Datasheet - Silikron

SSBR20100CT/ SSBR20100CTF
Main Product Characteristics:
IF
2×10A
VRRM
100V
Tj(max)
150℃
Vf(max)
0.8V
TO220
TO220F
SSBR20100CT
SSBR20100CTF
Schematic Diagram
Features and Benefits:



High Junction Temperature
High ESD Protection
High Forward & Reverse Surge capability
Description:
Schottky Barrier Rectifier designed for high frequency switch model power supplies such as adaptors and DC/DC
convertors; this product special design for high forward and reverse surge capability
Absolute Rating:
Symbol
VRRM
VR(RMS)
Characterizes
Value
Unit
Peak Repetitive Reverse Voltage
100
V
RMS Reverse Voltage
70
V
Per diode
10
A
Per device
20
A
IF(AV)
Average Forward Current
IFSM
Non Repetitive Surge Forward Current(tp=8.3ms sinusoidal)
180
A
IRRM
Peak Repetitive Reverse Surge Current(Tp=2us)
0.5
A
TJ
Maximum operation Junction Temperature Range
-55~150
℃
Tstg
Storage Temperature Range
-55~150
℃
Value
Unit
TO220
2
℃/W
TO220F
4
℃/W
Thermal Resistance
Symbol
RθJC
RθJC
Characterizes
Maximum Thermal Resistance Junction To
Case(per leg)
Electrical Characterizes @TA=25℃ unless otherwise specified
Symbol
Characterizes
Min
VR
Reverse Breakdown Voltage
VF
Forward Voltage Drop
IR
Leakage Current
©Silikron Semiconductor CO., LTD.
Typ
Max
100
V
0.8
0.7
0.1
5
2013.3.21
www.silikron.com
Unit
V
mA
Version: 2.2
Test Condition
IR=0.5mA
IF=10A, TJ=25℃
IF=10A, TJ=125℃
VR=100V, TJ=25℃
VR=100V, TJ=125℃
page
1of8
SSBR20100CT/ SSBR20100CTF
I-V Curves:
Figure 1:Typical Forward Characteristics
Figure 2:Typical Capacitance Characteristics
Figure 3:Typical Reverse Characteristics
©Silikron Semiconductor CO., LTD.
2013.3.21
www.silikron.com
Version: 2.2
page
2of8
SSBR20100CT/ SSBR20100CTF
Mechanical Data:
TO-220
-Option1-
TO220 PACKAGE OUTLINE DIMENSION_GN
Symbol
A
A1
A2
b
b1
b2
C
D
D1
D2
E
E1
ФP
ФP1
e
e1
L
L1
L2
L3
L4
Q1
Dimension In Millimeters
Min
Nom
Max
4.400
4.550
4.700
1.270
1.300
1.330
2.240
2.340
2.440
1.270
1.270
1.370
1.470
0.750
0.800
0.850
0.480
0.500
0.520
15.100
15.400
15.700
8.800
8.900
9.000
2.730
2.800
2.870
9.900
10.000
10.100
8.700
3.570
3.600
3.630
1.400
1.500
1.600
2.54BSC
5.08BSC
13.150
13.360
13.570
7.35REF
Dimension In Inches
Nom
Max
0.179
0.185
0.051
0.052
0.092
0.096
0.050
0.054
0.058
0.031
0.033
0.020
0.021
0.606
0.618
0.350
0.354
0.110
0.113
0.394
0.398
0.343
0.142
0.143
0.059
0.063
0.1BSC
0.2BSC
0.518
0.526
0.534
0.29REF
Min
0.173
0.050
0.088
0.050
0.030
0.019
0.594
0.346
0.107
0.390
0.141
0.055
2.900
1.650
3.000
1.750
3.100
1.850
0.114
0.065
0.118
0.069
0.122
0.073
0.900
1.000
1.100
0.035
0.039
0.043
0
5
0
7
0
9
5
0
0
90
7
Q2
Q3
0
5
50
0
7
70
0
9
90
0
5
50
0
7
70
90
90
Q4
10
30
50
10
30
50
©Silikron Semiconductor CO., LTD.
2013.3.21
www.silikron.com
Version: 2.2
page
3of8
SSBR20100CT/ SSBR20100CTF
TO-220
-Option2-
TO220 PACKAGE OUTLINE DIMENSION_2
Symbol
A
A1
A2
b
b2
c
D
D1
DEP
E
E1
E2
ФP1
e
e1
H1
L
L1
L2
ФP
Q
ϴ1
ϴ2
Dimension In Millimeters
Min
Nom
Max
4.400
4.550
4.700
1.270
1.300
1.330
2.350
2.425
2.500
0.770
0.900
1.170
1.360
0.480
0.500
0.520
15.400
15.600
15.800
9.000
9.100
9.200
0.050
0.125
0.200
9.800
10.000
10.200
8.700
9.800
10.000
10.200
1.400
1.500
1.600
2.54BSC
5.08BSC
6.400
6.500
6.600
12.750
13.200
13.650
3.300
2.5REF
Dimension In Inches
Nom
Max
0.179
0.185
0.051
0.052
0.095
0.098
0.035
0.054
0.020
0.020
0.614
0.622
0.358
0.362
0.005
0.008
0.394
0.402
0.343
0.394
0.402
0.059
0.063
0.1BSC
0.2BSC
0.252
0.256
0.260
0.502
0.520
0.537
0.130
0.098REF
Min
0.173
0.050
0.093
0.030
0.046
0.019
0.606
0.354
0.002
0.386
0.386
0.055
3.570
2.730
3.600
2.800
3.630
2.870
0.141
0.107
0.142
0.110
0.143
0.113
50
70
90
50
70
90
0
0
0
0
0
1
©Silikron Semiconductor CO., LTD.
3
5
2013.3.21
www.silikron.com
1
Version: 2.2
3
5
page
0
4of8
SSBR20100CT/ SSBR20100CTF
TO-220F
-Option1-
TO220F PACKAGE OUTLINE DIMENSION_GN
ФP1
ФP2
Dimension In Millimeters
Min
Nom
Max
9.960
10.160
10.360
9.840
10.040
10.240
6.800
7.000
7.200
4.600
4.700
4.800
2.440
2.540
2.640
2.660
2.760
2.860
0.600
0.700
0.800
0.500
15.780
15.870
15.980
8.970
9.170
9.370
6.500
6.700
6.800
2.54BSC
3.080
3.180
3.280
1.400
1.500
1.600
0.900
1.000
1.100
ФP3
L
L1
L2
Q1
Q2
b1
b2
b3
0.100
12.780
2.970
0.830
o
3
43o
1.180
0.760
-
Symbol
E
E1
E2
A
A1
A2
A3
c
D
D1
H1
e
ФP
©Silikron Semiconductor CO., LTD.
0.200
12.980
3.170
0.930
o
5
45o
1.280
0.800
-
0.300
13.180
3.370
1.030
o
7
47o
1.380
0.840
1.420
2013.3.21
www.silikron.com
Dimension In Inches
Nom
0.400
0.395
0.276
0.185
0.100
0.109
0.028
0.020
0.625
0.361
0.264
0.10BSC
0.121
0.125
0.055
0.059
0.035
0.039
Min
0.392
0.387
0.268
0.181
0.096
0.105
0.024
0.621
0.353
0.256
0.004
0.503
0.117
0.033
o
3
43o
0.046
0.030
-
Version: 2.2
0.008
0.511
0.125
0.037
o
5
45o
0.050
0.031
-
Max
0.408
0.403
0.283
0.189
0.104
0.113
0.031
0.629
0.369
0.268
0.129
0.063
0.043
0.012
0.519
0.133
0.041
o
7
47o
0.054
0.033
0.056
page
5of8
SSBR20100CT/ SSBR20100CTF
TO-220F
-Option2-
TO220F PACKAGE OUTLINE DIMENSION_2
A
A1
A2
A3
b
b1
b2
c
D
E
e
F
Ф
h
h1
h2
L
L1
L2
Min
4.300
2.800
2.500
0.500
1.100
1.500
0.500
9.960
14.800
0.000
28.000
1.700
1.900
Nom
1.300 REF.
2.540 TYP.
2.700 REF.
3.500 REF.
0.800 REF,
0.500 REF.
-
©Silikron Semiconductor CO., LTD.
Max
4.700
Min
0.169
3.200
2.900
0.750
1.350
1.750
0.750
10.360
15.200
0.110
0.098
0.020
0.043
0.059
0.020
0.392
0.583
0.300
0.000
28.400
1.900
2.100
1.102
0.067
0.075
2013.3.21
www.silikron.com
Nom
0.051 REF.
0.100 TYP.
0.106 REF.
0.138 REF.
0.031 REF.
0.020 REF.
-
Version: 2.2
page
Max
0.185
0.126
0.114
0.030
0.053
0.069
0.030
0.408
0.598
0.012
1.118
0.075
0.083
6of8
SSBR20100CT/ SSBR20100CTF
Ordering and Marking Information
Device Marking: SSBR20100CT & SSBR20100CTF
Package (Available)
TO-220&TO220F
Operating Temperature Range
C : -55 to 150 ºC
Devices per Unit
Package
Type
Units/ Tubes/Inner
Tube Box
Units/Inner
Box
Inner
Units/
Boxes/Carton Carton
Box
Box
TO220
TO220F
50
20
1000
6
6000
50
20
1000
6
6000
Reliability Test Program
Test Item
High
Temperature
Reverse
Bias(HTRB)
Conditions
Duration
Sample Size
Tj=125℃ to 150℃ @
80% of Max
VDSS/VCES/VR
168 hours
500 hours
1000 hours
3 lots x 77 devices
©Silikron Semiconductor CO., LTD.
2013.3.21
www.silikron.com
Version: 2.2
page
7of8
SSBR20100CT/ SSBR20100CTF
ATTENTION:
■
■
■
■
■
■
■
■
■
Any and all Silikron products described or contained herein do not have specifications that can handle applications
that require extremely high levels of reliability, such as life-support systems, aircraft's control systems, or other
applications whose failure can be reasonably expected to result in serious physical and/or material damage.
Consult with your Silikron representative nearest you before using any Silikron products described or contained
herein in such applications.
Silikron assumes no responsibility for equipment failures that result from using products at values that exceed,
even momentarily, rated values (such as maximum ratings, operating condition ranges, or other parameters) listed
in products specifications of any and all Silikron products described or contained herein.
Specifications of any and all Silikron products described or contained herein stipulate the performance,
characteristics, and functions of the described products in the independent state, and are not guarantees of the
performance, characteristics, and functions of the described products as mounted in the customer’s products or
equipment. To verify symptoms and states that cannot be evaluated in an independent device, the customer
should always evaluate and test devices mounted in the customer’s products or equipment.
Silikron Semiconductor CO.,LTD. strives to supply high-quality high-reliability products. However, any and all
semiconductor products fail with some probability. It is possible that these probabilistic failures could give rise to
accidents or events that could endanger human lives, that could give rise to smoke or fire, or that could cause
damage to other property. When designing equipment, adopt safety measures so that these kinds of accidents or
events cannot occur. Such measures include but are not limited to protective circuits and error prevention circuits for
safe design, redundant design, and structural design.
In the event that any or all Silikron products(including technical data, services) described or contained herein are
controlled under any of applicable local export control laws and regulations, such products must not be exported
without obtaining the export license from the authorities concerned in accordance with the above law.
No part of this publication may be reproduced or transmitted in any form or by any means, electronic or mechanical,
including photocopying and recording, or any information storage or retrieval system, or otherwise, without the prior
written permission of Silikron Semiconductor CO.,LTD.
Information (including circuit diagrams and circuit parameters) herein is for example only ; it is not guaranteed for
volume production. Silikron believes information herein is accurate and reliable, but no guarantees are made or
implied regarding its use or any infringements of intellectual property rights or other rights of third parties.
Any and all information described or contained herein are subject to change without notice due to
product/technology improvement, etc. When designing equipment, refer to the "Delivery Specification" for the
Silikron product that you intend to use.
This catalog provides information as of Dec, 2008. Specifications and information herein are subject to change
without notice.
Customer Service
Worldwide Sales and Service:
[email protected]
Technical Support:
[email protected]
Suzhou Silikron Semiconductor Corp.
11A, 428 Xinglong Street, Suzhou Industrial Park, P.R.China
TEL: (86-512) 62560688
FAX: (86-512) 65160705
E-mail: [email protected]
©Silikron Semiconductor CO., LTD.
2013.3.21
www.silikron.com
Version: 2.2
page
8of8