MCZ5205SE_ApplicationNote

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MCZ5205SE APPLICATION NOTE
Jan.2011 Ver1.0
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MCZ5205SE
Disclaimers
Thank you for purchasing our products. This manual contains important information on the safe use of our products. Your safety is
of the utmost importance to us.
Please read these instructions carefully before using our products.
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Improper use of the products can result in death, serious injury, or expensive damage to
equipment.
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Improper use of the products can result in minor injuries or damage to equipment.
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Although we are constantly making every effort to improve the quality and reliability of our
products, there nevertheless remains a certain probability that the semiconductor products may
occasionally fail or malfunction. Please take careful precautions against product failures or
malfunctions to avoid any injuries, fire accidents or social loss by implementing safety designs
such as redundancy designs, designs for fire spread prevention, and designs for preventing
malfunctions.
Our semiconductor products listed in this document are not designed or manufactured to be used
in devices or systems requiring extremely high levels of quality and reliability, or the failure or
malfunction of which may directly threaten human lives or cause injury.
In the cases where the products are to be used in devices or systems for special applications or
devices or systems for specialized applications shown below, always make sure to consult us in
advance.
Special Applications
Transportation devices (automotive, marine, etc.), communication devices for core
network, traffic signal devices, fire prevention/anticrime devices, various safety
devices, medical devices, etc.
Specialized Applications
Nuclear power control systems, aircraft and aerospace devices, submarine relay devices, and
systems for preserving life, etc.
Even if it is not for a special or specialized application, when IC products are to be used for
devices or systems that are desired to last for a long period under continuous operation, please
make sure to consult us in advance.
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Do not attempt under any conditions to repair or modify IC products by yourself. Doing so could
result in electric shock, device breakage, fire, and malfunction.
When an abnormal condition occurs, an excessive voltage or under voltage may be generated
across the output terminals of the circuit.
Install preventative measures (e.g. over-voltage protection, over-current protection) for the device
by considering the possibility of a malfunction and/or breakage of a load in an abnormal condition.
Do not switch on the circuit before confirming the proper connection and polarity of input and
output terminals as an erroneous connection may cause breakage of the protection device or
smoke/fire.
Do not use the circuit beyond the rated input voltage and install a protection device on the input
rail to prevent smoke/fire that may be caused from an abnormal condition.
If a breakdown or other abnormal condition occurs during the use of the device, immediately stop
power to the device and consult us at your earliest possible convenience.
● We reserve the right to make any changes to the contents of this manual without prior notice in accordance with modifications to IC
products.
● Details of specifications should be exchanged at the adoption of the IC products.
● All information included in this manual is believed to be accurate and reliable. However, our company takes no responsibility for any
injury or damage incurred when using the IC products as described in this manual. Neither do we take any responsibility for issues
arising from infringement of patent or other rights caused by using this manual.
● The provision of this manual does not guarantee the right to use any third party’s patent or other rights, or grant
permission to use the patent or other rights of our company.
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We are happy to provide circuit design support for safe use of the IC. Please consult our sales representative .
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Index
1 : General Description
1.1: Features
4
1.2: Internal block diagram
5
1.3: Pin assignment
6
1.4: Functions
6
1.5: Application circuits
7
2 : Functional description
2.1: Outline
8
2.2: Power supply block
8
2.3: PFC block
9-12
2.4: LLC block
13-18
2.5: Others
19-21
2.6: Remarks
21
3 : Peripheral components setting
3.1: PFC ZCS turn on timing (ZC)
22
3.2: PFC Phase compensation (COMP)
23
3.3: PFC Output voltage / OVP threshold (FBP)
23
3.4: PFC OCP setting (CSP)
24
3.5: LLC Brown out protection (Vsen)
24
3.6: LLC Oscillator / Feedback (FBL)
25
3.7: LLC Soft start / protection delay timer (SST)
26
3.8: LLC Current limiting / capacitive mode protection (CSL)
3.9: PFC Output voltage and LLC Brown out protection
(In case of common sensing line for FBP and Vsen)
26
27
4 : Circuit diagram
4.1: Typical application circuit (LLC dual output)
28
5 : Dimension
5.1: SOP22 (MCZ5205SE)
29
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1 General description
The MCZ5205SE adopts one chip solution to provide CrM PFC and LLC controller/driver in small
package. This robust combo-IC eliminates external components for protective function and its multi
functional terminal configuration simplifies power supply designing by using minimal components.
Active standby function provides improved efficiency at light load condition.
CrM PFC and Symmetric LLC combination provides excellent performance in low noise characteristics
and also highly efficient power supply solution.
The MCZ5205SE is most suitable for:





FPD PSU (LCD / PDP / Projection)
OA equipment PSU (LBP …etc.)
High power adapter
High power industrial equipment
High power LED lighting driver
1.1 Features
1. PFC and LLC controllers are integrated in SOP22 package.
2. Active standby function improves efficiency at light load condition.
3. PFC adopts OVP multi-detective function to simplify the circuit.
4. Optimized PFC/LLC on-off timing.
5. Vcc up to 35V with 12.6 / 8.5V UVLO.
[ PFC ]
1. Critical conduction mode PFC controller.
2. Peak current limiting threshold of 0.5V.
3. No input line sensing is required.
4. Various protections are installed. (feedback pin open/short, dynamic OVP,
Thermal shutdown)
[ LLC ]
1. Optimized Gate drive balance simplifies drive circuitry.
2. 600V floating gate drivers with individual UVLO.
3. Active standby operation eliminates a weak point of symmetric LLC that is unsatisfactory efficiency
at light load condition.
4. Anti-capacitive protection
5. Various protections are installed. (Peak current limit / Timer delayed latching / Thermal shutdown)
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1.2 Internal block diagram
Fig.1 MCZ5205SE internal block diagram
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1.3 Pin assignment
Fig.2 MCZ5205SE Pin assignment
1.4 Functions
PIN NO.
symbol
converter
Function
1
ZC
PFC
Zero Current detection to determine turn on timing
2
COMP
PFC
Output of PFC feedback amp for phase COMPensation and soft
start
3
FBP
PFC
Input of PFC FeedBack amp
4
Vsen
LLC
Line Voltage sensing for brownout protection
5
Vc1
Common
Voltage source input for control circuit with 12.6V/8.5V UVLO
6
FBL
LLC
LLC operating frequency and duty setting FeedBack terminal
7
SST
LLC
Soft Start and protection Timer
8
SGND
Common
9
CSL
LLC
10
AS
Common
11
VGL
LLC
Gate drive output for Low side mosfet
12
VGH
LLC
Gate drive output for High side mosfet
13
VS
LLC
Floating high side gate driver reference voltage ( : connect with
Source terminal of high side mosfet)
14
VB
LLC
Floating Vcc Bootstrapping input
15-18
NC
-
19
Vc2
Common
Output terminal of supply for PFC and LLC driver
20
PGND
Common
Power GND
21
CSP
PFC
PFC mosfet source Current Sensing
22
VGP
PFC
Gate drive output for PFC mosfet
Signal GND terminal
LLC resonant Current Sensing
Terminal for Active Standby mode / external latch signals input
Non connection
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1.5
Application circuits
Fig.3 Basic circuit example
Fig.4 Basic circuit example (Without PFC)
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2 Functional description
Values described in this document such as Threshold are typical, unless otherwise specified.
For details, please refer to characteristic specification.
2.1 Outline
The functionality of the MCZ5205SE can be grouped as follows:
1) Power supply
For details, refer Section 2.2.
2) PFC Controller
For details, refer Section 2.3.
3) LLC Controller
For details, refer Section 2.4.
4) Others (Active Standby, Common Protection)
For details, refer Section 2.5.
2.2 Power supply block
2.2.1 Power supply for controller (Vc1)
Vc1 is power supply input terminal for controller. Connect a capacitor between Vc1 and GND
close to the terminals to supply stable voltage.
Select the capacitance value to stabilize transient conditions. (For example, start up and shut
down.)
If malfunction of MCZ5205SE occurs due to noise on Vc1, insert a MLCC of 1 to 4.7uF between
Vc1 and GND close to the terminal.
If Vc1 voltage reaches Vc1(start) 12.6V, Vc2 start charging. If Vc1 voltage falls below Vc1(stop)
8.5V, Vc2 starts discharging and controller stops its operation. If the latch-stop works due to an
abnormal state, it is necessary for restarting to release the latch by reducing Vc1 voltage to less
than latch reset voltage of Vc1(latch reset) 8.1V.
2.2.2 Power supply for gate driver (Vc2)
Vc2 is output terminal of supply for PFC and LLC driver. Vc2 supplies stable voltage to gate drivers
of PFC and LLC controllers. Connect a capacitor between Vc2 and GND close to the terminals to
secure the stable driving in general and also transient conditions such as start up and shut down.
Capacitance of 4.7 to 22uF is recommended.
When Vc2 voltage reaches Vc2(start) 9.6V, oscillator (connected with FBL) starts operation and
driving is ready. Refer to section 2.3 and 2.4 for the condition to start gate driving of PFC and LLC
controllers.
2.2.3 Power supply for LLC High-side gate driver (VB)
VB is output terminal of supply for LLC high-side driver. VB is connected with Vc2 via the bootstrap
diode. Connect a capacitor between VB and VS. Select a capacitor with considering stable driving
in transient conditions such as start up and shut down. Capacitance of 0.1 to 0.47uF is
recommended.
Bootstrap diode requires fast and soft recovery characteristics. For example, select a diode of 600V
or higher when PFC output voltage is 400V. D1NK60(Shindengen) is recommended.
VB is equipped with an independent UVLO (under voltage lock out). If VB voltage reaches VBVS(start) 7.4V, high-side gate driving starts. If VB voltage falls below VB-VS(stop) 5.3V, high-side
gate driving stops. This hysteresis provides stable driving at transient condition of start up and shut
down.
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2.3 PFC block
2.3.1 PFC gate driver (VGP)
VGP drives a gate of PFC, and the voltage is supplied by stabilized voltage source Vc2,10.2V.
Fig. 5 shows some examples of the drive circuit.
In typical circuits shown in A) and B), Select the small type Schottky Barrier Diode, not hard
recovery diodes. D1NS4 or M1FM3 (Shindengen) is recommended.
In case of using a MOSFET with large Qg, use PNP transistor as shown in Fig. 5 C).
A)
R2
Qa
Qb
VGP
B)
Q1
D1
D1
Qa
Q1
Qb
R1
VGP
R1
R2
R3
R3
CSP
CSP
Rcspdet
GND
C)
GND
Rcspdet
Q1
Qa
R1
Qb
R2
VGP
R3
CSP
Rcspdet
GND
Fig.5 PFC gate drive circuit
2.3.2 PFC output voltage control and over-voltage protection
PFC output voltage is stabilized by controlling the On-duty of PFC gate driving.
Shown in Fig.6, PFC output voltage is monitored by FBP, and is stabilized by feeding-back the
FBP voltage by comparison with internal reference voltage Vo(ref), 2.5V.
COMP controls charge and discharge so that FBP voltage becomes 2.5V, consequently PFC
output voltage becomes stable.
(FBP voltage<2.5V --> COMP capacitor charges. and FBP voltage>2.5V --> COMP capacitor
discharges.)
PFC has an over-voltage protective function to protect components (e.g. capacitors) from damage
due to excessive voltage. If FBP voltage exceeds Vfb(H), that is Vo(ref)×1.10, the gate driving
stops (not latch-stop).
Connect a capacitor of around 1000pF between FBP and GND close to the terminals for noise
reduction.
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Fig.6 PFC gate drive circuit
2.3.3 PFC phase compensation
COMP is feedback amplifier output terminal. Phase compensation is adjusted by capacitor of 0.11.0uF connected between COMP and GND.
Fig. 7 shows an example of the COMP phase compensation. For details of phase adjustment, refer
to section 3.2.
The relationship between VGP ON-time and COMP voltage is shown in Fig. 8.
Maximum ON-time is fixed as Ton(max) 27.5us. When COMP voltage decreases to 0.8V or less,
On-time becomes zero, consequently to prevent the increase of output voltage.
COMP
RCOMP
CCOMP2
CCOMP1
Fig.7 Example circuit connected with COMP
Fig.8 COMP VS ON Time
2.3.4 PFC critical conduction mode
PFC block adopts critical conduction mode. PFC MOSFET turns ON by detecting the voltage
across a control winding of main choke. Gate ON timing is determined by ZC signal as shown in
Fig.9.
Once VZC reaches ZC comparator threshold voltage(H) VZC(H), 1.55V, and then decreases
beyond ZC comparator threshold voltage(L) VZC(L), 0.55V, MOSFET turns ON by detecting the
negative edge.
This hysteresis (:VZC(H) – VZC(L)) provides the higher noise immunity.
Ton dead time of 800ns is adopted in order to prevent malfunction of MOSFET caused by ringing
voltage at the timing of gate-OFF.
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Fig.9 PFC block timing diagram (ZC)
Insert a limiting resistor between control winging and ZC. This resistance has following two roles.
1. Turn on the gate at the lowest point of the Drain-Source voltage of MOSFET.
2. The resistor limits the current on ZC to +/-5mA or less, that is maximum allowable current on
ZC.
2.3.5 PFC over current protection
PFC over current protection is provided by monitoring the CSP voltage determined by resistors .
Connected between source of PFC MOSFET and GND. MOSFET turns OFF by detecting CSP
voltage exceeding the over-current threshold voltage as shown in Fig.10.
To prevent malfunction of over-current protection caused by noise just after turn ON, Leading edge
blank time (LEB) is adopted.
Connect a capacitor of around 0.1uF close to CSP to prevent malfunctions due to noise.
Adding a resistor RCSP2 of around 10ohm is more effective for the prevention.
For designing the circuit, refer to section 3.4.
Fig.10 CSP circuit example and timing diagram
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2.3.6 PFC FBP open/short protection
If FBP voltage decreases to Vfb(L) 0.4V or less, PFC stops operation.
Therefore, if FBP is shorted circuit to GND, PFC safely stops operation.
PFC also stops operation on condition of FBP open circuit, as FBP voltage to zero.
2.3.7 PFC low input voltage protection
The MCZ5205SE does not directly monitor the input voltage. Therefore, if FBP voltage exceeds
0.4V even in low input voltage condition, PFC continues the operation.
However, MCZ5205SE has the limiting function for maximum ON-time internally fixed as 27.5us.
decreases output current to prevent the excessive stress on MOSFET or other components.
2.3.8 PFC output over voltage protection (light load)
At light load condition, the output voltage is stabilizes by narrowing the ON-time width of gate
driving. However, in the case where the output voltage increases even if the ON-time width reaches
the minimum set value, a function that the oscillation stops where COMP voltage decreases to
Vth(burst), 0.8V or less operates to prevent the over voltage of output.
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2.4 LLC block
2.4.1 LLC gate driver (VGL,VGH)
The gate drivers have 0.18A sourcing and 0.38A sinking current capability at Vc2=10.2V.
Typical example circuits are shown in Fig.11 A). When using a diode for discharging as shown in
Fig. 11 B) C), small type SBD(Schottky Barrier Diode). D1NS4(Shindengen) or
M1FM3(Shindengen) are recommended.
Fig.11 LLC Gate drive circuits
2.4.2 LLC Oscillator (FBL)
The timing of gate drive pulse VGL and VGH is determined by charging and discharging of a timing
capacitor Ct. (The timing capacitor Ct is connected with FBL.)
Gate outputs are ON during the period of Ct discharging. VGL and VGH are alternately outputted to
drive MOSFETs. During the time period of Ct charging, both VGL and VGH are simultaneously
OFF, called as Dead time (DT), to prevent simultaneously ON of MOSFETs.
FBL
FBL
FB
VGH
Ct
Rt
VGL
PC1
DT
DT
DT
DT
Fig.12 FBL timing diagram
The MCZ5205SE is the frequency and ON duty modulation type. The frequency modulates by FB
current across a current limiting resistor and ON-duty modulates according to the frequency as
shown in Fig. 13.
Larger dead time in light load condition secures ZVS (Zero Voltage Switching) over a wide
frequency range.
Minimum frequency (fmin) is determined by the value of Ct capacitor and Rt resistor.
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Maximum frequency (fmax) is determined by the value of Rt resistor and FB resistor.
Maximum frequency (fmax) of 300kHz or less is recommended in continual operating condition.
Soft start oscillation frequency (fss) varies depending on the value of Ct capacitance. (For details,
refer to characteristic diagram sheet.)
fr e qu e n c y vs du ty
fr e qu e n c y vs de adtime
50
800
Ct=1500pF
Ct=1200pF
Ct=1000pF
Ct=820pF
600
de ad t im e [ n s]
du t y [ % ]
45
40
Ct=1500pF
Ct=1200pF
Ct=1000pF
Ct=820pF
700
35
500
400
300
200
100
30
0
0
50
100
150
200
250
300
350
400
0
50
100
150
fre qu e n c y [ kHz]
200
250
300
350
400
fre qu e n c y [ kH z]
Fig.13 Duty/dead time vs frequency
2.4.3 Vsen brown-out protection (Vsen)
Vsen monitors the PFC output voltage for halting gate drive pulse, varying the frequency. UVLO
function avoids below-resonant state caused by Vbulk supply brown-out (quick decrease of input
voltage) or black-out (instantaneous interruption).
Timing diagram of Vsen brown-out protection is shown in Fig.14.
Vsen threshold voltage varies depending on AS mode ON or AS mode OFF. (See section
2.5.1)
(1) AS mode OFF : Vsen1(ss-reset) 3.55V / Vsen2(ss-reset) 3.25V
(2) AS mode ON : Vsen3(ss-reset) 1.00V / Vsen4(ss-reset) 0.90V
Hysteresis characteristics of Vsen prevents malfunction of Vsen due to the PFC output voltage
ripple.
[Power ON]
(a) Vsen voltage exceeds to 3.55V (AS mode OFF), SST capacitor starts charging.
(b) SST voltage exceeds to 0.6V, LLC gate output is starts.
SST is the soft start operated by gradual charging of SST capacitor. (For details of SST,
refer to section 2.4.4.)
[Power OFF]
(a) Vsen voltage decreases to 3.25V (AS mode OFF), SST capacitor starts discharging.
Frequency gradually increases.
(b) SST voltage decreases to 0.5V, LLC gate output stops.
Fig.14 Vsen output timing diagram
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2.4.4 Soft start function (SST)
LLC unit has soft-start function. The frequency gradually decreases according to charging of
capacitor connected between SST and GND. SST capacitor starts to be charged subject to
following two conditions.
(1) Vc1 voltage exceeds startup threshold voltage Vc1(start) 12.6V
(2) Vsen voltage exceeds 3.55V (at AS mode OFF) or 1.00V (at AS mode ON).
LLC gate output starts when SST voltage exceeds 0.6V, and then SST voltage is stabilized in 2.1V.
LLC gate output stops if SST voltage decreases to 0.5V or less.
For the relationship between SST voltage and frequency, refer to Fig. 15.
In addition, SST equips a timer latch function to decrease the stress on MOSFETs and/or
peripheral components in abnormal conditions.
For details, refer to section 2.4.8.
V S ST vs fre qu e n c y
500
Ct=1500pF
Ct=1200pF
Ct=1000pF
Ct=820pF
450
fr e qu e n c y [ kHz ]
400
350
300
250
200
150
100
50
0
0.4
0.6
0.8
1
1.2
1.4
1.6
1.8
2
2.2
V SS T [ V]
Fig.15 fss characteristics
2.4.5 Over current protection (CSL)
OCP (over current protection) operates by detecting peak current of resonant tank with pulse by
pulse at CSL. The detection threshold voltage is +/-0.350V (OCP input threshold voltage.) and is
low enough to minimize ineffective power loss of sensing resistor.
When CSL voltage exceeds OCP input threshold voltage, the gate output turns off and FBL
capacitor immediately starts charging and simultaneously charging SST capacitor, and
consequently output current is limited with pulse by pulse. (See Fig. 16.)
In next cycle just after OCP detection, FBL capacitor stops discharging when FBL bottom voltage
reaches 1.9V, thus, ON-time is limited to avoid below-resonant. (See Fig. 16.)
Note that di/dt threshold is about 1/6 of OCP threshold.
In order to prevent malfunction of OCP due to switching noise induced by MOSFET, OCP-mask
period is adopted as shown in Fig.16. During the OCP-mask period, OCP detection does not work
(period of FBL(TOP) to mask voltage, 2.8V).
A filter is built-in in CSL to prevent malfunction due to random noise, and the filter causes delay
time of around 200ns, that is the period of OCP detection to FBL starting to charge.
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Fig.16 Over current protection
2.4.6 di/dt mode protection (CSL)
The MCZ5205SE adopts pulse by pulse bidirectional di/dt protection to avoid below resonant mode
operation.
This function helps to avoid di/dt hard switching mode of MOSFETs in below ZVS boundary
operation.
When CSL voltage decreasing to 60mV, instantaneously FBL starts charging and gate drive turns
off. In negative current direction, it operates in the same manner with threshold voltage of -60mV.
Di / dt charge timer operation varies depending on AS mode ON or AS mode OFF. (See section
2.5.1)
(1) AS mode OFF : timer capacitor is not charged.
(2) AS mode ON : timer capacitor is charged.
During OCP-mask period (FBL(Top) to mask voltage, 2.8V), di/dt detection does not work to
prevent the malfunction due to noise.
FBL(Top)
di/dt masking time
mask voltage
2.8V
FBL(Bottom)
+0.06V
CSL 0V
-0.06V
VGH
VGL
Fig.17 di/dt protection
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2.4.7 di/dt protection at startup (Tss(3))
The MCZ5205SE has another di/dt protection at startup state to prevent the turn-off of gate drive
during period of body diode.
nd
On 2 VGL gate drive pulse, increase the ON-time width by decreasing the voltage to start
charging to 0.8V, consequently the gate drive turns-off after MOSFET current starts to flow.
The operation sequence is shown in Fig.18.
Fig.18 Tss(3) operating sequence
2.4.8 Timer latch protection (SST)
SST capacitor starts charging to either case below.
(1) OCP detection
(2) di/dt detection under AS mode ON
SST capacitor starts charging and continual abnormal condition keeps charging SST capacitor with
40uA constantly until SST voltage reaches 3.6V.
Once SST terminal voltage reaches 3.6V, gate output stops and SST capacitor start discharging
with 6uA constantly until SST voltage decreases to 0.35V. At the moment SST voltage reaches
0.35V, SST capacitor restarts charging with 28uA constantly, then, the soft start operation restarts.
Timer counter counts the number of times of 3.6V charging. If count is twice, output latches off.
If abnormal condition is eliminated and the controller recovers normal operation before the two
counts, SST capacitor starts discharging with 500uA and the counting result is reset.
To release the latch, restart with Vc1 less than 8.1V.
Latch counter is reset by either condition below.
(1) SST voltage reaches 2.1V by continual OCP detection.
(2) SS refreshing operation (Vc1 ON/OFF operation )
Timing chart is shown in Fig.19.
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Vc1
Vc1(start)
12.6V
Vc1(stop)
8.5V
Momentary
overload
over load mode
LLC ID
OCP
operation
Abnomaly detection signal
(IC internal)
OCP
operation
OCP
operation
Vtimer1 3.6V
2.1V
SST
1.5V
0.6V
Vtimer2 0.35V
Fig.19 SST operating sequence
2.4.9 High side floating Vcc (VB)
Floating High side gate drive voltage source (VB) is produced by stabilized Vc2 of 10.2V through
bootstrap circuit.
Recommended components at PFC output voltage of 400V are :
600V soft recovery type UFRD (ultra fast recovery diode) D1NK60 (Shindengen) or D1FK60
(Shindengen) for Dboot
16V, 0.1 to 1.0uF MCLL for Cboot
VB = Vc2 – Vf (Forward voltage of Dboot)
Cboot
0.1 uF
16V
Np
Dboot
D1NK60
D1FK60
VGH
VS
VB
VGL
PGND Vc2
MCZ5205SE
Fig.20 Boot Strapping configuration
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2.5 Others
2.5.1 Active Standby (AS)
The MCZ5205SE adopts active standby function contributing to loss reduction at light load
condition.
The example circuit is shown in Fig. 21.
Active standby function operates as below.
(1) AS mode ON : If AS voltage reaches 0.8V or less.
(2) AS mode OFF : If AS voltage reaches 1.0V or more.
(3) AS latch stop : If AS voltage reaches 4.5V or more.
To release the latch, restart with Vc1 of 8.1V or less.
Connect a capacitor of 1000 to 10000pF between AS terminals to prevent malfunction due to noise
even where AS function is not used. Note that AS voltage is set to 2.4V at AS load open.
Fig.21 AS mode circuit example
Following operations are provided after shifting to AS mode.
For detailed timing diagram, refer to Fig.22.
(1) LLC operating mode
(2) Vsen SS-reset threshold
(3) Timer charge (di/dt mode)
(4) PFC operating mode
: Switched from symmetric operation to asymmetric operation.
: Switched from 3.55V/3.25V to 1.0V/0.9V.
: Switched from ‘disable’ to ‘enable’.
: Switched from ‘Oscillation start’ to ‘Oscillation stop’.
Asymmetric operation can lower the peak current at light load condition and PFC oscillation stops
resulted in significant efficiency improvement at light load.
Vsen SS-reset threshold is automatically switched so that LLC oscillation continues even when the
PFC oscillation stops.
This function does not require any additional components.
In addition, AS mode ON enables charging SST capacitor at di/dt mode to provide OCP.
Soon after switching from AS mode ON to AS mode OFF, COMP starts charging and PFC starts
operation when COMP voltage reaches 0.8V or more. Then, FBP voltage exceeds 2V and Vsen
SS-reset threshold switches, LLC operation mode switches to symmetric mode (normal operation
mode).
AS has a latch stop function. If AS voltage exceeds AS latch stop voltage 4.5V,
PFC and LLC oscillation immediately stops unlike SST timer latch.
To release the latch, restart at Vc1 of 8.1V or less.
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Fig.22 AS mode sequence
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2.5.2 Over temperature protection (TSD)
The MCZ5205SE adopts over temperature protection. (TSD: thermal shut down) that stops the
oscillation of PFC and also LLC.
The operating condition is minimum 140 C. TSD is released on condition that the temperature
decreases by 40 C less than the temperature at which TSD operated.
2.6 Remarks
2.6.1 PFC stand-alone operation
Connect SST to GND to disable LLC.
2.6.2 LLC stand-alone operation
Connect COMP to GND to disable PFC.
To operate the LLC, Vsen>3.55V should be applied. (AS mode OFF)
If intending to start LLC operation at low input voltage, apply 3.55V or more on Vsen.
Vsen sink current should be limited to around 2mA.
Note that this operation should be for test purpose only. Do not switch on/off the Vbulk when Vsen
is externally biased to protect MOSFET from undesired heavy switching stress especially in
mid/heavy load condition.
If using the AS mode, FBP>2.0V should be applied.
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3
Peripheral components setting
3.1 PFC ZCS turn on timing (ZC)
PFC ON timing is determined by the current limiting resistor Rzc as shown in Fig. 23.
ZC sink/source current limit is +/-5mA. The resistor limits the current to +/-5mA or less.
The polarity of NC winding should be designed according to Fig. 23.
The voltage of NC winding at maximum input voltage must be greater than 1.55V. Design the
number of turns of Nc winding on the minimum integer according to an formula(1).
For example, in case of Vin (AC) max = 264V, Vo = 390V and Np=50 turns, Nc=4.5 is obtained
from formula, therefore it should be 5 turns. Estimated number of turns Np and Nc is 10:1. (Vin
max=264V cases.)
Nc  . 
Np
---- (1)
Vo  [   Vin( AC ) max]
If designing ZC current as + /-4mA (80% of maximum value), select a value of Rzc greater than the
value calculated from the formula (2) and (3) below.
A resistor of 700 ohms is built in ZC in series.
[Control winding pulse side]
Vo  Vin min    Nc   
R ZC  

 Np 
  
* 6V : ZC built-in zener voltage
  [ohm] ---- (2)
[Control winding minus side]
R ZC  
 Vin max    Nc 
 Np   
     
Fig.23 ZC limiting resistance
[Design example]
At Vo=400[V], Vin(AC)max=276[V] , Np=50[turns] , Nc=5[turns] ,
[Control winding pulse side]
 

  
   . [kohm]
    
    
R ZC  
[Control winding minus side]
R ZC  
       

   

    .[kohm]
Thus, ZC current limiting resistor RZC can be designed as 9.1kohm or greater.
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[ohm] ---- (3)
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3.2 PFC Phase compensation (COMP)
PFC feedback amp is trans-conductance amplifier
(gm amp).
Fig.24 shows a circuit for pfc phase compensation.
The value of Ccomp1, Ccomp2, and Rcomp are
calculated from following formula.
Finally adjust the values in actual circuit.
Determine the value of Ccomp1 and Ccomp2
according to formula (4), so that fc(cut off
frequency) is 20Hz or less.
fc 
u
[Hz] ・・・(4)
  Ccomp  Ccomp
Fig.24 COMP circuit
* 140u: the conductance of gm amp
Recommended value of Ccomp2 is around 0.1uF, and Rcomp is 4.7k to 47kohm respectively.
3.3 PFC output voltage / OVP threshold (FBP terminal)
PFC output voltage is determined by resistance divider (Refer to Fig. 25) and is obtained from
formula (5).
RFBPH value of about 2Mohm is recommended for PFC output voltage of 400V.
It is effective to connect a capacitor(CFBP) of around 1000pF between FBP and GND for avoiding
malfunction due to noise.
*Note :
Capacitance of CFBP may affect feedback characteristic and it is necessary to check and adjust
the value in actual operating circuit.
PFC Vo 
.  R FBPH  R FBPL 
[V] ----(5)
R FBPL
PFC OVP detection voltage is obtained from
formula (6).
Rated voltage of PFC output capacitor should
be selected with considering the detection
voltage pulse margin.
PFC Vo(OVP) 
Fig.25 FBP resistance divider
.  RFBPH  RFBPL 
RFBPL
----(6)
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3.4 PFC OCP setting (CSP)
PFC over current protection points is obtained from formula (7).
Ps is output power of PFC at the point on which over-current protection works.
n is efficiency of PFC.
R CSP  . 
η AC min 
Vo  AC min  . 
Vo
[ohm] ---- (7)
  Ps
3.5 LLC Brown out protection (Vsen)
Vsen SS reset threshold voltage is 3.55V/3.25V. (AS mode OFF)
Vsen SS reset threshold voltage is 1.0V/0.9V. (AS mode ON)
0.2uA is required for Vsen sink current and 20uA or more is recommended not to be affected by
the sink current.
If PFC output voltage is 400V, RvsenseH value of 2Mohm is recommended.
Connect a capacitor of 3300 to 10000pF between Vsen and GND for noise reduction.
Low side resistor, RvsenseL(init) is obtained from formula (8). Correct value of Vbulkreset threshold
is obtained from formula (9) by using actual value of RvsenseL.
Vbulk
input
RvsenseH
AS mode ON is obtained from formula (10).
SS Reset
RvsenseL
R VsenseL (init) 
Vc1&Vc2
UVLO
+
3300pF~
10000pF
Vc1
AS OFF
3.5V/3.2V
AS ON
1.0V/0.9V
Internal
Vref 5V
AS pin low : AS ON
Vbulkreset 
3.25  R VsenseH
Vbulkreset - 3.25
R VsenseH  R VsenseL
 3.25
R VsenseL
Vbulkreset (AS ON) 
Fig.26 Vsen internal circuit
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---- (8)
---- (9)
R VsenseH  R VsenseL
 0.9 ---- (10)
R VsenseL
Confidential
3.6 LLC Oscillator / Feedback (FBL)
LLC oscillator frequency is controlled by FBL. FBL sets dead time and soft start (fss), max
frequency (fmax) and min frequency (fmin).
3.6.1 dead time and soft start frequency (Ct capacitor)
Dead time and soft start frequency fss are determined by Ct capacitance. Select a Ct capacitance
from characteristic specification sheet.
Capacitance value of Ct of 820pF to 2200pF is recommended due to the relation with dead time.
3.6.2 Minimum frequency fmin (Rt resistance)
Minimum frequency fmin is determined by Rt resistance. (Connect between FBL and GND.)
Relation between Rt resistance and frequency is shown in characteristic specification sheet.
The estimated value of fmin is obtained from formula (11) to (13). tcharge is dead time and
tdischarge is turn on time of VGL/VGH. The exact value should be adjusted by using characteristic
specification sheet after checking the frequency at actual circuit operation.
VFBL(bottom) : 1.70V , VFBL(top) : 3.15V
*Note :
This value does not include overshooting and the response delay. Response delay is about 100ns.
Rt  Ct  VFBL ( top )
t ch arg e 
Rt  .      VFBL ( top )
t disch arg e  Rt  Ct  ln
fmin 
VFBL (bottom )
VFBL( top )

Rt  Ct  VFBL (bottom )
Rt  .      VFBL (bottom )
---- (12)

---- (13)
  t ch arg e  t disch arg e


3.6.3 Maximum frequency fmax (FB resistance)
Maximum frequency fmax is determined Rt resistance and FB resistance.
Check the characteristic specification sheet and determine the maximum frequency.
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---- (11)
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3.7 LLC Soft start / protection delay timer (SST)
Soft start charging current is 28uA. When SST voltage rises to 0.6V, gate output starts and timer
charging is enabled when SST voltage rises to 1.5V.
Soft start time tss is a time in which SST voltage rises from 0.6V to 1.5V.
Soft start time tss is obtained from formula (14).
t ss 
.  C ss
    
----(14)
Timer charging current is 40uA and timer threshold voltage is 3.6V.
Thus, Timer charging time ttimer is obtained from formula (15).
t timer 
.  C ss
    
----(15)
Timer discharge current is 6uA.
Timer intermittent operation time is obtained from formula (16)
t timer (int ermittent ) 
.  C ss
----(16)
    
3.8 LLC Current limiting / capacitive mode protection (CSL)
Rocpdet is calculated from desired OCP threshold Ipk by using formula (17).
Tentative value of RocpL(init) is obtained from formula(18) and correct value of Id is calculated
from formula(19) by using actual value of RocpL.
RocpH of 10 to 47 ohm is recommended considering OCP terminal sourcing current (95uA).
Id value should be determined with care to have enough margins in low input voltage / Pomax or
switching load condition.
Connect a noise reduction capacitor of around 1000pF to 10000pF between CSL to GND.
R ocp det 
0.35
Ipk
R ocpL (init ) 
Id 
[ohm] ・・・()
0.35  R ocpH
Ipk  R ocp det  0.35
R ocpH  R ocpL
R ocpL  R ocp det
Fig.27 CSL peripheral circuit
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 0.35
[ohm] ・・・ ()
[ A ] ・・・ ()
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3.9 PFC Output voltage and LLC Brown out protection
(In case of common sensing line for FBP and Vsen)
If Vsen and FBP have a common sensing line, circuit diagram is shown in Fig. 28.
RH value of 2Mohm is recommended in case of 400V of PFC output voltage.
1000pF is recommended as CVsen capacitance value and also CFBP capacitance value.
*Note :
Capacitance value of CVsen and CFBP is related to feedback characteristic, and it is necessary to
check and adjust the value by actual operating circuit.
PFC OUT
LLC INPUT
Value of RFBP is obtained from formula (20).
Value of RVsen is obtained from formula (21).
+
RFBP 
R vsen 
Fig.28 Vsen FBP voltage dividing resistors
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.  RH  Vbulkreset
PFC Vo  Vbulkreset  . ---- (20)
.  RH
 RFBP ----(21)
Vbulkreset  .
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4
Circuit diagram
4.1 Typical application circuit (LLC dual output)
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5
Dimension
5.1 SOP22 (MCZ5205SE)
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Notes:
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