Data Sheet - Skyworks Solutions, Inc.

DATA SHEET
SKY65137-11: Power Amplifier for 802.11a WLAN
Applications
Applications
Description
• IEEE802.11a WLAN enabled:
− access points
− media gateways
− set top boxes
− LCD TVs
Skyworks SKY65137-11 is a Microwave Monolithic Integrated
Circuit (MMIC) Power Amplifier (PA) with superior output power,
linearity, and efficiency. These features make the SKY65137-11
ideal for Wireless Local Area Network (WLAN) applications.
• Other broadband triple-play multimedia applications
Features
• Linear output power of +24 dBm for IEEE802.11a 64-QAM EVM
<2.5%
• High gain of 26 dB
• Output power detector: 20 dB dynamic range
The device is fabricated using Skyworks high reliability Indium
Gallium Phosphide (InGaP) Heterojunction Bipolar Transistor (HBT)
technology. The device is internally matched and mounted in a
20-pin, 6 x 6 mm Multi-Chip Module (MCM) Surface-Mounted
Technology (SMT) package, which allows for a highly
manufacturable low cost solution.
The device package and pinout for the 20-pin MCM are shown in
Figure 1. A block diagram of the SKY65137-11 is shown in
Figure 2.
• Power shutdown mode
• Superior gain flatness
• Internal RF match and bias circuits
• Small footprint, MCM (20-pin, 6 x 6 mm) SMT package (MSL3,
260 °C per JEDEC J-STD-020)
Figure 1. SKY65137-11 Pinout – 20-Pin MCM
(Top View)
Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • [email protected] • www.skyworksinc.com
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DATA SHEET • SKY65137-11 WLAN PA
Figure 2. SKY65137-11 Block Diagram
Table 1. SKY65137-11 Signal Descriptions
Pin #
Name
Description
Pin #
Name
Description
1
GND
Ground
11
VCC3
Stage 3 collector voltage
2
GND
Ground
12
N/C
No connection
3
PA_EN
Power shutdown enable
13
VCC2
Stage 2 collector voltage
4
VC_BIAS
Bias voltage
14
V_DET
Detector output signal
5
N/C
No connection
15
N/C
No connection
6
N/C
No connection
16
VCC1
Stage 1 collector voltage
7
N/C
No connection
17
GND
Ground
8
GND
Ground
18
RF_IN
RF input
9
RF_OUT
RF output
19
GND
Ground
10
GND
Ground
20
GND
Ground
Technical Description
The SKY65137-11 PA contains all of the needed RF matching and
DC biasing circuits. The device also provides an output power
detector voltage.
The SKY65137-11 is a three-stage, HBT InGaP device optimized
for high linearity and power efficiency. These features make the
device suitable for wideband digital applications, where PA
linearity and power consumption are of critical importance (e.g.,
WLANs).
The device has been characterized with the highest specified data
rates for IEEE802.11a (54 Mbps). Under these stringent test
conditions, the device exhibits excellent spectral purity and power
efficiency.
Electrical and Mechanical Specifications
Signal pin assignments and functional pin descriptions are
described in Table 1. The absolute maximum ratings of the
SKY65137-11 are provided in Table 2. Electrical specifications are
provided in Table 3.
Typical performance characteristics of the SKY65137-11 are
illustrated in Figures 3 through 19.
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DATA SHEET • SKY65137-11 WLAN PA
Table 2. SKY65137-11 Absolute Maximum Ratings (Note 1)
Parameter
Symbol
Minimum
Maximum
Units
RF output power (CW signal)
POUT
+28
dBm
Supply voltage, measured at pin of package
(Note 2)
VCC1, VCC2, VCC3,
VC_BIAS
5.5
V
PA_EN
3.8
V
Total supply current (ICC + IBIAS + IREF)
ICC_TOTAL
1200
mA
Storage temperature
TST
+125
°C
Junction temperature
TJ
Thermal resistance
ΘJC
–55
23
+150
°C
28
°C/W
Note 1: Exposure to maximum rating conditions for extended periods may reduce device reliability. There is no damage to device with only one parameter set at the limit and all other
parameters set at or below their nominal value. Exceeding any of the limits listed here may result in permanent damage to the device.
Note 2: Evaluation Board supply voltage levels can be different. Refer to the Evaluation Board schematic diagram in Figure 21.
CAUTION: Although this device is designed to be as robust as possible, Electrostatic Discharge (ESD) can damage this device. This device
must be protected at all times from ESD. Static charges may easily produce potentials of several kilovolts on the human body
or equipment, which can discharge without detection. Industry-standard ESD precautions should be used at all times.
Table 3. SKY65137-11 Recommended Operating Conditions
Parameter
Symbol
Minimum
Typical
Frequency range
f
RF output power
POUT
Supply voltage, measured at pin of package
(Note 1)
VCC1, VCC2, VCC3,
VC_BIAS
4.5
5.0
2.5
3.0
TC
–40
Units
5.9
GHz
+24
Power shutdown enable voltage @ PA_EN
Case operating temperature
Maximum
4.9
dBm
5.5
V
3.6
V
+85
°C
Note 1: Evaluation Board supply voltage levels can be different. Refer to the Evaluation Board schematic diagram in Figure 21.
Table 4. SKY65137-11 Electrical Specifications (1 of 2) (Note 1)
(VCC1 = VCC2 = VCC3 = VC_BIAS = 5 V, PA_EN = 3.3 V Static, TC = +25 °C, Test Frequency = 5.75 GHz unless otherwise noted)
Parameter
Symbol
Test Condition
Min
Typical
24.5
26
Max
Units
Using Continuous Wave Input Signals
Small signal gain
|S21|
Gain flatness over band
PIN = –30 dBm
From 5.6 to 5.9 GHz
Output power @ 1 dB compression
P1dB
Quiescent Current
IQ
No RF input
Input return loss
|S11|
PIN = –30 dBm
Detector voltage
VDET
POUT = +24 dBm
POUT = 0 dBm
Power added efficiency @ P1dB
PAE
@ P1dB
Shutdown mode current draw
1
+31
+32
420
0.50
0.10
26
dB
2
0.60
0.15
dBm
485
mA
–10
dB
0.70
0.20
V
V
2.5
μA
29
2.0
dB
%
Power-up time
TUP
500
ns
Power-down time
TDOWN
50
ns
Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • [email protected] • www.skyworksinc.com
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DATA SHEET • SKY65137-11 WLAN PA
Table 4. SKY65137-11 Electrical Specifications (1 of 2) (Note 1)
(VCC1 = VCC2 = VCC3 = VC_BIAS = 5 V, PA_EN = 3.3 V Static, TC = +25 °C, Test Frequency = 5.75 GHz, Unless Otherwise Noted)
Parameter
Symbol
Test Condition
Min
Typical
Max
Units
490
570
mA
+2.0
+2.5
dBm
Using IEEE802.11a Orthogonal Frequency Division Multiplexing Input Signal, Data Rate = 54 Mbps
Total supply current
ICC_TOTAL
EVM @ POUT = +24 dBm
POUT_EVM
POUT = +24 dBm
Static ruggedness
PA_EN static, 10:1 VSWR,
PIN = +10 dBm, 64 QAM
input signal
Pass, all
phases
–
Dynamic ruggedness
PA_EN pulsed, 4:1 VSWR,
PIN = +1 dBm, 64 QAM
input signal
Pass, all
phases
–
Note 1: Performance is guaranteed only under the conditions listed in this Table.
Typical Performance Characteristics
(VCC1 = VCC2 = VCC3 = VC_BIAS = 5 V, PA_EN = 3.3 V Static, TC = +25 °C, Test Frequency = 5.75 GHz, Unless Otherwise Noted)
Figure 3. Low Band EVM vs Output Power
Figure 4. High Band EVM vs Output Power
Figure 5. Low Band Detector Voltage vs Output Power
Figure 6. High Band Detector Voltage vs Output Power
Figure 7. Supply Current vs Output Power, Modulated Input
Figure 8. Supply Current vs Output Power, CW Input
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DATA SHEET • SKY65137-11 WLAN PA
Figure 9. EVM vs Output Power Over Voltage
Figure 10. EVM vs Output Power Over Temperature
Figure 11. Small Signal Gain vs Frequency Over Voltage
Figure 12. Small Signal Gain vs Frequency Over Temperature
Figure 13. Typical Spectral Response With 802.11a 65-QAM
OFDM Signal Over Output Power Level
Figure 14. Second Harmonic vs Output Power
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DATA SHEET • SKY65137-11 WLAN PA
Figure 15. Detector Voltage vs Output Power Over Temperature
Figure 16. Detector Voltage vs Output Power Over Voltage
Figure 17. Noise Figure vs Frequency
Figure 18. Start-Up Time
Figure 19. Power-Down Time
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DATA SHEET • SKY65137-11 WLAN PA
Evaluation Board Description
The SKY65137-11 Evaluation Board is used to test the
performance of the SKY65137-11 WLAN PA. An assembly drawing
for the Evaluation Board is shown in Figure 20 and the layer detail
is provided in Figure 21. Layer detail physical characteristics are
noted in Figure 22. A schematic diagram of the SKY65137-11
Evaluation Board is shown in Figure 23.
Step 3: Connect a signal generator to the RF signal input port. Set
it to the desired RF frequency at a power level of
–15 dBm or less to the Evaluation Board. DO NOT enable
the RF signal.
Step 4: Connect a spectrum analyzer or vector signal analyzer to
the RF signal output port. Add attenuation as needed to
protect the analyzer.
The following design considerations are general in nature and
must be followed regardless of final use or configuration
Step 5: On startup, turn on the VCC1, VCC2, VCC3, and VC_BIAS
lines first. Then turn on the PA_ENB line. Finally, turn on
the RF input. Make sure to keep the initial input power to
the PA at –20 dBm and gradually increase to the desired
output power level.
1. Paths to ground should be made as short as possible.
Step 6: Take measurements.
2. The ground pad of the SKY65137-11 has special electrical and
thermal grounding requirements. This pad is the main thermal
conduit for heat dissipation. Since the circuit board acts as the
heat sink, it must shunt as much heat as possible from the
device. Therefore, design the connection to the ground pad to
dissipate the maximum wattage produced by the circuit board.
Multiple vias to the grounding layer are required.
Step 7: On power down, turn off the RF input first. Then turn off
the PA_ENB line. Finally, turn off the VCC1, VCC2, VCC3,
and VC_BIAS lines.
Circuit Design Considerations
3. Bypass capacitors should be used on the DC supply lines. The
VCC lines may be connected after the RF bypass and
decoupling capacitors to provide better isolation between each
VCC line. Refer to Figure 23 for further details.
4. The RF lines should be well separated from each other with
solid ground in between traces to maximize input-to-output
isolation.
NOTE: A poor connection between the slug and ground increases
junction temperature (TJ), which reduces the lifetime of the
device. Refer to the Skyworks Application Note, “PCB
Design Guidelines for High Power Dissipation Packages”
(document number 201211) for further information.
Evaluation Board Test Procedure
Step 1: Connect a +5 V supply to the VCC1, VCC2, VCC3, and
VC_BIAS pins. Connect the PA_ENB pin to a separate
supply. If available, enable the current limiting function of
the power supply to 1000 mA.
Step 2: If desired, connect a voltage meter to the V_DET pin.
Package Dimensions
The PCB layout footprint for the SKY65137-11 is provided in
Figure 22. Package dimensions for the 20-pin MCM are shown in
Figure 23, and tape and reel dimensions are provided in
Figure 24.
Package and Handling Information
Since the device package is sensitive to moisture absorption, it is
baked and vacuum packed before shipping. Instructions on the
shipping container label regarding exposure to moisture after the
container seal is broken must be followed. Otherwise, problems
related to moisture absorption may occur when the part is
subjected to high temperature during solder assembly.
The SKY65137-11 is rated to Moisture Sensitivity Level 3 (MSL3)
at 260 °C. It can be used for lead or lead-free soldering. For
additional information, refer to Skyworks Application Note, PCB
Design and SMT Assembly/Rework Guidelines for MCM-L
Packages, document number 101752.
Care must be taken when attaching this product, whether it is
done manually or in a production solder reflow environment.
Production quantities of this product are shipped in a standard
tape and reel format.
Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • [email protected] • www.skyworksinc.com
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DATA SHEET • SKY65137-11 WLAN PA
Figure 20. Evaluation Board Assembly Drawing
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DATA SHEET • SKY65137-11 WLAN PA
Figure 21. SKY65137-11 Evaluation Board Layer Detail
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DATA SHEET • SKY65137-11 WLAN PA
Figure 22. Evaluation Board Layer Detail Physical Characteristics
Figure 23. SKY65137-11 Evaluation Board Schematic
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DATA SHEET • SKY65137-11 WLAN PA
Figure 24. PCB Layout Footprint For The SKY65137-11
Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • [email protected] • www.skyworksinc.com
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DATA SHEET • SKY65137-11 WLAN PA
Figure 25. SKY65137-11 20-Pin MCM Package Dimensions
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DATA SHEET • SKY65137-11 WLAN PA
Figure 26. SKY65137-11 20-Pin MCM Tape and Reel Dimensions
Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • [email protected] • www.skyworksinc.com
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DATA SHEET • SKY65137-11 WLAN PA
Ordering Information
Model Name
SKY65137-11 WLAN Power Amplifier
Manufacturing Part Number
SKY65137-11
Evaluation Board Part Number
TW17-D335-007
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