Data Sheets - Skyworks Solutions, Inc.

DATA SHEET
SE2433T: 2.4 GHz Power Amplifier
Applications
BOUT
B1
B2
PAEN
 ISM band applications
Bias and Control
 Smart meters
 In-home appliances
RFIN
 Smart thermostats
Input
Match
Match
 Remote controls
RFOUT
Y1601
Figure 1. SE2433T Block Diagram
Features
 Suitable for Zigbee®, Bluetooth® Low Energy, and Bluetooth 1.0
 High output power at +24 dBm
 Integrated interstage matching
Description
The SE2433T is a high-performance power amplifier, suitable for
Zigbee, Bluetooth Low Energy, and Bluetooth 1.0 applications.
The SE2433T is designed for ease of use and maximum flexibility,
with an integrated input match and a digital enable control for
Complementary Metal Oxide Semiconductor (CMOS) compatible
device on/off control.
 Integrated 50  input matching
 Fast switch ON/OFF time <1 μs
 2.0 V to 3.6 V supply operation
A functional block diagram of the SE2433T is provided in
Figure 1. Figure 2 shows the pinout for the SE2433T. Table 1 lists
the pin assignments and signal descriptions.
 Standby current <1 μA
 QFN package (12-pin, 2.5 x 2 x 0.55 mm,
(MSL1, 260 C per JEDEC J-STD-020)
PAEN
BOUT
DNC
Skyworks GreenTM products are compliant with
all applicable legislation and are halogen-free.
For additional information, refer to Skyworks
Definition of GreenTM, document number
SQ04–0074.
12
11
10
B2 1
9
RFOUT
B1 2
8
N/C
VCC1 3
7
N/C
6
N/C
5
GND
RFIN
4
ts366
N/C pins can be connected to ground,
but the DNC pin should be left floating
Figure 2. SE2433T Pinout – 12-Pin (Top View)
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DATA SHEET • SE2433T: 2.4 GHz POWER AMPLIFIER
Table 1. SE2433T Signal Descriptions (Note 1)
Pin
Name
Description
Pin
Name
Description
1
B2
Connect through bias resistor to Pin 11,
second stage bias.
7
N/C
Not connected.
2
B1
Connect through bias resistor to Pin 11,
first stage bias.
8
N/C
Not connected.
3
VCC1
Power supply. Connect to positive supply.
9
RFOUT
RF output port.
4
RFIN
Input port, Connect to 50 Ω single-ended RF
source, DC short to GND.
10
DNC
Do not connect.
5
GND
Ground. Connect to PCB ground.
11
BOUT
Bias supply, Connect to through bias resistors to
pins 1 and 2.
6
N/C
Not connected.
12
PAEN
PA enable, Connect to GPIO signal to control powerup status (see Table 7) .
Paddle
GND
Exposed die paddle; electrical and thermal ground;
Connect to PCB ground.
Note 1: The N/C pins can be connected to ground, but the DNC pin should be left floating.
Electrical and Mechanical Specifications
Logic characteristics and logic controls are provided in Tables 6
and 7, respectively.
Table 2 provides the absolute maximum ratings, and Table 3
shows the recommended operating conditions. Electrical
characteristics are shown in Tables 3, 4, and 5.
Typical performance characteristics are shown in Figures 3
through 14.
Table 2. SE2433T Absolute Maximum Ratings (Note 1)
Parameter
Supply voltage
Symbol
VCC
Control pin voltages
Minimum
Maximum
Units
–0.3
3.6
V
–0.3
3.6
V
Operating temperature
TOP
–0.3
85
°C
Storage temperature
TSTG
–40
125
°C
PIN_MAX
–40
+6
dBm
500
V
TX input power
Electrostatic discharge:
Human Body Model (HBM), Class 1B
ESD
Note 1: Exposure to maximum rating conditions for extended periods may reduce device reliability. There is no damage to device with only one parameter set at the
limit and all other parameters set at or below their nominal value. Exceeding any of the limits listed here may result in permanent damage to the device.
CAUTION: Although this device is designed to be as robust as possible, electrostatic discharge (ESD) can damage this device. This device
must be protected at all times from ESD. Static charges may easily produce potentials of several kilovolts on the human body
or equipment, which can discharge without detection. Industry-standard ESD precautions should be used at all times.
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DATA SHEET • SE2433T: 2.4 GHz POWER AMPLIFIER
Table 3. SE2433T Recommended Operating Conditions
Parameter
Symbol
Minimum
Typical
Maximum
Units
Ambient temperature
TA
–40
+25
+85
°C
Supply voltage on VCC
VCC
2.0
3.0
3.6
V
Table 4. SE2433T Electrical Specifications: DC Electrical Characteristics
(VCC = 3.0 V, TA = +25 C, as Measured on the Evaluation Board [De-Embedded to Device], All Unused Ports Terminated at 50 Ω,
Unless Otherwise Noted)
Parameter
Symbol
Condition
Min
Typ
Max
Unit
Total supply current
ICC-Tx20
ICC-Tx17
ICC-Tx10
POUT = +20 dBm
POUT = +18 dBm
POUT = +12 dBm
100
80
50
mA
mA
mA
Quiescent current
ICQ
No RF
25
mA
OFF supply current
ICC_OFF
PAEN = 0 V, No RF
1
μA
Table 5. Electrical Specifications: AC Electrical Characteristics
(VCC = 3.0 V, PAEN = 3.0 V, TA = 25 C, as Measured on the Evaluation Board [De-Embedded to Device], All Unused Ports
Terminated with 50 Ω, Unless Otherwise Noted)
Parameter
Symbol
Test Condition
Frequency
f
Output power (Notes 1 and 5)
POUT
VCC = 3.6 V, PIN = +5.5 dBm
VCC = 3.3 V, PIN = +5.5 dBm
VCC = 3.0 V, PIN = +2 dBm
VCC = 2.7 V, PIN = 0 dBm
VCC = 2.0 V, PIN = 0 dBm
VCC = 3.0 V, PIN = –11 dBm
Small signal gain high-power mode
S21
2400 to 2483 MHz
Small signal gain variation (Note 1)
∆S21
Gain variation across channels,
2400 to 2483 MHz
Min
Typ
2400
POUT = +20 dBm
Max
Unit
2483
MHz
dBm
dBm
dBm
dBm
dBm
dBm
+24.5
+23.0
+20.0
+19.0
+17.0
+10
19.5
22
24
dB
1
dBP-P
Harmonics (Notes 1, 2, and 6)
HD2, HD3
–42
dBm/MHz
Turn-on time (Note 3)
tR
800
ns
Turn-off time (Note 4)
tF
800
ns
Stability
STAB
CW, PIN = 0 dBm, 0.1 GHz to 20 GHz,
load VSWR = 6:1
Ruggedness
RU
CW, PIN = +6 dBm, load VSWR = 10:1
All non-harmonically related outputs less than
–42 dBm/MHz
No permanent damage
Note 1: 2400 to 2483 MHz.
Note 2: IEEE 802.15.4 source.
Note 3: From 50% of PAEN edge to 90% of final RF output power.
Note 4: From 50% of PAEN edge to 10% of final RF output power.
Note 5: OEVM = 1% max.
Note 6: Using recommended output matching network.
Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • [email protected] • www.skyworksinc.com
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DATA SHEET • SE2433T: 2.4 GHz POWER AMPLIFIER
Table 6. Logic Characteristics
(VCC = 3.0 V, TA = +25 C, as Measured on the Evaluation Board [De-Embedded to Device], All Unused Ports Terminated with 50 Ω,
Unless Otherwise Noted)
Max
Unit
Logic input high
Parameter
VIH
Symbol
Min
1.6
Typ
3.6
V
Logic input low
VIL
0
0.3
V
Logic input high
IIH
1
μA
Logic input low
IIL
1
μA
Table 7. Logic Controls
(VCC = 3.0 V, TA = +25 C)
Mode
Mode Description
PAEN
0
PA disabled
0
1
PA enabled
1
Note 1: Logic ‘0’ level compliant to VIL as specified in Table 6.
Note 2: Logic ‘1’ level compliant to VIH as specified in Table 6.
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DATA SHEET • SE2433T: 2.4 GHz POWER AMPLIFIER
Typical Performance Characteristics
(VCC = VDD = 3 V, TA = +25 C, f = 2.44 GHz, ZigBee Signal with Symbol Rate = 1 Msps, Unless Otherwise Noted)
25
POUT
250
ICC
20
Gain (dB)
150
10
ICC (mA)
200
15
18
100
5
2400 MHz
2440 MHz
50
0
-5
-22 -20 -18 -16 -14 -12 -10 -8
2483 MHz
16
0
-6
-4
-2
0
2
4
0
6
Input Power (dBm)
ts370
20
POUT (dBm)
22
300
30
2
4
6
8
10
12
14
16
18
20
22
24
26
18
20
22
24
26
18
20
22
24
26
Output Power (dBm)
ts369
Figure 3. POUT and ICC VS PIN, CW
Figure 4. Gain vs POUT, CW
21
300
2400 MHz
250
2440 MHz
ICC (mA)
Gain (dB)
200
20
2483 MHz
150
100
19
2400
2420
2440
2460
2480
ts372
ts371
50
0
2500
0
2
4
6
8
Frequency (MHz)
14
16
Figure 6. ICC vs POUT, CW
23
45
22
2400 MHz
2440 MHz
21
30
2483 MHz
20
Gain (dB)
35
25
20
18
17
10
16
5
15
ts373
15
0
2
4
6
8
10
12
14
16
18
Output Power (dBm)
Figure 7. PAE vs POUT, CW
20
22
24
26
VCC = 3.3 V
VCC = 3.6 V
VCC = 2.7 V
VCC = 3 V
19
VCC = 2 V
ts374
40
PAE (%)
12
Output Power (dBm)
Figure 5. Small Signal Gain vs Frequency, CW
0
10
14
0
2
4
6
8
10
12
14
16
Output Power (dBm)
Figure 8. Gain vs POUT and VCC, CW
Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • [email protected] • www.skyworksinc.com
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DATA SHEET • SE2433T: 2.4 GHz POWER AMPLIFIER
-30
-30
2440 MHz
2483 MHz
-50
-60
-70
-80
15
16
17
18
19
20
21
22
2400 MHz
-40
2440 MHz
2483 MHz
-50
-60
-70
ts376
3rd Harmonic (dBm/1MHz)
-40
ts375
2nd Harmonic (dBm/1MHz)
2400 MHz
-80
15
23
16
17
Output Power (dBm)
23
2441 MHz
-20
2480 MHz
-30
-40
-20
2480 MHz
-30
-40
11
12
13
14
15
16
17
18
19
20
21
22
23
-60
10
24
ts378
-50
ts377
-50
11
12
13
14
Output Power (dBm)
15
16
17
18
19
20
21
22
23
24
23
24
Output Power (dBm)
Figure 11. BT ACPR CH−2 vs POUT, BT-BDR-DH1
Figure 12. BT ACPR CH−3 VS POUT, BT-BDR-DH1
0
0
2402 MHz
-10
BT ACPR (dBm)
-20
2402 MHz
-10
2441 MHz
2480 MHz
-30
-40
2441 MHz
-20
2480 MHz
-30
-40
ts379
11
12
13
14
15
16
17
18
19
20
21
22
Output Power (dBm)
Figure 13. BT ACPR CH+2 vs POUT, BT-BDR-DH1
23
24
-60
10
ts380
-50
-50
11
12
13
14
15
16
17
18
19
20
21
22
Output Power (dBm)
Figure 14. BT ACPR CH+3 vs POUT, BT-BDR-DH1
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22
2402 MHz
-10
2402 MHz
2441 MHz
BT ACPR (dBm)
BT ACPR (dBm)
21
0
-10
BT ACPR (dBm)
20
Figure 10. 3rd Harmonic vs POUT, Zigbee
0
-60
10
19
Output Power (dBm)
Figure 9. 2nd Harmonic vs POUT, Zigbee
-60
10
18
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DATA SHEET • SE2433T: 2.4 GHz POWER AMPLIFIER
Evaluation Board Description
Evaluation Board Setup Procedure
The SE2433T Evaluation Board is used to test the performance of
the SE2433T FEM. The Evaluation Board schematic diagram is
shown in Figure 15. A reference design schematic is shown in
Figure 16. A photograph of the Evaluation Board is shown in
Figure 17. Component values for the SE2433T Evaluation Board
are listed in the Bill of Materials (BOM) in Table 8.
1. Connect (J1 and J2) to 50  instruments. Terminate all unused
ports (if applicable) with 50 .
Circuit Design Considerations
The following design considerations are general in nature and
must be followed regardless of final use or configuration:
 Paths to ground should be made as short as possible.
 The ground pad of the SE2433T has special electrical and
thermal grounding requirements. This pad is the main thermal
conduit for heat dissipation. Since the circuit board acts as the
heat sink, it must shunt as much heat as possible from the
device.
2. Connect the supply ground to Pin 7.
3. Connect 3.0 V to Pins 1, 3, and 6 of J3.
4. Apply an RF signal to connector J1 (RF_IN) to monitor the
2.4 GHz amplifier performance. Monitor the output power on
connector J2 (RF_OUT).
Caution: Care should be taken not to overdrive the amplifier by
applying too much RF on the input to the device. A
suitable starting input power for the device is
+20 dBm.
Therefore, design the connection to the ground pad to dissipate
the maximum wattage produced by the circuit board. Multiple
vias to the grounding layer are required.
NOTE: A poor connection between the ground pad and ground
increases junction temperature (TJ), which reduces the life
of the device.
6
VCC2
7
5
4
3
1
2
J3
VCC2
PAEN
BOUT 11
DNC 10
R2
1.5 kΩ
PAD 13
R1
1.2 kΩ
PAEN 12
VCC1
C8
100 nF
4
C5
10 pF
J1
L3
2.4 nH
RFOUT
8
N/C
7
N/C
RFIN
5
GND
6
N/C
B2
2
B1
3
VCC1
C3
100 nF
U1
L1
1.2 nH
9
1
VCC1
C9
10 pF
L2
1.2 nH
J2
SMA
C4
1.8 pF
C6
4.7 pF
C1
1.5 pF
C2
1.8pF
SE2433T
C10
100 pF
SMA
ts367
Figure 15. SE2433T Evaluation Board Schematic
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DATA SHEET • SE2433T: 2.4 GHz POWER AMPLIFIER
VCC2
PAEN
C8
100 nF
C5
10 pF
4
C3
100 nF
10
11
L3
2.4 nH
BOUT
DNC
RFOUT
N/C
N/C
B2
B1
VCC1
6
3
U1
9
L1
1.2 nH
L2
1.2 nH
RFOUT
8
7
C4
1.8 pF
C6
4.7 pF
C1
1.5 pF
C2
1.8 pF
RFIN
GND
N/C
2
5
1
VCC1
PAEN
13
R2
1.5 kΩ
PAD
R1
1.2 kΩ
12
C9
10 pF
SE2433T
C10
100 pF
RFIN
ts368
Figure 16. SE2433T Reference Design Schematic
Figure 17. SE2433T Evaluation Board
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DATA SHEET • SE2433T: 2.4 GHz POWER AMPLIFIER
Table 8. SE2433T Evaluation Board Bill of Materials
Component
Value
Manufacturer
Mfr Part Number
Package
Description
C1
1.5 pF
Murata
GRM1555C1H1R5CZ01
0402
Multilayer ceramic
C2, C8
100 nF
Murata
GRM1555R71C104KA88D
0402
Multilayer ceramic
C4, C2
1.8 pF
Murata
GRM1555C1H1R8CZ01
0402
Multilayer ceramic
C5, C9
10 pF
Murata
GRM1555C1H100JZ01
0402
Multilayer ceramic
C6
4.7 pF
Murata
GRM1555C1H4R7CZ01
0402
Multilayer ceramic
C10
100 pF
Murata
GRM1555C1H101JZ01
0402
Multilayer ceramic
J1, J2
SMA
Johnson Components
142-0701-851
End launch
SMA end launch straight jack receptacle – tab
contact
J3
7X1
Samtec
TSW-107-07-G-S
100 mil
L1, L2
1.2 nH
Murata
LQG15HN1N2S02D
0402
High-frequency multilayer
L3
2.4 nH
Murata
LQG15HN2N4S02D
0402
High-frequency multilayer
R1
1.2 k
Panasonic
ERJ2GEJ122
0402
Thick film chip resistor
R2
1.5 k
Panasonic
ERJ2GEJ152
0402
Thick film chip resistor
U1
SE2433T
Skyworks
SE2433T
QFN 2X2.5–12
802.15.4 PA
Package Dimensions
Package and Handling Information
The recommended land and solder patterns for the SE2433T are
provided in Figure 18. Typical part markings are shown in
Figure 19. Package dimensions for the are shown in Figure 20,
and tape and reel dimensions are provided in Figure 21.
Instructions on the shipping container label regarding exposure to
moisture after the container seal is broken must be followed.
Otherwise, problems related to moisture absorption may occur
when the part is subjected to high temperature during solder
assembly.
The SE2433T is rated to Moisture Sensitivity Level 1 (MSL1) at
260 C. It can be used for lead or lead-free soldering. For
additional information, refer to the Skyworks Application Note,
Solder Reflow Information, document number 200164.
Care must be taken when attaching this product, whether it is
done manually or in a production solder reflow environment.
Production quantities of this product are shipped in a standard
tape and reel format.
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DATA SHEET • SE2433T: 2.4 GHz POWER AMPLIFIER
2X 0.52
0.20 Typ
2X 0.00
0.400 Typ
2X 0.52
2.90
0.50 Typ
3X 0.28
2.40 1.05
0
3X 0.24
0
0.50
0
6X ø0.254
0.80
1.55
Via Pattern
(Note 4)
Board Metal
3.00
0.400 Typ
2.90
0.400 Typ
0.30 Typ
0.20 Typ
0.50 Typ
0.60 Typ
2.40
2.50 0.90
1.40
Solder Mask Pattern
(Note 6)
Package
Outline
2X 0.70
0.52 Typ
0.15
Stencil Pattern
(Note 5)
58% Solder Coverage
on Center Pad
Notes:
1. All dimensions are in millimeters.
2. Dimensions and tolerances per ASME 14.5M–1994.
3. Unless specified, dimensions are symmetrical about center lines.
4. Via hole recommendations:
0.025 mm Cu via wall plating (minimum), via holes to be filled with conductive paste and plated over.
5. Stencil recommendations:
0.10 mm stencil thickness, laser cut apertures, trapezoidal walls and rounded corners offer better paste release.
6. Solder mask recommendations:
Contact board fabricator for recommended solder mask offset and tolerance.
Figure 18. SE2433T Recommended Land and Solder Patterns
(Top View)
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Y2120
DATA SHEET • SE2433T: 2.4 GHz POWER AMPLIFIER
Pin 1
Indicator
Skyworks
Part Number
Lot Code
Y1604
Figure 19. Typical Part Markings
(Top View)
2.50 ± 0.05
A
0.55 ± 0.05
0.05 C
1.50 ± 0.05
0.152 Ref
B
0.30 x 45°
0.00–0.05
Pin 1
Indicator
Pin 1 Indicator
0.400
1.00 ± 0.05
2.00 ± 0.05
Exposed Pad
2X
0.05 C
2X
13X
0.05 C
4
C
Bottom View
Seating
Plane
Top View
Detail A
0.05 C
Notes:
1. All measurements are in millimeters.
2. Dimensions and tolerances according to ASME Y14.5M-2009.
3. Unless otherwise specified, the following values apply:
Decimal Tolerance:
Angular Tolerance:
X.X (1 place) ± 0.1 mm
±1/2°
X.XX (2 places) ± 0.05 mm
X.XXX (3 places) ± 0.025 mm
4. Coplanarity applies to the terminals as well as all other bottom surface metallization.
5. Dimension applies to metallized terminal. If terminal tip has a radius, dimension
should not be measured in that radius area.
6. Unless specified, dimensions are symmetrical about center lines.
2X R0.075
0.30 ± 0.05
Detail A
Scale: 2X
12 Places
0.20 ± 0.05
5
0.10 M C A B
0.05 M C
Y1602
Figure 20. SE2433T Package Dimensions
Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • [email protected] • www.skyworksinc.com
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DATA SHEET • SE2433T: 2.4 GHz POWER AMPLIFIER
2.0 ± 0.1 (Note 4)
1.75 ± 0.1
B
See Detail A
Min
2.7 ± 0.1
(Bo)
∅1.0
+0.05
12.00 ± 0.3
∅1.55
5.50 ± 0.1
(Note 4)
0.3 ± 0.05 (T)
4.0 ± 0.1 (Note 5)
3°
B
0.80 ± 0.1 (Ko)
2.20 ± 0.1
Pin 1
Indicator
0.2
fR
0
.1
f0
Detail A
Re
Notes:
1. Carrier tape must meet all requirements of Skyworks GP01-D233 procurement spec for tape and reel shipping.
2. Carrier tape: black conductive polystyrene.
3. Cover tape: transparent conductive material.
4. Measured from center line of sprocket hole to center line of pocket.
5. Ten-sprocket hole pitch cumulative tolerance: ±0.20 mm.
6. All measurements are in millimeters.
5
Direction of Feed
Re
Section B
8.00 ± 0.1
Y2121
Figure 21. SE2433T Tape and Reel Dimensions
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DATA SHEET • SE2433T: 2.4 GHz POWER AMPLIFIER
Ordering Information
Model Name
SE2433T: 2.4 GHz Power Amplifier
Manufacturing Part Number
SE2433T-R
Evaluation Board Part Number
SE2433T-EK1
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202411E • Skyworks Proprietary Information • Products and Product Information are Subject to Change Without Notice • June 29, 2015
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