SSG12N03

SSG12N03
12A, 30V, RDS(ON) 9m
N-Channel Enhancement Mode Power MOSFET
Elektronische Bauelemente
RoHS Compliant Product
A suffix of “-C” specifies halogen & lead-free
SOP-8
DESCRIPTION
The SSG12N03 provide the designer with the best
Combination of fast switching, ruggedized device design,
Ultra low on-resistance and cost-effectiveness.
B
L
FEATURES



D
M
Low on-resistance
Simple Drive Requirement
Double-N MosFET Package
A
C
N
J
H
G
K
E
F
MARKING CODE
REF.
12N03SC


A
B
C
D
E
F
G
= Date Code

PACKAGE INFORMATION
Package
MPQ
Leader Size
SOP-8
3K
13’ inch
Millimeter
Min.
Max.
5.80
6.20
4.80
5.00
3.80
4.00
0°
8°
0.40
0.90
0.19
0.25
1.27 TYP.
REF.
H
J
K
L
M
N
Millimeter
Min.
Max.
0.35
0.49
0.375 REF.
45°
1.35
1.75
0.10
0.25
0.25 REF.
S
D
S
D
S
D
G
D
ABSOLUTE MAXIMUM RATINGS (TA = 25°C unless otherwise specified)
Parameter
Symbol
Ratings
Unit
Drain-Source Voltage
VDS
30
V
Gate-Source Voltage
VGS
±20
V
TA = 25°C
Continuous Drain Current 1
TA = 70°C
Pulsed Drain Current 2
Single Pulse Avalanche Energy
3
Avalanche Current
Power Dissipation
4
Maximum Junction to Ambient 1
Maximum Junction to Case
1
Operating Junction & Storage Temperature Range
http://www.SeCoSGmbH.com/
23-Jan-2014 Rev. B
ID
12
8.2
A
IDM
52
A
EAS
130
mJ
IAS
34
A
PD
1.5
W
RθJA
85
°C / W
RθJC
50
°C / W
TJ, TSTG
-55~150
°C
Any changes of specification will not be informed individually.
Page 1 of 4
SSG12N03
12A, 30V, RDS(ON) 9m
N-Channel Enhancement Mode Power MOSFET
Elektronische Bauelemente
ELECTRICAL CHARACTERISTICS (Tj = 25°C unless otherwise specified)
Parameter
Symbol
Min.
Typ.
Max.
Unit
Test condition
Static
Drain-Source Breakdown Voltage
BVDSS
30
-
-
V
VGS=0V, ID=250μA
Gate-Threshold Voltage
VGS(th)
1
-
2.5
V
VDS=VGS, ID =250μA
Forward Transfer Conductance
Gfs
-
35
-
S
VDS=5V, ID=10A
Gate-Body Leakage
IGSS
-
-
±100
nA
VGS=±20V
Gate Resistance
RG
-
2.1
3.5
Ω
f=1.0MHz
-
-
1
μA
VDS=24V,VGS=0
-
-
5
μA
VDS=24V,VGS=0
-
-
9
-
-
13.5
Zero Gate Voltage Drain
Current
TJ=25°C
TJ=55°C
Drain-Source On-Resistance 2
IDSS
RDS(ON)
Total Gate Charge
Qg
-
10.6
-
Gate-Source Charge
Qgs
-
4
-
Gate-Drain (“Miller”) Charge
Qgd
-
4.1
-
Td(on)
-
5.8
-
Tr
-
61
-
Td(off)
-
23.6
-
Tf
-
7.6
-
Input Capacitance
Ciss
-
1127
-
Output Capacitance
Coss
-
194
-
Reverse Transfer Capacitance
Crss
-
77
-
Turn-On Delay Time
Rise Time
Turn-Off Delay Time
Fall Time
mΩ
VGS=10V, ID =10A
VGS=4.5V, ID =8A
nC
ID=10A
VDS=15V
VGS= 4.5V
nS
VDD=15V
ID=10A
VGS=10V
RG=1.5Ω
pF
VGS=0V
VDS=15V
f=1.0MHz
mJ
VDD=25V, L=0.1mH, IAS=20A
Avalanche Characteristics
Single Pulse Avalanche Energy
5
EAS
45
-
-
Source-Drain Diode
1.6
Continuous Source Current
IS
-
-
12
Pulsed Source Current
ISM
-
-
52
Forward On Voltage 2
VDS
-
-
Reverse Recovery Time
Trr
-
Reverse Recovery Charge
Qrr
-
2.6
A
VG=VD=0, Force Current.
1
V
IS=1A, VGS=0, TJ =25°C
14.1
-
nS
5.9
-
nC
IF=10A, dl/dt=100A/μs, TJ =25°C
Notes:
1 surface mounted on a 1 inch2 FR-4 board with 2OZ copper. 125℃/W when mounted on Min. copper pad.
2 The data tested by pulsed , pulse width≦300us , duty cycle≦2%
3 The EAS data shows Max. rating . The test condition is VDD=25V,VGS=10V,L=0.1mH,IAS=34A
4 The power dissipation is limited by 150℃ junction temperature
5 The Min. value is 100% EAS tested guarantee.
6 The data is theoretically the same as ID and IDM , in real applications , should be limited by total power dissipation.
http://www.SeCoSGmbH.com/
23-Jan-2014 Rev. B
Any changes of specification will not be informed individually.
Page 2 of 4
SSG12N03
Elektronische Bauelemente
12A, 30V, RDS(ON) 9m
N-Channel Enhancement Mode Power MOSFET
CHARACTERISTICS CURVE
http://www.SeCoSGmbH.com/
23-Jan-2014 Rev. B
Any changes of specification will not be informed individually.
Page 3 of 4
SSG12N03
Elektronische Bauelemente
12A, 30V, RDS(ON) 9m
N-Channel Enhancement Mode Power MOSFET
CHARACTERISTICS CURVE
http://www.SeCoSGmbH.com/
23-Jan-2014 Rev. B
Any changes of specification will not be informed individually.
Page 4 of 4