Data Sheets - Skyworks Solutions, Inc.

DATA SHEET
SE2622L: 2.4 GHz, 256 QAM Power Amplifier
Applications
Description
 DSSS 2.4 GHz WLAN (IEEE 802.11b)
The SE2622L is a 2.4 GHz power amplifier designed for use in the
2.4 GHz ISM band for wireless LAN applications. The device
incorporates a power detector for closed loop monitoring of the
output power.
 OFDM 2.4 GHz WLAN (IEEE 802.11g)
 OFDM 2.4 GHz WLAN (IEEE 802.11n)
 OFDM 2.4 GHz WLAN (256 QAM)
The SE2622L includes a digital enable control for device on/off
control.
 Access points, PCMCIA, PC cards
 Integrated temperature compensated power detector
 Digital power amplifier enable pin (VEN)
N/U
 Small signal gain: 31 dB typical
N/C
 Single 3.3 V supply operation:
 18 dBm, EVM = 35 dB, 256 QAM OFDM
 20 dBm, EVM = 30 dB, 802.11n
 23 dBm, ACPR < 32 dBc, 802.11b
VCC
Features
GND
The SE2622L temperature compensated power detector is highly
immune to mismatch at its output with less than 1.5 dB of
variation with a 2:1 mismatch. The device package and pinout for
the 16-pin QFN are shown in Figure 1. A block diagram of the
SE2622L is shown in Figure 2.
16
15
14
13
12 GND
RF_IN 1
 Lead Free, Halogen Free and RoHS compliant
11 RF_OUT/VCC
EN 2
GND 3
10 N/U
N/U 4
9 GND
6
7
8
N/U
GND
5
DET
Skyworks Green™ products are compliant with
all applicable legislation and are halogen-free.
For additional information, refer to Skyworks
Definition of Green™, document number
SQ04-0074.
GND
 Small footprint QFN (16-pin, 3  3  0.9 mm) package
(MSL1, 260 C per JEDEC J-STD-020)
Y1122
Figure 1. SE2622L Pinout – 16-Pin QFN
(Top View)
VCC
EN
RF_IN
Bias
Input
Match
Inter-Stage
Match
Inter-Stage
Match
RF_OUT
Detector
VDET
ts042
Figure 2. SE2622L Block Diagram
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DATA SHEET • SE2622L: 2.4 GHZ, 256 QAM POWER AMPLIFIER
Electrical and Mechanical Specifications
Signal pin assignments and functional pin descriptions are
described in Table 1. The absolute maximum ratings of the
SE2622L are provided in Table 2. Recommended operating
conditions are specified in Table 3. Electrical specifications are
provided in Tables 4, 5, and 6.
Typical performance characteristics of the SE2622L are illustrated
in Figure 3.
Table 1. SE2622L Signal Descriptions
Pin
Name
Description
Pin
Name
Description
1
RF_IN
Power amplifier RF input; DC block required
10
N/U
Not used
2
EN
Digital pin used to power up and power down the IC
11
RF_OUT/VCC
Power Amplifier RF output / Final stage collector
supply
3
GND
Ground
12
GND
Ground
4
N/U
Not used
13
N/U
Not used
5,6
GND
Ground
14
N/C
No connect
7
DET
Analog power detector output
15
VCC
Stages 1, 2 collector supply
8
N/U
Not used
16
GND
Ground
9
GND
Ground
Paddle
GND
Exposed die paddle; electrical and thermal ground
Table 2. SE2622L Absolute Maximum Ratings (Note 1)
Minimum
Maximum
Units
Supply voltage on pins VCC
Parameter
VCC
Symbol
0.3
+4
V
Power amplifier enable
VEN
0.3
+3.6
V
+10
dBm
40
+150
C
500
V
RF input power, RF_OUT terminated into 50  match
RFIN
Storage temperature range
TSTG
Electrostatic discharge:
ESD
Human Body Model (HBM), Class 1B
Note 1: Exposure to maximum rating conditions for extended periods may reduce device reliability. There is no damage to device with only one parameter set at the limit and all other
parameters set at or below their nominal value. Exceeding any of the limits listed here may result in permanent damage to the device.
CAUTION: Although this device is designed to be as robust as possible, electrostatic discharge (ESD) can damage this device. This device
must be protected at all times from ESD. Static charges may easily produce potentials of several kilovolts on the human body
or equipment, which can discharge without detection. Industry-standard ESD precautions should be used at all times.
Table 3. SE2622L Recommended Operating Conditions
Parameter
Symbol
Minimum
Maximum
Units
Supply voltage
VCC
3.0
3.6
V
Supply voltage on pins VCC3
VCC3
3.0
3.6
V
Ambient temperature
TA
–40
85
C
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DATA SHEET • SE2622L: 2.4 GHZ, 256 QAM POWER AMPLIFIER
Table 4. SE2622L Electrical Specifications: DC Characteristics (Note 1)
(VCC = VCC3 = VEN = 3.3 V, TA = +25 C, as Measured on Evaluation Board, Unless Otherwise Noted)
Parameter
Symbol
Test Condition
Min
Typical
Max
Units
Supply current (Sum of Vcc0, Vcc,
Vcc3)
Icc-802.11b
POUT = +23 dBm, 11 Mbps CCK signal,
BT = 0.45, VCC = VCC3 = 3.3 V
250
mA
Supply current (Sum of Vcc, Vcc3)
Icc-802.11g
Pout = +19 dBm, 54 Mbps OFDM signal,
Vcc = Vcc3 = 3.3 V
175
mA
Supply current (Sum of Vcc, Vcc3)
ICQ
No RF
125
mA
Supply current
IOFF
VEN = 0 V, No RF
Logic high voltage
VENH
1.3
Logic low voltage
VENL
0
Input current logic high voltage
IENH
300
A
Input current logic low voltage
IENL
<1
A
Enable pin input impedance
ZEN
10
kΩ
2
Passive pull down
10
A
VCC
V
0.5
V
Note 1: Performance is guaranteed only under the conditions listed in this table.
Table 5. SE2622L Electrical Specifications: AC Characteristics (Note 1)
(VCC = VCC3 = VEN = 3.3 V, f = 2.45 GHz, TA = +25 C, as Measured on Evaluation Board, Unless Otherwise Noted)
Parameter
Frequency range
Symbol
Test Condition
f
Output power
POUT
Min
Typ
2400
OFDM, 256 QAM, HT40, 35 dB EVM
+18
OFDM, 256 QAM, HT20, 35 dB EVM
+19
OFDM, 256 QAM, HT40, 38 dB EVM
+16
OFDM, 64 QAM, HT20, 30 dB EVM
+20
CCK signal, BT = 0.045, Mask
+23
802.11n, HT20, all data rates, Mask
+23
802.11n, HT40, all data rates, Mask
+22
Output 1dB compression point
P1dB
Input return loss
S11
No modulation
Small signal gain
S21
PIN = 25 dBm
Gain Variation over band
S21
PIN = 25 dBm, f = 2400 to 2500 MHz
+24.5
26
Max
Units
2500
MHz
dBm
+27
dBm
12
10
dB
31
34
dB
1
dB
50
dBm/MHz
3f
50
dBm/MHz
Rise and fall time
tR, tF
0.5
s
Stability
STAB
POUT = +23 dBm, 54 Mbps OFDM signal,
64 QAM, VSWR = 6:1. All Phases
All non-harmonically related outputs less
than 50 dBc/100 kHz
Tolerance to output load mismatching
VSVR
POUT = +23 dBm, 54 Mbps OFDM signal,
64 QAM, VSWR = 10:1. All Phases
No damage
2f
Harmonic
POUT = +23 dBm, CW
Note 1: Performance is guaranteed only under the conditions listed in this table.
Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • sales@skyworksinc.com • www.skyworksinc.com
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DATA SHEET • SE2622L: 2.4 GHZ, 256 QAM POWER AMPLIFIER
Table 6. SE2622L Electrical Specifications: Power Detector Characteristics (Note 1)
(VCC = VCC3 = VEN = 3.3 V, f = 2.45 GHz, TA = +25 C, as Measured on Evaluation Board, Unless Otherwise Noted)
Parameter
Symbol
Test Condition
Min
Typical
0
Max
Units
P1dB
dBm
POUT detect range
PDR
Detector voltage
VDET
POUT = +23 dBm
1.04
V
Detector voltage
VDET
POUT = +21 dBm
0.87
V
Detector voltage
VDET
POUT = No RF
0.33
V
Output impedance
PDZOUT
2.3
k
DC load impedance
PDZLOAD
10
k
Note 1: Performance is guaranteed only under the conditions listed in this table.
1.2
1.1
1
0.8
0.7
0.6
2400
0.5
2450
0.4
2500
0.3
3
5
7
9
11
13
15
17
19
21
23
ts043
VDET (V)
0.9
25
Output Pow er (dBm )
Figure 3. SE2622L Power Detector Characteristics
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DATA SHEET • SE2622L: 2.4 GHZ, 256 QAM POWER AMPLIFIER
Evaluation Board Description
schematic diagram is provided in Figure 4. Table 7 provides the
Bill of Materials (BOM) list for Evaluation Board components.
The SE2622L-EK1 Evaluation Board is used to test the
performance of the SE2622L-R PA. A typical application
Header 6
J3
C4
1500 pF
VDET
1
2
3
4
5
6
C3
10 pF
C5
DNI
C6
DNI
VCC
VCC
VEN
VCC
N/C
1 RF_IN
VEN
GND
2 EN
RF_OUT/VCC
U1
SE2622L
3 GND
C2
DNI
N/U
4 N/U
GND
12
T2
T1
C15
15 pF
10
T3
T4
9
C17
1.0 pF
C16
1.5 pF
N/U
DET
J2
SMA
L3
1.5 nH
8
7
GND
GND
6
5
VCC
T5
11
C14
1.8 pF
DNI = Do Not Install
C11
4.7 μF
L2
4.7 nH
J1
SMA
RFIN
C10
DNI
13
N/U
14
15
VCC
GND
GND
16
Pad
C9
10 pF
C13
DNI
Notes:
VDET
R1
DNI
C19
DNI
T1: L = 0.9 mm, W = 0.424 mm
T1 length is measured from the outside
edge of the device lead to the middle
edge of the C14 land pad.
T5: L = 1.50 mm, W = 0.424 mm
T5 length is measured from the inside
edge of the C15 land pad to the inside
edge of the L3 land pad.
T2: L = 1.95 mm, W = 0.424 mm
T2 length is measured from the middle
edge of the C14 land pad to the inside
edge of the C15 land pad.
C17 is placed immediately after L3 with the
top land pad directly on the TX track.
T3: L = 1.04 mm, W = 0.424 mm
T3 length is measured from the outside
edge of the TX line to the inside
edge of the C14 land pad.
T4: L = 1.04 mm, W = 0.424 mm
T4 length is measured from the outside edge
of the TX line to the inside edge of the C16
land pad. C16 is centered on the middle edge of
the right land pad of C15.
L2 is placed 1.4 mm away from the device.
This dimension is measured from the outside
edge of the device lead to the middle edge of
the land pad of L2. The outer edge of the land
pad is aligned with the center of the TX track.
All trace dimensions are based on having a
ground plane immediately below the trace with
0.254 mm off FR406 as the substrate.
Y1118
Figure 4. SE2622L Evaluation Board Schematic
Circuit Design Considerations
The following design considerations are general in nature and
must be followed regardless of final use or configuration:
 Paths to ground should be made as short as possible.
 The ground pad of the SE2622L-R has special electrical and
thermal grounding requirements. This pad is the main thermal
conduit for heat dissipation. Since the circuit board acts as the
heat sink, it must shunt as much heat as possible from the
device. Therefore, design the connection to the ground pad to
dissipate the maximum wattage produced by the circuit board.
Multiple vias to the grounding layer are required. For further
information, refer to the Skyworks Application Note, PCB Design
Guidelines for High Power Dissipation Packages, document
number 201211.
 Bypass capacitors should be used on the DC supply lines. An RF
inductor is required on the VCC supply line to block RF signals
from the DC supply. Refer to the schematic drawing below for
further details.
 The RF lines should be well separated from each other with
solid ground between traces to maximize input-to-output
isolation.
Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • sales@skyworksinc.com • www.skyworksinc.com
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DATA SHEET • SE2622L: 2.4 GHZ, 256 QAM POWER AMPLIFIER
Evaluation Board Test Procedure
7. Enable the power supply.
1. Connect GND to all ground pins.
8. Enable the RF signal.
2. Connect a power supply to the VCC1, VCC2, and the two
RF_OUT pins.
9. Take measurements.
3. If desired, connect a voltage meter to the VDET pin.
CAUTION: If the input signal exceeds the rated power, the
Evaluation Board can be permanently damaged.
4. Connect a +3.3 V supply to EN pin.
5. Connect a signal generator to the RF signal input port. Set it to
the desired RF frequency at a power level of –30 dBm or less
to the Evaluation Board. DO NOT enable the RF signal.
NOTE: It is important to adjust the VCC voltage source so that the
target supply voltage (+5) is measured at the board. The high
collector currents will drop the collector voltage significantly if
long leads are used. Adjust the bias voltage to compensate."
6. Connect a spectrum analyzer to the RF signal output port.
Table 7. SE2622L Evaluation Board Bill of Materials
Component
U1
Part number
Description
Manufacturer
SE2622L
Skyworks
PCB
Z053-B
Skyworks
R1, C2, C5, C6, C10, C13, C19
DNI
C3, C9
10 pF
GRM1555C1H100JZ01
C4
1500 pF
GRM155R71H152KA01
Murata
C11
4.7 F
GRM188R60J475KE19
Murata
C14
1.8 pF
GRM1555C1H1R8CZ01
Murata
C15
15 pF
GRM1555C1H150JZ01
Murata
C16
1.5 pF
GRM1555C1H1R5CZ01
Murata
C17
1.0 pF
GRM1555C1H1R0CZ01
Murata
J1, J2
SMA
142-0701-851
Johnson
J3
HEADER 6
22-28-4063
Molex
L2
4.7 nH
LQG18HN4N7S00D
Murata
L3
1.5 nH
LQG15HN1N5S02D
Murata
Package Dimensions
The PCB layout footprint for the SE2622L is provided in Figure 5.
Typical case markings are shown in Figure 6. Package
dimensions for the 16-pin QFN are shown in Figure 7, and tape
and reel dimensions are provided in Figure 8.
Package and Handling Information
Because of its sensitivity to moisture absorption, instructions on
the shipping container label must be followed regarding exposure
to moisture after the container seal is broken, otherwise,
problems related to moisture absorption may occur when the part
is subjected to high temperature during solder assembly. The
SE2622L is capable of withstanding a Pb free solder reflow. Care
Murata
must be taken when attaching this product, whether it is done
manually or in a production solder reflow environment. If the part
is manually attached, precaution should be taken to insure that
the device is not subjected to temperatures above its rated peak
temperature for an extended period of time. For details on both
attachment techniques, precautions, and handling procedures
recommended by Skyworks, please refer to:
 Skyworks Application Note: Quad Flat No-Lead Module Solder
Reflow & Rework Information, Document Number QAD-00045.
 Skyworks Application Note: Handling, Packing, Shipping and
Use of Moisture Sensitive QFN, Document Number QAD-00044.
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2X 1.32
0.98
3X 0.61
1.32
1.27
3.40
0
3X 0.61
DATA SHEET • SE2622L: 2.4 GHZ, 256 QAM POWER AMPLIFIER
2X 1.40
3X 0.61
1.09 0.500 Typ
3.40
0
1.90
0
3X 0.61
1.27 0.25 Typ
0
1.40
1.55
0.60 Typ
1.90
Board Metal
3.50
3.40
0.20
0.500 Typ
0.500 Typ
0.35 Typ
0.65 Typ
0.65 Typ
1.70
3.50
0.70 Typ
13X ø0.254
Via Pattern
(Note 4)
0.20
3.40
0.25 Typ
Package
Outline
1.70
0.60 Typ
Stencil Pattern
(Note 5)
Solder Mask Pattern
(Note 6)
58% solder coverage
on center pad
Notes:
1.
2.
3.
4.
All dimensions are in millimeters.
Dimensions and tolerances according to ASME Y14.5M-1994.
Unless specified, dimensions are symmetrical about center lines.
Via hole recommendations: 0.025 mm Cu via wall plating (minimum),
via hole to be filled with conductive paste and plated over.
5. Stencil recommendations: 0.125 mm stencil thickness, laser cut
apertures, trapezoidal walls and rounded corners offer better paste release.
6. Solder mask recommendations: contact board fabricator for recommended
solder mask offset and tolerance.
Y1177
Figure 5. PCB Layout Footprint for the SE2622L
Pin 1
Indicator
Part Number
Lot Code
Y1121
Figure 6. Typical Case Markings
(Top View)
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DATA SHEET • SE2622L: 2.4 GHZ, 256 QAM POWER AMPLIFIER
2X
0.10 C
A
3.000 ± 0.050
1.700 ± 0.050
0.850 ± 0.050
See Note 3
B
0.30 X 45°
0.203 Ref
R0.075
Typ
3.000 ± 0.050
2X
0.500
1.700 ± 0.050
Seating
Plane
0.10 C
16X 0.230 ±0.050
0.10 M C A B
0.05 M C
0.10 C
0.000–0.050
16X 0.375 ±0.050
C
Top View
Bottom View
Notes:
1. Dimensions and tolerances according to ASME Y14.5M-1994.
2. All measurements are in millimeters.
Unless otherwise specified, the following values apply:
Decimal Tolerance:
Angular Tolerance:
X.X (1 place) ± 0.1 mm
± 0.5°
X.XX (2 places) ± 0.05 mm
X.XXX (3 places) ± 0.025 mm
3. Terminal 1 identification mark located within marked area.
4. Unless specified, dimensions are symmetrical about center lines.
Y1123
Figure 7. SE2622L 16-Pin QFN Package Dimensions
4.0 ± 0.1 (Note 2)
2.00 ± 0.051 (Note 1)
3.30 ± 0.10
Y
1.75 + 0.10
“A”
Ø1.5 Min.
12.00 ± 0.30
Ø1.55 + 0.05
(Note 1)
5.50 ± 0.10
0.30 ± 0.05
Ref. 3º
Pin #1
Y
8.00 ± 0.10
1.10 ± 0.10
Ref.
R0.25
3.30 ± 0.10
R
0. ef.
25
Section Y-Y
Notes:
1. Measured from centreline of sprocket hole to centreline of pocket.
2. Cumulative tolerance of 10 sprocket holes is ±0.20 mm.
3. Other material available.
4. All measurements are in millimeters unless otherwise stated.
View “A”
ts019
Figure 8. SE2622L Tape and Reel Dimensions
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DATA SHEET • SE2622L: 2.4 GHZ, 256 QAM POWER AMPLIFIER
Ordering Information
Model Name
SE2622L 2.4 GHz, 256 QAM Power Amplifier
Manufacturing Part Number
Evaluation Board Part Number
SE2622L
SE2622L-EK1
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