Data Sheets - Skyworks Solutions, Inc.

DATA SHEET
SMP1331-087LF: 45 W Surface Mount Series Connected
PIN Diode
Applications
 Low-loss, high-power switches
 Low-distortion attenuators
Features
 High RF power handling: 45 W
 Low thermal resistance: 26 °C/W
 Low series resistance: 0.50 Ω typical @ 100 mA
 Low total capacitance: 0.35 pF maximum @ 30 V
 Small QFN (2 × 2 mm) package
(MSL1, 260 °C per JEDEC J-STD-020)
Anode
(Pin 2)
Skyworks Green™ products are compliant with
all applicable legislation and are halogen-free.
For additional information, refer to Skyworks
Definition of Green™, document number
SQ04-0074.
Cathode
(Pin 1)
ts647
Figure 1. SMP1331-087LF Block Diagram
Description
The SMP1331-087LF is a surface mountable, low-capacitance
silicon PIN diode designed as a series connected PIN diode for
high-power, high-volume switch and attenuator applications from
10 MHz to beyond 6 GHz.
Typical resistance at 100 mA is 0.50 Ω and maximum
capacitance at 30 V is 0.35 pF. The combination of low
capacitance, low parasitic inductance, and nominal 30 μm
I-region width, makes the SMP1331-087LF useful in large signal
switches and attenuator applications.
The device has a 0.75 W dissipation power rating, which makes it
capable of handling up to 45 W @ 85 °C Continuous Wave (CW) in
a series-connected transmit/receive (T/R) switch.
Design information for high-power switches may be found in the
Skyworks Application Note, Design With PIN Diodes (document
number 200312).
A block diagram of the SMP1331-087LF is shown in Figure 1.
Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • [email protected] • www.skyworksinc.com
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DATA SHEET • SMP1331-087LF: 45 W SURFACE MOUNT SERIES CONNECTED PIN DIODE
Electrical and Mechanical Specifications
bias schematic, and Table 3 lists the Evaluation Board Bill of
Materials. Typical RF performance of the SMP1331-087LF using
the schematic shown in Figure 5 is summarized in Table 4 and
illustrated in Figures 6, 7, and 8.
The absolute maximum ratings of the SMP1331-087LF are
provided in Table 1. Electrical specifications are provided in
Table 2. Typical DC performance characteristics of the
SMP1331-087LF are illustrated in Figures 2, 3, and 4.
An assembly drawing for the Evaluation Board is shown in
Figure 9. The layer detail physical characteristics are provided in
Figure 10.
The SMP1331-087LF Evaluation Board is used to test the
performance of the SMP1331-087LF PIN Diode. Figure 5 shows a
Table 1. SMP1331-087LF Absolute Maximum Ratings
Parameter
Symbol
Forward current
Minimum
Maximum
Units
200
mA
IF
Reverse voltage
VR
200
V
Dissipated power @ 85 °C
PD
0.75
W
Peak pulse power dissipation @ 85 °C (10% duty cycle)
7.5
W
Operating temperature
TA
–55
+85
C
Storage temperature
TSTG
–55
+200
C
Junction temperature
TJ
–55
+175
C
Electrostatic discharge:
ESD
1100
5000
400
V
V
V
Charged-Device Model (CDM), Class 4
Human Body Model (HBM), Class 3A
Machine Model (MM), Class C
Note:
Exposure to maximum rating conditions for extended periods may reduce device reliability. There is no damage to device with only one parameter set at the limit and all other
parameters set at or below their nominal value. Exceeding any of the limits listed here may result in permanent damage to the device.
CAUTION: Although this device is designed to be as robust as possible, electrostatic discharge (ESD) can damage this device. This device
must be protected at all times from ESD. Static charges may easily produce potentials of several kilovolts on the human body
or equipment, which can discharge without detection. Industry-standard ESD precautions should be used at all times.
Table 2. SMP1331-087LF Electrical Specifications (Note 1)
(TA = +25 C, Unless Otherwise Noted)
Parameter
Symbol
Test Condition
Min
Typical
Max
0.80
Forward voltage
VF
IF = 10 mA
Reverse leakage current
IR
VR = 200 V
Series resistance
RS1
IF = 1 mA, f = 100 MHz
RS10
IF = 10 mA, f = 100 MHz
1.7
Ω
RS100
IF = 100 mA, f = 100 MHz
0.50
Ω
Total capacitance
CT30
VR = 30 V, f = 1 MHz
Series inductance
LS
Minority carrier lifetime
tL
9.0
0.26
V
10
μA
14.5
Ω
0.35
pF
0.37
nH
IF = 10 mA
600
ns
I region width
W
30
μm
Thermal resistance (Note 2)
JC
Junction-to-case
26
°C/W
Peak thermal resistance
P
Single, 1 μs pulse width,
junction-to-case (10% duty cycle)
2.6
°C/W
Note 1: Performance is guaranteed only under the conditions listed in this table.
Note 2: Assume a thermal resistance of 90 °C/W for the junction-to-bottom of the circuit board.
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Units
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DATA SHEET • SMP1331-087LF: 45 W SURFACE MOUNT SERIES CONNECTED PIN DIODE
Typical DC Performance Characteristics
(TA = 25 °C, Unless Otherwise Noted)
100.0
0.30
ts648
0.25
0.20
5
10
15
20
25
30
35
40
10.0
1.0
0.1
0.1
Reverse Voltage (V)
1
10
100
Forward Current (mA)
Figure 2. Capacitance vs Reverse Voltage
Figure 3. Series Resistance vs Forward Current
1.0
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
ts650
0
Forward Voltage (V)
Capacitance (pF)
0.35
ts649
Series Resistance (Ω)
0.40
1
10
100
Forward Current (mA)
Figure 4. Forward Voltage vs Forward Current
Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • [email protected] • www.skyworksinc.com
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DATA SHEET • SMP1331-087LF: 45 W SURFACE MOUNT SERIES CONNECTED PIN DIODE
IF = 50 mA
100 pF
22 nH
SMP 1331 -087LF
100 pF
100 pF
50 Ω
Term
50 Ω
Term
22 nH
100 pF
ts651
Figure 5. SMP1331-087LF Bias Schematic
Table 3. Evaluation Board Bill of Materials for EN33-D515-01_V3
Component
Value
Size
QTY
Manufacturer
Mfg. Part Number
Characteristics
C
100 pF
0402
4
Murata
GRM1555C1H101JZ01
5% C0G 50 V
L
22 nH
0402
2
Murata
HK100522NJ-T
5%
Table 4. Typical RF Performance @ 25 °C, f = 2.6 GHz, IF = 50 mA
Parameter
Insertion loss
Typical
Units
0.35
dB
16
dB
Isolation
12.2
dB
Max power (IF = 100 mA)
+47
dBm
Return loss
Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • [email protected] • www.skyworksinc.com
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DATA SHEET • SMP1331-087LF: 45 W SURFACE MOUNT SERIES CONNECTED PIN DIODE
Typical RF Performance Characteristics
(TOP = +25 °C, Characteristic Impedance [ZO] = 50 Ω, EVB Optimized with Bias Circuit, Unless Otherwise Noted)
0
+10
–10
|S-Parameters| (dB)
–10
–20
–30
–40
S11
S21
–60
0
1
2
3
4
–30
–40
S11
S21
–50
ts652
–50
–20
5
–60
6
ts653
|S-Parameters| (dB)
0
0
1
2
Frequency (GHz)
3
4
5
6
Frequency (GHz)
Figure 6. S-Parameter Magnitude vs Frequency (IF = 50 mA)
Figure 7. S-Parameter Magnitude vs Frequency (VREV = –30 V)
0
IF = 100 mA
IF = 50 mA
Insertion Loss (dB)
–0.1
–0.2
–0.3
–0.4
–0.6
15
ts654
–0.5
20
25
30
35
40
45
50
CW Input Power (dBm)
Figure 8. Insertion Loss vs CW Input Power (f = 2.6 GHz)
Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • [email protected] • www.skyworksinc.com
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DATA SHEET • SMP1331-087LF: 45 W SURFACE MOUNT SERIES CONNECTED PIN DIODE
Figure 9. SMP1331-087LF Evaluation Board
Cross Section
Name
Thickness (in)
Material
Top Soldermask
L1
(0.0028)
Cu foil
0.012 ± 0.0006
Rogers RO4003C Core
L2
(0.0014)
Cu foil
Laminate
(Note 1)
FR4 Prepreg
L3
(0.0014)
Cu foil
0.010 ± 0.0006
FR4 Core
(0.0028)
Cu foil
Laminate
Laminate
L4
Bottom Soldermask
Note 1: Adjust this thickness to meet total thickness goal of 0.062 ± 0.005 inches.
S2531
Figure 10. Board Layer Detail Physical Characteristics
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DATA SHEET • SMP1331-087LF: 45 W SURFACE MOUNT SERIES CONNECTED PIN DIODE
Package Dimensions
Package and Handling Information
The PCB layout footprint for the SMP1331-087LF is provided in
Figure 11. Typical part markings are shown in Figure 12.
Package dimensions for the SMP1331-087LF are provided in
Figure 13, and tape and reel dimensions are provided in
Figure 14.
Instructions on the shipping container label regarding exposure
to moisture after the container seal is broken must be followed.
Otherwise, problems related to moisture absorption may occur
when the part is subjected to high temperature during solder
assembly.
The SMP1331-087LF is rated to Moisture Sensitivity Level 1
(MSL1) at 260 C. It can be used for lead or lead-free soldering.
For additional information, refer to the Skyworks Application
Note, Solder Reflow Information, document number 200164.
Care must be taken when attaching this product, whether it is
done manually or in a production solder reflow environment.
Production quantities of this product are shipped in a standard
tape and reel format.
0.25
Part Outline
0.55
Exposed Soldering
Area, Typical
2X 0.80
Pin 1
Pin 2
0.35
0.80
Y0041
Figure 11. SMP1331-087LF PCB Layout Footprint
(Top View)
Pin 1
Indicator
Skyworks Part
Marking
RJ
1
1
2
2
Y2056
Figure 12. Typical Part Markings
(Top View)
Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • [email protected] • www.skyworksinc.com
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DATA SHEET • SMP1331-087LF: 45 W SURFACE MOUNT SERIES CONNECTED PIN DIODE
2
1
C
Pin 1
Indicator
2
Exposed Pad
Seating Plane
A
B
1.15 + 0.1/–0.15
0.0 – 0.05
Detail A
2
1.6 + 0.1/–0.15
2
1
0.05 C
2X
0.90 ± 0.1
2X
2X
0.10 C
0.05 C
Top View
0.20 Min.
3
0.20
0.08 C
Side View
Bottom View
0.4 ± 0.1
0.30 ± 0.05
5
0.10 M C A B
Detail A
All measurements are in millimeters.
Dimensioning and tolerancing according to ASME Y14.5M-1994.
Coplanarity applies to the exposed heat sink slug as well as the terminals..
Dimension applies to metalized terminal and is measured between 0.10 mm and 0.30 mm from terminal tip.
S1989
Figure 13. SMP1331-087LF Package Dimensions
∅1.50+ 0.10/–0.00
0.30 ± 0.05 (T)
Pin #1
4.00 ± 0.10
2.00 ± 0.05
4.00 (see Note 4)
1.75 ± 0.10
2.30 (Bo)
A
B
1.00 (Ko)
2.30 (Ao)
8.00 +0.30/–0.10
A
3.50 ± 0.05
B
∅1.00 Min.
R0.30 Typ.
B
Notes:
1. Carrier tape: black conductive polystyrene.
2. Cover tape material: transparent conductive HSA.
3. Cover tape size: 5.40 mm width.
4. Ten sprocket hole pitch cumulative tolerance = ±0.20 mm.
5. ESD surface resistivity is ≤1 x 108 Ohms/square per EIA, JEDEC
tape and reel specification.
6. Ao and Bo measurement point to be 0.30 mm from bottom pocket.
7. All measurements are in millimeters.
A
S1601
Figure 14. SMP1331-087LF Tape and Reel Dimensions
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June 8, 2015 • Skyworks Proprietary Information • Products and Product Information are Subject to Change Without Notice • 203589A
DATA SHEET • SMP1331-087LF: 45 W SURFACE MOUNT SERIES CONNECTED PIN DIODE
Ordering Information
Model Name
SMP1331-087LF: 45 W Surface Mount Series Connected PIN Diode
Manufacturing Part Number
SMP1331-087LF
Evaluation Board Part Number
SMP1331-087LF EVB
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