T6340A

tm
TE
CH
T6340A
Low-Dropout, Constant-Current
White LED with Dimming Control and Low Voltage Detect
FEATURES
GENERAL DESCRIPTION
• Low Voltage Detection and Indication:
T6340A provides the low-dropout bias supply
and the high performance alternative solution
for the white LEDs application. The build-in
Low Voltage Detection and Indication
function can provide the internal LED
dimming. Morse Code S.O.S Signal and
Single Flash Loop Flicker Function are
supported with the significantly lower dropout
voltage. The T6340A is available in TO-252,
SOP-8 and SOT-23 lead-free package.
Detect Voltage Level Options by External
Resistor
• Up to 700mA LED Bias Current
• External Resistor to set Output Current
• Simple LED Dimming Control
• Build-in Morse Code S.O.S Signal
and Single Flash Loop Flicker Function
• Low Dropout Voltage
• Low 0.05uA Shutdown Current
• 2.7V to 6V Supply Voltage Range
• TO-252, SOP-8 and SOT-23 lead-free
Package
• ESD Human Body Mode Over 4KV
• Thermal Protection 160 °C
APPLICATIONS
• Handheld Electronics
• Flash Light
• Lighting
TM Technology Inc. reserves the right
P. 1
to change products or specifications without notice.
Publication Date: JUL. 2008
Revision: A
tm
TE
CH
T6340A
PACKAGE DIMENSIONS
5-LEAD TO-252
E
A
A1
6
L2
2
3
4
D1
SEATING PLANE
D
1
E1
c1
b2
5
H
L
L1
c
e
b
e1
Symbol
A
A1
b
b2
c
c1
D
D1
E
E1
e
e1
H
L
L1
L2
Dimension in inch
Min.
Max.
0.087
0.094
0.040
0.050
0.016
0.24
0.205
0.213
0.017
0.023
0.017
0.023
0.213
0.224
0.150 (REF.)
0.250
0.262
0.150 (REF.)
0.050 (TYP.)
0.200 (TYP.)
0.313
0.338
0.055
0.070
0.043
0.047
0.050
0.060
Dimension in mm
Min.
Max.
2.20
2.40
1.00
1.27
0.40
0.60
5.20
5.40
0.43
0.58
0.43
0.58
5.40
5.70
3.80 (REF.)
6.35
6.65
3.80 (REF.)
1.27 (TYP.)
5.08 (TYP.)
7.94
8.6
1.40
1.78
1.09
1.19
1.30
1.50
TM Technology Inc. reserves the right
P. 2
to change products or specifications without notice.
Publication Date: JUL. 2008
Revision: A
tm
TE
CH
T6340A
PACKAGE DIMENSIONS
8-LEAD SOP
B
B1
K
T h e rm a l P a d *
J
A1
C1
A
C
C2
F
D
Symbol
A
A1
B
B1
C
C1
C2
D
E
F
J
K
H
Min.
5.70
3.75
1.35
0.10
0.31
0.30
0.10
Dimension in mm
Typ.
6.00
3.95
1.27
1.55
0.41
0.50
0.15
2.23 REF
2.97 REF
0~8°
E
H
Max.
6.30
4.10
5.13
1.80
1.75
0.25
0.51
0.70
0.25
Min.
0.224
0.148
0.052
0.001
0.012
0.012
0.004
Dimension in inch
Typ.
0.236
0.156
0.050
0.061
0.016
0.020
0.006
0.088 REF
0.117 REF
0~8°
Max.
0.248
0.164
0.202
0.071
0.069
0.004
0.020
0.028
0.010
*Note :
The thermal pad on the IC’s bottom has to be mounted on the copper foil.
To eliminate the noise influence, the thermal pad is suggested to be connected to GND on PCB.
In addition, desired thermal conductivity will be improved, if a heat-conducting copper foil on
PCB is soldered with thermal pad. The thermal pad enhances the power dissipation. As a result, a
large amount of current can be sunk safely in one package.
TM Technology Inc. reserves the right
P. 3
to change products or specifications without notice.
Publication Date: JUL. 2008
Revision: A
tm
TE
CH
T6340A
PACKAGE DIMENSIONS
SOT23-6
B
B 1
B 2
A 1
C 1
A
C
C 2
F
D
I
Symbol
A
A1
B
B1
B2
C
C1
C2
D
E
F
G
H
I
Min.
2.60
1.40
2.70
0.95
0.90
0
0.30
0.08
Dimension in mm
Typ.
2.80
1.575
2.85
1.90(BSC)
0.95(BSC)
1.20
1.10
0.075
0.40
0.45
0.15
0.60(REF)
H
Max.
3.00
1.60
3.00
Min.
0.102
0.055
0.106
1.45
1.30
0.150
0.037
0.035
0
0.60
0.22
0.012
0.003
G
E
Dimension in inch
Typ.
0.110
0.062
0.112
0.075(BSC)
0.037(BSC)
0.047
0.043
0.003
0.015
0.018
0.006
5~15°
TM Technology Inc. reserves the right
P. 4
to change products or specifications without notice.
Max.
0.118
0.063
0.118
0.057
0.051
0.06
0.023
0.009
0~8°
5~15°
Publication Date: JUL. 2008
Revision: A