UM10481 SSL21082 reference board

UM10481
SSL21082 reference board
Rev. 2.1 — 28 November 2011
User manual
Document information
Info
Content
Keywords
SSL21082, buck converter, reference board, LED driver, LED retrofit
lamp, low power
Abstract
This document describes the performance, technical data and the
connection of the SSL21082 reference board. The SSL2108 series is an
NXP Semiconductors driver IC intended to provide a low cost, small form
factor LED driver. This board is intended to operate at 100 V (AC) or
120 V (AC), using an output voltage of 30 V or more.
UM10481
NXP Semiconductors
SSL21082 reference board
Revision history
Rev
Date
Description
v.2.1
20111128
fourth issue
Modifications:
•
Figure 12 “Schematic” on page 13: changed.
v.2
20111109
third issue
v.1.1
20110826
second issue
v.1
20110719
first issue
Contact information
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: [email protected]
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1. Introduction
WARNING
Lethal voltage and fire ignition hazard
The non-insulated high voltages that are present when operating this product, constitute a
risk of electric shock, personal injury, death and/or ignition of fire.
This product is intended for evaluation purposes only. It shall be operated in a designated test
area by personnel qualified according to local requirements and labor laws to work with
non-insulated mains voltages and high-voltage circuits. This product shall never be operated
unattended.
The SSL21082 is a highly integrated switching mode LED driver which enables constant
current driving from mains input. It is a solution for small LED retrofit lamp application,
especially for low-power factor design.
The SSL21082 supports buck converter topology, and is suitable for non-isolated,
non-dimmable LED retrofit lamp. It can drive long LED string with, for example, a 70 V
forward voltage. The SSL2108 series is intended to operate with higher output voltages,
as present in modern LED modules.
This reference board is an example that can be used in applications up to E26 form factor
lamp fittings.
Remark: Unless otherwise stated all voltages are in V (AC).
2. Safety warning
This demo board is connected to a high AC voltage. Avoid touching the reference board
during operation. An isolated housing is mandatory when used in uncontrolled,
non-laboratory environments. Galvanic isolation of the mains phase using a fixed or
variable transformer (Variac) is always recommended. These devices are recognized by
the symbols shown in Figure 1.
019aab174
019aab173
a. Isolated
Fig 1.
UM10481
User manual
b. Not isolated
Variac isolation symbols
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SSL21082 reference board
3. Connecting to the board
The board is optimized for a 100 V (AC, 60 Hz) mains supply. Besides the mains voltage
optimization, the board is designed to work with multiple LEDs or an LED module with a
high forward voltage.
Mains connection of this reference board is different from other general evaluation/demo
boards. Connect the mains to an axial lead resistor and fuse which are connected to J1
and J2. In the application, it is possible that one side of these components is directly
connected to the socket.
Remark: The maximum rated voltage of the board is 141 V (limited by the value of
electrolytic capacitor C1) or 200 V (DC).
Remark: The rated voltage of fuse F1 is 125 V (AC).
An anode of the LED string is connected to J3 and a cathode is connected to J4. Use an
LED string with a VF greater than 20 volt on this board. Under the expected conditions, the
output current is 125 mA. If the rated current of the LED does not meet this specification,
the current can be adjusted. See Section 5 for instructions.
The electrolytic capacitor is mounted outside the board so it can be mounted in the screw
cap of the lamp. The temperature around screw cap is the lowest in the lamp. When the
capacitor is placed in the screw cap, the life time of the electrolytic capacitor is improved.
J4
J3
J2
J1
019aac531
(1) J2: connect the flying lead end of R1 to the AC mains supply.
(2) J1: connect the flying lead end of F1 to the AC mains supply.
(3) J3: Anode.
(4) J4: Cathode.
Fig 2.
UM10481
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Board connection diagram
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SSL21082 reference board
4. Specification
Table 1.
Specifications for the reference board
Parameter
Value
Comment
AC line input voltage
85 V (AC) to 138 V (AC)
the board is optimized for 100 V
(AC), 60 Hz.
output voltage
> 20 V (DC)
output current
125 mA
at 100 V (AC) mains; 70 V LED
output current dependency
5 %
100 V (AC) 10 %; at 70 V;
125 mA output (see Figure 3)
efficiency
> 90 %
at 70 V; 125 mA output
power factor
0.6
at 70 V; 125 mA output
board dimension
30 mm  19 mm  12 mm
length  width  height
019aac532
200
Io
(mA)
160
(1)
(2)
(3)
(4)
120
(5)
(6)
80
40
0
40
80
120
Vo (V)
(1) 100 V (AC); 50 Hz
(2) 100 V (AC); 60 Hz
(3) 110 V (AC); 50 Hz
(4) 110 V (AC); 60 Hz
(5) 120 V (AC); 50 Hz
(6) 120 V (AC); 60 Hz
Fig 3.
UM10481
User manual
Load regulation: output current as a function of output voltage
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SSL21082 reference board
019aac533
115
Io
(mA)
95
(1)
(2)
75
(3)
(4)
(5)
(6)
55
65
85
105
125
145
Vi (AC)
(1) 35 V; 50 Hz
(2) 35 V; 60 Hz
(3) 48 V; 60 Hz
(4) 48 V; 50 Hz
(5) 70 V; 60 Hz
(6) 70 V; 50 Hz
Fig 4.
Line regulation: output current as a function of input voltage
019aac535
93
η
(%)
(1)
(2)
91
(3)
89
(4)
(5)
(6)
87
65
85
105
125
145
Vi (V)
(1) 70 V; 50 Hz
(2) 70 V; 60 Hz
(3) 48 V; 50 Hz
(4) 48 V; 60 Hz
(5) 35 V; 50 Hz
(6) 35 V; 60 Hz
Fig 5.
UM10481
User manual
Line regulation: efficiency as a function of input voltage
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UM10481
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SSL21082 reference board
019aac534
100
η
(%)
(1)
80
(2)
(3)
(4)
(5)
(6)
60
40
0
40
80
120
Vo (V)
(1) 100 V (AC); 50 Hz
(2) 100 V (AC); 60 Hz
(3) 110 V (AC); 50 Hz
(4) 110 V (AC); 60 Hz
(5) 120 V (AC); 50 Hz
(6) 120 V (AC); 60 Hz
Fig 6.
Load regulation: efficiency as a function of output voltage
019aac536
0.75
PF
0.70
0.65
0.60
(1)
0.55
(2)
(3)
0.50
70
80
90
100
110
120
130
140
Vi (V)
(1) Vo = 70 V
(2) Vo = 48 V
(3) Vo = 35 V
Fig 7.
UM10481
User manual
Load regulation: power factor as a function of input voltage
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SSL21082 reference board
UM10481
User manual
Fig 8.
SSL21082 EMC measurement L-phase according to FCC15 norm
Fig 9.
SSL21082 EMC measurement N-phase according to FCC15 norm
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SSL21082 reference board
5. Changing the output current
The SSL21082 monitors the charging current in the inductor using the sense resistors R2
and R3. It controls a MOSFET to retain a constant peak current. In addition, the IC
supports valley detection.
These features enable a driver to operate in Boundary Conduction Mode (BCM) with
valley switching where the average current in the inductor is an output current.
The SSL21082 turns off the MOSFET when the voltage on pin SOURCE reaches 500 mV.
If resistors R2 and R3 are between pin SOURCE and GND is 2 , the peak current is
limited to 250 mA.
0.5   R2 + R3 
I peak = --------------------------------------R2  R3
(1)
When the MOSFET is turned off, inductor L2 is discharged and the current flowing
through the inductor is decreased. When the current in the inductor reaches 0 mA, the
voltage on pin DRAIN starts to oscillate. SSL21082 waits for a valley of this oscillation.
When the voltage on pin DRAIN reaches it lowest value, the MOSFET is turned on again.
The charge time of the inductor is calculated using Equation 2:
2  I LED
t ch = L2  -----------------------V i – V LED
(2)
The discharge time of the inductor is calculated using Equation 3:
2  I LED
t dch = L2  -------------------V LED
(3)
When the inductor is charging/discharging, a current flows through it. However, there is
also an effective current when oscillating. Consider the oscillation frequency when
adjusting the output current. It is calculated using Equation 4:
1
f ring = -------------------------------------------------------------------2    L2   C FET  C6 
(4)
The time from the start of oscillation to the first valley is calculated using Equation 5:
1
t ring = ------------------2  f ring
(5)
The output current is calculated using Equation 6:
t ch + t dch
1
I LED = ---  I peak  -------------------------------------2
t ch + t dch + t ring
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SSL21082 reference board
6. External OverTemperature Protection (OTP)
The SSL21082 supports external OTP by adding an external Negative Temperature
Coefficient (NTC) thermistor. This feature is delivered by detecting a voltage on pin NTC.
Pin NTC has an integrated current source, which provides the pin with an offset. The
Resistance of the NTC thermistor is decreased as the temperature is raised. When the
NTC temperature rises and the voltage on pin NTC falls to below 0.5 V, the SSL21082
lowers the threshold level for detecting peak current in the inductor. Decreasing the peak
current in the inductor causes the power consumption in the system to decrease as well.
The output current is adjusted to the point where a balance between safety temperature
and output current can be retained (the so called thermal management).
If the temperature on NTC increases continuously and the voltage on the pin drops below
0.3 V, the SSL21082 starts the NTC time-out timer. If the voltage on pin NTC pin does not
drop below 0.2 V within the time-out, the SSL21082 detects an abnormal condition and
stops switching.
An NTC thermistor can be directly connected to pin NTC. It is also possible to tune the
protection temperature by adding a resistor in parallel or in series with the NTC. One NTC
and one resistor are installed on the reference board. The values of these components
can be changed depending on the protection temperature requirement and component
availability.
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SSL21082 reference board
7. Power factor adjustment
The SSL21082 reference board is designed for a standard operation with a power factor
of 0.6 at 100 V (AC). This option offers the highest efficiency. There are two ways of tuning
the power factor to higher values. The first option is by increasing the value of R1, which
raises the power factor to above 0.7, resulting in additional losses (see Table 2).
Table 2.
Power factor adjustment - increasing the value of resistor R1
Vi (V (AC))
Vo (Vavr)
Io (mA)
R1 ()
Efficiency (%) Power factor
THD (%)
100
62.8
127
10
91.5
0.6131
111
100
62.8
127
33
85.0
0.701
90.5
120
62.5
123
68
84.7
0.711
94.2
120
63.1
124
100
81.9
0.75
84.3
120
43.5
129
100
82.7
0.715
95.1
Increasing R1 also results in a lower inrush current, allowing the board to be connected to
leading-edge phase cut dimmers without damage to the dimmer or to the lamp (dimmer
resistant). This adjustment is not intended for stable operation without flicker or a good
dimming range, but is for safety only. Dimension the power rating of R1 to handle peak
powers that occur using leading-edge dimmers. This power is between 2 W and 4 W.
Alternatively, a thermal link can be made between the onboard NTC and resistor R1,
causing the board to turn off at an overtemperature of resistor R1.
The second option is to increase power factor is using a valley fill circuit. The basic
schematic for this circuit is shown in Figure 10. Table 3 shows the results when using a
10 F capacitor for C2X and C2Y.
Table 3.
Power factor adjustment - valley fill circuit
Vi (V (AC))
Vo (Vavr)
Io (mA)
R1 ()
Efficiency (%) Power factor
THD (%)
120
42.4
133
120
86.0
0.904
43.8
120
20.9
137
220
82.4
0.908
43.1
C2X
R1
C2Y
120 Ω
019aac537
Fig 10. Valley fill circuit
The valley fill circuit can only be employed in buck converter mode if the output voltage is
below half the peak input voltage. In practice, at 120 V (AC) input it operates up to 50 V
(DC) output voltage.
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SSL21082 reference board
8. Active bypass
An increased value for the inrush current resistor protects the board from damage with
most phase cut dimmers, but also lowers the efficiency. If a higher power factor is not
required, but leading-edge dimmer resistance and high efficiency are important, the active
bypass option is available. In this circuit, the inrush current resistor is bypassed using a
Silicon Controlled Rectifier (SCR) (see Figure 11).
Table 4 shows the results when active bypass is used.
Table 4.
Active bypass
Vi (V (AC))
Vo (Vavr)
Io (mA)
R1 () Efficiency (%) Power factor
THD (%)
100
22
143
56
86.2
0.566
135
100
43
130
56
89.0
0.618
109
120
22
142
56
85.0
0.533
151
120
43
130
56
89.2
0.585
125
1 MΩ
22 nF
MCR22-6
56 Ω
019aac538
Fig 11. Active bypass
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9. Schematic
L1
J3
LED+
330 μH
U1
1 S1ZB60
J1
VIN1
J2
VIN2
F1
1A
(125 V)
2
3
C7
0.47 μF
(250 V)
D1
STTH2R06A
C1
10 μF
U2
C2
0.22 μF
(250 V)
HV
GND
SOURCE
VCC
NTC
GND
4
R1
10 Ω
1W
R2
2.2 Ω
1%
R3
7.5 Ω
1%
C3
1 μF
(25 V)
1
12
L2
DRAIN
J4
LED-
0.7 mH
GND
11
2
GND
10
3
DVDT
SSL21082
9
4
TONMAX
8
5
GND
7
6
C6
150 pF
(630 V)
RT1
C4
1000 pF
R4
1 kΩ
1%
C5
n.m.
019aac539
Fig 12. Schematic
10. Bill of materials
Table 5.
Bill of materials
Component Values
UM10481
User manual
Amount
Manufacturer
Part number
1
Rubycon
200BXC10M8X11.5
0.22 F; X7R; 250 V 1
Murata
RDER72E224K8K1C11B
1 F; F; 25 V
1
Murata
GRM188F51E105ZA12D
C4
1000 pF; X7R; 50 V
1
Murata
GRM188R71H102KA01D
C5
not mounted
0
-
-
C6
150 pF; C0G; 630 V
1
Murata
GRM31A5C2J151JW01D
C7
0.47 F; X7R; 250 V 1
Murata
RDER72E474K5B1C13B
D1
600 V; 1 A; fast
recovery
1
ST Micro
STTH2R06A
F1
1 A; 125 V
1
Littelfuse
473001
L1
330 H
1
Taiyo-Yuden
CAL45VB331K
L2
0.7 mH
1
TDK-EPC
SRL8EE-202V001
R1
10 ; 1 W
1
Panasonic
ERG-1SJ100A
R2
2.2 ; 1 %; 2012
1
Dale
CRCW08052R20FKEA
R3
7.5 ; 1 %; 1608
1
Dale
CRCW06037R50FKEA
R4
1 k; 1 %; 1608
1
Panasonic
ERJ-3EKF1001V
RT1
100 k
1
Murata
NXFT15WF104FA2B020
U1
600 V; 0.8 A
1
Shindengen
S1ZB60
U2
SSL21082
1
NXP Semiconductors SSL21082
C1
10 F; 200 V
C2
C3
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11. Inductor appearance and dimensions
line edge height
1.5 mm max
2- Ø 0.5
9 max
9 max
9 max
3
4
2
5
1
6
3.3 ± 0.5
Dimensions in mm
TERMINAL PIN GAUGE CHECK
be able to inserted
the gauge as right
1
6
3
4
2.5 ± 0.1
2.5 ± 0.1
6.0 ± 0.1
2- Ø 0.8
WINDING SPECIFICATION
3
core
N1
2
N1
primary
bottom view
019aac540
Fig 13. Inductor appearance and dimensions
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12. Board layout
a. Top layer
b. Bottom layer
c. Top silk
d. Bottom silk
e. Drill
Fig 14. Board layout
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13. Board photographs
aaa-000045
a. Front view
aaa-000046
b. Back view
Fig 15. Photographs of the board
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14. Legal information
14.1 Definitions
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liability for the consequences of
use of such information.
Export control — This document as well as the item(s) described herein
may be subject to export control regulations. Export might require a prior
authorization from competent authorities.
14.2 Disclaimers
Limited warranty and liability — Information in this document is believed to
be accurate and reliable. However, NXP Semiconductors does not give any
representations or warranties, expressed or implied, as to the accuracy or
completeness of such information and shall have no liability for the
consequences of use of such information.
In no event shall NXP Semiconductors be liable for any indirect, incidental,
punitive, special or consequential damages (including - without limitation - lost
profits, lost savings, business interruption, costs related to the removal or
replacement of any products or rework charges) whether or not such
damages are based on tort (including negligence), warranty, breach of
contract or any other legal theory.
Notwithstanding any damages that customer might incur for any reason
whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards
customer for the products described herein shall be limited in accordance
with the Terms and conditions of commercial sale of NXP Semiconductors.
Right to make changes — NXP Semiconductors reserves the right to make
changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
Suitability for use — NXP Semiconductors products are not designed,
authorized or warranted to be suitable for use in life support, life-critical or
safety-critical systems or equipment, nor in applications where failure or
malfunction of an NXP Semiconductors product can reasonably be expected
to result in personal injury, death or severe property or environmental
damage. NXP Semiconductors accepts no liability for inclusion and/or use of
NXP Semiconductors products in such equipment or applications and
therefore such inclusion and/or use is at the customer’s own risk.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty that such applications will be suitable for the
specified use without further testing or modification.
Customers are responsible for the design and operation of their applications
and products using NXP Semiconductors products, and NXP Semiconductors
accepts no liability for any assistance with applications or customer product
design. It is customer’s sole responsibility to determine whether the NXP
Semiconductors product is suitable and fit for the customer’s applications and
products planned, as well as for the planned application and use of
customer’s third party customer(s). Customers should provide appropriate
design and operating safeguards to minimize the risks associated with their
applications and products.
UM10481
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NXP Semiconductors does not accept any liability related to any default,
damage, costs or problem which is based on any weakness or default in the
customer’s applications or products, or the application or use by customer’s
third party customer(s). Customer is responsible for doing all necessary
testing for the customer’s applications and products using NXP
Semiconductors products in order to avoid a default of the applications and
the products or of the application or use by customer’s third party
customer(s). NXP does not accept any liability in this respect.
Evaluation products — This product is provided on an “as is” and “with all
faults” basis for evaluation purposes only. NXP Semiconductors, its affiliates
and their suppliers expressly disclaim all warranties, whether express, implied
or statutory, including but not limited to the implied warranties of
non-infringement, merchantability and fitness for a particular purpose. The
entire risk as to the quality, or arising out of the use or performance, of this
product remains with customer.
In no event shall NXP Semiconductors, its affiliates or their suppliers be liable
to customer for any special, indirect, consequential, punitive or incidental
damages (including without limitation damages for loss of business, business
interruption, loss of use, loss of data or information, and the like) arising out
the use of or inability to use the product, whether or not based on tort
(including negligence), strict liability, breach of contract, breach of warranty or
any other theory, even if advised of the possibility of such damages.
Notwithstanding any damages that customer might incur for any reason
whatsoever (including without limitation, all damages referenced above and
all direct or general damages), the entire liability of NXP Semiconductors, its
affiliates and their suppliers and customer’s exclusive remedy for all of the
foregoing shall be limited to actual damages incurred by customer based on
reasonable reliance up to the greater of the amount actually paid by customer
for the product or five dollars (US$5.00). The foregoing limitations, exclusions
and disclaimers shall apply to the maximum extent permitted by applicable
law, even if any remedy fails of its essential purpose.
Safety of high-voltage evaluation products — The non-insulated high
voltages that are present when operating this product, constitute a risk of
electric shock, personal injury, death and/or ignition of fire. This product is
intended for evaluation purposes only. It shall be operated in a designated
test area by personnel that is qualified according to local requirements and
labor laws to work with non-insulated mains voltages and high-voltage
circuits.
The product does not comply with IEC 60950 based national or regional
safety standards. NXP Semiconductors does not accept any liability for
damages incurred due to inappropriate use of this product or related to
non-insulated high voltages. Any use of this product is at customer’s own risk
and liability. The customer shall fully indemnify and hold harmless NXP
Semiconductors from any liability, damages and claims resulting from the use
of the product.
14.3 Trademarks
Notice: All referenced brands, product names, service names and trademarks
are the property of their respective owners.
All information provided in this document is subject to legal disclaimers.
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15. Contents
1
2
3
4
5
6
7
8
9
10
11
12
13
14
14.1
14.2
14.3
15
Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
Safety warning . . . . . . . . . . . . . . . . . . . . . . . . . . 3
Connecting to the board . . . . . . . . . . . . . . . . . . 4
Specification. . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
Changing the output current . . . . . . . . . . . . . . 9
External OverTemperature Protection (OTP) 10
Power factor adjustment . . . . . . . . . . . . . . . . . 11
Active bypass. . . . . . . . . . . . . . . . . . . . . . . . . . 12
Schematic . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Bill of materials . . . . . . . . . . . . . . . . . . . . . . . . 13
Inductor appearance and dimensions . . . . . . 14
Board layout . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Board photographs . . . . . . . . . . . . . . . . . . . . . 16
Legal information. . . . . . . . . . . . . . . . . . . . . . . 17
Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 17
Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
© NXP B.V. 2011.
All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: [email protected]
Date of release: 28 November 2011
Document identifier: UM10481