UM10418 UBA2211 demo board for 230 V, 12 W CFL Rev. 2 — 10 January 2011 User manual Document information Info Content Keywords UBA2211, demo board, low cost, high performance, CFL Abstract This document is a user manual for the UBA2211 12 W demo board UM10418 NXP Semiconductors UBA2211 demo board for 230 V, 12 W Revision history Rev Date Description v.2 20110110 second issue v.1 20101026 first issue UM10418 User manual All information provided in this document is subject to legal disclaimers. Rev. 2 — 10 January 2011 © NXP B.V. 2011. All rights reserved. 2 of 17 UM10418 NXP Semiconductors UBA2211 demo board for 230 V, 12 W 1. Introduction The UBA2211 is a high voltage power IC intended to drive and control electronically ballasted Compact Fluorescent Lamps (CFLs) with few external components needed. It provides all the necessary functions for sufficient preheating, ignition and burning operation of the lamp. It features a ballast IC with high performance price ratio and is integrated with the related protection functions. This UBA2211 user manual is intended for 230 V application of a 12 W demo board. 2. Features 2.1 System integration • Integrated half-bridge power MOSFET – UBA2211A: 13.5 Ω, 0.9 A maximum ignition current – UBA2211B: 9 Ω, 1.35 A maximum ignition current – UBA2211C: 6.6 Ω, 1.85 A maximum ignition current • Integrated bootstrap diode • Integrated low voltage supply • Integrated level-shifter 2.2 Burner lifetime • • • • • Adjustable preheat time and ignition time Adjustable preheat current independent from mains voltage variation Minimum glow time control to support cold start Adjustable lamp power Lamp power independent from mains voltage variations 2.3 Safety • • • • • • • • UM10418 User manual Soft start function Accurate 50 % duty cycle UnderVoltage LockOut protection (UVLO) Saturation current protection OverTemperature Protection (OTP) Capacitive Mode Protection (CMP) System protection for EOL Lamp removal protection All information provided in this document is subject to legal disclaimers. Rev. 2 — 10 January 2011 © NXP B.V. 2011. All rights reserved. 3 of 17 UM10418 NXP Semiconductors UBA2211 demo board for 230 V, 12 W 2.4 Ease of use • Adjustable operating frequency for easy fit with various burners 3. Circuit diagram Typical application circuit diagram is shown in Figure 1 LFILT D1 COUT1 D4 Llamp LAMP Clamp SGND L_N HV AC input PGND CBUF C0 DVDT Rfuse L_L VDD Rosc D2 D3 COUT2 CDVDT U1 SGND CVDD RC 1 14 2 13 3 12 4 UBA2211 11 5 10 6 9 7 8 OUT SGND CFS SENSE FS SGND SGND RSENSE SW Cosc CSW 019aab249 Fig 1. Typical application circuit for Compact Fluorescent Lamp 4. Specifications The UBA2211B demo board is set up to drive a 12 W burner. The specifications for this setup are: • 230 V (AC) – Input voltage range: 220 V to 240 V; 50 Hz – Input power: 12 W at 230 V (AC) – Input current: 80 mA at 230 V (AC) – Power factor: > 0.58 – Operating frequency: 42 kHz – 800 ms preheat • Burners – Baishi 3U 12 W burner – Other burners with 70 V lamp voltage and 150 mA current UM10418 User manual All information provided in this document is subject to legal disclaimers. Rev. 2 — 10 January 2011 © NXP B.V. 2011. All rights reserved. 4 of 17 UM10418 NXP Semiconductors UBA2211 demo board for 230 V, 12 W 5. Application photographs The 230 V (AC) mains input connection and four connections for the burner are connected as shown in Figure 2. 019aab250 Fig 2. Photos of a 12 W CFL with the UBA2211 6. Circuit description The device is an integrated circuit for electronically ballasted compact fluorescent lamps. It provides all the necessary functions for sufficient preheat, ignition and on-state operation of the lamp. Several protective measures safeguard the correct operation of the compact fluorescent lamp and controller. A typical system timing sequence is shown in Figure 3, with each phase described in greater detail in Section 6.1 to Section 6.7. UM10418 User manual All information provided in this document is subject to legal disclaimers. Rev. 2 — 10 January 2011 © NXP B.V. 2011. All rights reserved. 5 of 17 UM10418 NXP Semiconductors UBA2211 demo board for 230 V, 12 W Vlamp 2.5 × fosc(nom) fosc(int) fosc(nom) VSW HIGH VSW 0.6 × VH(RC) VSW(ph) 0 time (s) preheat time ignition Fig 3. RMS control 001aal992 System timing sequence with warm ignition In non-preheated applications, a patented glow time control minimizes the electrode damage directly after lamp ignition (see Figure 4). UM10418 User manual All information provided in this document is subject to legal disclaimers. Rev. 2 — 10 January 2011 © NXP B.V. 2011. All rights reserved. 6 of 17 UM10418 NXP Semiconductors UBA2211 demo board for 230 V, 12 W Vlamp 2.5 × fosc(nom) fosc(int) fosc(nom) VSW HIGH VSW 0.6 × VH(RC) VSW(ph) VSW(ph) 0 preheat time glow ignition time (s) RMS control 001aal991 Fig 4. System timing sequence with cold ignition 6.1 Supply voltage The UBA2211 is powered using a start-up current source and the DVDT supply. The start-up current source is integrated in to the IC and the DVDT supply is provided by the CDVDT capacitor. VDD is used for low-side switch driving and logic circuit operation. As well as the VDD supply, a floating supply is needed for high-side switch driving. This is supplied by a bootstrap capacitor connected to the HB output node which is also connected to CDVDT. The schematic diagram Figure 5 illustrates how the low voltage supplies are easily obtained by setting the capacitors. The UBA2211 has an UnderVoltage LockOut (UVLO) function for both VDD and VFS. Refer to Ref. 1 “Data sheet UBA2211” for further details regards supply threshold values. The start-up current source is enabled when the voltage on pin VDD is below VDD(stop) level. The high-side transistor is switched off when the voltage on pin FS is less than the high-side lockout voltage VFS(lock). UM10418 User manual All information provided in this document is subject to legal disclaimers. Rev. 2 — 10 January 2011 © NXP B.V. 2011. All rights reserved. 7 of 17 UM10418 NXP Semiconductors UBA2211 demo board for 230 V, 12 W 14 OUT SGND 1 SGND 2 13 SGND HV 3 12 SENSE PGND 4 11 FS DVDT 5 10 SGND VDD 6 9 SGND RC 7 8 SW CDVDT UBA2211T CVDD Fig 5. CFS 019aaa596 Low voltage supply 6.2 Preheat state UBA2211 features a patented, current controlled preheat circuit during start-up where the preheat current is independently regulated from the mains voltage. The preheat time is set by the value of the external capacitor (CSW). The IC enters the preheat state when the voltage on pin VDD is above VDD(start) and OTP is not active. The capacitor on pin SW (CSW) is charged by the sweep current (ISW) (integrated in the IC) until the decreasing CSW voltage equals VSW(ph); see Figure 3: The preheat current is monitored using the external resistor RSENSE and can be determined by Equation 1: V ref ( ph ) I ph ( peak ) = ----------------R SENSE (1) The preheat current can be determined by the value of resistor RSENSE selected. Figure 6 shows the scope waveform in real application. UM10418 User manual All information provided in this document is subject to legal disclaimers. Rev. 2 — 10 January 2011 © NXP B.V. 2011. All rights reserved. 8 of 17 UM10418 NXP Semiconductors UBA2211 demo board for 230 V, 12 W Ipreheat 019aaa875 Fig 6. Preheat state 6.3 Ignition state The ignition state is entered after the preheat state has finished. The capacitor on pin SW (CSW) is charged by ISW up to 0.6 × VH(RC) which corresponds to the frequency fosc(nom). During this frequency sweep, the resonance frequency is reached resulting in the ignition of the lamp (see Figure 3). The resonance frequency is set by the lamp inductor (Llamp) and lamp capacitor (Clamp). The ignition state ends when the voltage on pin SW (VSW) reaches 0.6 × VH(RC). 6.4 Steady state Another distinctive feature is the RMS current control function. The RMS current control only becomes active when the mains voltage rises above the nominal value. The IC dissipation and lamp current are limited in this way and ensures that input power is nearly constant while AC mains input increases. This results in constant IC dissipation and temperature at a fixed ambient temperature. RMS V SENSE = V O ( ref )RMS = R SENSE × I LSPT (2) A constant current flows through the power switches and the lamp which is defined by the internal reference voltage (VO(ref)RMS) and the external RSENSE resistor; see Equation 2. Figure 7 shows the RMS control trend calculated using the calculation tool. The lamp operating point is the intersection of curves (1) and (2). UM10418 User manual All information provided in this document is subject to legal disclaimers. Rev. 2 — 10 January 2011 © NXP B.V. 2011. All rights reserved. 9 of 17 UM10418 NXP Semiconductors UBA2211 demo board for 230 V, 12 W 019aaa598 0.15 (1) llamp (A) (2) 0.1 0.05 (4) 0 6x104 0 (3) 8x104 1x105 f (Hz) V (DC) = V (DC ) nominal (1) IC controlled half-bridge current; f = fmin; Vi = 230 V; RMS takes control at Vi > 230 V (AC) (2) Half-bridge current as a function of frequency; operating point at intersection with curve (1) (3) Burner current as a function of frequency (4) Maximum frequency set by RMS control Fig 7. RMS control in calculation tool Control behavior of the lamp power is shown by the test results in real application; see Figure 8. 019aaa599 14 65 f (kHz) Pi (W) (1) 12 55 (2) 10 8 260 45 280 300 320 35 340 360 HV (V)(DC) (1) Pi (W) (2) f (kHz) Fig 8. UM10418 User manual RMS control in real application All information provided in this document is subject to legal disclaimers. Rev. 2 — 10 January 2011 © NXP B.V. 2011. All rights reserved. 10 of 17 UM10418 NXP Semiconductors UBA2211 demo board for 230 V, 12 W The preheat and steady state half-bridge (~lamp) currents are both set by the resistor RSENSE. That results in fixing the ratio between these two currents equal to 1.2. This is a perfect setting for the majority of the burners. However for an extended burner covering this ratio can be enlarged by adding a resistor across capacitor CSW. Table 1 lists the typical settings. The resistor should not be chosen smaller than 10 MΩ to prevent malfunctioning of the preheat timer. Table 1. UM10418 User manual Typical ratio setting of Iph / IRMS RSW (MΩ) Iph / IRMS none 1.2 25 1.3 20 1.4 15 1.5 11 1.7 All information provided in this document is subject to legal disclaimers. Rev. 2 — 10 January 2011 © NXP B.V. 2011. All rights reserved. 11 of 17 UM10418 NXP Semiconductors UBA2211 demo board for 230 V, 12 W 6.5 Overtemperature protection (OTP) OTP is active in all states. When the die temperature reaches the OTP activation threshold (Tth(act)otp), the oscillator is stopped, the LS switch remains in the on state and the HS switch remains in the off state. This allows the inductor energy to resonate and damp out gradually. With the oscillator now stopped the DVDT supply no longer generates a supply current. Voltage VDD gradually decreases and the start-up state is entered when VDD falls below VDD(stop). The OTP is reset when the temperature falls below the release threshold (Tth(rel)otp). VOUT LLamp VRC 019aaa876 Fig 9. OTP function 6.6 Saturation Current Protection (SCP) A critical parameter in the design of the lamp inductor is its saturation current. Saturation of the lamp inductor is likely to occur in cost-effective and miniaturized CFLs. The UBA2211 internally monitors the power transistor current. When this current exceeds the momentary rating of the internal half-bridge power transistors, the conduction time is reduced and the frequency is slowly increased (by discharging CSW). This causes the system to balance at the edge of the current rating of the internal power switches. Figure 10 shows SCP in real application using an easily saturated inductor. When an IC without this protection function was tested under identical conditions, it failed during ignition. UM10418 User manual All information provided in this document is subject to legal disclaimers. Rev. 2 — 10 January 2011 © NXP B.V. 2011. All rights reserved. 12 of 17 UM10418 NXP Semiconductors UBA2211 demo board for 230 V, 12 W VOUT LLamp VRC 019aaa877 Fig 10. Correctly functioning IC with saturated inductor at ignition 6.7 Capacitive Mode Protection (CMP) UBA2211 detects switch operation through an internal active Zero-Voltage Switching (ZVS) control circuit preventing stress on the MOSFETs. When capacitive mode is detected, capacitor CSW is discharged causing the frequency to increase. The system sets itself to the operating point where capacitive mode switching is minimized. CMP is active during the ignition state and in the steady state; see Figure 11. VOUT LLamp VRC 019aaa878 Fig 11. Capacitive mode protection in RMS state UM10418 User manual All information provided in this document is subject to legal disclaimers. Rev. 2 — 10 January 2011 © NXP B.V. 2011. All rights reserved. 13 of 17 UM10418 NXP Semiconductors UBA2211 demo board for 230 V, 12 W 7. Bill Of Materials (BOM) The components used for the 230 V demo board are given in Table 2 UM10418 User manual Table 2. BOM Number Reference 1 Rfuse 2 D1, D2, D4, D5 M7 4 3 CBUF C1 2.7 μF; 400 V; 105 °C; 10*16 1 4 CFS C5 10 nF; 50 V; 0805 1 5 CSW, CVDD C6 100 nF; 50 V; 0805 2 6 CDVDT C9 220 pF; 500 V 1 7 Cosc C7 220 pF; 50 V; 0805 1 9 C0, COUT1, COUT2 C0, C2, C3 100 nF; 400 V; CL21 3 10 Clamp C4 2.2 nF; 1 kV; CBB28 1 11 LFILT L1 3 mH; LGB 1 12 Llamp L2 3 mH; EE13; PC40 1 13 Rosc R1 100 kΩ; 1 %; 0805 1 14 RSENSE R2 1.8 Ω; 1 W; 1 % 1 15 PCB UBA2211-1; UBA2211-8 2 16 IC UBA2211B 1 17 Burner 3U-12 W; 2700k 1 Alias Typical value Quantity 10 Ω; 1 W 1 All information provided in this document is subject to legal disclaimers. Rev. 2 — 10 January 2011 © NXP B.V. 2011. All rights reserved. 14 of 17 UM10418 NXP Semiconductors UBA2211 demo board for 230 V, 12 W 8. PCB layout Figure 12 shows the PCB layout. 019aaa879 Fig 12. PCB layout: Motherboard (left) and daughter board (right) 9. References [1] UM10418 User manual Data sheet UBA2211 — Half-bridge power IC family for CFL lamps. All information provided in this document is subject to legal disclaimers. Rev. 2 — 10 January 2011 © NXP B.V. 2011. All rights reserved. 15 of 17 UM10418 NXP Semiconductors UBA2211 demo board for 230 V, 12 W 10. Legal information 10.1 Definitions Draft — The document is a draft version only. The content is still under internal review and subject to formal approval, which may result in modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. Export control — This document as well as the item(s) described herein may be subject to export control regulations. Export might require a prior authorization from national authorities. 10.2 Disclaimers Limited warranty and liability — Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. In no event shall NXP Semiconductors be liable for any indirect, incidental, punitive, special or consequential damages (including - without limitation - lost profits, lost savings, business interruption, costs related to the removal or replacement of any products or rework charges) whether or not such damages are based on tort (including negligence), warranty, breach of contract or any other legal theory. Notwithstanding any damages that customer might incur for any reason whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards customer for the products described herein shall be limited in accordance with the Terms and conditions of commercial sale of NXP Semiconductors. Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof. Suitability for use — NXP Semiconductors products are not designed, authorized or warranted to be suitable for use in life support, life-critical or safety-critical systems or equipment, nor in applications where failure or malfunction of an NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. NXP Semiconductors accepts no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer’s own risk. Applications — Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Customers are responsible for the design and operation of their applications and products using NXP Semiconductors products, and NXP Semiconductors accepts no liability for any assistance with applications or customer product design. It is customer’s sole responsibility to determine whether the NXP Semiconductors product is suitable and fit for the customer’s applications and products planned, as well as for the planned application and use of customer’s third party customer(s). Customers should provide appropriate design and operating safeguards to minimize the risks associated with their applications and products. UM10418 User manual NXP Semiconductors does not accept any liability related to any default, damage, costs or problem which is based on any weakness or default in the customer’s applications or products, or the application or use by customer’s third party customer(s). Customer is responsible for doing all necessary testing for the customer’s applications and products using NXP Semiconductors products in order to avoid a default of the applications and the products or of the application or use by customer’s third party customer(s). NXP does not accept any liability in this respect. Evaluation products — This product is provided on an “as is” and “with all faults” basis for evaluation purposes only. NXP Semiconductors, its affiliates and their suppliers expressly disclaim all warranties, whether express, implied or statutory, including but not limited to the implied warranties of non-infringement, merchantability and fitness for a particular purpose. The entire risk as to the quality, or arising out of the use or performance, of this product remains with customer. In no event shall NXP Semiconductors, its affiliates or their suppliers be liable to customer for any special, indirect, consequential, punitive or incidental damages (including without limitation damages for loss of business, business interruption, loss of use, loss of data or information, and the like) arising out the use of or inability to use the product, whether or not based on tort (including negligence), strict liability, breach of contract, breach of warranty or any other theory, even if advised of the possibility of such damages. Notwithstanding any damages that customer might incur for any reason whatsoever (including without limitation, all damages referenced above and all direct or general damages), the entire liability of NXP Semiconductors, its affiliates and their suppliers and customer’s exclusive remedy for all of the foregoing shall be limited to actual damages incurred by customer based on reasonable reliance up to the greater of the amount actually paid by customer for the product or five dollars (US$5.00). The foregoing limitations, exclusions and disclaimers shall apply to the maximum extent permitted by applicable law, even if any remedy fails of its essential purpose. Safety of high-voltage evaluation products — The non-insulated high voltages that are present when operating this product, constitute a risk of electric shock, personal injury, death and/or ignition of fire. This product is intended for evaluation purposes only. It shall be operated in a designated test area by personnel that is qualified according to local requirements and labor laws to work with non-insulated mains voltages and high-voltage circuits. The product does not comply with IEC 60950 based national or regional safety standards. NXP Semiconductors does not accept any liability for damages incurred due to inappropriate use of this product or related to non-insulated high voltages. Any use of this product is at customer’s own risk and liability. The customer shall fully indemnify and hold harmless NXP Semiconductors from any liability, damages and claims resulting from the use of the product. 10.3 Trademarks Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners. All information provided in this document is subject to legal disclaimers. Rev. 2 — 10 January 2011 © NXP B.V. 2011. All rights reserved. 16 of 17 UM10418 NXP Semiconductors UBA2211 demo board for 230 V, 12 W 11. Contents 1 2 2.1 2.2 2.3 2.4 3 4 5 6 6.1 6.2 6.3 6.4 6.5 6.6 6.7 7 8 9 10 10.1 10.2 10.3 11 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 System integration . . . . . . . . . . . . . . . . . . . . . . 3 Burner lifetime . . . . . . . . . . . . . . . . . . . . . . . . . 3 Safety . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 Ease of use. . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 Circuit diagram . . . . . . . . . . . . . . . . . . . . . . . . . 4 Specifications. . . . . . . . . . . . . . . . . . . . . . . . . . . 4 Application photographs . . . . . . . . . . . . . . . . . 5 Circuit description . . . . . . . . . . . . . . . . . . . . . . . 5 Supply voltage . . . . . . . . . . . . . . . . . . . . . . . . . 7 Preheat state . . . . . . . . . . . . . . . . . . . . . . . . . . 8 Ignition state . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 Steady state . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 Overtemperature protection (OTP) . . . . . . . . . 12 Saturation Current Protection (SCP) . . . . . . . 12 Capacitive Mode Protection (CMP) . . . . . . . . 13 Bill Of Materials (BOM) . . . . . . . . . . . . . . . . . . 14 PCB layout . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 References . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 Legal information. . . . . . . . . . . . . . . . . . . . . . . 16 Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 16 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 Please be aware that important notices concerning this document and the product(s) described herein, have been included in section ‘Legal information’. © NXP B.V. 2011. All rights reserved. For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: [email protected] Date of release: 10 January 2011 Document identifier: UM10418