Datasheet - NXP Semiconductors

TO
-92
BT1306-400D/600D
Logic level triac
Rev. 2 — 14 September 2011
Product data sheet
1. Product profile
1.1 General description
Logic level sensitive gate triac intended to be interfaced directly to microcontrollers, logic
integrated circuits and other low power gate trigger circuits.
1.2 Features and benefits
 Sensitive gate in all four quadrants
 Low cost package.
1.3 Applications
 General purpose bidirectional
switching
 Solid state relays
 Phase control applications
 Low power AC fan speed controllers.
1.4 Quick reference data
 VDRM  600 V (BT1306-600D)
 ITSM  8 A
 VDRM  400 V (BT1306-400D)
 IT(RMS)  0.6 A.
2. Pinning information
Table 1.
Pinning - SOT54 (TO-92), simplified outline and symbol
Pin
Description
1
main terminal 2
2
gate
3
main terminal 1
Simplified outline
1
Symbol
1
2
3
2
msb033
SOT54 (TO-92)
3
mbl305
BT1306-400D/600D
NXP Semiconductors
Logic level triac
3. Ordering information
Table 2.
Ordering information
Type number
Package
Name
Description
Version
BT1306-600D
TO-92
Plastic single-ended leaded (through hole) package; 3 leads
SOT54
BT1306-400D
TO-92
Plastic single-ended leaded (through hole) package; 3 leads
SOT54
4. Limiting values
Table 3.
Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol Parameter
VDRM
Conditions
Min
Max
Unit
25 C  Tj  125 C
-
600
V
-
400
V
-
0.6
A
t = 20 ms
-
8
A
t = 16.7 ms
-
8.8
A
-
0.32
A2s
repetitive peak off-state voltage
BT1306-600D
BT1306-400D
full sine wave; Tlead  65 C; Figure 1 and 2
IT(RMS)
on-state current (RMS value)
ITSM
non-repetitive peak on-state current full sine wave; Tj = 25 C prior to surge;
Figure 3 and 4
I2t
I2t
dIT/dt
repetitive rate of rise of on-state
current after triggering
for fusing
t = 10 ms
ITM = 1 A; IG = 0.2 A; dIG/dt = 0.2 A/s
T2+ G+
-
50
A/s
T2+ G
-
50
A/s
T2 G
-
50
A/s
T2 G+
-
10
A/s
t = 2 s max
IGM
gate current (peak value)
-
1
A
VGM
gate voltage (peak value)
-
5
V
PGM
gate power (peak value)
-
5
W
PG(AV)
average gate power
-
0.1
W
Tstg
storage temperature
40
+150
C
Tj
junction temperature
40
+125
C
BT1306_XXXD_SER
Product data sheet
t = 2 s max; Tcase  80 C
All information provided in this document is subject to legal disclaimers.
Rev. 2 — 14 September 2011
© NXP B.V. 2011. All rights reserved.
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BT1306-400D/600D
NXP Semiconductors
Logic level triac
003aaa037
0.8
IT(RMS)
(A)
003aaa041
3
IT(RMS)
(A)
0.6
2
0.4
1
0.2
0
0
50
100
0
10-3
150
10-2
1
Tlead (°C)
tsurge (S)
10
f = 50 Hz
Tlead  65 C
Fig 1.
Maximum permissible on-state current (RMS
value) as a function of lead temperature.
Fig 2.
003aaa040
103
ITSM
IT
ITSM
(A)
Maximum permissible repetitive on-state
current (RMS value) as a function of surge
duration for sinusoidal currents.
003aaa038
10
ITSM
(A)
8
t
Tp
102
6
dlT/dt limit
T2- G+ quadrant
4
10
2
1
10-5
0
10-4
10-3
10-2
tp (s)
10-1
1
10
102
103
n
tp  20 ms
n = number of cycles
initial Tj  25 C
f = 50 Hz
initial Tj  25 C
Fig 3.
Maximum permissible non-repetitive peak
on-state current as a function of pulse width
for sinusoidal currents.
BT1306_XXXD_SER
Product data sheet
Fig 4.
Maximum permissible non-repetitive peak
on-state current as a function of number of
cycles for sinusoidal currents; typical values.
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Rev. 2 — 14 September 2011
© NXP B.V. 2011. All rights reserved.
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BT1306-400D/600D
NXP Semiconductors
Logic level triac
5. Thermal characteristics
Table 4.
Thermal characteristics
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
Rth(j-lead)
thermal resistance from junction to lead
full cycle
-
-
60
K/W
half cycle
thermal resistance from junction to ambient
Rth(j-a)
80
mounted on a printed-circuit board; lead length = 4 mm; Figure 5
150
-
K/W
5.1 Transient thermal impedance
003aaa029
103
Zth(j-a)
(K/W)
102
10
P
tp
1
10-5
10-4
10-3
10-2
10-1
1
t
10
tp (s)
Fig 5.
Transient thermal impedance from junction to ambient as a function of pulse duration; typical values.
BT1306_XXXD_SER
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 2 — 14 September 2011
© NXP B.V. 2011. All rights reserved.
4 of 12
BT1306-400D/600D
NXP Semiconductors
Logic level triac
6. Characteristics
Table 5.
Characteristics
Tj = 25 C unless otherwise specified.
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
T2+ G+
-
1
5
mA
T2+ G
-
2
5
mA
T2 G
-
2
5
mA
T2 G+
-
4
7
mA
T2+ G+
-
1
10
mA
T2+ G
-
5
10
mA
Static characteristics
IGT
IL
gate trigger current
latching current
VD = 12 V; IT = 0.1 A; Figure 8
VD = 12 V; IT = 0.1 A; Figure 9
T2 G
-
1
10
mA
T2 G+
-
2
10
mA
IH
holding current
VD = 12 V; IGT = 0.1 A; Figure 10
-
1
10
mA
VT
on-state voltage
IT = 0.85 A; Figure 11
-
1.4
1.9
V
VGT
gate trigger voltage
ID
off-state leakage current
VD = 12 V; IT = 0.1 A; Figure 7
-
0.9
2
V
VD = VDRM; IT = 0.1 A; Tj = 110 C
0.1
0.7
-
V
VD = VDRM(max); Tj = 110 C
-
3
100
A
VD = 67% of VDM(max); Tcase = 110 C;
exponential waveform; gate open circuit;
Figure 12
30
45
-
V/s
Dynamic characteristics
dVD/dt
critical rate of rise of off-state
voltage
dVcom/dt
critical rate of rise of commutation VD = rated VDM; Tcase = 50 C; ITM = 0.84 A;
voltage
commutating dI/dt = 0.3 A/ms
-
5
-
V/s
tgt
gate controlled turn-on time
-
2
-
s
BT1306_XXXD_SER
Product data sheet
ITM = 1.0 A; VD = VDRM(max); IG = 25 mA;
dIG/dt = 5 A/s
All information provided in this document is subject to legal disclaimers.
Rev. 2 — 14 September 2011
© NXP B.V. 2011. All rights reserved.
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BT1306-400D/600D
NXP Semiconductors
Logic level triac
003aaa036
1.2
003aaa039
1.6
VGT
Ptot
(W)
α
VGT(25°C)
α = 180°
α
1.2
120°
0.8
90°
60°
0.8
30°
0.4
0.4
0
0
0.2
0.4
0
-60
0.8
0.6
IT(RMS) (A)
90
140
V GT  T 
j
a = ----------------------V GT 25 C 
On-state dissipation as a function of on-state
current (RMS value); maximum values.
Fig 7.
003aaa030
3
Normalized gate trigger voltage as a function
of junction temperature; typical values.
003aaa031
3
IL
IL(25°C)
IGT
IGT(25°C)
(1)
(2)
2
2
(3)
(4)
(1)
(2)
(3)
1
1
(4)
0
-60
-10
40
90
0
-60
140
-10
I GT  T 
j
a = ---------------------I GT 25 C 
Product data sheet
90
140
I LT 
j
a = -----------------I L 25 C 
Normalized gate trigger current as a function
of junction temperature; typical values.
BT1306_XXXD_SER
40
Tj (°C)
Tj (°C)
Fig 8.
40
Tj (°C)
 = conduction angle
Fig 6.
-10
Fig 9.
Normalized latching current as a function of
junction temperature; typical values.
All information provided in this document is subject to legal disclaimers.
Rev. 2 — 14 September 2011
© NXP B.V. 2011. All rights reserved.
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BT1306-400D/600D
NXP Semiconductors
Logic level triac
003aaa032
2.0
IH
IH(25°C)
003aaa033
1.6
Tj = 125 °C
IT
(A)
Tj = 25 °C
1.2
1.5
(A)
1.0
0.8
Typ
Max
0.4
0.5
0
0
-60
-10
40
90
140
0
0.8
1.6
Tj (°C)
VT (V)
2.4
IH  T 
j
a = ------------------I H 25 C 
Fig 10. Normalized holding current as a function of
junction temperature; typical values.
Fig 11. On-state current as a function of on-state
voltage; typical and maximum values.
003aaa034
103
dVD/dt
(V/μs)
102
10
1
0
25
50
75
100
125
Tj (°C)
Fig 12. Critical rate of rise of off-state voltage as a function of junction temperature; typical values.
BT1306_XXXD_SER
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 2 — 14 September 2011
© NXP B.V. 2011. All rights reserved.
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BT1306-400D/600D
NXP Semiconductors
Logic level triac
7. Package outline
Plastic single-ended leaded (through hole) package; 3 leads
SOT54
c
E
d
A
L
b
1
e1
2
D
e
3
b1
L1
0
2.5
5 mm
scale
DIMENSIONS (mm are the original dimensions)
UNIT
A
b
b1
c
D
d
E
mm
5.2
5.0
0.48
0.40
0.66
0.55
0.45
0.38
4.8
4.4
1.7
1.4
4.2
3.6
e
2.54
e1
L
L1(1)
1.27
14.5
12.7
2.5
max.
Note
1. Terminal dimensions within this zone are uncontrolled to allow for flow of plastic and terminal irregularities.
OUTLINE
VERSION
SOT54
REFERENCES
IEC
JEDEC
JEITA
TO-92
SC-43A
EUROPEAN
PROJECTION
ISSUE DATE
04-06-28
04-11-16
Fig 13. SOT54 (TO-92).
BT1306_XXXD_SER
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 2 — 14 September 2011
© NXP B.V. 2011. All rights reserved.
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BT1306-400D/600D
NXP Semiconductors
Logic level triac
8. Revision history
Table 6.
Revision history
Document ID
Release date
Data sheet status
Change notice
Supersedes
BT1306_XXXD_SER v.2
20110914
Product data sheet
-
BT1306_XXXD_SER v.1
(9397 750 12593)
Modifications:
BT1306_XXXD_SER v.1
(9397 750 12593)
BT1306_XXXD_SER
Product data sheet
•
The format of this data sheet has been redesigned to comply with the new identity
guidelines of NXP Semiconductors.
•
•
Legal texts have been adapted to the new company name where appropriate.
Package outline drawings have been updated to the latest version.
20040219
Product data
-
All information provided in this document is subject to legal disclaimers.
Rev. 2 — 14 September 2011
-
© NXP B.V. 2011. All rights reserved.
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BT1306-400D/600D
NXP Semiconductors
Logic level triac
9. Legal information
9.1
Data sheet status
Document status[1][2]
Product status[3]
Definition
Objective [short] data sheet
Development
This document contains data from the objective specification for product development.
Preliminary [short] data sheet
Qualification
This document contains data from the preliminary specification.
Product [short] data sheet
Production
This document contains the product specification.
[1]
Please consult the most recently issued document before initiating or completing a design.
[2]
The term ‘short data sheet’ is explained in section “Definitions”.
[3]
The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status
information is available on the Internet at URL http://www.nxp.com.
9.2
Definitions
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liability for the consequences of
use of such information.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and title. A short data sheet is intended
for quick reference only and should not be relied upon to contain detailed and
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local NXP Semiconductors sales
office. In case of any inconsistency or conflict with the short data sheet, the
full data sheet shall prevail.
Product specification — The information and data provided in a Product
data sheet shall define the specification of the product as agreed between
NXP Semiconductors and its customer, unless NXP Semiconductors and
customer have explicitly agreed otherwise in writing. In no event however,
shall an agreement be valid in which the NXP Semiconductors product is
deemed to offer functions and qualities beyond those described in the
Product data sheet.
9.3
Disclaimers
Limited warranty and liability — Information in this document is believed to
be accurate and reliable. However, NXP Semiconductors does not give any
representations or warranties, expressed or implied, as to the accuracy or
completeness of such information and shall have no liability for the
consequences of use of such information.
In no event shall NXP Semiconductors be liable for any indirect, incidental,
punitive, special or consequential damages (including - without limitation - lost
profits, lost savings, business interruption, costs related to the removal or
replacement of any products or rework charges) whether or not such
damages are based on tort (including negligence), warranty, breach of
contract or any other legal theory.
Notwithstanding any damages that customer might incur for any reason
whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards
customer for the products described herein shall be limited in accordance
with the Terms and conditions of commercial sale of NXP Semiconductors.
malfunction of an NXP Semiconductors product can reasonably be expected
to result in personal injury, death or severe property or environmental
damage. NXP Semiconductors accepts no liability for inclusion and/or use of
NXP Semiconductors products in such equipment or applications and
therefore such inclusion and/or use is at the customer’s own risk.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty that such applications will be suitable for the
specified use without further testing or modification.
Customers are responsible for the design and operation of their applications
and products using NXP Semiconductors products, and NXP Semiconductors
accepts no liability for any assistance with applications or customer product
design. It is customer’s sole responsibility to determine whether the NXP
Semiconductors product is suitable and fit for the customer’s applications and
products planned, as well as for the planned application and use of
customer’s third party customer(s). Customers should provide appropriate
design and operating safeguards to minimize the risks associated with their
applications and products.
NXP Semiconductors does not accept any liability related to any default,
damage, costs or problem which is based on any weakness or default in the
customer’s applications or products, or the application or use by customer’s
third party customer(s). Customer is responsible for doing all necessary
testing for the customer’s applications and products using NXP
Semiconductors products in order to avoid a default of the applications and
the products or of the application or use by customer’s third party
customer(s). NXP does not accept any liability in this respect.
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) will cause permanent
damage to the device. Limiting values are stress ratings only and (proper)
operation of the device at these or any other conditions above those given in
the Recommended operating conditions section (if present) or the
Characteristics sections of this document is not warranted. Constant or
repeated exposure to limiting values will permanently and irreversibly affect
the quality and reliability of the device.
Terms and conditions of commercial sale — NXP Semiconductors
products are sold subject to the general terms and conditions of commercial
sale, as published at http://www.nxp.com/profile/terms, unless otherwise
agreed in a valid written individual agreement. In case an individual
agreement is concluded only the terms and conditions of the respective
agreement shall apply. NXP Semiconductors hereby expressly objects to
applying the customer’s general terms and conditions with regard to the
purchase of NXP Semiconductors products by customer.
Right to make changes — NXP Semiconductors reserves the right to make
changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
No offer to sell or license — Nothing in this document may be interpreted or
construed as an offer to sell products that is open for acceptance or the grant,
conveyance or implication of any license under any copyrights, patents or
other industrial or intellectual property rights.
Suitability for use — NXP Semiconductors products are not designed,
authorized or warranted to be suitable for use in life support, life-critical or
safety-critical systems or equipment, nor in applications where failure or
Export control — This document as well as the item(s) described herein
may be subject to export control regulations. Export might require a prior
authorization from national authorities.
BT1306_XXXD_SER
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 2 — 14 September 2011
© NXP B.V. 2011. All rights reserved.
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BT1306-400D/600D
NXP Semiconductors
Logic level triac
Quick reference data — The Quick reference data is an extract of the
product data given in the Limiting values and Characteristics sections of this
document, and as such is not complete, exhaustive or legally binding.
Non-automotive qualified products — Unless this data sheet expressly
states that this specific NXP Semiconductors product is automotive qualified,
the product is not suitable for automotive use. It is neither qualified nor tested
in accordance with automotive testing or application requirements. NXP
Semiconductors accepts no liability for inclusion and/or use of
non-automotive qualified products in automotive equipment or applications.
In the event that customer uses the product for design-in and use in
automotive applications to automotive specifications and standards, customer
(a) shall use the product without NXP Semiconductors’ warranty of the
product for such automotive applications, use and specifications, and (b)
whenever customer uses the product for automotive applications beyond
NXP Semiconductors’ specifications such use shall be solely at customer’s
own risk, and (c) customer fully indemnifies NXP Semiconductors for any
liability, damages or failed product claims resulting from customer design and
use of the product for automotive applications beyond NXP Semiconductors’
standard warranty and NXP Semiconductors’ product specifications.
9.4
Trademarks
Notice: All referenced brands, product names, service names and trademarks
are the property of their respective owners.
10. Contact information
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: [email protected]
BT1306_XXXD_SER
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 2 — 14 September 2011
© NXP B.V. 2011. All rights reserved.
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NXP Semiconductors
BT1306-400D/600D
Logic level triac
11. Contents
1
1.1
1.2
1.3
1.4
2
3
4
5
5.1
6
7
8
9
9.1
9.2
9.3
9.4
10
11
Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1
General description . . . . . . . . . . . . . . . . . . . . . 1
Features and benefits . . . . . . . . . . . . . . . . . . . . 1
Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Quick reference data . . . . . . . . . . . . . . . . . . . . 1
Pinning information . . . . . . . . . . . . . . . . . . . . . . 1
Ordering information . . . . . . . . . . . . . . . . . . . . . 2
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 2
Thermal characteristics . . . . . . . . . . . . . . . . . . 4
Transient thermal impedance . . . . . . . . . . . . . . 4
Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 5
Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 8
Revision history . . . . . . . . . . . . . . . . . . . . . . . . . 9
Legal information. . . . . . . . . . . . . . . . . . . . . . . 10
Data sheet status . . . . . . . . . . . . . . . . . . . . . . 10
Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Contact information. . . . . . . . . . . . . . . . . . . . . 11
Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
© NXP B.V. 2011.
All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: [email protected]
Date of release: 14 September 2011
Document identifier: BT1306_XXXD_SER