a module solution provider WG7310-20 WLAN Module TI IEEE 802.11b/g/n, Product Specification Revision 0.2 Copyright © JORJIN TECHNOLOGIES INC. LIMITED 2009 http://WWW.JORJIN.COM.TW CONFIDENTIAL Doc No: WG7310-20-SPC-R02 Index 1. OVERVIEW...............................................................................................................2 1.1. GENERAL FEATURES..............................................................................................2 2. FUNCTIONAL FEATURES........................................................................................3 2.1. MODULE BLOCK DIAGRAM .................................................................................3 2.2. BLOCK FUNCTIONAL FEATURE ..............................................................................3 2.2.1. WLAN Features .......................................................................................3 3. MODULE SPECIFICATION.....................................................................................5 3.1. ABSOLUTE MAXIMUM RATINGS.............................................................................5 3.2. RECOMMENDED OPERATING CONDITIONS ..........................................................5 3.3. RF CHARACTERISTIC ............................................................................................5 3.3.1. WLAN RF ...................................................................................................5 4. PACKAGE INFORMATION ...................................................................................7 4.1. SIGNAL LAYOUT (TOP VIEW) ................................................................................7 4.2. PIN DESCRIPTION .................................................................................................8 4.3. ORDERING INFORMATION .................................................................................. 11 4.4. PACKAGE MARKING.......................................................................................... 11 5. MECHANICAL CHARACTERISTICS ...................................................................12 6. SMT AND BAKING RECOMMENDATION ........................................................13 6.1. BAKING RECOMMENDATION ..............................................................................13 6.2. SMT RECOMMENDATION ...................................................................................13 7. HISTORY CHANGE ...............................................................................................14 Copyright © JORJIN TECHNOLOGIES INC. LIMITED 2009 http://WWW.JORJIN.COM.TW CONFIDENTIAL Page 1 Doc No: WG7310-20-SPC-R02 1. OVERVIEW WG7310-20, a WiFi SiP (system in package) module, is the most demanded design for all handset and portable devices with TI WL1270 IEEE 802.11b/g/n chip and power saving technologies from TI. 1.1. General Features z z z z z z z WLAN SIP module LGA96 pin package Dimension 10mm(L) x 10mm(W) x 1.4mm(H) Based on TI WL1270 65-nm CMOS technology packaged in WSP for module Seamless integration with TI OMAP application processor and GSM-GPRS-UMTS chipset Direct connection to battery using external switching mode power supply supporting 5.5V to 2.3V operation VIO in the 1.8V domain Copyright © JORJIN TECHNOLOGIES INC. LIMITED 2009 http://WWW.JORJIN.COM.TW CONFIDENTIAL Page 2 Doc No: WG7310-20-SPC-R02 2. FUNCTIONAL FEATURES 2.1. Module Block Diagram VBAT DC2DC WL1270 WL1270 FE WLAN VIO PA(b/g/n) 38.4M X’tal SW BPF Slow CLK Host I/F Host Signaling Debug I/F WG7310-20 2.2. Block Functional Feature 2.2.1. WLAN Features z z z z z WLAN MAC Baseband Processor and RF transceiver which is IEEE802.11b/g/n PICS compliant Optimized for ultra low current consumption in all operating modes including extremely low power modes IEEE Std 802.11d, e, h, I, k, r, s PICS compliant Supports Cisco Client eXtensions (CCX) standard Support Secure Digital Input/Output (SDIO), Serial Peripheral Interface (SPI) Host Interfaces Copyright © JORJIN TECHNOLOGIES INC. LIMITED 2009 http://WWW.JORJIN.COM.TW CONFIDENTIAL Page 3 Doc No: WG7310-20-SPC-R02 z z z Medium-Access Controller (MAC) ¾ Embedded ARM Central Processing Unit (CPU) ¾ 292kByte (Used for Program code, data and packet data) Embedded Random-Access Memory (RAM) ¾ Hardware-Based Encryption/Decryption Using 64-, 128-, and 256-Bit WEP, TKIP or AES Keys ¾ Supports Wi-Fi Protected Access (WPA and WPA2.0) and IEEE Std 802.11i [Includes Hardware-Accelerated Advanced-Encryption Standard (AES)] ¾ Designed to Work with IEEE Std 802.1x for Virtual Private Network (VPN) Solutions Baseband Processor ¾ All IEEE Std 802.11b Data Rates, all IEEE Std 802.11b/g and 802.11n Data Rates up to 72.2Mbps 2.4 GHz Radio ¾ Digital Radio Processor (DRP) implementation ¾ Internal LNA ¾ Supports: IEEE Std 802.11b, 802.11g, 802.11b/g and 802.11n Copyright © JORJIN TECHNOLOGIES INC. LIMITED 2009 http://WWW.JORJIN.COM.TW CONFIDENTIAL Page 4 Doc No: WG7310-20-SPC-R02 3. MODULE SPECIFICATION 3.1. Absolute Maximum Ratings Over operating free-air temperature range Characteristics Value Unit VBAT -0.5 to 5.5 V VIO -0.5 to 2.1 V Input Voltage to Analog Pins -0.5 to 2.1 V Input Voltage to all Other Pins -0.5 to VIO + 0.5V V Operating Ambient Temperature Range -20 to 70 °C Storage Temperature Range -40 to 85 °C Supply Voltage Range 3.2. Recommended Operating Conditions The WG7310 requires three two supplies: VBAT and VIO. Voltage Power Supply Min. Typ. Max. VBAT 2.7V 3.3V 4.8V VIO 1.62V 1.8V 1.92V 3.3. RF Characteristic 3.3.1. WLAN RF WLAN Transmitter Characteristics Condition EVM Min Typ Max Unit dBm (Typ) Output Power 54M OFDM -28 13.0 14.0 15.0 48M OFDM -28 13.0 14.0 15.0 36M OFDM -28 13.0 14.0 15.0 24M OFDM -28 13.0 14.0 15.0 Copyright © JORJIN TECHNOLOGIES INC. LIMITED 2009 http://WWW.JORJIN.COM.TW CONFIDENTIAL Page 5 Doc No: WG7310-20-SPC-R02 18M OFDM -28 13.0 14.0 15.0 12M OFDM -28 13.0 14.0 15.0 9M OFDM -28 13.0 14.0 15.0 6M OFDM -28 13.0 14.0 15.0 11M CCK -29 17.0 18.0 19.0 5.5M CCK -29 17.0 18.0 19.0 2M DSSS -29 17.0 18.0 19.0 1M DSSS -29 17.0 18.0 19.0 WLAN Receive Characteristics Condition Min Typ Sensitivity 54M OFDM -73 48M OFDM -75 36M OFDM -80 24M OFDM -83 18M OFDM -86 12M OFDM -88 9M OFDM -89 6M OFDM -90 11M CCK -88 5.5M CCK -90 2M DSSS -91 1M DSSS -94 Max Copyright © JORJIN TECHNOLOGIES INC. LIMITED 2009 http://WWW.JORJIN.COM.TW CONFIDENTIAL Unit dBm Page 6 Doc No: WG7310-20-SPC-R02 4. Package Information 4.1. Signal Layout (Top View) Copyright © JORJIN TECHNOLOGIES INC. LIMITED 2009 http://WWW.JORJIN.COM.TW CONFIDENTIAL Page 7 Doc No: WG7310-20-SPC-R02 4.2. Pin Description No. Index Name Type Description 1 A1 GND GND GROUND 2 A2 VBAT_FEM O FEM POWER SUPPLY 3 B1 BT_FUNC2: BT_WU/ DC2DC O (Reserve for BT Only) 4 B2 GND 5 C1 BT_FUNC6: BT_SDA O (Reserve for BT Only) 6 C2 BT_FUNC4: BT_TX_DBG O (Reserve for BT Only) 7 D1 BT_FUNC5: HOST_WU O (Reserve for BT Only) 8 D2 GND GND GROUND 9 E1 GND GND GROUND 10 E2 DRPWPABC 11 F1 BT_RF_ANT 12 F2 GND GND GROUND 13 G1 GND GND GROUND 14 G2 DRPWPDET I 15 H1 WL_TX_SW O 16 H2 GND 17 J1 WL_BTH_SW O WLPA_IF (internal use only) 18 J2 WL_RX_SW O WLPA_IF (internal use only) 19 K1 GND 20 K2 VCC_DCOW O WL DCO SUPPLY 21 L1 NC_C3/VCC_TXAW O WL PPA A SUPPLY 22 L2 GND 23 L3 FM_EN 24 K3 VCC_RXW 25 L4 GND 26 K4 BT_EN 27 L5 WB_RF_ANT 28 K5 GND GND GROUND 29 L6 GND GND GROUND 30 K6 WL_RS232_RX/ I2S_M_SCL GND GROUND O I/O WL PA BIAS (internal use only) (Reserve for BT Only) WL POWER DET IN (internal use only) WLPA_IF (internal use only) GND GROUND GND GROUND GND GROUND I O (Reserve for FM only) WL LNA SUPPLY GND GROUND I I/O I (Reserve for BT Only) WL RF ANT RS232_RX (default) or I2C_M_SCL (reserved for debug) 31 L7 SDIO_D1 I/O SDIO IF Copyright © JORJIN TECHNOLOGIES INC. LIMITED 2009 http://WWW.JORJIN.COM.TW CONFIDENTIAL Page 8 Doc No: WG7310-20-SPC-R02 32 K7 WL_RS232_TX/ I2S_M_SDA O RS232_TX (default) or I2C_M_SDA (reserved for debug) 33 L8 SDIO_D2 I/O SDIO IF 34 K8 SPI_CSX/ SDIO_D3 I/O SDIO IF 35 L9 SPI_DIN/ SDIO_CMD I/O SDIO IF 36 K9 SPI_DOUT/ SDIO_D0 I/O SDIO IF 37 L10 SPI_CLK/ SDIO_CLK I SDIO IF 38 K10 FM_I2S_FSYNC 39 L11 WL_EN 40 K11 FM_SDA I/O (Reserve for FM only) 41 J11 FM_SCL I/O (Reserve for FM only) 42 J10 FM_IRQ O (Reserve for FM only) 43 H11 FM_I2S_CLK I/O (Reserve for FM only) 44 H10 FM_I2S_DI I (Reserve for FM only) 45 G11 FM_I2S_DO O (Reserve for FM only) 46 G10 GND GND GROUND 47 F11 GND GND GROUND 48 F10 SLOWCLK 49 E11 FM_TX_ANT 50 E10 GND GND GROUND 51 D11 GND GND GROUND 52 D10 FMAUDROUT O (Reserve for FM only) 53 C11 FM_RX_ANT I (Reserve for FM only) 54 C10 GND GND GROUND 55 B11 GND GND GROUND 56 B10 FMAUDLOUT 57 A11 FMAUDRIN 58 A10 GND 59 A9 FMAUDLIN 60 B9 GND GND GROUND 61 A8 GND GND GROUND 62 B8 XTALP O FREF INPUT (internal use only) 63 A7 XTALM O FREF INPUT (internal use only) 64 B7 GND GND GROUND 65 A6 GND GND GROUND I/O I I O (Reserve for FM only) WL RST SLEEP CLK (Reserve for FM only) O (Reserve for FM only) I (Reserve for FM only) GND GROUND I (Reserve for FM only) Copyright © JORJIN TECHNOLOGIES INC. LIMITED 2009 http://WWW.JORJIN.COM.TW CONFIDENTIAL Page 9 Doc No: WG7310-20-SPC-R02 66 B6 BT_FUNC1: O DC2DC/ btSPI_CLK BT DC2DC mode (default) or btSPI_CLK 67 A5 DC_REQ O DC_REQ to INTERNAL DC2DC 68 B5 TPS_DC2DC I MODE SELECTION PIN OF DC2DC 69 A4 VIO I 1.62~1.92V POWER SUPPLY, 1.8V TYP 70 B4 1V8 O 71 A3 VBAT I 2.3~4.8V POWER SUPPLY, 3.3V TYP 72 B3 VDD_LDO_IN_CLASS1P5 I (Reserve for BT Only) 73 D4 PCM_AUD_CLK/ I/O (Reserve for BT Only) I/O (Reserve for BT Only) 1.8V DC2DC POWER SUPPLY FM_I2S_CLK 74 E4 PCM_AUD_IN/ FM_I2S_DI 75 F4 GND 76 G4 WL_PAEN_B 77 H4 GND 78 H5 VCC_ANAW O WLANA INPUT SUPPLY 79 H6 VCC_TXBW O WL PPA BG SUPPLY 80 H7 WL_UART_DBG O (Reserve for BT Only) 81 H8 CLK_REQ_OUT O CLK_REQ positive polarity 82 G8 WLAN_IRQ O WLAN interrupt request 83 F8 HCI_RX/ btSPI_DIN 84 E8 HCI_TX/ btSPI_DOUT 85 D8 86 GND GROUND O WLPA_IF (internal use only) GND GROUND I (Reserve for BT Only) O (Reserve for BT Only) BT_FUNC7: BT_SCL I/O (Reserve for BT Only) D7 HCI_RTS/ btSPI_IRQ I/O (Reserve for BT Only) 87 D6 HCI_CTS/ btSPI_CS I/O (Reserve for BT Only) 88 D5 PCM_AUD_FSYNC/ I/O (Reserve for BT Only) O (Reserve for BT Only) FM_I2S_FSYNC 89 E5 PCM_AUD_OUT/ FM_I2S_DO 90 F5 GND GND GROUND 91 G5 GND GND GROUND 92 G6 GND GND GROUND 93 G7 GND GND GROUND 94 F7 GND GND GROUND 95 E7 GND GND GROUND 96 E6 GND GND GROUND Copyright © JORJIN TECHNOLOGIES INC. LIMITED 2009 http://WWW.JORJIN.COM.TW CONFIDENTIAL Page 10 Doc No: WG7310-20-SPC-R02 4.3. Ordering Information Part number: WG7310-20 4.4. Package Marking Date Code: YYWWSSF YY = Digit of the year, ex: 2008=08 WW = Week (01~53) SS = Serial number from 01 ~99 match to manufacture’s lot number F = for internal use only Copyright © JORJIN TECHNOLOGIES INC. LIMITED 2009 http://WWW.JORJIN.COM.TW CONFIDENTIAL Page 11 Doc No: WG7310-20-SPC-R02 5. MECHANICAL CHARACTERISTICS WG7310 Bottom View Side View WG7310 Bottom View ‧ ‧ ‧ ‧ Pin array = 11x11 Pin number = 96 pins Bump pitch = 0.85mm Bump diameter = 0.5mm Copyright © JORJIN TECHNOLOGIES INC. LIMITED 2009 http://WWW.JORJIN.COM.TW CONFIDENTIAL Page 12 Doc No: WG7310-20-SPC-R02 6. SMT and Baking Recommendation 6.1. Baking Recommendation Baking condition： ¾ Follow MSL Level 4 to do baking process. After bag is opened, devices that will be subjected to reflow solder or other high temperature process must be a) Mounted within 72 hours of factory conditions <30°C/60% RH, or b) Stored at <10% RH. - Devices require bake, before mounting, if Humidity Indicator Card reads >10% If baking is required, Devices may be baked for 8 hrs at 125 °C. - 6.2. SMT Recommendation ¾ Recommended Reflow profile： Copyright © JORJIN TECHNOLOGIES INC. LIMITED 2009 http://WWW.JORJIN.COM.TW CONFIDENTIAL Page 13 Doc No: WG7310-20-SPC-R02 No. Item Temperature (°C) Time (sec) 1 Pre-heat D1: 140 ~ D2: 200 T1: 80 ~ 120 2 Soldering D2: = 220 T2: 60 +/- 10 3 Peak-Temp. D3: 250 °C max Note: (1) Reflow soldering is recommended two times maximum. (2) Add Nitrogen while Reflow process： SMT solder ability will be better. 7. History Change Revision Date Description R 0.1 2009/08/13 New Release 0.1 R 0.2 2009/10/29 Modify P2, P3 Main Chip No. Copyright © JORJIN TECHNOLOGIES INC. LIMITED 2009 http://WWW.JORJIN.COM.TW CONFIDENTIAL Page 14