RClamp7522T

RClamp7522T
Ultra Low Capacitance TVS Array
PROTECTION PRODUCTS - RailClamp®
Description
PRELIMINARY
Features
RailClamp TVS arrays are ultra low capacitance ESD
protection devices designed to protect high speed data
interfaces. This series has been specifically designed to
protect sensitive components which are connected to
high-speed data and transmission lines from overvoltage caused by ESD (electrostatic discharge), CDE
(Cable Discharge Events), and EFT (electrical fast
transients).
The RClamp®7522T has a typical capacitance of only
0.25pF. This allows it to be used on circuits operating
in excess of 3GHz without signal attenuation. Each
device will protect two data lines lines and the voltage
supply bus in USB applications. Steering diodes serve
as backdrive protection on the VBus pin for operation
during power-down. The device may also be used to
protect up to three high speed data lines in applications such as camera data lines in mobile phones.
The RClamp7522T is in a 5-pin SLP1007N5T package.
It measures 1.0 x 0.7mm with a nominal height of
0.40mm. The innovative flow through package design
simplifies pcb layout and maximizes signal integrity on
high-speed lines.
The combination of small size, low capacitance, and high
level of ESD protection makes this device a flexible solution for applications such as camera data lines, MHL,
and USB interfaces.
®
‹ ESD protection for high-speed data lines to
IEC 61000-4-2 (ESD) ±25kV (air), ±15kV (contact)
IEC 61000-4-5 (Lightning) 5A (8/20μs)
IEC 61000-4-4 (EFT) 40A (5/50ns)
‹ Package design optimized for high speed lines
‹ Flow-Through design
‹ Very small PCB area: 0.7mm2
‹ Protects up to three high-speed lines
‹ Backdrive protection on VBus pin
‹ Low capacitance: 0.25pF (typical)
‹ Low ESD clamping voltage
‹ Solid-state silicon-avalanche technology
Mechanical Characteristics
‹
‹
‹
‹
‹
SLP1007N5T 5-pin package (1.0 x 0.7 x 0.40mm)
Pb-Free, Halogen Free, RoHS/WEEE Compliant
Lead finish: NiPdAu
Marking: Marking Code
Packaging: Tape and Reel
Applications
‹ USB 2.0 & USB 3.0
‹ Camera Data Lines
‹ MHL
Dimensions
Circuit Diagram
1.00
0.35 BSC
1
1
2
0.70
3
4
5
0.40
Nominal Dimensions in mm (Bottom View)
Revision 11/29/2011
Device Schematic
1
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RClamp7522T
PRELIMINARY
PROTECTION PRODUCTS
Absolute Maximum Rating
R ating
Symbol
Value
Units
Peak Pulse Power (tp = 8/20μs)
Pp k
100
Watts
Peak Pulse Current (tp = 8/20μs)
IP P
4
A
ESD p er IEC 61000-4-2 (Air)
ESD p er IEC 61000-4-2 (Contact)
VESD
+/- 25
+/- 15
kV
TJ
-55 to +125
°C
TSTG
-55 to +150
°C
Op erating Temp erature
Storage Temp erature
Electrical Characteristics (T=25oC)
Parameter
Symbol
Conditions
Reverse Stand-Off Voltage
VRWM
Any I/O to GN D
Reverse Breakdown Voltage
V BR
It = 1mA,
Any I/O to GN D
Reverse Leakage Current
IR
VRWM = 5.0V,
Any I/O to GN D
Clamping Voltage
VC
Clamping Voltage
Junction Capacitance
© 2011 Semtech Corp.
Maximum
Units
5
V
9
11
V
0.005
0.100
μA
IPP = 1A, tp = 8/20μs
Any I/O to GN D
15
V
VC
IPP = 4A, tp = 8/20μs
Any I/O to GN D
25
V
Cj
VR = 0V, f = 1MHz,
Any I/O to GN D
0.4
pF
2
Minimum
6.5
Typical
0.25
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RClamp7522T
PRELIMINARY
PROTECTION PRODUCTS
Typical Characteristics
Non-Repetitive Peak Pulse Power vs. Pulse Time
Pulse Waveform
110
10
Waveform
Parameters:
tr = 8µs
td = 20µs
100
Peak Pulse Power - P PP (kW)
90
PP
80
Percent of I
1
0.1
70
e-t
60
50
40
td = IPP/2
30
20
10
0
0.01
0.1
1
10
100
0
1000
5
10
15
Pulse Duration - tp (us)
30
1.2
25
1.0
20
0.8
15
10
Waveform
Parameters:
tr = 8µs
td = 20µs
0.6
0.4
0.2
f = 1 MHz
0.0
0
0
1
2
3
4
5
0
6
1
2
3
4
5
Reverse Voltage - VR (V)
Peak Pulse Current - IPP (A)
© 2011 Semtech Corp.
30
Normalized Capacitance vs. Reverse Voltage
Cj(VR)/Cj(VR=0V)
Clamping Voltage -VC (V)
25
Time (µs)
Clamping Voltage vs. Peak Pulse Current
(Between any I/O and Ground)
5
20
3
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RClamp7522T
PRELIMINARY
PROTECTION PRODUCTS
Typical Characteristics (Con’t)
Insertion Loss S21 - I/O to GND
CH1 S21
LOG
6 dB / REF 0 dB
1: - .03480 dB
800 MHz
2: - .04930 dB
900 MHz
0 dB
12
3
4
3: - .09650 dB
1.8 GHz
-6 dB
-12 dB
4: - .29330 dB
2.5 GHz
-18 dB
-24 dB
-30 dB
-36 dB
-42 dB
-48 dB
1
MHz
10
MHz
100
MHz
3
1
GHz GHz
STOP 3000. 000000 MHz
START . 030 MHz
USB 3.0 Eye Pattern with RClamp7522T
© 2011 Semtech Corp.
4
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RClamp7522T
PRELIMINARY
PROTECTION PRODUCTS
Typical Characteristics (Con’t)
ESD Clamping (+8kV Contact per IEC 61000-4-2)
250
Clamping Voltage (V)
200
150
100
50
0
-20
0
20
40
60
80
60
80
Time (ns)
ESD Clamping (-8kV Contact per IEC 61000-4-2)
0
Clamping Voltage (V)
-50
-100
-150
-200
-250
-20
0
20
40
Time (ns)
© 2011 Semtech Corp.
5
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RClamp7522T
PRELIMINARY
PROTECTION PRODUCTS
Typical Characteristics (Con’t)
TLP Characteristic
30
TLP Current (A)
25
20
RDYN: 0.90Ω
15
10
TLP
Parameters:
tp = 100ns
tr = 200ps
5
0
0
10
20
30
40
50
TLP Voltage (V)
© 2011 Semtech Corp.
6
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RClamp7522T
PRELIMINARY
PROTECTION PRODUCTS
Applications Information
Design Recommendations for USB Protection
The RClamp7522T is specifically designed for
protection of high-speed interfaces. They present
<0.40pF capacitance between any line and ground
while being rated to handle >±15kV ESD contact
discharges (>±25kV air discharge) as outlined in IEC
61000-4-2. Each device is in a leadless SLP package
that occupies a nominal PCB area of 0.7mm2. The pin
configuration is designed such that the traces can be
routed straight through the device. The narrow
package and flow-through design reduces discontinuity
and minimizes impact on signal integrity.
1
3
4
5
Figure 1 - Circuit Diagram
Design Recommendations for Camera Data Line
Protection
Figure 2 shows the recommended pin configuration for
protection of camera data lines in mobile phone
applications. The camera data lines are connected at
pins 3, 4, and 5. The ground connection is made at pin
1. The steering diodes at pin 1 serve to reduce the
overall line capacitance.
GND 1
Reset
NC
I2C-SDA
I2C-SDC
Design Recommendations for USB Protection
Figure 3 shows the recommended pin configuration for
protection of USB data lines. The voltage supply bus is
connected at pin 1. The steering diode pair at pin 1
serve as backdrive protection for operation during
power down. Data lines are connected at pins 3 and
4. Ground is connected at pin 5. The ground and data
line pins are interchangeable since the ground
connection contains a steering diode pair for reduced
capacitance.
Figure 2 - Pin Configuration (Top View)
for Camera Data Line Protection Applications
VBus 1
GND
NC
DD+
Figure 3 - Pin Configuration (Top View)
for USB 2.0 Applications
© 2011 Semtech Corp.
7
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RClamp7522T
PRELIMINARY
PROTECTION PRODUCTS
Applications Information
Recommended Mounting Pattern
Assembly Guidelines
The small size of this device means that some care
must be taken during the mounting process to insure
reliable solder joint. The table below provides
Semtech's recommended assembly guidelines for
mounting this device. The figure at the right details
Semtech’s recommended aperture based on the
below recommendations. Note that these are only
recommendations and should serve only as a starting
point for design since there are many factors that
affect the assembly process. The exact manufacturing parameters will require some experimentation to
get the desired solder application.
Assembly Parameter
Solder Stencil Design
Aper ture shape
Stencil Opening (200x413 mm)
.200
.175
.413
.388
.175
.950
R ecommendation
Laser cut, Electro-polished
1.000
Rectangular
All Dimensions are in mm.
Land Pad.
Solder Stencil Thickness
Solder Paste Type
Solder Reflow Profile
PCB Solder Pad Design
PCB Pad Finish
© 2011 Semtech Corp.
Land Pad (175x388 mm)
Stencil opening
Component
0.100 mm (0.004")
Type 4 size sphere or smaller
Per JEDEC J-STD-020
N on-Solder mask defined
OSP OR N iAu
8
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RClamp7522T
PRELIMINARY
PROTECTION PRODUCTS
Outline
OutlineDrawing
Drawing- -SO-8
SLP1007N5T
A
B
D
PIN 1
INDICATOR
(LASER MARK)
DIMENSIONS
MILLIMETERS
MIN NOM MAX
DIM
E
A
SEATING
PLANE
aaa C
C
A1
A2
b1xN
bbb
D/2
A
A1
A2
b
b1
D
E
e
L
N
aaa
bbb
0.37 0.40 0.43
0.00 0.02 0.05
(0.13)
0.125 0.15 0.175
0.15 0.175 0.20
0.90 1.00 1.10
0.60 0.70 0.80
0.35 BSC
0.225 0.25 0.275
5
0.08
0.10
C A B
e
1
2
LxN
E/2
N
bxN
e/2
bbb
C A B
NOTES:
1. CONTROLLING DIMENSIONS ARE IN MILLIMETERS (ANGLES IN DEGREES).
Land Pattern - SLP1007N5T
P/2
(C)
DIMENSIONS
G
DIM
C
G
P
X
Y
Z
Z
Y
P
X
MILLIMETERS
(0.563)
0.175
0.35
0.175
0.388
0.95
NOTES:
1. CONTROLLING DIMENSIONS ARE IN MILLIMETERS (ANGLES IN DEGREES).
2. THIS LAND PATTERN IS FOR REFERENCE PURPOSES ONLY.
CONSULT YOUR MANUFACTURING GROUP TO ENSURE YOUR
COMPANY'S MANUFACTURING GUIDELINES ARE MET.
© 2011 Semtech Corp.
9
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RClamp7522T
PRELIMINARY
PROTECTION PRODUCTS
Marking Codes
Ordering Information
72
Part Number
Qty per
Reel
Reel
Size
RClamp 7522T.TN T
10,000
7 Inch
RailClamp and RClamp are trademarks of Semtech Corporation.
Notes:
Marking will also include line matrix date code
Carrier Tape Specification
Device Orientation in Tape
72
72
72
72
72
Pin 1 Location
(Towards Sprocket Holes)
Contact Information for Semtech International AG
Taiw an Branch
Korea Branch
Tel: 886-2-2748-3380
Fax: 886-2-2748-3390
Semtech Sw itz erland GmbH
Japan Branch
Tel: 81-3-6408-0950
Fax: 81-3-6408-0951
Tel: 82-2-527-4377
Fax: 82-2-527-4376
Semtech Limited (U.K.)
Tel: 44-1794-527-600
Fax: 44-1794-527-601
Tel: 86-21-6391-0830
Fax: 86-21-6391-0831
Semtech France SARL
Tel: 33-(0)169-28-22-00
Fax: 33-(0)169-28-12-98
Semtech International AG is a wholly-owned subsidiary of
Semtech Corporation, which has its headquarters in the U.S.A.
Semtech Germany GmbH
Tel: 49-(0)8161-140-123
Fax: 49-(0)8161-140-124
© 2011 Semtech Corp.
10
Shanghai Office
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