TS31023/223 High Input Voltage Linear Regulator TRIUNE PRODUCTS Features Description • Wide input supply operating range TS31023 : 5V-16V TS31223 : 5V-36V The TS31x23 high voltage linear regulator consists of a low power amplifier with a high voltage p-channel pass gate. • Adjustable output voltage from 1.25V to VIN - Vdropout • • 60mA output current capability Enable control function The linear regulator has a wide operating range, and is ideal for systems that may have large voltage transients and require the output load to remain regulated. An analog current limit is used to limit output current and protect the regulator from external short circuits. Applications • • • • • • Set-top Boxes Automotive Industrial Medical Energy harvesting systems Wireless Power Summary Specification • • Ambient operating temperature 0C to 85C Packaged in a 8pin DFN (2x2) Typical Application Circuit TS31023/223 Final Datasheet March 19, 2015 Rev 1.1 www.semtech.com 1 of 15 Semtech Proprietary & Confidential Pin-out Configuration Pin # Pin Symbol I/O/P Description 1 GND P Ground 2 VOUT O Regulated Output Voltage 3 N/C No Connect 4 N/C No Connect 5 N/C No Connect 6 FB I Feedback Voltage 7 VIN P Input Voltage 8 EN I ENABLE Input Absolute Maximum Ratings Over operating free–air temperature range unless otherwise noted(1,2) Unit VIN -0.3 to 18 (TS31023) -0.3 to 40 (TS31223) V VOUT -0.3 to 18 (TS31023) -0.3 to 40 (TS31223) V EN, FB -0.3 to 6.0 V 2 kV Electrostatic Discharge – Human Body Model Maximum junction temperature, TJ Storage temperature range, Tstg Lead Temperature (soldering, 10 seconds) 150 O C -65 to 150 O 260 O C C Note 1: Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not implied. Exposure to absolute–maximum–rated conditions for extended periods may affect device reliability. Note 2: All voltage values are with respect to network ground terminal. Thermal Characteristics Package DFN θJA (OC/W) θJC (OC/W) (See Note 4) (See Note 5) 8 pin 73.1 10.7 Note 4: This assumes a FR4 board only. Note 5: This assumes a 1oz. Copper JEDEC standard board with thermal vias. See Exposed Pad section and application note for more information. TS31023/223 Final Datasheet March 19, 2015 Rev 1.1 www.semtech.com 2 of 15 Semtech Proprietary & Confidential Recommended Operating Conditions Parameter Min Max Units Unregulated Supply Input Voltage (VIN) 5 16 (TS31023) 36 (TS31223) V Enable Input (EN) 0 5 V Regulated Supply Output Voltage (VOUT) 1.25 VIN - Vdropout V Operating Junction Temperature, TJ -40 125 C O Electrical Characteristics (T=25OC unless otherwise specified) Electrical characteristics, VIN = 12V, TJ = 25C, unless otherwise noted Parameter Symbol Conditions Input Supply Voltage VIN Output Voltage Min. TS31023 TS31223 VOUT Max. Units 5 5 16 36 V V 1.25 VIN Vdropout V Feedback Voltage FB Output Bypass Capacitor COUT Disabled Current Ioff(VIN) EN=0V, VIN=12V 1 uA Quiescent Current Iqq(VIN) EN=5V, IOUT = 0 220 uA Load Capability 1.10 1.20 1.30 V 1 2.2 4.7 uF IOUT DC Line Regulation (TS31023) DC Line Regulation (TS31223) DC Load Regulation (TS31023) Current Limit TS31023/223 Final Datasheet March 19, 2015 VIN = 12V Typ. VLine VLoad ILimit Rev 1.1 60 mA VIN = 5.5V to 16V, VOUT=5.0V, IOUT = 5mA 0.1 0.6 % VIN = 5.5V to 36V, VOUT=5.0V, IOUT = 5mA 0.1 0.6 % VIN = 12V, VOUT=5.0V, IOUT = 1mA to 60mA 0.02 0.35 % VIN = 6V, Vout=5.0V, IOUT = 1mA to 60mA 0.02 0.15 % VIN =12V 100 www.semtech.com mA 3 of 15 Semtech Proprietary & Confidential Typical Performance Characteristics TS31023/223 Final Datasheet March 19, 2015 Rev 1.1 www.semtech.com 4 of 15 Semtech Proprietary & Confidential Typical Performance Characteristics continued TS31023/223 Final Datasheet March 19, 2015 Rev 1.1 www.semtech.com 5 of 15 Semtech Proprietary & Confidential Package Mechanical Drawings (all dimensions in mm) Units Millimeters Dimensions Limits NOM MAX Number of Pins N 8 Pitch e 0.50 BSC Overall Height A 0.80 0.90 1.00 Standoff A1 0.00 0.02 0.05 Contact Thickness A3 0.20 REF Overall Length D 2.00 BSC Exposed Pad Width E2 Overall Width E Exposed Pad Length TS31023/223 Final Datasheet March 19, 2015 MIN 0.75 0.90 1.00 2.00 BSC D2 1.55 1.70 1.80 Contact Width b 0.18 0.25 0.30 Contact Length L 0.20 0.30 0.40 Contact-to-Exposed Pad K 0.20 - - Rev 1.1 www.semtech.com 6 of 15 Semtech Proprietary & Confidential Recommended PCB Land Pattern Units Dimensions Limits Contact Pitch TS31023/223 Final Datasheet March 19, 2015 Millimeters MIN E NOM MAX 0.50 BSC Optional Center Pad Width W2 – – 1.70 Optional Center Pad Length T2 – – 0.90 Contact Pad Spacing C1 – 2.00 – Contact Pad Width (X8) X1 – – 0.35 Contact Pad Length (X8) Y1 – – 0.65 Distance Between Pads G 0.15 – – Rev 1.1 www.semtech.com 7 of 15 Semtech Proprietary & Confidential Application Using A Multi-Layer PCB To maximize the efficiency of this package for application on a single layer or multi-layer PCB, certain guidelines must be followed when laying out this part on the PCB. The following are guidelines for mounting the exposed pad IC on a Multi-Layer PCB with ground a plane. JEDEC standard FR4 PCB Cross-section: Multi-Layer Board (Cross-sectional View) In a multi-layer board application, the thermal vias are the primary method of heat transfer from the package thermal pad to the internal ground plane. The efficiency of this method depends on several factors, including die area, number of thermal vias, thickness of copper, etc. TS31023/223 Final Datasheet March 19, 2015 Rev 1.1 www.semtech.com 8 of 15 Semtech Proprietary & Confidential Note: NOT to Scale The above drawing is a representation of how the heat can be conducted away from the die using an exposed pad package. Each application will have different requirements and limitations and therefore the user should use sufficient copper to dissipate the power in the system. The output current rating for the linear regulators may have to be de-rated for ambient temperatures above 85C. The de-rate value will depend on calculated worst case power dissipation and the thermal management implementation in the application. Application Using A Single Layer PCB Layout recommendations for a Single Layer PCB: utilize as much Copper Area for Power Management. In a single layer board application the thermal pad is attached to a heat spreader (copper areas) by using low thermal impedance attachment method (solder paste or thermal conductive epoxy). In both of the methods mentioned above it is advisable to use as much copper traces as possible to dissipate the heat. Important: If the attachment method is NOT implemented correctly, the functionality of the product is not guaranteed. Power dissipation capability will be adversely affected if the device is incorrectly mounted onto the circuit board. TS31023/223 Final Datasheet March 19, 2015 Rev 1.1 www.semtech.com 9 of 15 Semtech Proprietary & Confidential IR Reflow Profile Profile Feature Sn-Pb Eutectic Assembly Pb-Free Assembly Average ramp-up rate (Tsmax to Tp) 3 OC/second max. 3 OC/second max. Preheat - Temperature Min (Tsmin) - Temperature Max (Tsmax) - Time (Tsmin to Tsmax) (ts) 100 OC 150 OC 60 - 120 seconds 150 OC 200 OC 60 - 180 seconds Time maintained above - Temperature (TL) - Time (tL) 183 OC 60 - 150 seconds 217 OC 60 - 150 seconds Peak Temperature (Tp) see table 4.1 see table 4.2 Time within 5 OC of actual Peak Temperature (tp) 10 - 30 seconds 20 - 40 seconds Ramp-down Rate 6 OC/second max. 6 OC/second max. Time 25 OC to Peak Temperature 6 minutes max. 8 minutes max. Note 1: All temperatures refer to topside of the package, measured on the package body surface. Note 2: Time within 5 OC of actual peak temperature (tp) specified for the reflow profiles is a “supplier” minimum and “user” maximum. TS31023/223 Final Datasheet March 19, 2015 Rev 1.1 www.semtech.com 10 of 15 Semtech Proprietary & Confidential Table 4-1 SnPb Eutectic Process - Package Peak Reflow Temperatures Package Thickness Volume mm3 < 350 Volume mm3 > 350 < 2.5mm 240 +0/-5 OC 225 +0/-5 OC > 2.5mm 225 +0/-5 OC 225 +0/-5 OC Table 4-2 Pb-free Process - Package Peak Reflow Temperatures Package Thickness Volume mm3 < 350 Volume mm3 350 - 2000 Volume mm3 > 2000 < 1.6mm 260 OC* 260 OC* 260 OC* 1.6mm - 2.5mm 260 OC* 250 OC* 245 OC* > 2.5mm 250 OC* 245 OC* 245 OC* * Tolerance: The device manufacturer/supplier shall assure process compatibility up to and including the stated classified temperature at the rated MSL level Note 1: Package volume excludes external terminals (balls, bumps, lands, leads) and/or non-integral heat sinks. Note 2: The maximum component temperature reached during reflow depends on package thickness and volume. The use of convection reflow processes reduces the thermal gradients between packages. However, thermal gradients due to differences in thermal mas of SMD packages may still exist. Note 3: Components intended for use in a “lead-free” assembly process shall be evaluated using the “lead-free” peak temperature and profiles defined in Tables 4-1, 4.2 and 5-2 whether or not lead free. TS31023/223 Final Datasheet March 19, 2015 Rev 1.1 www.semtech.com 11 of 15 Semtech Proprietary & Confidential RoHS and Reach Compliance Triune Systems is fully committed to environmental quality. All Triune Systems materials and suppliers are fully compliant with RoHS (European Union Directive 2011/65/EU), REACH SVHC Chemical Restrictions (EC 1907/2006), IPC-1752 Level 3 materials declarations, and their subsequent amendments. Triune Systems maintains certified laboratory reports for all product materials, from all suppliers, which show full compliance to restrictions on the following: • • • • • • • • • • • • TS31023/223 Final Datasheet March 19, 2015 Cadmium (Cd) Chlorofluorocarbons (CFCs) Chlorinate Hydrocarbons (CHCs) Halons Hexavalent Chromium (CrVI) Hydrobromofluorocarbons (HBFCs) Hydrochlorofluorocarbons (HCFCs) Lead (Pb) Mercury (Hg) Perfluorocarbons (PFCs) Polybrominated biphenyls (PBB) Polybrominated Diphenyl Ethers (PBDEs) Rev 1.1 www.semtech.com 12 of 15 Semtech Proprietary & Confidential Ordering Information Part Number: TS31023-QFNR TS31223-QFNR Reel Dimensions (13 inch) Product Specifications Tape Width A (MAX) N (MIN) W1 W2 8mm 330 100 8.4 14.4 12mm 330 100 12.4 18.4 16mm 330 100 16.4 22.4 TS31023/223 Final Datasheet March 19, 2015 Rev 1.1 www.semtech.com 13 of 15 Semtech Proprietary & Confidential Carrier Tape Specification All DFN and QFN packages will be oriented so that the index package locations will be on the upper right corner of the sprocket side of the carrier tape. All carrier tape used for packaging Triune Components will be specifically formulated to provide protection from physical and electro-static discharge (ESD) damage during shipping and storage. Embossed carrier tape must be EIA standard-481-1 compliant and meet the mechanical characteristics shown in Table 3. Dimensions are in millimeters Pkg type A0 B0 W D0 D1 E1 E2 F P1 P0 K0 T Wc Tc 2x2mm DFN 2.3 2.3 8.0 +/0.2 1.50 +/0.10 1.10 +/0.10 1.75 +/0.10 6.25 min 3.5 +/0.05 4 4 1.5 0.25 +/0.05 8 0.21 0.35 3x3mm QFN 3.3 3.3 12 1.50 +/0.10 1.10 +/0.10 3.5 +/0.05 8 8 1.1 4.5 0.21 0.35 4x4mm QFN 4.35 4.35 12 1.50 +/0.10 1.10 +/0.10 3.5 +/0.05 8 8 1.1 5.4 0.21 0.35 5x5mm QFN 5.25 5.25 12 1.50 +/0.10 1.10 +/0.10 3.5 +/0.05 8 8 1.1 9.2 0.21 0.35 6x6mm QFN 6.3 +/0.10 6.3 +/0.10 16 +/0.30 1.50 +/0.10 1.50 +/0.10 7.5 +/0.10 12 2 1.1 13.3 0.21 0.35 TS31023/223 Final Datasheet March 19, 2015 Rev 1.1 1.75 +/0.10 14.25 www.semtech.com 0.30 +/0.05 14 of 15 Semtech Proprietary & Confidential IMPORTANT NOTICE Information relating to this product and the application or design described herein is believed to be reliable, however such information is provided as a guide only and Semtech assumes no liability for any errors in this document, or for the application or design described herein. Semtech reserves the right to make changes to the product or this document at any time without notice. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. Semtech warrants performance of its products to the specifications applicable at the time of sale, and all sales are made in accordance with Semtech’s standard terms and conditions of sale. SEMTECH PRODUCTS ARE NOT DESIGNED, INTENDED, AUTHORIZED OR WARRANTED TO BE SUITABLE FOR USE IN LIFE-SUPPORT APPLICATIONS, DEVICES OR SYSTEMS, OR IN NUCLEAR APPLICATIONS IN WHICH THE FAILURE COULD BE REASONABLY EXPECTED TO RESULT IN PERSONAL INJURY, LOSS OF LIFE OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE. INCLUSION OF SEMTECH PRODUCTS IN SUCH APPLICATIONS IS UNDERSTOOD TO BE UNDERTAKEN SOLELY AT THE CUSTOMER’S OWN RISK. Should a customer purchase or use Semtech products for any such unauthorized application, the customer shall indemnify and hold Semtech and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs damages and attorney fees which could arise. The Semtech name and logo are registered trademarks of the Semtech Corporation. Triune Systems, L.L.C. is now a wholly-owned subsidiary of Semtech Corporation. The Triune Systems® name and logo, MPPT-lite™, and nanoSmart® are trademarks of Triune Systems, L.L.C. in the U.S.A. All other trademarks and trade names mentioned may be marks and names of Semtech or their respective companies. Semtech reserves the right to make changes to, or discontinue any products described in this document without further notice. Semtech makes no warranty, representation or guarantee, express or implied, regarding the suitability of its products for any particular purpose. All rights reserved. © Semtech 2015 Contact Information Semtech Corporation 200 Flynn Road, Camarillo, CA 93012 Phone: (805) 498-2111, Fax: (805) 498-3804 www.semtech.com TS31023/223 Final Datasheet March 19, 2015 Rev 1.1 15 of 15 Semtech Proprietary & Confidential