Datasheet - NXP Semiconductors

PEMIxQFN; PEMI2STD family
Integrated 1-, 2-, 4-, 6- and 8-channel passive filter network
with ESD protection
Rev. 2 — 3 November 2011
Product data sheet
1. Product profile
1.1 General description
The devices are a family of RC low pass filters. They are designed to provide filtering of
undesired RF signals on the I/O ports of portable communication or computing devices.
The devices incorporate diodes to provide protection to downstream components from
ElectroStatic Discharge (ESD) voltages up to 25 kV.
The devices are fabricated using monolithic silicon technology in lead-free plastic
packages.
Table 1.
Product overview
Type number
Package
Number of
channels
Package
pitch (mm)
Package configuration
PEMI1QFN
SOT883
1
-
3-pin MicroPak (QFN compatible)
PEMI2QFN
SOT886
2
0.5
6-pin MicroPak (QFN compatible)
PEMI2STD
SOT665
1
-
5-pin microlead
PEMI4QFN
SOT1157-1
4
0.4
8-pin extremely thin leadless
PEMI6QFN
SOT1158-1
6
0.4
12-pin extremely thin leadless
PEMI8QFN
SOT1159-1
8
0.4
16-pin extremely thin leadless
1.2 Features and benefits
 Pb-free, Restriction of Hazardous Substances (RoHS) compliant and free of halogen
and antimony (Dark Green compliant)
 Integrated 1-, 2-, 4-, 6- and 8-channel -type RC filter network
 ESD protection up to 25 kV contact discharge according to IEC 61000-4-2,
far exceeding level 4
1.3 Applications
General-purpose ElectroMagnetic Interference (EMI) and Radio-Frequency
Interference (RFI) filtering and downstream ESD protection for:
 Cellular phone and Personal Communication Systems (PCS) mobile handsets
 Cordless telephones
 Wireless data (WAN/LAN) systems
PEMIxQFN; PEMI2STD family
NXP Semiconductors
1-, 2-, 4-, 6- and 8-channel passive filter network with ESD protection
1.4 Quick reference data
Table 2.
Quick reference data
Symbol
Parameter
Conditions
Typ
Unit
Rs(ch)
channel series resistance
20

PEMIxxxx/Hx
45

PEMIxxxx/Lx
65

PEMIxxxx/Rx
100

PEMIxxxx/Wx
200

PEMIxxxx/xE
15
pF
PEMIxxxx/xG
19
pF
PEMIxxxx/xK
23
pF
PEMIxxxx/xM
28
pF
PEMIxxxx/xP
32
pF
PEMIxxxx/xR
36
pF
PEMIxxxx/xT
40
pF
PEMIxxxx/Cx
Cch
channel capacitance
for the total channel;
f = 100 kHz; Vbias(DC) = 0 V
2. Pinning information
Table 3.
Pin
Pinning
Description
Simplified outline
Graphic symbol
PEMI1QFN (SOT883)
1 and 2
filter channel
3
ground (GND)
Rs(ch)
1
3
1
2
2
Cch
2
Transparent
top view
Cch
2
3
018aaa042
PEMI2QFN (SOT886)
1 and 6
filter channel 1
2 and 5
ground (GND)
3 and 4
6
5
Rs(ch)
4
1,3
4,6
Cch
2
filter channel 2
Cch
2
2,5
1
PEMIXQFN_PEMI2STD_FAM
Product data sheet
2
3
Transparent
top view
All information provided in this document is subject to legal disclaimers.
Rev. 2 — 3 November 2011
018aaa044
© NXP B.V. 2011. All rights reserved.
2 of 29
PEMIxQFN; PEMI2STD family
NXP Semiconductors
1-, 2-, 4-, 6- and 8-channel passive filter network with ESD protection
Table 3.
Pin
Pinning …continued
Description
Simplified outline
Graphic symbol
PEMI2STD (SOT665)
1 and 5
filter channel 1
2
ground (GND)
3 and 4
5
Rs(ch)
4
1,3
4,5
Cch
2
filter channel 2
Cch
2
2
1
2
3
018aaa043
PEMI4QFN (SOT1157-1)
1 and 8
filter channel 1
2 and 7
filter channel 2
3 and 6
filter channel 3
4 and 5
filter channel 4
ground
pad
ground (GND)
8
Rs(ch)
5
1 to 4
5 to 8
Cch
2
Cch
2
1
4
Transparent
top view
GND
018aaa071
PEMI6QFN (SOT1158-1)
1 and 12
filter channel 1
2 and 11
filter channel 2
3 and 10
filter channel 3
4 and 9
filter channel 4
5 and 8
filter channel 5
6 and 7
filter channel 6
ground
pad
ground (GND)
12
Rs(ch)
7
1 to 6
7 to 12
Cch
2
1
Cch
2
6
Transparent
top view
GND
018aaa072
PEMI8QFN (SOT1159-1)
PEMIXQFN_PEMI2STD_FAM
Product data sheet
1 and 16
filter channel 1
2 and 15
filter channel 2
3 and 14
filter channel 3
4 and 13
filter channel 4
5 and 12
filter channel 5
6 and 11
filter channel 6
7 and 10
filter channel 7
8 and 9
filter channel 8
ground
pad
ground (GND)
16
Rs(ch)
9
1 to 8
9 to 16
Cch
2
Cch
2
1
8
Transparent top view
All information provided in this document is subject to legal disclaimers.
Rev. 2 — 3 November 2011
GND
018aaa073
© NXP B.V. 2011. All rights reserved.
3 of 29
PEMIxQFN; PEMI2STD family
NXP Semiconductors
1-, 2-, 4-, 6- and 8-channel passive filter network with ESD protection
3. Ordering information
Table 4.
Ordering information
Type number
Package
Name
Description
Version
PEMI1QFN
SC-101
leadless ultra small plastic package; 3 solder lands; body 1.0  0.6  0.5 mm
SOT883
PEMI2QFN
XSON6
plastic extremely thin small outline package; no leads; 6 terminals;
body 1  1.45  0.5 mm
SOT886
PEMI2STD
-
plastic surface-mounted package; 5 leads
SOT665
PEMI4QFN
HXSON8
plastic thermal enhanced extremely thin small outline package; no leads;
8 terminals; body 1.2  1.7  0.5 mm
SOT1157-1
PEMI6QFN
HXSON12 plastic thermal enhanced extremely thin small outline package; no leads;
12 terminals; body 1.2  2.5  0.5 mm
SOT1158-1
PEMI8QFN
HXSON16 plastic thermal enhanced extremely thin small outline package; no leads;
16 terminals; body 1.2  3.3  0.5 mm
SOT1159-1
4. Limiting values
Table 5.
Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
PEMIXQFN_PEMI2STD_FAM
Product data sheet
Symbol
Parameter
Conditions
Min
Max
Unit
VCC
supply voltage
0.5
+5.6
V
VESD
electrostatic discharge
voltage
contact discharge
-
15
kV
air discharge
-
15
kV
PEMIxxxx/xM;
PEMIxxxx/xP
contact discharge
-
20
kV
air discharge
-
20
kV
PEMIxxxx/xR;
PEMIxxxx/xT
contact discharge
-
25
kV
air discharge
-
25
kV
IEC 61000-4-2, level 4
all pins to ground
Pch
channel power dissipation continuous power;
Tamb = 85 C
-
60
mW
Ptot
total power dissipation
-
120
mW
Tstg
storage temperature
55
+150
C
Tamb
ambient temperature
40
+85
C
continuous power;
Tamb = 85 C
All information provided in this document is subject to legal disclaimers.
Rev. 2 — 3 November 2011
© NXP B.V. 2011. All rights reserved.
4 of 29
PEMIxQFN; PEMI2STD family
NXP Semiconductors
1-, 2-, 4-, 6- and 8-channel passive filter network with ESD protection
5. Characteristics
Table 6.
Channel characteristics
Tamb = 25 C; unless otherwise specified.
Symbol Parameter
Rs(ch)
Conditions
Min
Typ
Max
Unit
PEMIxxxx/Cx
18
20
22

PEMIxxxx/Hx
40
45
50

PEMIxxxx/Lx
58
65
72

PEMIxxxx/Rx
90
100
110

180
200
220

-
15
-
pF
channel series resistance
PEMIxxxx/Wx
Cch
channel capacitance
PEMIxxxx/xE
PEMIxxxx/xG
PEMIxxxx/xK
PEMIxxxx/xM
PEMIxxxx/xP
PEMIxxxx/xR
PEMIxxxx/xT
PEMIXQFN_PEMI2STD_FAM
Product data sheet
for the total channel;
f = 100 kHz
Vbias(DC) = 0 V
Vbias(DC) = 2.5 V
-
8.5
-
pF
Vbias(DC) = 0 V
-
19
-
pF
Vbias(DC) = 2.5 V
-
11
-
pF
Vbias(DC) = 0 V
-
23
-
pF
Vbias(DC) = 2.5 V
-
13.5
-
pF
Vbias(DC) = 0 V
-
28
-
pF
Vbias(DC) = 2.5 V
-
16
-
pF
Vbias(DC) = 0 V
-
32
-
pF
Vbias(DC) = 2.5 V
-
18.5
-
pF
Vbias(DC) = 0 V
-
36
-
pF
Vbias(DC) = 2.5 V
-
21
-
pF
Vbias(DC) = 0 V
-
40
-
pF
Vbias(DC) = 2.5 V
-
23
-
pF
VBR
breakdown voltage
positive clamp; II = 1 mA
5.8
-
9
V
VF
forward voltage
negative clamp; IF = 1 mA
1.5
-
0.4
V
ILR
reverse leakage current
per channel; VI = 3.5 V
-
-
0.1
A
All information provided in this document is subject to legal disclaimers.
Rev. 2 — 3 November 2011
© NXP B.V. 2011. All rights reserved.
5 of 29
PEMIxQFN; PEMI2STD family
NXP Semiconductors
1-, 2-, 4-, 6- and 8-channel passive filter network with ESD protection
Table 7.
Frequency characteristics
Tamb = 25 C; unless otherwise specified; Rsource = 50 ; RL = 50 .
Symbol
Parameter
Conditions
il
insertion loss
Cch = 15 pF
PEMIxxxx/CE
PEMIxxxx/HE
PEMIxxxx/LE
PEMIxxxx/RE
PEMIxxxx/WE
il
insertion loss
PEMIxxxx/CG
PEMIxxxx/HG
PEMIxxxx/LG
PEMIxxxx/RG
PEMIxxxx/WG
PEMIXQFN_PEMI2STD_FAM
Product data sheet
Min
Typ
Max
Unit
800 MHz < f < 3 GHz
7
-
-
dB
f = 5 GHz
-
30
-
dB
800 MHz < f < 3 GHz
9
-
-
dB
f = 4 GHz
-
31
-
dB
800 MHz < f < 3 GHz
11
-
-
dB
f = 3.5 GHz
-
32
-
dB
800 MHz < f < 3 GHz
13
-
-
dB
f = 3 GHz
-
33
-
dB
800 MHz < f < 3 GHz
18
-
-
dB
f = 2.2 GHz
-
34
-
dB
800 MHz < f < 3 GHz
9
-
-
dB
f = 4 GHz
-
32
-
dB
800 MHz < f < 3 GHz
11
-
-
dB
f = 3.2 GHz
-
33
-
dB
Rs(ch) = 20 
Rs(ch) = 45 
Rs(ch) = 65 
Rs(ch) = 100 
Rs(ch) = 200 
Cch = 19 pF
Rs(ch) = 20 
Rs(ch) = 45 
Rs(ch) = 65 
800 MHz < f < 3 GHz
13
-
-
dB
f = 2.8 GHz
-
33.5
-
dB
800 MHz < f < 3 GHz
15
-
-
dB
f = 2.5 GHz
-
34
-
dB
800 MHz < f < 3 GHz
21
-
-
dB
f = 1.9 GHz
-
35.5
-
dB
Rs(ch) = 100 
Rs(ch) = 200 
All information provided in this document is subject to legal disclaimers.
Rev. 2 — 3 November 2011
© NXP B.V. 2011. All rights reserved.
6 of 29
PEMIxQFN; PEMI2STD family
NXP Semiconductors
1-, 2-, 4-, 6- and 8-channel passive filter network with ESD protection
Table 7.
Frequency characteristics …continued
Tamb = 25 C; unless otherwise specified; Rsource = 50 ; RL = 50 .
Symbol
Parameter
Conditions
il
insertion loss
Cch = 23 pF
PEMIxxxx/CK
PEMIxxxx/HK
PEMIxxxx/LK
PEMIxxxx/RK
PEMIxxxx/WK
il
insertion loss
PEMIxxxx/CM
PEMIxxxx/HM
PEMIxxxx/LM
PEMIxxxx/RM
PEMIxxxx/WM
PEMIXQFN_PEMI2STD_FAM
Product data sheet
Min
Typ
Max
Unit
800 MHz < f < 3 GHz
10
-
-
dB
f = 3.6 GHz
-
33
-
dB
800 MHz < f < 3 GHz
13
-
-
dB
f = 2.8 GHz
-
34
-
dB
800 MHz < f < 3 GHz
15
-
-
dB
f = 2.5 GHz
-
35
-
dB
800 MHz < f < 3 GHz
18
-
-
dB
f = 2.1 GHz
-
36
-
dB
800 MHz < f < 3 GHz
24
-
-
dB
f = 1.6 GHz
-
37
-
dB
800 MHz < f < 3 GHz
12
-
-
dB
f = 3.2 GHz
-
34
-
dB
800 MHz < f < 3 GHz
15
-
-
dB
f = 2.5 GHz
-
35
-
dB
800 MHz < f < 3 GHz
17
-
-
dB
f = 2.1 GHz
-
36
-
dB
800 MHz < f < 3 GHz
21
-
-
dB
f = 1.8 GHz
-
37
-
dB
800 MHz < f < 3 GHz
27
-
-
dB
f = 1.4 GHz
-
38
-
dB
Rs(ch) = 20 
Rs(ch) = 45 
Rs(ch) = 65 
Rs(ch) = 100 
Rs(ch) = 200 
Cch = 28 pF
Rs(ch) = 20 
Rs(ch) = 45 
Rs(ch) = 65 
Rs(ch) = 100 
Rs(ch) = 200 
All information provided in this document is subject to legal disclaimers.
Rev. 2 — 3 November 2011
© NXP B.V. 2011. All rights reserved.
7 of 29
PEMIxQFN; PEMI2STD family
NXP Semiconductors
1-, 2-, 4-, 6- and 8-channel passive filter network with ESD protection
Table 7.
Frequency characteristics …continued
Tamb = 25 C; unless otherwise specified; Rsource = 50 ; RL = 50 .
Symbol
Parameter
Conditions
il
insertion loss
Cch = 32 pF
PEMIxxxx/CP
PEMIxxxx/HP
PEMIxxxx/LP
PEMIxxxx/RP
PEMIxxxx/WP
il
insertion loss
PEMIxxxx/CR
PEMIxxxx/HR
PEMIxxxx/LR
PEMIxxxx/RR
PEMIxxxx/WR
PEMIXQFN_PEMI2STD_FAM
Product data sheet
Min
Typ
Max
Unit
800 MHz < f < 3 GHz
13
-
-
dB
f = 2.9 GHz
-
36
-
dB
800 MHz < f < 3 GHz
17
-
-
dB
f = 2.2 GHz
-
36
-
dB
800 MHz < f < 3 GHz
19
-
-
dB
f = 1.9 GHz
-
37
-
dB
800 MHz < f < 3 GHz
23
-
-
dB
f = 1.6 GHz
-
38
-
dB
800 MHz < f < 3 GHz
30
-
-
dB
f = 1.2 GHz
-
39
-
dB
800 MHz < f < 3 GHz
14
-
-
dB
f = 2.6 GHz
-
36
-
dB
800 MHz < f < 3 GHz
18
-
-
dB
f = 2.0 GHz
-
37
-
dB
800 MHz < f < 3 GHz
21
-
-
dB
f = 1.8 GHz
-
38
-
dB
800 MHz < f < 3 GHz
25
-
-
dB
f = 1.6 GHz
-
39
-
dB
800 MHz < f < 3 GHz
32
-
-
dB
f = 1.2 GHz
-
40
-
dB
Rs(ch) = 20 
Rs(ch) = 45 
Rs(ch) = 65 
Rs(ch) = 100 
Rs(ch) = 200 
Cch = 36 pF
Rs(ch) = 20 
Rs(ch) = 45 
Rs(ch) = 65 
Rs(ch) = 100 
Rs(ch) = 200 
All information provided in this document is subject to legal disclaimers.
Rev. 2 — 3 November 2011
© NXP B.V. 2011. All rights reserved.
8 of 29
PEMIxQFN; PEMI2STD family
NXP Semiconductors
1-, 2-, 4-, 6- and 8-channel passive filter network with ESD protection
Table 7.
Frequency characteristics …continued
Tamb = 25 C; unless otherwise specified; Rsource = 50 ; RL = 50 .
Symbol
Parameter
Conditions
il
insertion loss
Cch = 40 pF
PEMIxxxx/CT
PEMIxxxx/HT
PEMIxxxx/LT
PEMIxxxx/RT
PEMIxxxx/WT
Min
Typ
Max
Unit
800 MHz < f < 3 GHz
16
-
-
dB
f = 2.5 GHz
-
36
-
dB
800 MHz < f < 3 GHz
20
-
-
dB
f = 1.9 GHz
-
38
-
dB
800 MHz < f < 3 GHz
23
-
-
dB
f = 1.6 GHz
-
39
-
dB
800 MHz < f < 3 GHz
27
-
-
dB
f = 1.4 GHz
-
40
-
dB
800 MHz < f < 3 GHz
32
-
-
dB
f = 1.0 GHz
-
41
-
dB
Rs(ch) = 20 
Rs(ch) = 45 
Rs(ch) = 65 
Rs(ch) = 100 
Rs(ch) = 200 
6. Application information
6.1 Use cases
The selection of one of the filter devices has to be performed in dependence of the
maximum clock frequency, the driver strength, the capacitive load of the sink and the
maximum applicable rise and fall times.
6.2 LCD interfaces, medium-speed interfaces
For digital interfaces such as Liquid Crystal Display (LCD) interfaces running at clock
speeds between 10 MHz and 25 MHz or more, the devices can be used in dependence of
the sink load, the clock speed, the driver strength and the rise and fall time requirements.
The minimum EMI filter requirements may be an important factor, too.
6.3 Keypad, low-speed interfaces
Especially for lower-speed interfaces such as keypads, low-speed serial interfaces and
low-speed control signals, the devices offer a very robust ESD protection and strong
suppression of unwanted frequencies (EMI filtering). Due to their small size the devices
can easily be spread on a Printed-Circuit Board (PCB) in order to move the ESD and EMI
protection close to the part of the design which shall be protected.
PEMIXQFN_PEMI2STD_FAM
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 2 — 3 November 2011
© NXP B.V. 2011. All rights reserved.
9 of 29
PEMIxQFN; PEMI2STD family
NXP Semiconductors
1-, 2-, 4-, 6- and 8-channel passive filter network with ESD protection
6.4 Insertion loss
The devices are designed as EMI/RFI filters for multichannel interfaces.
All measurements were performed in a typical 50  NetWork Analyzer (NWA) setup as
shown in Figure 1. The insertion loss was measured with a test Printed-Circuit
Board (PCB) utilizing laser-drilled micro-via holes which connect the PCB ground plane to
the devices ground pins.
DUT
IN
OUT
50 Ω
50 Ω
Vgen
018aaa074
Fig 1.
Frequency response setup
018aaa161
0
S21
(dB)
S21
(dB)
(1)
(2)
–10
(1)
(2)
–10
(3)
–20
018aaa162
0
(3)
(4)
(4)
(5)
(5)
–20
(6)
(6)
(7)
–30
(7)
–30
–40
–40
–50
1
10
102
103
104
–50
1
10
f (MHz)
Rs(ch) = 20 
(2) PEMIxxxx/CG
(2) PEMIxxxx/HG
(3) PEMIxxxx/CK
(3) PEMIxxxx/HK
(4) PEMIxxxx/CM
(4) PEMIxxxx/HM
(5) PEMIxxxx/CP
(5) PEMIxxxx/HP
(6) PEMIxxxx/CR
(6) PEMIxxxx/HR
(7) PEMIxxxx/CT
(7) PEMIxxxx/HT
PEMIxxxx/Cx: Frequency response curves
Product data sheet
104
Rs(ch) = 45 
(1) PEMIxxxx/HE
PEMIXQFN_PEMI2STD_FAM
103
f (MHz)
(1) PEMIxxxx/CE
Fig 2.
102
Fig 3.
PEMIxxxx/Hx: Frequency response curves
All information provided in this document is subject to legal disclaimers.
Rev. 2 — 3 November 2011
© NXP B.V. 2011. All rights reserved.
10 of 29
PEMIxQFN; PEMI2STD family
NXP Semiconductors
1-, 2-, 4-, 6- and 8-channel passive filter network with ESD protection
018aaa163
0
S21
(dB)
S21
(dB)
(1)
(2)
–10
018aaa164
0
(1)
(2)
–10
(3)
(3)
(4)
(4)
(5)
–20
(5)
–20
(6)
(6)
(7)
–30
(7)
–30
–40
–40
–50
1
10
102
103
104
–50
1
10
f (MHz)
Rs(ch) = 100 
(1) PEMIxxxx/LE
(1) PEMIxxxx/RE
(2) PEMIxxxx/LG
(2) PEMIxxxx/RG
(3) PEMIxxxx/LK
(3) PEMIxxxx/RK
(4) PEMIxxxx/LM
(4) PEMIxxxx/RM
(5) PEMIxxxx/LP
(5) PEMIxxxx/RP
(6) PEMIxxxx/LR
(6) PEMIxxxx/RR
(7) PEMIxxxx/LT
(7) PEMIxxxx/RT
PEMIxxxx/Lx: Frequency response curves
PEMIXQFN_PEMI2STD_FAM
Product data sheet
103
104
f (MHz)
Rs(ch) = 65 
Fig 4.
102
Fig 5.
PEMIxxxx/Rx: Frequency response curves
All information provided in this document is subject to legal disclaimers.
Rev. 2 — 3 November 2011
© NXP B.V. 2011. All rights reserved.
11 of 29
PEMIxQFN; PEMI2STD family
NXP Semiconductors
1-, 2-, 4-, 6- and 8-channel passive filter network with ESD protection
018aaa165
0
S21
(dB)
–10
(1)
(2)
(3)
–20
(4)
(5)
(6)
–30
(7)
–40
–50
10
1
102
103
104
f (MHz)
Rs(ch) = 200 
(1) PEMIxxxx/WE
(2) PEMIxxxx/WG
(3) PEMIxxxx/WK
(4) PEMIxxxx/WM
(5) PEMIxxxx/WP
(6) PEMIxxxx/WR
(7) PEMIxxxx/WT
Fig 6.
PEMIxxxx/Wx: Frequency response curves
All important values of the RF behavior such as relative 3dB frequency, insertion loss at
800 MHz and above and also the DC attenuation in an NWA environment can be derived
from the insertion loss response curves depicted in Figure 2 to 6.
Note: insertion loss at low frequencies (1 MHz) is nearly independent from the channel
capacitance values available within the PEMI family.
6.4.1 Relative 3dB frequency (-filter structure)
Table 8.
Relative 3dB frequency (MHz) per RC combination; typical values
Tamb = 25 C; unless otherwise specified.
PEMIXQFN_PEMI2STD_FAM
Product data sheet
PEMIxxxx/
xE
xG
xK
xM
xP
xR
xT
Cch (pF)
15
19
23
28
32
36
40
PEMIxxxx/
Rs(ch)
Cx
20
397 MHz 317 MHz 264 MHz 218 MHz 194 MHz 170 MHz 153 MHz
Hx
45
376 MHz 300 MHz 249 MHz 206 MHz 185 MHz 161 MHz 145 MHz
Lx
65
361 MHz 288 MHz 239 MHz 197 MHz 176 MHz 155 MHz 139 MHz
Rx
100
343 MHz 272 MHz 227 MHz 187 MHz 166 MHz 145 MHz 131 MHz
Wx
200
311 MHz 247 MHz 205 MHz 169 MHz 150 MHz 132 MHz 119 MHz
All information provided in this document is subject to legal disclaimers.
Rev. 2 — 3 November 2011
© NXP B.V. 2011. All rights reserved.
12 of 29
PEMIxQFN; PEMI2STD family
NXP Semiconductors
1-, 2-, 4-, 6- and 8-channel passive filter network with ESD protection
6.4.2 Insertion loss (dB) at 800 MHz (-filter structure)
Table 9.
Insertion loss (dB) at 800 MHz per RC combination; typical values
Tamb = 25 C; unless otherwise specified.
PEMIxxxx/
Cch (pF)
xE
xG
xK
xM
xP
xR
xT
15
19
23
28
32
36
40
PEMIxxxx/
Rs(ch)
Cx
20
9 dB
11 dB
13 dB
15 dB
16 dB
18 dB
19 dB
Hx
45
12 dB
14 dB
17 dB
19 dB
21 dB
23 dB
25 dB
Lx
65
14 dB
17 dB
19 dB
22 dB
25 dB
27 dB
29 dB
Rx
100
17 dB
20 dB
23 dB
26 dB
29 dB
32 dB
35 dB
Wx
200
22 dB
26 dB
29 dB
34 dB
36 dB
39 dB
41 dB
6.4.3 Insertion loss (dB) at frequencies lower than 1 MHz (-filter structure)
Table 10. Insertion loss (dB) at  1 MHz per RC combination; typical values
Tamb = 25 C; unless otherwise specified.
PEMIxxxx/
xE
xG
xK
xM
xP
xR
xT
Cch (pF)
15
19
23
28
32
36
40
PEMIxxxx/
Rs(ch)
Cx
20
1.6 dB
1.6 dB
1.6 dB
1.6 dB
1.6 dB
1.6 dB
1.6 dB
Hx
45
3.2 dB
3.2 dB
3.2 dB
3.2 dB
3.2 dB
3.2 dB
3.2 dB
Lx
65
4.3 dB
4.3 dB
4.3 dB
4.3 dB
4.3 dB
4.3 dB
4.3 dB
Rx
100
6.0 dB
6.0 dB
6.0 dB
6.0 dB
6.0 dB
6.0 dB
6.0 dB
Wx
200
9.5 dB
9.5 dB
9.5 dB
9.5 dB
9.5 dB
9.5 dB
9.5 dB
7. Marking
Table 11.
Marking codes
Type number
Marking
code
Type number
Marking
code
Type number
Marking
code
Type number
Marking
code
PEMI1QFN/CE
CE
PEMI2QFN/LP
LP
PEMI4QFN/CE
CE
PEMI6QFN/LP
LP
PEMI1QFN/CG
CG
PEMI2QFN/LR
LR
PEMI4QFN/CG
CG
PEMI6QFN/LR
LR
PEMI1QFN/CK
CK
PEMI2QFN/LT
LT
PEMI4QFN/CK
CK
PEMI6QFN/LT
LT
PEMI1QFN/CM
CM
PEMI2QFN/RE
RE
PEMI4QFN/CM
CM
PEMI6QFN/RE
RE
PEMI1QFN/CP
CP
PEMI2QFN/RG
RG
PEMI4QFN/CP
CP
PEMI6QFN/RG
RG
PEMI1QFN/CR
CR
PEMI2QFN/RK
RK
PEMI4QFN/CR
CR
PEMI6QFN/RK
RK
PEMI1QFN/CT
CT
PEMI2QFN/RM
RM
PEMI4QFN/CT
CT
PEMI6QFN/RM
RM
PEMI1QFN/HE
HE
PEMI2QFN/RP
RP
PEMI4QFN/HE
HE
PEMI6QFN/RP
RP
PEMI1QFN/HG
HG
PEMI2QFN/RR
RR
PEMI4QFN/HG
HG
PEMI6QFN/RR
RR
PEMI1QFN/HK
HK
PEMI2QFN/RT
RT
PEMI4QFN/HK
HK
PEMI6QFN/RT
RT
PEMI1QFN/HM
HM
PEMI2QFN/WE
WE
PEMI4QFN/HM
HM
PEMI6QFN/WE
WE
PEMI1QFN/HP
HP
PEMI2QFN/WG
WG
PEMI4QFN/HP
HP
PEMI6QFN/WG
WG
PEMI1QFN/HR
HR
PEMI2QFN/WK
WK
PEMI4QFN/HR
HR
PEMI6QFN/WK
WK
PEMI1QFN/HT
HT
PEMI2QFN/WM
WM
PEMI4QFN/HT
HT
PEMI6QFN/WM
WM
PEMIXQFN_PEMI2STD_FAM
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 2 — 3 November 2011
© NXP B.V. 2011. All rights reserved.
13 of 29
PEMIxQFN; PEMI2STD family
NXP Semiconductors
1-, 2-, 4-, 6- and 8-channel passive filter network with ESD protection
Table 11.
Marking codes …continued
Type number
Marking
code
Type number
Marking
code
Type number
Marking
code
Type number
Marking
code
PEMI1QFN/LE
LE
PEMI2QFN/WP
WP
PEMI4QFN/LE
LE
PEMI6QFN/WP
WP
PEMI1QFN/LG
LG
PEMI2QFN/WR
WR
PEMI4QFN/LG
LG
PEMI6QFN/WR
WR
PEMI1QFN/LK
LK
PEMI2QFN/WT
WT
PEMI4QFN/LK
LK
PEMI6QFN/WT
WT
PEMI1QFN/LM
LM
PEMI2STD/CE
CE
PEMI4QFN/LM
LM
PEMI8QFN/CE
CE
PEMI1QFN/LP
LP
PEMI2STD/CG
CG
PEMI4QFN/LP
LP
PEMI8QFN/CG
CG
PEMI1QFN/LR
LR
PEMI2STD/CK
CK
PEMI4QFN/LR
LR
PEMI8QFN/CK
CK
PEMI1QFN/LT
LT
PEMI2STD/CM
CM
PEMI4QFN/LT
LT
PEMI8QFN/CM
CM
PEMI1QFN/RE
RE
PEMI2STD/CP
CP
PEMI4QFN/RE
RE
PEMI8QFN/CP
CP
PEMI1QFN/RG
RG
PEMI2STD/CR
CR
PEMI4QFN/RG
RG
PEMI8QFN/CR
CR
PEMI1QFN/RK
RK
PEMI2STD/CT
CT
PEMI4QFN/RK
RK
PEMI8QFN/CT
CT
PEMI1QFN/RM
RM
PEMI2STD/HE
HE
PEMI4QFN/RM
RM
PEMI8QFN/HE
HE
PEMI1QFN/RP
RP
PEMI2STD/HG
HG
PEMI4QFN/RP
RP
PEMI8QFN/HG
HG
PEMI1QFN/RR
RR
PEMI2STD/HK
HK
PEMI4QFN/RR
RR
PEMI8QFN/HK
HK
PEMI1QFN/RT
RT
PEMI2STD/HM
HM
PEMI4QFN/RT
RT
PEMI8QFN/HM
HM
PEMI1QFN/WE
WE
PEMI2STD/HP
HP
PEMI4QFN/WE
WE
PEMI8QFN/HP
HP
PEMI1QFN/WG
WG
PEMI2STD/HR
HR
PEMI4QFN/WG
WG
PEMI8QFN/HR
HR
PEMI1QFN/WK
WK
PEMI2STD/HT
HT
PEMI4QFN/WK
WK
PEMI8QFN/HT
HT
PEMI1QFN/WM
WM
PEMI2STD/LE
LE
PEMI4QFN/WM
WM
PEMI8QFN/LE
LE
PEMI1QFN/WP
WP
PEMI2STD/LG
LG
PEMI4QFN/WP
WP
PEMI8QFN/LG
LG
PEMI1QFN/WR
WR
PEMI2STD/LK
LK
PEMI4QFN/WR
WR
PEMI8QFN/LK
LK
PEMI1QFN/WT
WT
PEMI2STD/LM
LM
PEMI4QFN/WT
WT
PEMI8QFN/LM
LM
PEMI2QFN/CE
CE
PEMI2STD/LP
LP
PEMI6QFN/CE
CE
PEMI8QFN/LP
LP
PEMI2QFN/CG
CG
PEMI2STD/LR
LR
PEMI6QFN/CG
CG
PEMI8QFN/LR
LR
PEMI2QFN/CK
CK
PEMI2STD/LT
LT
PEMI6QFN/CK
CK
PEMI8QFN/LT
LT
PEMI2QFN/CM
CM
PEMI2STD/RE
RE
PEMI6QFN/CM
CM
PEMI8QFN/RE
RE
PEMI2QFN/CP
CP
PEMI2STD/RG
RG
PEMI6QFN/CP
CP
PEMI8QFN/RG
RG
PEMI2QFN/CR
CR
PEMI2STD/RK
RK
PEMI6QFN/CR
CR
PEMI8QFN/RK
RK
PEMI2QFN/CT
CT
PEMI2STD/RM
RM
PEMI6QFN/CT
CT
PEMI8QFN/RM
RM
PEMI2QFN/HE
HE
PEMI2STD/RP
RP
PEMI6QFN/HE
HE
PEMI8QFN/RP
RP
PEMI2QFN/HG
HG
PEMI2STD/RR
RR
PEMI6QFN/HG
HG
PEMI8QFN/RR
RR
PEMI2QFN/HK
HK
PEMI2STD/RT
RT
PEMI6QFN/HK
HK
PEMI8QFN/RT
RT
PEMI2QFN/HM
HM
PEMI2STD/WE
WE
PEMI6QFN/HM
HM
PEMI8QFN/WE
WE
PEMI2QFN/HP
HP
PEMI2STD/WG
WG
PEMI6QFN/HP
HP
PEMI8QFN/WG
WG
PEMI2QFN/HR
HR
PEMI2STD/WK
WK
PEMI6QFN/HR
HR
PEMI8QFN/WK
WK
PEMI2QFN/HT
HT
PEMI2STD/WM
WM
PEMI6QFN/HT
HT
PEMI8QFN/WM
WM
PEMI2QFN/LE
LE
PEMI2STD/WP
WP
PEMI6QFN/LE
LE
PEMI8QFN/WP
WP
PEMI2QFN/LG
LG
PEMI2STD/WR
WR
PEMI6QFN/LG
LG
PEMI8QFN/WR
WR
PEMI2QFN/LK
LK
PEMI2STD/WT
WT
PEMI6QFN/LK
LK
PEMI8QFN/WT
WT
PEMI2QFN/LM
LM
-
-
PEMI6QFN/LM
LM
-
-
PEMIXQFN_PEMI2STD_FAM
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 2 — 3 November 2011
© NXP B.V. 2011. All rights reserved.
14 of 29
PEMIxQFN; PEMI2STD family
NXP Semiconductors
1-, 2-, 4-, 6- and 8-channel passive filter network with ESD protection
8. Package outline
Leadless ultra small plastic package; 3 solder lands; body 1.0 x 0.6 x 0.5 mm
L
SOT883
L1
2
b
3
e
b1
1
e1
A
A1
E
D
0
0.5
1 mm
scale
DIMENSIONS (mm are the original dimensions)
UNIT
A (1)
A1
max.
b
b1
D
E
e
e1
L
L1
mm
0.50
0.46
0.03
0.20
0.12
0.55
0.47
0.62
0.55
1.02
0.95
0.35
0.65
0.30
0.22
0.30
0.22
Note
1. Including plating thickness
OUTLINE
VERSION
REFERENCES
IEC
JEDEC
JEITA
SOT883
Fig 7.
SC-101
EUROPEAN
PROJECTION
ISSUE DATE
03-02-05
03-04-03
Package outline PEMI1QFN (SOT883/SC-101)
PEMIXQFN_PEMI2STD_FAM
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 2 — 3 November 2011
© NXP B.V. 2011. All rights reserved.
15 of 29
PEMIxQFN; PEMI2STD family
NXP Semiconductors
1-, 2-, 4-, 6- and 8-channel passive filter network with ESD protection
XSON6: plastic extremely thin small outline package; no leads; 6 terminals; body 1 x 1.45 x 0.5 mm
SOT886
b
1
2
3
4×
(2)
L
L1
e
6
5
4
e1
e1
6×
A
(2)
A1
D
E
terminal 1
index area
0
1
2 mm
scale
DIMENSIONS (mm are the original dimensions)
UNIT
A (1)
max
A1
max
b
D
E
e
e1
L
L1
mm
0.5
0.04
0.25
0.17
1.5
1.4
1.05
0.95
0.6
0.5
0.35
0.27
0.40
0.32
Notes
1. Including plating thickness.
2. Can be visible in some manufacturing processes.
OUTLINE
VERSION
SOT886
Fig 8.
REFERENCES
IEC
JEDEC
JEITA
EUROPEAN
PROJECTION
ISSUE DATE
04-07-15
04-07-22
MO-252
Package outline PEMI2QFN (SOT886/XSON6)
PEMIXQFN_PEMI2STD_FAM
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 2 — 3 November 2011
© NXP B.V. 2011. All rights reserved.
16 of 29
PEMIxQFN; PEMI2STD family
NXP Semiconductors
1-, 2-, 4-, 6- and 8-channel passive filter network with ESD protection
Plastic surface-mounted package; 5 leads
SOT665
D
E
A
X
Y S
S
HE
5
4
A
1
2
e1
c
3
bp
w M A
Lp
e
detail X
0
1
2 mm
scale
DIMENSIONS (mm are the original dimensions)
UNIT
A
bp
c
D
E
e
e1
HE
Lp
w
y
mm
0.6
0.5
0.27
0.17
0.18
0.08
1.7
1.5
1.3
1.1
1.0
0.5
1.7
1.5
0.3
0.1
0.1
0.1
OUTLINE
VERSION
REFERENCES
IEC
JEDEC
JEITA
ISSUE DATE
04-11-08
06-03-16
SOT665
Fig 9.
EUROPEAN
PROJECTION
Package outline PEMI2STD (SOT665)
PEMIXQFN_PEMI2STD_FAM
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 2 — 3 November 2011
© NXP B.V. 2011. All rights reserved.
17 of 29
PEMIxQFN; PEMI2STD family
NXP Semiconductors
1-, 2-, 4-, 6- and 8-channel passive filter network with ESD protection
HXSON8: plastic thermal enhanced extremely thin small outline package; no leads;
8 terminals; body 1.2 x 1.7 x 0.5 mm
SOT1157-1
X
A
B
D
E
A
A1
A3
terminal 1
index area
detail X
e1
terminal 1
index area
e
v
w
b
1
4
C
C A B
C
y
y1 C
L
k
E2
8
5
D2
0
1
scale
Dimensions
Unit(1)
mm
max
nom
min
2 mm
A
A1
0.5
0.05
A3
b
0.25
0.127 0.20
0.15
0.00
D
D2
E
E2
1.8
1.7
1.6
1.25
1.20
1.15
1.3
1.2
1.1
0.35
0.30
0.25
e
e1
0.4
1.2
k
L
v
0.2
0.30
0.25
0.20
0.1
w
y
y1
0.05 0.05 0.05
Note
1. Plastic or metal protrusions of 0.075 maximum per side are not included.
References
Outline
version
IEC
JEDEC
JEITA
SOT1157-1
---
---
---
sot1157-1_po
European
projection
Issue date
09-12-16
09-12-17
Fig 10. Package outline PEMI4QFN (SOT1157-1/HXSON8)
PEMIXQFN_PEMI2STD_FAM
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 2 — 3 November 2011
© NXP B.V. 2011. All rights reserved.
18 of 29
PEMIxQFN; PEMI2STD family
NXP Semiconductors
1-, 2-, 4-, 6- and 8-channel passive filter network with ESD protection
HXSON12: plastic thermal enhanced extremely thin small outline package; no leads;
12 terminals; body 1.2 x 2.5 x 0.5 mm
SOT1158-1
X
A
B
D
E
A
A1
A3
terminal 1
index area
detail X
e1
terminal 1
index area
e
v
w
b
1
6
C
C A B
C
y
y1 C
L
k
E2
12
7
D2
0
1
scale
Dimensions
Unit(1)
mm
max
nom
min
2 mm
A
A1
0.5
0.05
A3
b
0.25
0.127 0.20
0.15
0.00
D
D2
E
E2
2.6
2.5
2.4
2.1
2.0
1.9
1.3
1.2
1.1
0.35
0.30
0.25
e
e1
0.4
2
k
L
v
0.2
0.30
0.25
0.20
0.1
w
y
y1
0.05 0.05 0.05
Note
1. Plastic or metal protrusions of 0.075 maximum per side are not included.
References
Outline
version
IEC
JEDEC
JEITA
SOT1158-1
---
---
---
sot1158-1_po
European
projection
Issue date
09-12-16
09-12-17
Fig 11. Package outline PEMI6QFN (SOT1158-1/HXSON12)
PEMIXQFN_PEMI2STD_FAM
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 2 — 3 November 2011
© NXP B.V. 2011. All rights reserved.
19 of 29
PEMIxQFN; PEMI2STD family
NXP Semiconductors
1-, 2-, 4-, 6- and 8-channel passive filter network with ESD protection
HXSON16: plastic thermal enhanced extremely thin small outline package; no leads;
16 terminals; body 1.2 x 3.3 x 0.5 mm
SOT1159-1
X
B
D
A
E
A
A1
A3
terminal 1
index area
detail X
e1
terminal 1
index area
e
v
w
b
1
8
C
C A B
C
y1 C
y
L
k
E2
16
9
D2
0
1
scale
Dimensions
Unit(1)
mm
max
nom
min
2 mm
A
A1
0.5
0.05
A3
b
0.25
0.127 0.20
0.15
0.00
D
D2
E
E2
3.4
3.3
3.2
2.9
2.8
2.7
1.3
1.2
1.1
0.35
0.30
0.25
e
e1
0.4
2.8
k
L
v
0.2
0.30
0.25
0.20
0.1
w
y
y1
0.05 0.05 0.05
Note
1. Plastic or metal protrusions of 0.075 maximum per side are not included.
References
Outline
version
IEC
JEDEC
JEITA
SOT1159-1
---
---
---
sot1159-1_po
European
projection
Issue date
09-12-16
09-12-17
Fig 12. Package outline PEMI8QFN (SOT1159-1/HXSON16)
PEMIXQFN_PEMI2STD_FAM
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 2 — 3 November 2011
© NXP B.V. 2011. All rights reserved.
20 of 29
PEMIxQFN; PEMI2STD family
NXP Semiconductors
1-, 2-, 4-, 6- and 8-channel passive filter network with ESD protection
9. Soldering
1.3
0.7
R0.05 (12×)
solder lands
solder resist
0.9
0.7
0.6
solder paste
0.25
(2×)
occupied area
0.3
(2×)
0.3
0.4
(2×)
0.4
Dimensions in mm
sot883_fr
Reflow soldering is the only recommended soldering method.
Fig 13. Reflow soldering PEMI1QFN (SOT883/SC-101)
1.250
0.675
0.370
(6×)
0.500
1.700
solder resist
0.500
solder paste = solderland
0.270
(6×)
occupied area
Dimensions in mm
0.325
(6×)
0.425
(6×)
sot886_fr
Reflow soldering is the only recommended soldering method.
Fig 14. Reflow soldering PEMI2QFN (SOT886/XSON6)
PEMIXQFN_PEMI2STD_FAM
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 2 — 3 November 2011
© NXP B.V. 2011. All rights reserved.
21 of 29
PEMIxQFN; PEMI2STD family
NXP Semiconductors
1-, 2-, 4-, 6- and 8-channel passive filter network with ESD protection
2.45
2.1
1.6
solder lands
0.4
(5×)
0.7
(2×)
placement area
2
1
0.25
0.3
0.55
solder paste
0.45 0.4
(2×) (2×)
0.538
0.325 0.375
(2×) (2×)
occupied area
Dimensions in mm
1.7
0.45
(4×)
0.6
0.5
(4×)
0.65
sot665_fr
Reflow soldering is the only recommended soldering method.
Fig 15. Reflow soldering PEMI2STD (SOT665)
PEMIXQFN_PEMI2STD_FAM
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 2 — 3 November 2011
© NXP B.V. 2011. All rights reserved.
22 of 29
PEMIxQFN; PEMI2STD family
NXP Semiconductors
1-, 2-, 4-, 6- and 8-channel passive filter network with ESD protection
Footprint information for reflow soldering of HXSON8 package
SOT1157-1
Hx
Gx
D
0.025
P
0.025
Ay
Gy
By
SPy
SLy
nSPy
Hy
nSPx
SPx
SLx
Generic footprint pattern
Refer to the package outline drawing for actual layout
solder land
solder paste deposit
solder land plus solder paste
occupied area
solder resist
DIMENSIONS in mm
P
Ay
By
D
Slx
Sly
SPx
SPy
Gx
Gy
Hx
Hy
0.40
1.75
0.75
0.22
1.25
0.35
0.6
0.2
1.65
1.45
1.95
2.0
Issue date
11-06-27
11-07-06
sot1157-1_fr
Reflow soldering is the only recommended soldering method.
Fig 16. Reflow soldering PEMI4QFN (SOT1157-1/HXSON8)
PEMIXQFN_PEMI2STD_FAM
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 2 — 3 November 2011
© NXP B.V. 2011. All rights reserved.
23 of 29
PEMIxQFN; PEMI2STD family
NXP Semiconductors
1-, 2-, 4-, 6- and 8-channel passive filter network with ESD protection
Footprint information for reflow soldering of HXSON12 package
SOT1158-1
Hx
Gx
D
0.025
P
0.025
Ay
Gy
By
SPy
SPy tot
SLy
nSPy
Hy
nSPx
SPx
SLx
Generic footprint pattern
Refer to the package outline drawing for actual layout
solder land
solder paste deposit
solder land plus solder paste
occupied area
solder resist
DIMENSIONS in mm
P
Ay
By
D
Slx
Sly
SPx
SPy
Gx
Gy
Hx
Hy
0.40
1.75
0.75
0.22
2.1
0.35
0.9
0.2
2.45
1.45
2.75
2.0
Issue date
11-06-27
11-07-06
sot1158-1_fr
Reflow soldering is the only recommended soldering method.
Fig 17. Reflow soldering PEMI6QFN (SOT1158-1/HXSON12)
PEMIXQFN_PEMI2STD_FAM
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 2 — 3 November 2011
© NXP B.V. 2011. All rights reserved.
24 of 29
PEMIxQFN; PEMI2STD family
NXP Semiconductors
1-, 2-, 4-, 6- and 8-channel passive filter network with ESD protection
Footprint information for reflow soldering of HXSON16 package
SOT1159-1
Hx
Gx
D
0.025
P
0.025
Ay
Gy
By
SPy
SPy tot
SLy
nSPy
Hy
nSPx
SPx
SLx
Generic footprint pattern
Refer to the package outline drawing for actual layout
solder land
solder paste deposit
solder land plus solder paste
occupied area
solder resist
DIMENSIONS in mm
P
Ay
By
D
Slx
Sly
SPx
SPy
Gx
Gy
Hx
Hy
0.40
2.15
0.75
0.21
2.9
0.35
1.3
0.2
3.25
1.45
3.55
2.4
Issue date
11-06-27
11-07-06
sot1159-1_fr
Reflow soldering is the only recommended soldering method.
Fig 18. Reflow soldering PEMI8QFN (SOT1159-1/HXSON16)
PEMIXQFN_PEMI2STD_FAM
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 2 — 3 November 2011
© NXP B.V. 2011. All rights reserved.
25 of 29
PEMIxQFN; PEMI2STD family
NXP Semiconductors
1-, 2-, 4-, 6- and 8-channel passive filter network with ESD protection
10. Revision history
Table 12.
Revision history
Document ID
Release date
PEMIXQFN_PEMI2STD_ 20111103
FAM v.2
Modifications:
Product data sheet
Change notice
Supersedes
Product data sheet
-
PEMIXQFN_PEMI2STD_
FAM v.1
•
Table 3 “Pinning”: corrected pinning description for PEMI8QFN (SOT1159-1); updated
simplified outline of SOT886
•
Section 11 “Legal information”: updated
PEMIXQFN_PEMI2STD_ 20110729
FAM v.1
PEMIXQFN_PEMI2STD_FAM
Data sheet status
Product data sheet
-
All information provided in this document is subject to legal disclaimers.
Rev. 2 — 3 November 2011
-
© NXP B.V. 2011. All rights reserved.
26 of 29
PEMIxQFN; PEMI2STD family
NXP Semiconductors
1-, 2-, 4-, 6- and 8-channel passive filter network with ESD protection
11. Legal information
11.1
Data sheet status
Document status[1][2]
Product status[3]
Definition
Objective [short] data sheet
Development
This document contains data from the objective specification for product development.
Preliminary [short] data sheet
Qualification
This document contains data from the preliminary specification.
Product [short] data sheet
Production
This document contains the product specification.
[1]
Please consult the most recently issued document before initiating or completing a design.
[2]
The term ‘short data sheet’ is explained in section “Definitions”.
[3]
The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status
information is available on the Internet at URL http://www.nxp.com.
11.2
Definitions
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liability for the consequences of
use of such information.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and title. A short data sheet is intended
for quick reference only and should not be relied upon to contain detailed and
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local NXP Semiconductors sales
office. In case of any inconsistency or conflict with the short data sheet, the
full data sheet shall prevail.
Product specification — The information and data provided in a Product
data sheet shall define the specification of the product as agreed between
NXP Semiconductors and its customer, unless NXP Semiconductors and
customer have explicitly agreed otherwise in writing. In no event however,
shall an agreement be valid in which the NXP Semiconductors product is
deemed to offer functions and qualities beyond those described in the
Product data sheet.
11.3
Disclaimers
Limited warranty and liability — Information in this document is believed to
be accurate and reliable. However, NXP Semiconductors does not give any
representations or warranties, expressed or implied, as to the accuracy or
completeness of such information and shall have no liability for the
consequences of use of such information.
In no event shall NXP Semiconductors be liable for any indirect, incidental,
punitive, special or consequential damages (including - without limitation - lost
profits, lost savings, business interruption, costs related to the removal or
replacement of any products or rework charges) whether or not such
damages are based on tort (including negligence), warranty, breach of
contract or any other legal theory.
Notwithstanding any damages that customer might incur for any reason
whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards
customer for the products described herein shall be limited in accordance
with the Terms and conditions of commercial sale of NXP Semiconductors.
malfunction of an NXP Semiconductors product can reasonably be expected
to result in personal injury, death or severe property or environmental
damage. NXP Semiconductors accepts no liability for inclusion and/or use of
NXP Semiconductors products in such equipment or applications and
therefore such inclusion and/or use is at the customer’s own risk.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty that such applications will be suitable for the
specified use without further testing or modification.
Customers are responsible for the design and operation of their applications
and products using NXP Semiconductors products, and NXP Semiconductors
accepts no liability for any assistance with applications or customer product
design. It is customer’s sole responsibility to determine whether the NXP
Semiconductors product is suitable and fit for the customer’s applications and
products planned, as well as for the planned application and use of
customer’s third party customer(s). Customers should provide appropriate
design and operating safeguards to minimize the risks associated with their
applications and products.
NXP Semiconductors does not accept any liability related to any default,
damage, costs or problem which is based on any weakness or default in the
customer’s applications or products, or the application or use by customer’s
third party customer(s). Customer is responsible for doing all necessary
testing for the customer’s applications and products using NXP
Semiconductors products in order to avoid a default of the applications and
the products or of the application or use by customer’s third party
customer(s). NXP does not accept any liability in this respect.
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) will cause permanent
damage to the device. Limiting values are stress ratings only and (proper)
operation of the device at these or any other conditions above those given in
the Recommended operating conditions section (if present) or the
Characteristics sections of this document is not warranted. Constant or
repeated exposure to limiting values will permanently and irreversibly affect
the quality and reliability of the device.
Terms and conditions of commercial sale — NXP Semiconductors
products are sold subject to the general terms and conditions of commercial
sale, as published at http://www.nxp.com/profile/terms, unless otherwise
agreed in a valid written individual agreement. In case an individual
agreement is concluded only the terms and conditions of the respective
agreement shall apply. NXP Semiconductors hereby expressly objects to
applying the customer’s general terms and conditions with regard to the
purchase of NXP Semiconductors products by customer.
Right to make changes — NXP Semiconductors reserves the right to make
changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
No offer to sell or license — Nothing in this document may be interpreted or
construed as an offer to sell products that is open for acceptance or the grant,
conveyance or implication of any license under any copyrights, patents or
other industrial or intellectual property rights.
Suitability for use — NXP Semiconductors products are not designed,
authorized or warranted to be suitable for use in life support, life-critical or
safety-critical systems or equipment, nor in applications where failure or
Export control — This document as well as the item(s) described herein
may be subject to export control regulations. Export might require a prior
authorization from competent authorities.
PEMIXQFN_PEMI2STD_FAM
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 2 — 3 November 2011
© NXP B.V. 2011. All rights reserved.
27 of 29
NXP Semiconductors
PEMIxQFN; PEMI2STD family
1-, 2-, 4-, 6- and 8-channel passive filter network with ESD protection
Quick reference data — The Quick reference data is an extract of the
product data given in the Limiting values and Characteristics sections of this
document, and as such is not complete, exhaustive or legally binding.
Non-automotive qualified products — Unless this data sheet expressly
states that this specific NXP Semiconductors product is automotive qualified,
the product is not suitable for automotive use. It is neither qualified nor tested
in accordance with automotive testing or application requirements. NXP
Semiconductors accepts no liability for inclusion and/or use of
non-automotive qualified products in automotive equipment or applications.
In the event that customer uses the product for design-in and use in
automotive applications to automotive specifications and standards, customer
(a) shall use the product without NXP Semiconductors’ warranty of the
product for such automotive applications, use and specifications, and (b)
whenever customer uses the product for automotive applications beyond
NXP Semiconductors’ specifications such use shall be solely at customer’s
own risk, and (c) customer fully indemnifies NXP Semiconductors for any
liability, damages or failed product claims resulting from customer design and
use of the product for automotive applications beyond NXP Semiconductors’
standard warranty and NXP Semiconductors’ product specifications.
11.4
Trademarks
Notice: All referenced brands, product names, service names and trademarks
are the property of their respective owners.
12. Contact information
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
PEMIXQFN_PEMI2STD_FAM
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 2 — 3 November 2011
© NXP B.V. 2011. All rights reserved.
28 of 29
NXP Semiconductors
PEMIxQFN; PEMI2STD family
1-, 2-, 4-, 6- and 8-channel passive filter network with ESD protection
13. Contents
1
1.1
1.2
1.3
1.4
2
3
4
5
6
6.1
6.2
6.3
6.4
6.4.1
6.4.2
6.4.3
7
8
9
10
11
11.1
11.2
11.3
11.4
12
13
Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1
General description . . . . . . . . . . . . . . . . . . . . . 1
Features and benefits . . . . . . . . . . . . . . . . . . . . 1
Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Quick reference data . . . . . . . . . . . . . . . . . . . . 2
Pinning information . . . . . . . . . . . . . . . . . . . . . . 2
Ordering information . . . . . . . . . . . . . . . . . . . . . 4
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 4
Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 5
Application information. . . . . . . . . . . . . . . . . . . 9
Use cases . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
LCD interfaces, medium-speed interfaces . . . . 9
Keypad, low-speed interfaces. . . . . . . . . . . . . . 9
Insertion loss . . . . . . . . . . . . . . . . . . . . . . . . . 10
Relative -3dB frequency (p-filter structure) . . . 12
Insertion loss (dB) at 800 MHz (p-filter
structure) . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Insertion loss (dB) at frequencies lower than
1 MHz (p-filter structure) . . . . . . . . . . . . . . . . . 13
Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Package outline . . . . . . . . . . . . . . . . . . . . . . . . 15
Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
Revision history . . . . . . . . . . . . . . . . . . . . . . . . 26
Legal information. . . . . . . . . . . . . . . . . . . . . . . 27
Data sheet status . . . . . . . . . . . . . . . . . . . . . . 27
Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27
Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 27
Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 28
Contact information. . . . . . . . . . . . . . . . . . . . . 28
Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
© NXP B.V. 2011.
All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
Date of release: 3 November 2011
Document identifier: PEMIXQFN_PEMI2STD_FAM