SKY66001-11 - Skyworks Solutions, Inc.

DATA SHEET
SKY66001-11: 2100 to 2200 MHz, +19 dBm Linear Power
Amplifier
Applications
Description
• Residential femtocells
The SKY66001-11 linear Power Amplifier (PA) is a fully matched
surface mount module developed for WCDMA applications
operating from 2100 to 2200 MHz. The device meets the stringent
spectral linearity requirements of WCDMA femtocell applications
with high power-added efficiency. An integrated directional
coupler eliminates the need for any external coupler.
• WCDMA, Band I
• Small cells
Features
• Small signal gain: 28.6 dB
• ACLR at POUT = +19 dBm: –51 dBc
• PA on/off control
• I/O impedance internally matched to 50 Ω
• Single DC supply: 3.3 V to 4.6 V
• Minimal number of external components required
• Small footprint MCM (10-pin, 3 x 3 mm) package
(MSL3, 260 °C per JEDEC J-STD-020)
The GaAs MMIC contains all active amplifier circuitry, which
includes input and interstage matching circuits. An output match
into a 50 Ω load, realized off-chip within the module package,
optimizes efficiency and power performance.
The SKY66001-11 is manufactured with Skyworks InGaP GaAs
HBT process, which provides for all positive voltage DC supply
operation and maintains high efficiency and good linearity. The
primary bias to the device can be supplied directly from any
suitable power supply with an output of 4.2 V. Power down is
achieved by setting the VEN pin to 0 V. No external supply side
switch is needed since typical “off” leakage is a few microamps
with full primary voltage supplied from the main power supply.
The SKY66001-11 is packaged in a 10-pin, 3 x 3 mm Multi-Chip
Module (MCM), which allows for a highly manufacturable low-cost
solution.
The 10-pin MCM package and pinout are shown in Figure 1. A
functional block diagram of the SKY66001-11 is shown in
Figure 2. Signal pin assignments and functional pin descriptions
are provided in Table 1.
Figure 1. SKY66001-11 Pinout – 10-Pin MCM
(Top View)
Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • [email protected] • www.skyworksinc.com
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DATA SHEET • SKY66001-11 LINEAR PA
Figure 2. SKY66001-11 Linear PA Block Diagram
Table 1. SKY66001-11 Signal Descriptions
Pin #
Name
Description
Pin #
Name
Description
1
VCC1
Input stage supply voltage
6
CPL_OUT
RF coupler output
2
RF_IN
RF input port
7
GND
Ground
3
GND
Ground
8
CPL_IN
RF coupler input
4
GND
Ground
9
RF_OUT
RF output port
5
VEN
Enable
10
VCC2
Output stage supply voltage
Technical Description
Electrical and Mechanical Specifications
The SKY66001-11 PA contains all of the needed RF matching and
DC biasing circuits. The device is a two-stage, HBT InGaP device
optimized for high linearity and power efficiency. These features
make the device suitable for wideband digital applications where
PA linearity and power consumption are of critical importance
(e.g., small cell and infrastructure applications).
The absolute maximum ratings of the SKY66001-11 are provided
in Table 2. The recommended operating conditions are specified
in Table 3 and electrical specifications are provided in Table 4.
Typical performance characteristics of the SKY66001-11 are
illustrated in Figures 3 to 11.
The device is designed for standard WCDMA modulated signals.
Under these stringent test conditions, the device exhibits excellent
spectral purity and power efficiency.
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DATA SHEET • SKY66001-11 LINEAR PA
Table 2. SKY66001-11 Absolute Maximum Ratings (Note 1)
Parameter
Symbol
Minimum
Maximum
Units
0
+4.6
V
Supply voltage (VCC1, VCC2)
VCC
Total supply current
ICC
700
mA
Logic control input voltage (VEN)
VCTL
–0.5
3.1
V
Case operating temperature (Note 2)
TC
–40
+85
°C
Storage temperature
TSTG
–55
+150
°C
Junction temperature
TJ
+150
°C
30
°C/W
500
1000
150
V
V
V
Thermal resistance
ΘJC
Electrostatic Discharge:
Charged Device Model (CDM), Class 4
Human Body Model (HBM), Class 1C
Machine Model (MM), Class A
ESD
Note 1: Exposure to maximum rating conditions for extended periods may reduce device reliability. There is no damage to device with only one parameter set at the limit and all other
parameters set at or below their nominal value. Exceeding any of the limits listed here may result in permanent damage to the device.
Note 2: Case operating temperature (Tc) refers to the temperature of the bottom ground pad.
CAUTION: Although this device is designed to be as robust as possible, Electrostatic Discharge (ESD) can damage this device. This device
must be protected at all times from ESD. Static charges may easily produce potentials of several kilovolts on the human body
or equipment, which can discharge without detection. Industry-standard ESD precautions should be used at all times.
Table 3. SKY66001-11 Recommended Operating Conditions
Parameter
Symbol
Minimum
Typical
2100
Maximum
Units
2200
MHz
Frequency range
f
Supply voltage (VCC1, VCC2) (Note 1)
VCC
4.0
4.2
4.6
V
Logic control input voltage:
Logic high
Logic low
VIH
VIL
1.35
0
1.80
3.10
0.5
V
V
PA enable current
IEN
<1
mA
Case operating temperature
TC
+85
°C
–20
+25
Note 1: Voltage levels measured at the pads of the package. The Evaluation Board supply voltage levels may be different. Refer to the Evaluation Board schematic diagram in this Data Sheet.
Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • [email protected]com • www.skyworksinc.com
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DATA SHEET • SKY66001-11 LINEAR PA
Table 4. SKY66001-11 Electrical Specifications (Note 1)
(VCC1 = VCC2 = +4.2 V, TC = +25 °C, f = 2140 MHz, Characteristic Impedance [ZO] = 50 Ω, VEN = “1,” Unless Otherwise Noted)
Parameter
Symbol
Test Condition
Min
Typical
Max
Units
Small signal gain
|S21|
CW, PIN = –20 dBm
27.0
28.6
dB
Input return loss
|S11|
CW, PIN = –20 dBm
14
17
dB
Quiescent current
ICQ
No RF
57
Operating current
ICC
CW, POUT = +19 dBm
Power-down current
IPD
VEN = “0”
Adjacent Channel Leakage Ratio
ACLR5
@5 MHz offset, WCDMA
test model 1, with 64
DPCH, POUT = +19 dBm
Error Vector Magnitude
EVM
POUT = +19 dBm
1.3
2.0
%
Harmonic suppression
2fo
3fo
CW, POUT = +19 dBm
–52
–52
–47
–46
dBc
dBc
3rd Order Output Intercept Point
OIP3
+19 dBm/tone, frequency
separation = 5 MHz
Input coupling factor
+37
64
mA
120
134
mA
0.1
10.0
μA
–51
–47
dBc
+40
dBm
CPLIN
–29
dB
Output coupling factor
CPLOUT
–18
dB
Stability (non-harmonic spurious)
VSWRSTABILITY
VSWR = 6:1
–70
dBc
Maximum ruggedness input power
PIN_RUG
VSWR = 6:1
–7
dBm
Note 1: Performance is guaranteed only under the conditions listed in this Table. Both pins 6 and 8 (CPL_OUT and CPL_IN, respectively) should be terminated with 50 Ω.
Typical Performance Characteristics
(VCC1 = VCC2 = +4.2 V, TC = +25 °C, f = 2140 MHz, Characteristic Impedance [ZO] = 50 Ω, VEN = “1,” Unless Otherwise Noted)
Figure 3. ACLR5 vs Output Power Over Voltage
Figure 4. Small Signal Gain Over Frequency and Temperature
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DATA SHEET • SKY66001-11 LINEAR PA
Figure 5. ACLR Over Frequency and Temperature
Figure 6. EVM Over Frequency and Temperature
Figure 7. Second Harmonic Suppression Over Frequency and
Temperature
Figure 8. Third Harmonic Suppression Over Frequency and
Temperature
Figure 9. OIP3 Over Frequency and Temperature
Figure 10. Output Coupling Factor Over Frequency and
Temperature
Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • [email protected] • www.skyworksinc.com
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DATA SHEET • SKY66001-11 LINEAR PA
Figure 11. Input Coupling Factor Over Frequency and Temperature
Evaluation Board Description
The SKY66001-11 Evaluation Board is used to test the
performance of the SKY66001-11 PA. A typical application
schematic diagram is shown in Figure 12. An assembly drawing
for the Evaluation Board is shown in Figure 13 and the layer detail
is provided in Figure 14.
shipping container label regarding exposure to moisture after the
container seal is broken must be followed. Otherwise, problems
related to moisture absorption may occur when the part is
subjected to high temperature during solder assembly.
Package Dimensions
The SKY66001-11 is rated to Moisture Sensitivity Level 3 (MSL3)
at 260 °C. It can be used for lead or lead-free soldering. For
additional information, refer to the Skyworks Application Note,
PCB Design and SMT Assembly/Rework Guidelines for MCM-L
Packages, document number 101752.
The PCB layout footprint for the SKY66001-11 is provided in
Figure 15. Typical case markings are shown in Figure 16.
Figure 17 shows the package dimensions for the 10-pin MCM,
and Figure 18 provides the tape and reel dimensions.
Care must be taken when attaching this product, whether it is
done manually or in a production solder reflow environment.
Production quantities of this product are shipped in a standard
tape and reel format.
Package and Handling Information
Since the device package is sensitive to moisture absorption, it is
baked and vacuum packed before shipping. Instructions on the
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DATA SHEET • SKY66001-11 LINEAR PA
Figure 12. SKY66001-11 Application Schematic
Figure 13. SKY66001-11 Evaluation Board Assembly Diagram
Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • [email protected] • www.skyworksinc.com
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DATA SHEET • SKY66001-11 LINEAR PA
Figure 14. SKY66001-11 Evaluation Board Layer Detail
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DATA SHEET • SKY66001-11 LINEAR PA
Figure 15. PCB Layout Footprint for the SKY66001-11 3 x 3 mm MCM
Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • [email protected] • www.skyworksinc.com
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DATA SHEET • SKY66001-11 LINEAR PA
Figure 16. Typical Case Markings
(Top View)
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DATA SHEET • SKY66001-11 LINEAR PA
Figure 17. SKY66001-11 10-Pin MCM Package Dimensions
Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • [email protected] • www.skyworksinc.com
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DATA SHEET • SKY66001-11 LINEAR PA
Figure 18. SKY66001-11 Tape and Reel Dimensions
Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • [email protected] • www.skyworksinc.com
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DATA SHEET • SKY66001-11 LINEAR PA
Ordering Information
Model Name
SKY66001-11 Linear PA
Manufacturing Part Number
SKY66001-11
Evaluation Board Part Number
EN40-D605
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