RClamp3324T

RClamp3324T
Low Voltage RailClamp®
4-Line ESD Protection
PROTECTION PRODUCTS - RailClamp®
Description
PRELIMINARY
Features
 ESD protection for high-speed data lines to
The RClamp®3324T provides ESD protection for
USB3.0, HDMI1.3/1.4, and other high-speed ports. It
features a high maximum ESD withstand voltage of
±25kV contact and ±30kV air discharge per IEC
61000-4-2. RClamp3324T is designed to minimize
both the ESD peak clamping and the TLP clamping.
Peak ESD clamping voltage is extremely low and
approximately the same at each pin. The dynamic
resistance is among the industry’s lowest at 0.35
Ohms (typical). Typical capacitance on each line to
ground is approximately 0.40pF. This allows the
RClamp3324T to be used in applications operating in
excess of 5GHz without signal attenuation. These
devices are manufactured using Semtech’s proprietary
low voltage EPD technology for superior characteritics
at operating voltages up to 3.3 volts. Each device will
protect up to four lines (two high-speed pairs).
The RClamp3324T is in a 6-pin SLP1710P4T package. It
measures 1.7 x 1.0mm with a nominal height of 0.40mm.
The leads have a nominal pin-to-pin pitch of 0.40mm.
The flow- through package design simplifies PCB layout
and maintains signal integrity on high-speed lines.
The combination of low peak ESD clamping, low dynamic
resistance, and innovative package design enables this
device provides the highest level of ESD protection for
applications such as USB 3.0, HDMI and V-By-One interfaces.






IEC 61000-4-2 (ESD) ±30kV (air), ±25kV (contact)
IEC 61000-4-5 (Lightning) 5A (8/20μs)
IEC 61000-4-4 (EFT) 40A (5/50ns)
Flow-Through design
Protects four high-speed lines
Low capacitance: 0.40pF typical (I/O to ground)
Low ESD clamping voltage
Extremely low dynamic resistance: 0.35 Ohms (Typ)
Solid-state silicon-avalanche technology
Mechanical Characteristics







SLP1710P4T 6L package
Pb-Free, Halogen Free, RoHS/WEEE Compliant
Nominal Dimensions: 1.7 x 1.0 x 0.40 mm
Lead Finish: NiPdAu
Molding compound flammability rating: UL 94V-0
Marking : Marking code + date code
Packaging : Tape and Reel
Applications








Circuit Diagram
USB 3.0
HDMI 1.3/1.4
10GBase-T Ethernet
V-By-One
Display Port
MHL
LVDS Interfaces
eSATA Interfaces
Pin Configuration (Top View)
I/O 1
1
GND
I/O 2
Pin 1
Pin 2
Pin 3
Pin 4
I/O 3
I/O 4
5, 6
Revision 9/24/2014
1
GND
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RClamp3324T
PRELIMINARY
PROTECTION PRODUCTS
Absolute Maximum Rating
R ating
Symbol
Value
Units
Peak Pulse Power (tp = 8/20μs)
Pp k
75
Watts
Peak Pulse Current (tp = 8/20μs)
IP P
5
A
ESD p er IEC 61000-4-2 (Air)
ESD p er IEC 61000-4-2 (Contact)
VESD
+/- 30
+/- 25
kV
TJ
-40 to +125
°C
TSTG
-55 to +150
°C
Op erating Temp erature
Storage Temp erature
Electrical Characteristics (T=25oC Unless Otherwise Specified)
Parameter
Symbol
Conditions
VRWM
Any I/O to GN D
V PT
IPT = 2μA
Any I/O to GN D
Reverse Leakage Current
IR
VRWM = 3.3V
Any I/O to GN D
Clamp ing Voltage
VC
Clamp ing Voltage
Junction Cap acitance
Reverse Stand-Off Voltage
Punch-Through Voltage
© 2014 Semtech Corporation
Maximum
Units
3.3
V
4.8
5.5
V
0.005
0.100
μA
IPP = 1A, tp = 8/20μs
Any I/O to GN D
7
V
VC
IPP = 5A, tp = 8/20μs
Any I/O to GN D
10.5
V
Cj
VR = 0V, f = 1MHz,
Any I/O to GN D
0.40
0.65
pF
VR = 0V, f = 1MHz,
Between I/O p ins
0.30
0.4
pF
2
Minimum
3.8
Typical
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RClamp3324T
PRELIMINARY
PROTECTION PRODUCTS
Electrical Characteristics (T=25oC Unless Otherwise Noted)
ESD R atings (Each Pin)
P ar am et er
S y m b ol
Con d i t i on s
Mi n i mu m
Ty p i c a l
M ax i m u m
Units
ESD Withstand Voltage1
Contact discharge per
IEC 61000-4-2
25
kV
ESD Withstand Voltage1
Air discharge per IEC
61000-4-2
30
kV
ESD Peak Voltage1
V pk
+8kV per IEC 61000-4-2
55
V
ESD Peak Voltage1
V pk
-8kV per IEC 61000-4-2
-60
V
ESD Clamping Voltage2
V tl p
IPP = 16A,
tlp = 0.2/100ns
11.5
V
ESD Clamping Voltage2
V tl p
IPP = -16A,
tlp = 0.2/100ns
11
V
Dynamic Resistance (Positive)2, 3
RDyn
tp = 100ns
0.35
Ohms
Dynamic Resistance (N egative)2, 3
RDyn
tp = 100ns
0.50
Ohms
Notes
1)ESD peak voltage measured with a 20dB attenuator, 50 Ohm scope input impedance, 2GHz bandwidth. ESD
gun return path connected to ESD ground plane.
2)Transmission Line Pulse Test (TLP) Settings: tp = 100ns, tr = 0.2ns, ITLP and VTLP averaging window: t1 = 70ns to
t2 = 90ns.
3) Dynamic resistance calculated from ITLP = 4A to ITLP = 16A
© 2014 Semtech Corporation
3
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RClamp3324T
PRELIMINARY
PROTECTION PRODUCTS
Typical Characteristics
Non-Repetitive Peak Pulse Power vs. Pulse Time
120
DR040412-75
100
% of Rated Power or IPP
Peak Pulse Power - P PP (kW)
10
Power Derating Curve
1
0.1
80
60
40
20
DR040512:25:125:150
0
0.01
0
0.1
1
10
Pulse Duration - tp (µs)
100
25
1000
75
100
125
150
O
Clamping Voltage vs. Peak Pulse Current
Capacitance vs. Reverse Voltage
1.0
9
0.9
8
0.8
7
Capacitance - Cj (pf)
Clamping Voltage -VC (V)
50
Ambient Temperature - TA ( C)
6
5
4
3
Waveform
Parameters:
tr = 8µs
td = 20µs
2
1
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0
f = 1 MHz
0.0
0
1
2
3
4
5
6
0
0.5
1
1.5
2
2.5
3
Reverse Voltage - VR (V)
Peak Pulse Current - IPP (A)
TLP Characteristic (Positive Pulse)
TLP Characteristic (Negative Pulse)
30
0
25
-5
RDYN = 0.35
-10
Current (A)
Current (A)
20
15
10
RDYN= 0.50
-15
-20
Transmission Line Pulse Test
(TLP) Settings:
tp = 100ns, tr = 0.2ns,
ITLP and VTLP averaging window:
t1 = 70ns to t2 = 90ns
5
Transmission Line Pulse Test
(TLP) Settings:
tp = 100ns, tr = 0.2ns,
ITLP and VTLP averaging window:
t1 = 70ns to t2 = 90ns
-25
0
-30
0
5
10
15
20
-20
Voltage (V)
© 2014 Semtech Corporation
-15
-10
-5
0
Voltage (V)
4
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RClamp3324T
PRELIMINARY
PROTECTION PRODUCTS
Typical Characteristics
ESD Clamping at Each Pin
(+8kV Contact per IEC 61000-4-2)
ESD Clamping at Each Pin
(-8kV Contact per IEC 61000-4-2)
60
0
Measured with 50 Ohm scope input
impedance, 2GHz bandwidth.
Corrected for 50 Ohm, 20dB
attenuator. ESD gun return path
connected to ESD ground plane
50
-10
-20
Voltage (V)
Voltage (V)
40
30
-30
-40
20
-50
10
Measured with 50 Ohm scope input
impedance, 2GHz bandwidth.
Corrected for 50 Ohm, 20dB
attenuator. ESD gun return path
connected to ESD ground plane
-60
-70
0
-10
0
10
20
30
40
50
60
70
-10
80
0
10
20
30
50
60
70
ESD Clamping vs. Positive Discharge Voltage
(Contact Discharge per IEC 61000-4-2)
ESD Clamping vs. Negative Discharge Voltage
(Contact Discharge per IEC 61000-4-2)
60
10
50
+8kV
Vpk=54.6V
40
+6kV
VPK=41.8V
Measured with 50 Ohm scope input
impedance, 2GHz bandwidth.
Corrected for 50 Ohm, 20dB
attenuator. ESD gun return path
connected to ESD ground plane
-10
+4kV
Vpk=34.1V
30
80
0
Voltage (V)
Voltage (V)
40
Time (ns)
Time (ns)
+2kV
Vpk=22.5V
20
-20
-30
-2kV
Vpk= -19.20V
-40
-4kV
Vpk= -35.36V
-50
-6kV
Vpk= -48.00V
-60
-8kV
Vpk= -60.20V
10
0
-10
Measured with 50 Ohm scope input
impedance, 2GHz bandwidth.
Corrected for 50 Ohm, 20dB
attenuator. ESD gun return path
connected to ESD ground plane
-70
-10
0
10
20
30
40
50
60
-10
0
10
20
Time (ns)
30
40
50
60
Time (ns)
Typical Insertion Loss S21 (5GhZ)
Analog Crosstalk
0
-20
Insertion Loss (dB)
Insertion Loss (dB)
-3
-9
-40
-60
-80
-100
-120
Data includes loss due to SMA connector
-15
1.00E+06
1.00E+07
1.00E+08
1.00E+09
-140
1.00E+07
1.00E+10
© 2014 Semtech Corporation
1.00E+08
1.00E+09
1.00E+10
Frequency (Hz)
Frequency (Hz)
5
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RClamp3324T
PRELIMINARY
PROTECTION PRODUCTS
Applications Information
Layout Guidelines
RClamp3324T is designed to protect 2 high speed
differential pairs. The PCB traces enter and exit each
I/O pin. Ground is connected at pins 5 and 6. Figure 2
is an example of how to route the high speed
differential traces through the RClamp3324T. The
differential impedance of each pair can be controlled
for high-speed interfaces such as HDMI (100 Ohms +/15%) and USB 3.0 (85 Ohms +/-15%) while
maintaining a minimum trace-to-trace and trace-to-pad
spacing of 0.125mm when using 0.100mm wide
traces. These are only guidelines. Individual PCB
design constraints may necessitate different spacing or
trace width. Both ground pads should be connected for
optimal performance. Ground connection is made
using 0.254mm diameter filled via-in-pad. The via
should be filled with a conductive paste. This
technique saves board space and eliminates the
capillary effect of a non filled via.
I/O 1
1
GND
I/O 2
I/O 3
I/O 4
GND
Figure 1 - Pin Configuration
Figure 2 - Example Flow-Through Layout
© 2014 Semtech Corporation
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RClamp3324T
PRELIMINARY
PROTECTION PRODUCTS
Applications Information
USB 3.0 - Type A
Host Connector
SSRX-
RClamp3324T
GND
D+
SSRX+
GND
D-
SSTX-
RClamp3324T
VBus
SSTX+
uClamp0541T
Land Pad
Trace
Via
Device Outline
Figure 3 - USB 3.0 Layout (Type A Host Connector)
USB 3.0 - Type B
Device Connector
SSTX-
RClamp3324T
SSTX+
D+
D-
GND
GND
SSRX-
RClamp3324T
SSRX+
uClamp0541T
VBus
Land Pad
Trace
Via
Device Outline
Figure 4 - USB 3.0 Layout (Type B Device Connector)
© 2014 Semtech Corporation
7
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RClamp3324T
PRELIMINARY
PROTECTION PRODUCTS
Applications Information
HDMI Connector
HPD
5V
SDA
SCL
HEC_DAT
CEC
RClamp7528T
CLK
CLK+
D0
D0+
RClamp3324T
D1
D1+
D2
D2+
Land Pad
Trace
Via
Device Outline
RClamp3324T
Figure 5 - HDMI 1.4 Layout
Recommended Assembly Parameters
Stencil Opening
Assembly Parameter
Land Pad ( Follow drawing )
R ecommendation
.25
Solder Stencil Design
Laser cut, Electro-polished
Aper ture shape
Rectangular with rounded
corners
Solder Stencil Thickness
Solder Paste Type
Solder Reflow Profile
PCB Solder Pad Design
PCB Pad Finish
.75
0.100 mm (0.004")
1.00
.20
Type 3 size sphere or smaller
Per JEDEC J-STD-020
.50
N on-Solder mask defined
1.70
OSP OR N iAu
Note that these are only recommendations and should serve only as a
starting point for design. The exact manufacturing parameters will
require some experimentation to get the desired solder application.
© 2014 Semtech Corporation
.17
.23
8
All Dimensions are in mm.
Land Pad.
Stencil opening
Component
Recommended Mounting Pattern
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RClamp3324T
PRELIMINARY
PROTECTION PRODUCTS
Outline
OutlineDrawing
Drawing- -SO-8
SLP1710P4T
A
B
D
DIMENSIONS
MILLIMETERS
MIN NOM MAX
DIM
PIN 1
INDICATOR
(LASER MARK)
E
A
SEATING
PLANE
aaa C
C
A1
A2
e
A
A1
A2
b
D
E
e
e1
L
L1
N
aaa
bbb
0.37 0.40 0.43
0.00 0.02 0.05
(0.13)
0.15 0.20 0.25
1.65 1.70 1.78
0.95 1.00 1.08
0.40 BSC
1.00 BSC
0.20 0.25 0.30
0.45 0.50 0.55
4
0.08
0.10
e/2
1
N
LxN
E/2
L1x2
e1/2
e1
bx6
bbb
D/2
C A B
NOTES:
1. CONTROLLING DIMENSIONS ARE IN MILLIMETERS (ANGLES IN DEGREES).
2. COPLANARITY APPLIES TO THE EXPOSED PAD AS WELL AS THE TERMINALS.
Land Pattern - SLP1710P4T
P1
P1/2
Y1
Z
(C) G
Y
P/2
P
X
DIM
C
G
P
P1
X
Y
Y1
Z
DIMENSIONS
MILLIMETERS
(0.825)
0.25
0.40
1.00
0.20
0.45
0.70
1.40
NOTES:
1. CONTROLLING DIMENSIONS ARE IN MILLIMETERS (ANGLES IN DEGREES).
2. THIS LAND PATTERN IS FOR REFERENCE PURPOSES ONLY.
CONSULT YOUR MANUFACTURING GROUP TO ENSURE YOUR
COMPANY'S MANUFACTURING GUIDELINES ARE MET.
© 2014 Semtech Corporation
9
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RClamp3324T
PRELIMINARY
PROTECTION PRODUCTS
Marking Codes
Ordering Information
3324T
YYWW
Part Number
Qty per
Reel
R eel Size
RClamp 3324T.TCT
3,000
7 Inch
RailClamp and RClamp are trademarks of Semtech Corporation.
YYWW = Alphanumeric character Date Code
Carrier Tape Specification
3324T
YYWW
3324T
YYWW
3324T
YYWW
Pin 1 Location (Towards Sprocket Holes)
User Direction of feed
A0
1.18 +/-0.05 mm
Tape
Width
8 mm
B0
K0
1.88 +/-0.05 mm
B, (Max)
D
4.2 mm
1.5 + 0.1 mm
- 0.0 mm )
Device Orientation in Tape
0.53 +/-0.05 mm
D1
E
0.5 mm
±0.05
1.750±.10
mm
F
3.5±0.05
mm
K
(MAX)
P
P0
P2
2.4 mm
4.0±0.1
mm
4.0±0.1
mm
2.0±0.05
mm
T(MAX)
0.4 mm
W
8.0 mm
+ 0.3 mm
- 0.1 mm
Contact Information for Semtech International AG
Taiw an Branch
Korea Branch
Shanghai Office
Japan (Osaka)
Office
Tel: 886-2-2748-3380
Fax: 886-2-2748-3390
Japan (Tokyo) Office
Tel: 81-3-5719-7560
Fax: 81-3-5719-7561
Tel: 82-2-527-4377
Fax: 82-2-527-4376
Semtech Limited (U.K.)
Tel: 44-1794-527-600
Fax: 44-1794-527-601
Tel: 86-21-6391-0830
Fax: 86-21-6391-0831
Semtech France SARL
Tel: 33-(0)169-28-22-00
Fax: 33-(0)169-28-12-98
Semtech Germany GmbH
Tel: 49-(0)8161-140-123
Fax: 49-(0)8161-140-124
Tel: 81-6-6347-6570
Fax: 81-6-6347-6571
Semtech International AG is a wholly-owned subsidiary of
Semtech Corporation, which has its headquarters in the U.S.A.
© 2014 Semtech Corporation
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