BUJ100LR NPN power transistor

BUJ100LR
NPN power transistor
Rev. 02 — 29 July 2010
Product data sheet
1. Product profile
1.1 General description
High voltage, high speed, planar passivated NPN power switching transistor in a SOT54
(TO-92) 3 leads plastic package.
1.2 Features and benefits
„ Fast switching
„ High voltage capability of 700 V
1.3 Applications
„ Compact fluorescent lamps (CFL)
„ Inverters
„ Electronic lighting ballasts
„ Off-line self-oscillating power supplies
1.4 Quick reference data
Table 1.
Quick reference data
Symbol
Parameter
Conditions
Min
Typ
Max Unit
IC
collector current
DC; see Figure 2
-
-
1
A
Ptot
total power
dissipation
Tlead ≤ 25 °C; see Figure 1
-
-
2.1
W
VCESM
collector-emitter peak VBE = 0 V
voltage
-
-
700
V
5
7.5
20
Static characteristics
hFE
DC current gain
VCE = 5 V; IC = 0.8 A;
Tlead = 25 °C; see Figure 8;
see Figure 9
BUJ100LR
NXP Semiconductors
NPN power transistor
2. Pinning information
Table 2.
Pinning information
Pin
Symbol Description
1
B
base
2
C
collector
3
E
emitter
Simplified outline
Graphic symbol
C
B
E
sym123
321
SOT54 (TO-92)
3. Ordering information
Table 3.
Ordering information
Type number
Package
BUJ100LR
Name
Description
Version
TO-92
plastic single-ended leaded (through hole) package; 3 leads
SOT54
4. Limiting values
Table 4.
Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol
Parameter
Conditions
Min
Max
Unit
VCESM
collector-emitter peak voltage
VBE = 0 V
-
700
V
VCBO
collector-base voltage
IE = 0 A
-
700
V
VCEO
collector-emitter voltage
IB = 0 A
-
400
V
IC
collector current
DC; see Figure 2
-
1
A
ICM
peak collector current
-
2
A
IB
base current
IBM
peak base current
Ptot
total power dissipation
Tstg
storage temperature
Tj
junction temperature
VEBO
emitter-base voltage
BUJ100LR
Product data sheet
DC
Tlead ≤ 25 °C; see Figure 1
IC = 0 A; I(Emitter) = 10 mA
All information provided in this document is subject to legal disclaimers.
Rev. 02 — 29 July 2010
-
0.5
A
-
1
A
-
2.1
W
-65
150
°C
-
150
°C
-
9
V
© NXP B.V. 2010. All rights reserved.
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BUJ100LR
NXP Semiconductors
NPN power transistor
003aae644
120
Pder
(%)
80
40
0
0
Fig 1.
50
100
150
200
Tlead (°C)
Normalized total power dissipation as a function of lead temperature
003aad545
102
IC
(A)
10
IC(max) 1
10−1
(1)
10−2
DC
10−3
1
102
10
103
VCL(CE) (V)
Fig 2.
Forward bias safe operating area
BUJ100LR
Product data sheet
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Rev. 02 — 29 July 2010
© NXP B.V. 2010. All rights reserved.
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BUJ100LR
NXP Semiconductors
NPN power transistor
5. Thermal characteristics
Table 5.
Thermal characteristics
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
Rth(j-lead)
thermal resistance from
junction to lead
see Figure 3
-
-
60
K/W
Rth(j-a)
thermal resistance from
junction to ambient
printed-circuit board mounted; lead
length 4 mm
-
150
-
K/W
001aab451
102
Zth(j-lead)
(K/W)
10
1
δ=
P
tp
T
10−1
t
tp
T
10−2
10−5
10−4
10−3
10−2
10−1
1
10
tp (s)
Fig 3.
Transient thermal impedance from junction to lead as a function of pulse width
BUJ100LR
Product data sheet
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Rev. 02 — 29 July 2010
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BUJ100LR
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NPN power transistor
6. Characteristics
Table 6.
Characteristics
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
Static characteristics
ICES
collector-emitter cut-off
current
VBE = 0 V; VCE = 700 V; Tj = 125 °C
-
-
5
mA
IEBO
emitter-base cut-off
current
VEB = 9 V; IC = 0 A; Tlead = 25 °C
-
-
1
mA
VCEOsus
collector-emitter
sustaining voltage
IB = 0 A; IC = 1 mA; LC = 25 mH;
Tlead = 25 °C; see Figure 4; see Figure 5
400
-
-
V
VCEsat
collector-emitter
saturation voltage
IC = 0.25 A; IB = 50 mA; Tlead = 25 °C;
see Figure 6
-
0.2
0.5
V
IC = 0.5 A; IB = 125 mA; Tlead = 25 °C;
see Figure 6
-
0.3
1
V
IC = 0.75 A; IB = 250 mA; Tlead = 25 °C;
see Figure 6
-
0.4
1.5
V
IC = 0.25 A; IB = 50 mA; Tlead = 25 °C;
see Figure 7
-
-
1
V
IC = 0.5 A; IB = 125 mA; Tlead = 25 °C;
see Figure 7
-
-
1.2
V
IC = 0.5 mA; VCE = 2 V; Tlead = 25 °C
12
-
-
IC = 0.4 A; VCE = 5 V; Tlead = 25 °C;
see Figure 8; see Figure 9
10
-
30
IC = 0.8 A; VCE = 5 V; Tlead = 25 °C;
see Figure 8; see Figure 9
5
7.5
20
IC = 1 A; IBon = 200 mA; VBB = -5 V;
LB = 1 µH; Tlead = 25 °C; inductive load;
see Figure 10; see Figure 11
-
80
-
base-emitter saturation
voltage
VBEsat
hFE
DC current gain
Dynamic characteristics
tf
fall time
ns
IC
(mA)
50 V
100 Ω to 200 Ω
horizontal
oscilloscope
250
vertical
6V
300 Ω
1Ω
100
30 Hz to 60 Hz
001aab987
10
0
min
VCE (V)
VCEOsus
001aab988
Fig 4.
Test circuit for collector-emitter sustaining
voltage
BUJ100LR
Product data sheet
Fig 5.
Oscilloscope display for collector-emitter
sustaining voltage test waveform
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Rev. 02 — 29 July 2010
© NXP B.V. 2010. All rights reserved.
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BUJ100LR
NXP Semiconductors
NPN power transistor
003aad548
2.0
VCEsat
(V)
003aad549
1.6
VBEsat
(V)
1.4
Tj = 125 °C
1.6
1.2
Tj = 25 °C
1.0
1.2
Tj = −35 °C
Tj = −35 °C
Tj = 25 °C
0.8
0.8
Tj = 125 °C
0.6
0.4
0.4
0.2
0
10−2
10−1
1
0
10−2
10
IC (A)
Fig 6.
Collector-emitter saturation voltage as a
function of collector current; typical values
003aad546
102
Fig 7.
10−1
1
IC (A)
Base-emitter saturation voltage as a function of
collector current; typical values
003aad547
102
Tj = 125 °C
Tj = 125 °C
hFE
hFE
Tj = 25 °C Tj = −35 °C
Tj = 25 °C Tj = −35 °C
10
10
VCE = 3 V
VCE = 5 V
(1)
(1)
(2)
(2)
(3)
1
10−3
10−2
10−1
1
(3)
1
10−3
10
10−2
IC (A)
Fig 8.
10
Product data sheet
1
10
IC (A)
DC current gain as a function of collector
current; typical values
BUJ100LR
10−1
Fig 9.
DC current gain as a function of collector
current; typical values
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Rev. 02 — 29 July 2010
© NXP B.V. 2010. All rights reserved.
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BUJ100LR
NXP Semiconductors
NPN power transistor
IC
VCC
ICon
90 %
LC
IBon
VBB
LB
DUT
001aab991
10 %
t
tf
IB
ts
toff
IBon
t
−IBoff
001aab992
Fig 10. Test circuit for inductive load switching
BUJ100LR
Product data sheet
Fig 11. Switching times waveforms for inductive load
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Rev. 02 — 29 July 2010
© NXP B.V. 2010. All rights reserved.
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BUJ100LR
NXP Semiconductors
NPN power transistor
7. Package outline
Plastic single-ended leaded (through hole) package; 3 leads
SOT54
c
E
d
A
L
b
1
e1
2
D
e
3
b1
L1
0
2.5
5 mm
scale
DIMENSIONS (mm are the original dimensions)
UNIT
A
b
b1
c
D
d
E
mm
5.2
5.0
0.48
0.40
0.66
0.55
0.45
0.38
4.8
4.4
1.7
1.4
4.2
3.6
e
2.54
e1
L
L1(1)
1.27
14.5
12.7
2.5
max.
Note
1. Terminal dimensions within this zone are uncontrolled to allow for flow of plastic and terminal irregularities.
OUTLINE
VERSION
REFERENCES
IEC
SOT54
JEDEC
JEITA
TO-92
SC-43A
EUROPEAN
PROJECTION
ISSUE DATE
04-06-28
04-11-16
Fig 12. Package outline SOT54 (TO-92)
BUJ100LR
Product data sheet
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Rev. 02 — 29 July 2010
© NXP B.V. 2010. All rights reserved.
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BUJ100LR
NXP Semiconductors
NPN power transistor
8. Revision history
Table 7.
Revision history
Document ID
Release date
Data sheet status
Change notice
Supersedes
BUJ100LR v.2
20100729
Product data sheet
-
BUJ100LR v.1
-
-
Modifications:
BUJ100LR v.1
BUJ100LR
Product data sheet
•
Various changes to content.
20090812
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 02 — 29 July 2010
© NXP B.V. 2010. All rights reserved.
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BUJ100LR
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NPN power transistor
9. Legal information
9.1
Data sheet status
Document status[1][2]
Product status[3]
Definition
Objective [short] data sheet
Development
This document contains data from the objective specification for product development.
Preliminary [short] data sheet
Qualification
This document contains data from the preliminary specification.
Product [short] data sheet
Production
This document contains the product specification.
[1]
Please consult the most recently issued document before initiating or completing a design.
[2]
The term 'short data sheet' is explained in section "Definitions".
[3]
The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product
status information is available on the Internet at URL http://www.nxp.com.
9.2
Definitions
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liability for the consequences of
use of such information.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and title. A short data sheet is intended
for quick reference only and should not be relied upon to contain detailed and
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local NXP Semiconductors sales
office. In case of any inconsistency or conflict with the short data sheet, the
full data sheet shall prevail.
Product specification — The information and data provided in a Product
data sheet shall define the specification of the product as agreed between
NXP Semiconductors and its customer, unless NXP Semiconductors and
customer have explicitly agreed otherwise in writing. In no event however,
shall an agreement be valid in which the NXP Semiconductors product is
deemed to offer functions and qualities beyond those described in the
Product data sheet.
9.3
Disclaimers
Limited warranty and liability — Information in this document is believed to
be accurate and reliable. However, NXP Semiconductors does not give any
representations or warranties, expressed or implied, as to the accuracy or
completeness of such information and shall have no liability for the
consequences of use of such information.
In no event shall NXP Semiconductors be liable for any indirect, incidental,
punitive, special or consequential damages (including - without limitation - lost
profits, lost savings, business interruption, costs related to the removal or
replacement of any products or rework charges) whether or not such
damages are based on tort (including negligence), warranty, breach of
contract or any other legal theory.
Notwithstanding any damages that customer might incur for any reason
whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards
customer for the products described herein shall be limited in accordance
with the Terms and conditions of commercial sale of NXP Semiconductors.
Right to make changes — NXP Semiconductors reserves the right to make
changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
BUJ100LR
Product data sheet
Suitability for use — NXP Semiconductors products are not designed,
authorized or warranted to be suitable for use in medical, military, aircraft,
space or life support equipment, nor in applications where failure or
malfunction of an NXP Semiconductors product can reasonably be expected
to result in personal injury, death or severe property or environmental
damage. NXP Semiconductors accepts no liability for inclusion and/or use of
NXP Semiconductors products in such equipment or applications and
therefore such inclusion and/or use is at the customer’s own risk.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty that such applications will be suitable for the
specified use without further testing or modification.
NXP Semiconductors does not accept any liability related to any default,
damage, costs or problem which is based on a weakness or default in the
customer application/use or the application/use of customer’s third party
customer(s) (hereinafter both referred to as “Application”). It is customer’s
sole responsibility to check whether the NXP Semiconductors product is
suitable and fit for the Application planned. Customer has to do all necessary
testing for the Application in order to avoid a default of the Application and the
product. NXP Semiconductors does not accept any liability in this respect.
Quick reference data — The Quick reference data is an extract of the
product data given in the Limiting values and Characteristics sections of this
document, and as such is not complete, exhaustive or legally binding.
Limiting values — Stress above one or more limiting values (as defined in the
Absolute Maximum Ratings System of IEC 60134) will cause permanent
damage to the device. Limiting values are stress ratings only and (proper)
operation of the device at these or any other conditions above those given in
the Recommended operating conditions section (if present) or the
Characteristics sections of this document is not warranted. Constant or
repeated exposure to limiting values will permanently and irreversibly affect
the quality and reliability of the device.
Terms and conditions of commercial sale — NXP Semiconductors
products are sold subject to the general terms and conditions of commercial
sale, as published at http://www.nxp.com/profile/terms, unless otherwise
agreed in a valid written individual agreement. In case an individual
agreement is concluded only the terms and conditions of the respective
agreement shall apply. NXP Semiconductors hereby expressly objects to
applying the customer’s general terms and conditions with regard to the
purchase of NXP Semiconductors products by customer.
No offer to sell or license — Nothing in this document may be interpreted or
construed as an offer to sell products that is open for acceptance or the grant,
conveyance or implication of any license under any copyrights, patents or
other industrial or intellectual property rights.
Export control — This document as well as the item(s) described herein may
be subject to export control regulations. Export might require a prior
authorization from national authorities.
All information provided in this document is subject to legal disclaimers.
Rev. 02 — 29 July 2010
© NXP B.V. 2010. All rights reserved.
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BUJ100LR
NXP Semiconductors
NPN power transistor
Non-automotive qualified products — Unless this data sheet expressly
states that this specific NXP Semiconductors product is automotive qualified,
the product is not suitable for automotive use. It is neither qualified nor tested
in accordance with automotive testing or application requirements. NXP
Semiconductors accepts no liability for inclusion and/or use of
non-automotive qualified products in automotive equipment or applications.
In the event that customer uses the product for design-in and use in
automotive applications to automotive specifications and standards, customer
(a) shall use the product without NXP Semiconductors’ warranty of the
product for such automotive applications, use and specifications, and (b)
whenever customer uses the product for automotive applications beyond
NXP Semiconductors’ specifications such use shall be solely at customer’s
own risk, and (c) customer fully indemnifies NXP Semiconductors for any
liability, damages or failed product claims resulting from customer design and
use of the product for automotive applications beyond NXP Semiconductors’
standard warranty and NXP Semiconductors’ product specifications.
9.4
Trademarks
Notice: All referenced brands, product names, service names and trademarks
are the property of their respective owners.
Adelante, Bitport, Bitsound, CoolFlux, CoReUse, DESFire, EZ-HV,
FabKey, GreenChip, HiPerSmart, HITAG, I²C-bus logo, ICODE, I-CODE,
ITEC, Labelution, MIFARE, MIFARE Plus, MIFARE Ultralight, MoReUse,
QLPAK, Silicon Tuner, SiliconMAX, SmartXA, STARplug, TOPFET,
TrenchMOS, TriMedia and UCODE — are trademarks of NXP B.V.
HD Radio and HD Radio logo — are trademarks of iBiquity Digital
Corporation.
10. Contact information
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
BUJ100LR
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 02 — 29 July 2010
© NXP B.V. 2010. All rights reserved.
11 of 12
BUJ100LR
NXP Semiconductors
NPN power transistor
11. Contents
1
1.1
1.2
1.3
1.4
2
3
4
5
6
7
8
9
9.1
9.2
9.3
9.4
10
Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . .1
General description . . . . . . . . . . . . . . . . . . . . . .1
Features and benefits . . . . . . . . . . . . . . . . . . . . .1
Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . .1
Quick reference data . . . . . . . . . . . . . . . . . . . . .1
Pinning information . . . . . . . . . . . . . . . . . . . . . . .2
Ordering information . . . . . . . . . . . . . . . . . . . . . .2
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . .2
Thermal characteristics . . . . . . . . . . . . . . . . . . .4
Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . .5
Package outline . . . . . . . . . . . . . . . . . . . . . . . . . .8
Revision history . . . . . . . . . . . . . . . . . . . . . . . . . .9
Legal information. . . . . . . . . . . . . . . . . . . . . . . .10
Data sheet status . . . . . . . . . . . . . . . . . . . . . . .10
Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . .10
Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . .10
Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Contact information. . . . . . . . . . . . . . . . . . . . . . 11
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
© NXP B.V. 2010.
All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
Date of release: 29 July 2010
Document identifier: BUJ100LR