TCF03025U12002A

Engineering Specification
TCF03025U12002A
Features and Application
TCF03025U12002A series is a thin film common mode filter
designed to suppress common mode noise for high speed
differential data lines,shch as Display Port, e-SATA, USB3.0,
HDMI, MIPI and MHL.
ABSOLUTE MAXIMUM RATINGS
PARAMETER
PARAMETER
RATING
UNITS
Rated Voltage
VDC
5
V
-25~85
℃
Operating Temperature
Rated Current
IDC
100
mA
Lead Soldering
Temperature
TSOL
260(10sec.)
℃
ELECTRICAL CHARACTERISTICS
PARAMETER
Common Mode Impedance (at 100MHz)
MIN
TYP
7
12
Cut-off Frequency
10
UNITS
Ω
GHz
2.0
Ω
MΩ
UN Semiconductor Co., Ltd.
Revision December 18, 2014
17
8.5
DC Resistance
Insulation Resistance
MAX
www.unsemi.com.tw
1/5
@ UN Semiconductor Co., Ltd. 2014
Specifications are subject to change without notice.
Please refer to www.unsemi.com.tw for current information.
Engineering Specification
TCF03025U12002A
PART NUMBER CODE
TCF
03025
U
1
2
3
120 02
4
5
A □□
6
7
1: Product Type : TCF= Thin Film Common Mode Filter
2: EIA Dimension Code
3: Speed Identification Code
4: Impedance(at 100MHz):120=12Ω
5: Line Code:02=2 lines
6: Specialized Specification Code
7: Control code
TYPICAL CHARACTERISTIC
Fig1. IMPEDANCE vs. FREUQENCY CHARACTERISTICS
Fig2. INSERTION LOSS vs. FREUQENCY CHARACTERISTICS
Test Instrument : HP4291A Impedance/Material Analyzer
Test Instrument : Agilent E5071C ENAL-L Network Analyzer
UN Semiconductor Co., Ltd.
Revision December 18, 2014
www.unsemi.com.tw
2/5
@ UN Semiconductor Co., Ltd. 2014
Specifications are subject to change without notice.
Please refer to www.unsemi.com.tw for current information.
Engineering Specification
TCF03025U12002A
SHARES AND DIMENSIONS
Series
TCF
03025
A
0.85±0.05
B
0.65±0.05
C
D
E
F
0.4±0.05
0.27±0.1
0.2±0.1
0.5±0.1
CIRCUIT CONFIGURATION & LAYOUT PAD
UN Semiconductor Co., Ltd.
Revision December 18, 2014
www.unsemi.com.tw
3/5
@ UN Semiconductor Co., Ltd. 2014
Specifications are subject to change without notice.
Please refer to www.unsemi.com.tw for current information.
Engineering Specification
TCF03025U12002A
TAPE AND REEL SPECIFICATIONS / TAPING DIMENSIONS
Type : Paper Carrier
Unit : mm
A
8±0.1
B
3.5±0.05
C
1.75±0.05
D
2±0.05
E
4±0.1
F
1.55±0.05
L
1.04±0.03
W
0.78±0.03
T
0.60±0.03
REEL DIMENSIONS
UN Semiconductor Co., Ltd.
Revision December 18, 2014
www.unsemi.com.tw
4/5
@ UN Semiconductor Co., Ltd. 2014
Specifications are subject to change without notice.
Please refer to www.unsemi.com.tw for current information.
Engineering Specification
TCF03025U12002A
RECOMMENDED REFLOW SOLDERING
A
1st rising temperature
The normal to
30s to 60s
Preheating temperature
B
Preheating
140℃ to 160℃
C 2nd rising temperaturePreheating to 200℃
D Main heating
E
z
Regular cooling
60s to 120s
20s to 40s
if 220℃
50s～60s
if 230℃
40s～50s
if 240℃
30s～40s
if 250℃
20s～40s
if 260℃
20s～40s
200℃ to 100℃
1℃/s ～ 4℃/s
According to J-STD-020C
UN Semiconductor Co., Ltd.
Revision December 18, 2014
www.unsemi.com.tw
5/5
@ UN Semiconductor Co., Ltd. 2014
Specifications are subject to change without notice.
Please refer to www.unsemi.com.tw for current information.