstg
Storage temperature
*2
Isolation voltage
Viso (rms)
*3
Soldering temperature
Tsol
Rating
50
1
6
70
35
6
80
150
170
−25 to +100
−40 to +125
5
260
(Ta=25˚C)
Unit
mA
A
V
mW
V
V
mA
mW
mW
˚C
˚C
kV
˚C
*1 Pulse width≤100µs, Duty ratio : 0.001
*2 40 to 60%RH, AC for 1minute, f=60Hz
*3 For 10s
■ Electro-optical Characteristics
Input
Output
Transfer
characteristics
Symbol
Parameter
VF
Forward voltage
Peak forward voltage
VFM
Reverse current
IR
Terminal capacitance
Ct
Collector dark current
ICEO
Collector-emitter breakdown voltage BVCEO
Emitter-collector breakdown voltage BVECO
Current transfer ratio
IC
Collector-emitter saturation voltage VCE (sat)
Isolation resistance
RISO
Floating capacitance
Cf
Cut-off frequency
fC
tr
Rise time
Response time
tf
Fall time
Conditions
IF=10mA
IFM=0.5V
VR=4V
V=0, f=1kHz
VCE=10V, IF=0
IC=0.1mA, IF=0
IE=10µA, IF=0
IF=1mA, VCE=2V
IF=20mA, IC=5mA
DC500V, 40 to 60%RH
V=0, f=1MHz
VCE=2V, IC=2mA, RL=100Ω −3dB
VCE=2V, IC=10mA, RL=100Ω
MIN.
−
−
−
−
−
35
6
6.0
−
5×1010
−
−
−
−
TYP.
1.2
−
−
30
−
−
−
16.0
−
1×1011
0.6
6
60
53
MAX.
1.4
3.0
10
250
1 000
−
−
75.0
1.0
−
1.0
−
250
250
(Ta=25˚C)
Unit
V
V
µA
pF
nA
V
V
mA
V
Ω
pF
kHz
µs
µs
Sheet No.: D2-A04402FEN
4
PC715V0NSZXF Series
■ Model Line-up
Lead Form
Through-Hole
Sleeve
Package
50pcs/sleeve
DIN EN60747-5-2
−−−−−−
Approved
Model No.
PC715V0NSZXF PC715V0YSZXF
Please contact a local SHARP sales representative to inquire about production status.
Sheet No.: D2-A04402FEN
5
PC715V0NSZXF Series
Fig.1 Forward Current vs. Ambient
Temperature
Fig.2 Diode Power Dissipation vs. Ambient
Temperature
60
100
Diode power dissipation P (mW)
Forward current IF (mA)
50
40
30
20
10
0
−25
0
25
5055
75
100
80
70
60
40
20
0
−25
125
0
Ambient temperature Ta (˚C)
200
Total power dissipation Ptot (mW)
250
150
100
50
0
−25
0
25
50
75
100
200
170
150
100
50
0
−25
125
0
Ambient temperature Ta (˚C)
Fig.5 Peak Forward Current vs. Duty Ratio
25
50
75
100
Ambient temperature Ta (˚C)
Ta=75˚C
Pulse width≤100µs
Ta=25˚C
Forward current IF (mA)
Peak forward current IFM (A)
50˚C
1
0.1
10−3
10−2
10−1
125
Fig.6 Forward Current vs. Forward Voltage
10
0.01
125
Fig.4 Total Power Dissipation vs. Ambient
Temperature
Fig.3 Collector Power Dissipation vs.
Ambient Temperature
Collector power dissipation PC (mW)
25
50 55 75
100
Ambient temperature Ta (˚C)
25˚C
0˚C
100
−25˚C
10
1
1
0
Duty ratio
0.5
1
1.5
2
2.5
3
3.5
Forward voltage VF (V)
Sheet No.: D2-A04402FEN
6
PC715V0NSZXF Series
Fig.8 Collector Current vs. Collectoremitter Voltage
Fig.7 Current Transfer Ratio vs. Forward
Current
16
2 000
VCE=2V
Ta=25˚C
Ta=25˚C
IF=1mA
0.9mA
14
PC(MAX.)
1 600
Collector current IC (mA)
Current transfer ratio CTR (%)
1 800
1 400
1 200
1 000
800
600
12
0.8mA
10
0.7mA
0.6mA
8
0.5mA
6
0.4mA
4
400
0.3mA
2
200
0.2mA
0.1mA
0
0
0.1
1
0
10
1
2
3
4
5
6
7
8
9 10 11 12 13
Collector-emitter voltage VCE (V)
Forward current IF (mA)
Fig.9 Collector Current vs. Collectoremitter Voltage
Fig.10 Relative Current Transfer Ratio vs.
Ambient Temperature
150
100
Ta=25˚C
Relative current transfer ratio (%)
90
Collector current IC (mA)
80
70
IF=10mA
PC (MAX.)
60
50
5mA
40
2mA
30
20
1mA
IF=1mA
VCE=2V
100
50
10
0
−25
0
0
1
2
3
4
5
0
Fig.11 Collector - emitter Saturation Voltage
vs. Ambient Temperature
75
100
Fig.12 Collector Dark Current vs. Ambient
Temperature
10−5
1
VCE=10V
IF=20mA
IC=5mA
−6
0.8
Collector dark current ICEO (A)
Collector-emitter saturation voltage VCE(SAT) (V)
50
Ambient temperature Ta (˚C)
Collector-emitter voltage VCE (V)
0.6
0.4
0.2
0
−25
25
0
25
50
75
10
10−7
10−8
10−9
10−10
10−11
−25
100
Ambient temperature Ta (˚C)
0
25
50
75
100
Ambient temperature Ta (˚C)
Sheet No.: D2-A04402FEN
7
PC715V0NSZXF Series
Fig.13 Response Time vs. Load Resistance
Response time (µs)
1 000
Fig.14 Test Circuit for Response Time
VCE=2V
IC=10mA
Ta=25˚C
VCC
Input
tf
RD
RL
Output
tr
100
Input
VCE
Output
10%
90%
td
tr
ts
tr
td
10
Please refer to the conditions in Fig.13
ts
1
0.01
0.1
1
10
Load resistance RL (kΩ)
Fig.15 Frequency Response
Fig.16 Test Circuit for Frequency Response
10
VCC
Voltage gain Av (dB)
VCE=2V
IC=2mA
Ta=25˚C
RL
0
Output
RD
VCE
RL=10kΩ
1kΩ
100Ω
−10
Please refer to the conditions in Fig.15
−20
0.01
0.1
1
10
100
Frequency f (kHz)
Remarks : Please be aware that all data in the graph are just for reference and not for guarantee.
Sheet No.: D2-A04402FEN
8
PC715V0NSZXF Series
■ Design Considerations
● Design guide
While operating at IF<1.0mA, CTR variation may increase.
Please make design considering this fact.
This product is not designed against irradiation and incorporates non-coherent IRED.
● Degradation
In general, the emission of the IRED used in photocouplers will degrade over time.
In the case of long term operation, please take the general IRED degradation (50% degradation over 5
years) into the design consideration.
✩ For additional design assistance, please review our corresponding Optoelectronic Application Notes.
Sheet No.: D2-A04402FEN
9
PC715V0NSZXF Series
■ Manufacturing Guidelines
● Soldering Method
Flow Soldering :
Due to SHARP's double transfer mold construction submersion in flow solder bath is allowed under the below
listed guidelines.
Flow soldering should be completed below 270˚C and within 10s.
Preheating is within the bounds of 100 to 150˚C and 30 to 80s.
Please don't solder more than twice.
Hand soldering
Hand soldering should be completed within 3s when the point of solder iron is below 400˚C.
Please don't solder more than twice.
Other notices
Please test the soldering method in actual condition and make sure the soldering works fine, since the impact
on the junction between the device and PCB varies depending on the tooling and soldering conditions.
Sheet No.: D2-A04402FEN
10
PC715V0NSZXF Series
● Cleaning instructions
Solvent cleaning:
Solvent temperature should be 45˚C or below Immersion time should be 3 minutes or less
Ultrasonic cleaning:
The impact on the device varies depending on the size of the cleaning bath, ultrasonic output, cleaning time,
size of PCB and mounting method of the device.
Therefore, please make sure the device withstands the ultrasonic cleaning in actual conditions in advance of
mass production.
Recommended solvent materials:
Ethyl alcohol, Methyl alcohol and Isopropyl alcohol
In case the other type of solvent materials are intended to be used, please make sure they work fine in
actual using conditions since some materials may erode the packaging resin.
● Presence of ODC
This product shall not contain the following materials.
And they are not used in the production process for this product.
Regulation substances : CFCs, Halon, Carbon tetrachloride, 1.1.1-Trichloroethane (Methylchloroform)
Specific brominated flame retardants such as the PBBOs and PBBs are not used in this product at all.
This product shall not contain the following materials banned in the RoHS Directive (2002/95/EC).
•Lead, Mercury, Cadmium, Hexavalent chromium, Polybrominated biphenyls (PBB), Polybrominated
diphenyl ethers (PBDE).
Sheet No.: D2-A04402FEN
11
PC715V0NSZXF Series
■ Package specification
● Sleeve package
Package materials
Sleeve : HIPS (with anti-static material)
Stopper : Styrene-Elastomer
Package method
MAX. 50 pcs. of products shall be packaged in a sleeve.
Both ends shall be closed by tabbed and tabless stoppers.
The product shall be arranged in the sleeve with its anode mark on the tabless stopper side.
MAX. 20 sleeves in one case.
Sleeve outline dimensions
12.0
±2
5.8
10.8
520
6.7
(Unit : mm)
Sheet No.: D2-A04402FEN
12
PC715V0NSZXF Series
■ Important Notices
with equipment that requires higher reliability such as:
--- Transportation control and safety equipment (i.e.,
aircraft, trains, automobiles, etc.)
--- Traffic signals
--- Gas leakage sensor breakers
--- Alarm equipment
--- Various safety devices, etc.
(iii) SHARP devices shall not be used for or in connection with equipment that requires an extremely high level of reliability and safety such as:
--- Space applications
--- Telecommunication equipment [trunk lines]
--- Nuclear power control equipment
--- Medical and other life support equipment (e.g.,
scuba).
· The circuit application examples in this publication are
provided to explain representative applications of
SHARP devices and are not intended to guarantee any
circuit design or license any intellectual property rights.
SHARP takes no responsibility for any problems related to any intellectual property right of a third party resulting from the use of SHARP's devices.
· Contact SHARP in order to obtain the latest device
specification sheets before using any SHARP device.
SHARP reserves the right to make changes in the specifications, characteristics, data, materials, structure,
and other contents described herein at any time without
notice in order to improve design or reliability. Manufacturing locations are also subject to change without notice.
· If the SHARP devices listed in this publication fall within the scope of strategic products described in the Foreign Exchange and Foreign Trade Law of Japan, it is
necessary to obtain approval to export such SHARP devices.
· Observe the following points when using any devices
in this publication. SHARP takes no responsibility for
damage caused by improper use of the devices which
does not meet the conditions and absolute maximum
ratings to be used specified in the relevant specification
sheet nor meet the following conditions:
(i) The devices in this publication are designed for use
in general electronic equipment designs such as:
--- Personal computers
--- Office automation equipment
--- Telecommunication equipment [terminal]
--- Test and measurement equipment
--- Industrial control
--- Audio visual equipment
--- Consumer electronics
(ii) Measures such as fail-safe function and redundant
design should be taken to ensure reliability and safety
when SHARP devices are used for or in connection
· This publication is the proprietary product of SHARP
and is copyrighted, with all rights reserved. Under the
copyright laws, no part of this publication may be reproduced or transmitted in any form or by any means, electronic or mechanical, for any purpose, in whole or in
part, without the express written permission of SHARP.
Express written permission is also required before any
use of this publication may be made by a third party.
· Contact and consult with a SHARP representative if
there are any questions about the contents of this publication.
[E220]
Sheet No.: D2-A04402FEN
13