EClamp2515K

EClamp2515K
ESD Protection Device
for T-Flash/MicroSD Interfaces
PROTECTION PRODUCTS - EMIClamp®
Description
PRELIMINARY
Features
The EClamp 2515K is combination EMI filter and line
termination device with integrated TVS diodes for use
on Multimedia Card interfaces. This device utilizes
solid-state silicon-avalanche technology for superior
clamping performance and DC electrical characteristics. They have been optimized for protection of TFlash/MicroSD interfaces in cellular phones and
other portable electronics.
The device consists of six circuits that include series
impedance matching resistors and pull up resistors as
required by the SD specification. TVS diodes are
included on each line for ESD protection. Each data
line has a typical capacitance of 22pF while the clock
line has a typical capacitance of only 12pF. An additional TVS diode connection is included for protection
of the voltage (Vdd) bus. A 45 Ohm termination resistor is included on the DAT0, DAT1, DAT2, DAT3, CMD,
and CLK lines. Pull up resistors of 15k Ohms are
included on DAT0, DAT1, DAT2, DAT3, and CMD lines.
The TVS diodes provide effective suppression of ESD
voltages in excess of ±15kV (air discharge) and ±12kV
(contact discharge) per IEC 61000-4-2.
The EClamp2515K is in a 16-pin SLP3313P16 package. It measures 3.3 x 1.3 x 0.50mm. The leads are
spaced at a pitch of 0.4mm and are finished with leadfree NiPdAu.
‹ EMI/RFI filtering and line termination with inte-
®
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grated ESD protection
ESD protection to IEC 61000-4-2 (ESD), ±15kV
(air), ±12kV (contact) on input lines
TVS working voltage: 5V
Termination Resistors: 45Ω
Pull Up Resistors: 15kΩ (4 each)
Typical capacitance on DAT and CMD lines: 22pF
(VR = 0V)
Typical capacitance on CLK line: 12pF (VR=0V)
Solid-state technology
Mechanical Characteristics
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SLP3313P16 16-pin package
Pb-Free, Halogen Free, RoHS/WEEE Compliant
Nominal Dimensions: 3.3 x 1.3 x 0.50 mm
Lead Pitch: 0.4mm
Lead finish: NiPdAu
Marking: Marking Code
Packaging: Tape and Reel
Applications
‹ T-Flash / MicroSD Interfaces
‹ MMC Interfaces
‹ CDMA, GSM, 3G Cell Phones
Package Dimensions
Pin Configuration
3.30
1
DAT1 In
2
1
16
DAT0 In
1.30
DAT0 Out
CLK In
CLK Out
Rup
0.40 BSC
Nominal Dimensions in mm (Bottom View)
Revision 02/7/2012
No Connect
Vdd In
Vdd (out)
CMD In
CMD Out
DAT3 In
DAT3 Out
DAT2 In
0.50
DAT1 Out
8
9
DAT2 Out
Pin Designation (Top View)
1
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EClamp2515K
PRELIMINARY
PROTECTION PRODUCTS
Pin Identification and Configuration
Pin
Symbol
Identification
1, 16
DAT1
Data line #1 inp ut/outp ut
2, 15
DAT0
Data line #0 Inp ut/Outp ut
3, 14
Clock
Clock line Inp ut/Outp ut
4
Ru p
15K Pull-up resistors
5, 12
Vdd
Power Sup p ly ESD Protection in/outp ut
6, 11
CMD
Command Line Inp ut/Outp ut
7, 10
DAT3
Data line #3 inp ut/outp ut
8, 9
DAT2
Data line #2 inp ut/outp ut
13
NC
N ot connected
Center tab
GN D
Ground connection
16 15 14 13 12 11 10 9
1
2 3 4 5 6 7
8
Pin Configuration (Top View)
Schematics & Component Values
Pin 5
(Vdd In)
15K Ω 15K Ω 15K Ω
Pin 1
(DAT 1 In)
Pin 2
(DAT 0 In)
Pin 3
(CLK In)
Pin 6
(CMD In)
Pin 7
(DAT 3 In)
Pin 8
(DAT 2 In)
45 Ω
45 Ω
Pin 16
(DAT 1 Out)
45 Ω
Pin 15
(DAT 0 Out)
45 Ω
Pin 14
(CLK Out)
45 Ω
Pin 11
(CMD Out)
45 Ω
Pin 10
(DAT 3 Out)
Pin 9
(DAT 2 Out)
Notes:
In = Connector (uSD Card) Side
Out = Protected (Host) IC Side
© 2012 Semtech Corporation
15K Ω 15K Ω
HOST IC
uSD Card
Pin 4
(Rup)
Pin 12
(Vdd Out)
Center Tab
2
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EClamp2515K
PRELIMINARY
PROTECTION PRODUCTS
Absolute Maximum Rating
Parameter
Symbol
Value
Units
Junction Temp erature
TJ
125
o
Op erating Temp erature
Top
-40 to +85
o
Storage Temp erature
TSTG
-55 to +150
o
Inp ut Pins 1, 2, 3, 5, 6, 7, 8, 12 (Contact)
Inp ut Pins 1, 2, 3, 5, 6, 7, 8, 12 (Air)
VESD
+/- 12
+/- 15
kV
Outp ut Pins 4, 9, 10, 11, 14, 15, 16 (Contact)
Outp ut Pins 4, 9, 10, 11, 14, 15, 16 (Air)
VESD
+/- 10
+/- 10
kV
C
C
C
ESD per IEC 61000-4-2
Electrical Characteristics (T = 25oC)
P ar am et er
S y m b ol
Con d i t i on s
T VS Reverse Stand-Off Voltage
VRWM
T VS Reverse Breakdown Voltage
V BR
It = 1mA
T VS Reverse Leakage Current
IR
VRWM = 3.0V
Series Resistors
R
Each Line
Mi n i mu m
6
Ty p i c a l
8
M ax i m u m
Units
5
V
10
V
0.1
μA
38
45
52
Ohms
12
15
18
k Ohms
DAT Pull Up Resistor
Rup
Dynamic Resistance
RDYN
tp = 100ns,
Measured from
4A to 16A
Total Capacitance
Cin
Input to Gnd,
Pins 1, 2, 6, 7, 8
VR = 0V, f = 1MHz
10
22
25
pF
Total Capacitance
Cin
Input to Gnd,
Pin 3, 5, 12
VR = 0V, f = 1MHz
6
12
15
pF
© 2012 Semtech Corporation
3
0.40
Ohms
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EClamp2515K
PRELIMINARY
PROTECTION PRODUCTS
Typical Characteristics (Con’t)
Capacitance vs. Reverse Voltage
(CLK & VDD)
Capacitance vs. Reverse Voltage
(DAT & CMD Lines)
25
14
f = 1 MHz
f = 1 MHz
12
Capacitance - Cj (pF)
Capacitance - Cj (pF)
20
10
15
8
6
10
4
5
2
DD149202
DD149202
0
0
0
1
2
3
Reverse Voltage - VR (V)
4
5
0
LOG
2
3
Reverse Voltage - VR (V)
4
5
Typical Insertion Loss S21 (Each DAT Line)
Typical Insertion Loss S21 (CLK Line)
CH1 S21
1
6 dB / REF 0 dB
CH1 S21
LOG
6 dB / REF 0 dB
1: - 7.5642 dB
800 MHz
1: - 11.665 dB
800 MHz
0 dB
2: - 8.1753 dB
900 MHz
0 dB
2: - 12.372 dB
900 MHz
-6 dB
3: - 14.004 dB
1.8 GHz
-6 dB
3: - 22.211 dB
1.8 GHz
1
-12 dB
2
-18 dB
-12 dB
4: - 18.668 dB
2.5 GHz
3
1
4
-24 dB
4: - 32.885 dB
2.5 GHz
2
-18 dB
5
5: - 19.850 dB
2.7 GHz
-24 dB
-30 dB
-30 dB
-36 dB
-36 dB
-42 dB
-42 dB
5: - 34.446 dB
2.7 GHz
3
5
-48 dB
1
MHz
10
MHz
100
MHz
-48 dB
3
1
GHz GHz
STOP 3000. 000000 MHz
START . 030 MHz
4
1
MHz
LOG
100
MHz
3
1
GHz GHz
STOP 3000. 000000 MHz
START . 030 MHz
Analog Crosstalk
CH1 S21
10
MHz
TLP Characteristic
20dB / REF 0 dB
30
25
0 dB
RDYN = 0.40
TLP Current (A)
-20 dB
-40 dB
-60 dB
-80 dB
20
15
10
TLP
Parameters:
tp = 100ns
tr = 200ps
-100 dB
5
-120 dB
0
-140 dB
0
5
10
15
20
TLP Voltage (V)
-160 dB
START . 030 MHz
© 2012 Semtech Corporation
STOP 3000. 000000 MHz
4
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EClamp2515K
PRELIMINARY
PROTECTION PRODUCTS
Typical Characteristics
ESD Clamping (+8kV Contact per IEC 61000-4-2)
DAT Lines
ESD Clamping (-8kV Contact per IEC 61000-4-2)
DAT Lines
0
12
10
-2
Voltage (V)
Voltage (V)
8
6
-4
-6
4
-8
2
0
-10
-20
0
20
40
60
80
-20
0
20
40
60
80
Time (ns)
Time (ns)
ESD Clamping +8kV Contact per IEC 61000-4-2)
CLK Line
ESD Clamping -8kV Contact per IEC 61000-4-2)
CLK Line
0
12
10
-2
Voltage (V)
Voltage (V)
8
6
-4
4
-6
2
0
-8
-20
0
20
40
60
80
-20
0
20
Time (ns)
40
60
80
Time (ns)
ESD Clamping +8kV Contact per IEC 61000-4-2)
VDD Line
ESD Clamping -8kV Contact per IEC 61000-4-2)
VDD Line
60
10
50
0
-10
Voltage (V)
Voltage (V)
40
30
-20
-30
20
-40
10
-50
0
-60
-20
0
20
40
60
80
-20
© 2012 Semtech Corporation
0
20
40
60
80
Time (ns)
Time (ns)
5
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EClamp2515K
PRELIMINARY
PROTECTION PRODUCTS
Applications Information
Device Connection
Figure 1 - Pin Identification and Configuration
(Top Side View)
The EClamp2515K is a microSD/T-Flash interface
device designed for use in cell phones and other
portable electronic devices. The EClamp2515K is
comprised of series and pull up resistors required on
the microSD interface. Each line also includes TVS
diodes for ESD protection.
The EClamp2515K is in a 16-pin SLP package. Electrical connection is made to the 16 pins located at the
bottom of the device. The device has a flow through
design for easy layout. Pin connections are noted in
Figure 1. A center tab serves as the ground connection. Recommendations for the ground connection are
given below.
Ground Connection Recommendation
Parasitic inductance present in the board layout will
affect the filtering and ESD performance of the device.
Ground loop inductance can be reduced by using
multiple vias to make the connection to the ground
plane. Figure 2 shows the recommended device
layout. The ground pad vias have a diameter of 0.008
inches (0.20 mm) while the two external vias have a
diameter of 0.010 inches (0.250mm). The internal
vias are spaced approximately evenly from the center
of the pad. The designer may choose to use more vias
with a smaller diameter (such as 0.005 inches or
0.125mm) since changing the diameter of the via will
result in little change in inductance.
© 2012 Semtech Corporation
DAT1 In
DAT0 In
CLK In
Rup
1
16
DAT1 Out
DAT0 Out
CLK Out
No Connect
Vdd In
Vdd (out)
CMD In
CMD Out
DAT3 In
DAT3 Out
DAT2 In
DAT2 Out
Figure 2 - Recommended Layout using Ground Vias
6
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EClamp2515K
PRELIMINARY
PROTECTION PRODUCTS
Outline
OutlineDrawing
Drawing- -SO-8
SLP3313P16T
A
D
B
DIM
PIN 1
INDICATOR
(LASER MARK)
E
A
SEATING
PLANE
aaa C
A2
C
A1
A
A1
A2
b
D
D1
E
E1
e
L
N
aaa
bbb
DIMENSIONS
INCHES
MILLIMETERS
MIN NOM MAX MIN NOM MAX
.018 .020 .022
.000 .001 .002
(.005)
.006 .008 .010
.128 .130 .133
.110 .114 .118
.049 .051 .054
.008 .012 .016
.016 BSC
.008 .010 .012
16
.003
.004
0.45 0.50 0.55
0.00 0.02 0.05
(0.13)
0.15 0.20 0.25
3.25 3.30 3.375
2.80 2.90 3.00
1.25 1.30 1.375
0.20 0.30 0.40
0.40 BSC
0.20 0.25 0.30
16
0.08
0.10
D1
1
2
LxN
E/2
E1
N
bxN
e
bbb
C A B
e/2
D/2
NOTES:
1. CONTROLLING DIMENSIONS ARE IN MILLIMETERS (ANGLES IN DEGREES).
2. COPLANARITY APPLIES TO THE EXPOSED PAD AS WELL AS THE TERMINALS.
Land Pattern - SLP3313P16T
P
X
DIMENSIONS
Z
G
H (C)
Y
DIM
C
G
H
K
P
X
Y
Z
INCHES
(.050)
.027
.012
.118
.016
.008
.023
.073
MILLIMETERS
(1.27)
0.69
0.30
3.00
0.40
0.20
0.58
1.85
K
NOTES:
1. CONTROLLING DIMENSIONS ARE IN MILLIMETERS (ANGLES IN DEGREES).
2. THIS LAND PATTERN IS FOR REFERENCE PURPOSES ONLY.
CONSULT YOUR MANUFACTURING GROUP TO ENSURE YOUR
COMPANY'S MANUFACTURING GUIDELINES ARE MET.
© 2012 Semtech Corporation
7
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EClamp2515K
PRELIMINARY
PROTECTION PRODUCTS
Marking Code
Ordering Information
2515K
PIN 1
INDICATOR
YYWW
Part Number
Qty per
Reel
R eel Size
EClamp 2515K.TCT
3000
7 Inch
EMIClamp and EClamp are trademarks of Semtech Corporation
YYWW = Date Code
Tape and Reel Specification
2515K
YYWW
2515K
YYWW
2515K
YYWW
Pin 1 Location (Towards Sprocket Holes)
User Direction of feed
Device Orientation in Tape
A0
1.51 +/-0.10 mm
B0
K0
3.51 +/-0.10 mm
0.66 +/-0.10 mm
Tape
Width
B, (Max)
D
D1
12 mm
8.2 mm
(.476)
1.5 + 0.1 mm
- 0.0 mm
(0.59 +.005
- .000)
1.0 mm
±0.05
(.039)
E
1.750±.10
mm
(.069±.004)
F
K
(MAX)
P
P0
P2
T(MAX)
W
5.5±0.05
mm
(.217±.002)
4.5 mm
(.177)
4.0±0.1
mm
(.157±.004)
4.0±0.1
mm
(.157±.004)
2.0±0.05mm
(.079±.002)
0.4 mm
(.016)
12.0 mm
+ 0.3 mm
- 0.1 mm
(.472±.012)
Contact Information
Semtech Corporation
Protection Products Division
200 Flynn Road, Camarillo, CA 93012
Phone: (805)498-2111 FAX (805)498-3804
© 2012 Semtech Corporation
8
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