TDA10027HN Dual cable demodulator with Out-Of Band

TDA10027HN
Dual cable demodulator with Out-Of Band receiver
Rev. 1 — 8 November 2011
Product short data sheet
1. General description
The TDA10027 is a Dual Cable Downstream Processor.
The Cable Downstream Processor (CDP) implements the physical interfaces and
protocols required to provide the highest quality services of an in-band DOCSIS,
EuroDOCSIS, DVB, and OpenCable Set-Top Box (STB). The downstream signals are
digitized by 12-bit ADC and passed to the Demod and Forward Error Correction (FEC)
blocks, which do all the cable physical layer processing. This processing includes
demodulating and Annex A (Europe), Annex B (US) or Annex C (Japan) FEC for the
in-band data.
The Out-Of Band (OOB) receiver consists of a QPSK demodulator with FEC, compliant to
SCTE55-1 and SCTE55-2 standards, with either internal MAC or POD support. Data are
digitized by a 10-bit ADC.
2. Features and benefits












QPSK, 16 QAM, 32 QAM, 64 QAM, 128 QAM and 256 QAM Demodulator
ITU-T J83 Annex A, B and C FEC
Transport Stream Multiplex Frame (TSMF) module for Annex C compliance
Time interleaved parallel mode or serial mode for Transport Stream (TS) interface
On chip PLL for crystal frequency multiplication (16 MHz external)
Reuse of the tuner clock, saving one crystal
Embedded 12-bit ADC
3.3 V and 1.2 V power supplies
Low power < 260 mW for dual stream operation
Small size package
Low cost Bill of Material
OOB:
 QPSK demodulator
 SCTE55-1 and SCTE55-2 FEC
 Embedded 10-bit ADC
TDA10027HN
NXP Semiconductors
Dual cable demodulator with Out-Of Band receiver
3. Quick reference data
Table 1.
Symbol
P
Quick reference data
Parameter
Conditions
power dissipation
Min
Typ
Max
Unit
-
10[1]
30[2]
mW
1.2 V supply voltage; 2
simultaneous DVB-C
demodulations (256 QAM
6.9 Msps) and 1 OOB
SCTE55-1
-
225[1]
305[2]
mW
3.3 V supply voltage; 2
simultaneous DVB-C
demodulations (256 QAM
6.9 Msps) and 1 OOB
SCTE55-1
-
35[1]
55[2]
mW
-
260[1]
360[2]
mW
Standby mode:
all 3 ADC in Power-down
mode and all clocks disabled
operation mode:
Ptot
total power dissipation
VDD(1V2)
supply voltage (1.2 V)
1.15
1.2
1.3
V
VDD(3V3)
supply voltage (3.3 V)
3.0
3.3
3.6
V
VIH
HIGH-level input voltage VDD(3V3) related input levels
2.0
-
VDD(3V3) +
0.5
V
VIL
LOW-level input voltage
0.5
-
+0.8
V
2 simultaneous DVB-C
demodulations (256 QAM
6.9 Msps) and 1 OOB
SCTE55-1
[1]
Tamb = 25 C, VDD(1V2) and VDD(3V3) typical.
[2]
Tj = 120 C, VDD(1V2) and VDD(3V3) maximum.
4. Ordering information
Table 2.
Ordering information
Type number
Package
Name
Description
Version
TDA10027HN/C1 HVQFN64 plastic thermal enhanced very thin quad flat package; SOT804-4
no leads; 64 terminals; body 9  9  0.85 mm
TDA10027HN_SDS
Product short data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 1 — 8 November 2011
© NXP B.V. 2011. All rights reserved.
2 of 8
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ADC 0
(12-BIT)
ADC data 0
CABLE
DOWNSTREAM
PROCESSOR 0
TS0
TSMF 0
ADC input 1
ADC 1
(12-BIT)
ADC input 2
ADC 2
(10-BIT)
I2C-BUS interface
Block diagram
TRANSPORT
MUX
CABLE
DOWNSTREAM
PROCESSOR 1
ADC data 2
OOB
TS1
TSMF 1
TS output
TS1
TS output
I2C-BUS TO
DTL-MMIO
RGU
CGU
CONFIG
distributes resets
to all blocks
distributes clocks
to all blocks
commands settings
for different blocks
001aam421
TDA10027HN
3 of 8
© NXP B.V. 2011. All rights reserved.
Fig 1.
ADC data 1
TS0
Dual cable demodulator with Out-Of Band receiver
Rev. 1 — 8 November 2011
All information provided in this document is subject to legal disclaimers.
ADC
data 0
NXP Semiconductors
5. Block diagram
TDA10027HN_SDS
Product short data sheet
ADC input 0
TDA10027HN
NXP Semiconductors
Dual cable demodulator with Out-Of Band receiver
6. Limiting values
Table 3.
Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol
Parameter
Conditions
Tstg
storage temperature
Tj
junction temperature
VESD
electrostatic discharge voltage
EIA/JESD22-A114 (human body model)
[1]
EIA/JESD22-C101-C (FCDM)
[1]
Min
Max
Unit
40
+150
C
-
120
C
2
-
kV
0.5
-
kV
It withstands class IV of JEDEC standard.
7. Abbreviations
Table 4.
Abbreviations
Acronym
Description
ADC
Analog to Digital Converter
CDP
Cable Downstream Processor
CGU
Clock Generation Unit
DOCSIS
Data Over Cable Service Interface Specifications
DVB-C
Digital Video Broadcasting - Cable
FCDM
Field-Induced Charged-Device Model
FEC
Forward Error Correction
MAC
Media Access Control
OOB
Out-Of Band
PLL
Phase-Locked Loop
POD
Point Of Deployement
QAM
Quadrature Amplitude Modulation
QPSK
Quadrature Phase Shift Keying
RGU
Reset Generation Unit
STB
Set-Top Box
TS
Transport Stream
TSMF
Transport Stream Multiplex Frame
US
United States
8. Revision history
Table 5.
Revision history
Document ID
Release date
Data sheet status
Change notice
Supersedes
TDA10027HN_SDS v.1
20111108
Product short data sheet
-
-
TDA10027HN_SDS
Product short data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 1 — 8 November 2011
© NXP B.V. 2011. All rights reserved.
4 of 8
TDA10027HN
NXP Semiconductors
Dual cable demodulator with Out-Of Band receiver
9. Legal information
9.1
Data sheet status
Document status[1][2]
Product status[3]
Definition
Objective [short] data sheet
Development
This document contains data from the objective specification for product development.
Preliminary [short] data sheet
Qualification
This document contains data from the preliminary specification.
Product [short] data sheet
Production
This document contains the product specification.
[1]
Please consult the most recently issued document before initiating or completing a design.
[2]
The term ‘short data sheet’ is explained in section “Definitions”.
[3]
The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status
information is available on the Internet at URL http://www.nxp.com.
9.2
Definitions
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liability for the consequences of
use of such information.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and title. A short data sheet is intended
for quick reference only and should not be relied upon to contain detailed and
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local NXP Semiconductors sales
office. In case of any inconsistency or conflict with the short data sheet, the
full data sheet shall prevail.
Product specification — The information and data provided in a Product
data sheet shall define the specification of the product as agreed between
NXP Semiconductors and its customer, unless NXP Semiconductors and
customer have explicitly agreed otherwise in writing. In no event however,
shall an agreement be valid in which the NXP Semiconductors product is
deemed to offer functions and qualities beyond those described in the
Product data sheet.
9.3
Disclaimers
Limited warranty and liability — Information in this document is believed to
be accurate and reliable. However, NXP Semiconductors does not give any
representations or warranties, expressed or implied, as to the accuracy or
completeness of such information and shall have no liability for the
consequences of use of such information.
In no event shall NXP Semiconductors be liable for any indirect, incidental,
punitive, special or consequential damages (including - without limitation - lost
profits, lost savings, business interruption, costs related to the removal or
replacement of any products or rework charges) whether or not such
damages are based on tort (including negligence), warranty, breach of
contract or any other legal theory.
Notwithstanding any damages that customer might incur for any reason
whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards
customer for the products described herein shall be limited in accordance
with the Terms and conditions of commercial sale of NXP Semiconductors.
malfunction of an NXP Semiconductors product can reasonably be expected
to result in personal injury, death or severe property or environmental
damage. NXP Semiconductors accepts no liability for inclusion and/or use of
NXP Semiconductors products in such equipment or applications and
therefore such inclusion and/or use is at the customer’s own risk.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty that such applications will be suitable for the
specified use without further testing or modification.
Customers are responsible for the design and operation of their applications
and products using NXP Semiconductors products, and NXP Semiconductors
accepts no liability for any assistance with applications or customer product
design. It is customer’s sole responsibility to determine whether the NXP
Semiconductors product is suitable and fit for the customer’s applications and
products planned, as well as for the planned application and use of
customer’s third party customer(s). Customers should provide appropriate
design and operating safeguards to minimize the risks associated with their
applications and products.
NXP Semiconductors does not accept any liability related to any default,
damage, costs or problem which is based on any weakness or default in the
customer’s applications or products, or the application or use by customer’s
third party customer(s). Customer is responsible for doing all necessary
testing for the customer’s applications and products using NXP
Semiconductors products in order to avoid a default of the applications and
the products or of the application or use by customer’s third party
customer(s). NXP does not accept any liability in this respect.
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) will cause permanent
damage to the device. Limiting values are stress ratings only and (proper)
operation of the device at these or any other conditions above those given in
the Recommended operating conditions section (if present) or the
Characteristics sections of this document is not warranted. Constant or
repeated exposure to limiting values will permanently and irreversibly affect
the quality and reliability of the device.
Terms and conditions of commercial sale — NXP Semiconductors
products are sold subject to the general terms and conditions of commercial
sale, as published at http://www.nxp.com/profile/terms, unless otherwise
agreed in a valid written individual agreement. In case an individual
agreement is concluded only the terms and conditions of the respective
agreement shall apply. NXP Semiconductors hereby expressly objects to
applying the customer’s general terms and conditions with regard to the
purchase of NXP Semiconductors products by customer.
Right to make changes — NXP Semiconductors reserves the right to make
changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
No offer to sell or license — Nothing in this document may be interpreted or
construed as an offer to sell products that is open for acceptance or the grant,
conveyance or implication of any license under any copyrights, patents or
other industrial or intellectual property rights.
Suitability for use — NXP Semiconductors products are not designed,
authorized or warranted to be suitable for use in life support, life-critical or
safety-critical systems or equipment, nor in applications where failure or
Export control — This document as well as the item(s) described herein
may be subject to export control regulations. Export might require a prior
authorization from competent authorities.
TDA10027HN_SDS
Product short data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 1 — 8 November 2011
© NXP B.V. 2011. All rights reserved.
5 of 8
TDA10027HN
NXP Semiconductors
Dual cable demodulator with Out-Of Band receiver
Quick reference data — The Quick reference data is an extract of the
product data given in the Limiting values and Characteristics sections of this
document, and as such is not complete, exhaustive or legally binding.
Non-automotive qualified products — Unless this data sheet expressly
states that this specific NXP Semiconductors product is automotive qualified,
the product is not suitable for automotive use. It is neither qualified nor tested
in accordance with automotive testing or application requirements. NXP
Semiconductors accepts no liability for inclusion and/or use of
non-automotive qualified products in automotive equipment or applications.
In the event that customer uses the product for design-in and use in
automotive applications to automotive specifications and standards, customer
(a) shall use the product without NXP Semiconductors’ warranty of the
product for such automotive applications, use and specifications, and (b)
whenever customer uses the product for automotive applications beyond
NXP Semiconductors’ specifications such use shall be solely at customer’s
own risk, and (c) customer fully indemnifies NXP Semiconductors for any
liability, damages or failed product claims resulting from customer design and
use of the product for automotive applications beyond NXP Semiconductors’
standard warranty and NXP Semiconductors’ product specifications.
9.4
Trademarks
Notice: All referenced brands, product names, service names and trademarks
are the property of their respective owners.
I2C-bus — logo is a trademark of NXP B.V.
10. Contact information
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: [email protected]
TDA10027HN_SDS
Product short data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 1 — 8 November 2011
© NXP B.V. 2011. All rights reserved.
6 of 8
TDA10027HN
NXP Semiconductors
Dual cable demodulator with Out-Of Band receiver
11. Tables
Table 1.
Table 2.
Table 3.
Quick reference data . . . . . . . . . . . . . . . . . . . . .2
Ordering information . . . . . . . . . . . . . . . . . . . . .2
Limiting values . . . . . . . . . . . . . . . . . . . . . . . . . .4
Table 4.
Table 5.
Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . . 4
Revision history . . . . . . . . . . . . . . . . . . . . . . . . . 4
12. Figures
Fig 1.
Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . .3
TDA10027HN_SDS
Product short data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 1 — 8 November 2011
© NXP B.V. 2011. All rights reserved.
7 of 8
TDA10027HN
NXP Semiconductors
Dual cable demodulator with Out-Of Band receiver
13. Contents
1
2
3
4
5
6
7
8
9
9.1
9.2
9.3
9.4
10
11
12
13
General description . . . . . . . . . . . . . . . . . . . . . .
Features and benefits . . . . . . . . . . . . . . . . . . . .
Quick reference data . . . . . . . . . . . . . . . . . . . . .
Ordering information . . . . . . . . . . . . . . . . . . . . .
Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . .
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . .
Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . . .
Revision history . . . . . . . . . . . . . . . . . . . . . . . . .
Legal information. . . . . . . . . . . . . . . . . . . . . . . .
Data sheet status . . . . . . . . . . . . . . . . . . . . . . .
Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . .
Contact information. . . . . . . . . . . . . . . . . . . . . .
Tables . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Figures . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
1
1
2
2
3
4
4
4
5
5
5
5
6
6
7
7
8
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
© NXP B.V. 2011.
All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: [email protected]
Date of release: 8 November 2011
Document identifier: TDA10027HN_SDS