UDA1330ATS Low-cost stereo filter DAC

INTEGRATED CIRCUITS
DATA SHEET
UDA1330ATS
Low-cost stereo filter DAC
Product specification
Supersedes data of 2000 April 18
2001 Feb 02
NXP Semiconductors
Product specification
Low-cost stereo filter DAC
UDA1330ATS
FEATURES
General
• Low power consumption
• Power supply voltage from 2.7 to 5.5 V
• Selectable control via L3 microcontroller interface or via
static pin control
• System clock frequencies of 256fs, 384fs and 512fs
selectable via L3 interface or 256fs and 384fs via static
pin control
APPLICATIONS
• Supports sampling frequencies (fs) from 8 to 55 kHz
• PC audio applications
• Integrated digital filter plus non inverting
Digital-to-Analog Converter (DAC)
• Car radio applications.
• No analog post filtering required for DAC
GENERAL DESCRIPTION
• Slave mode only applications
The UDA1330ATS is a single-chip stereo DAC employing
bitstream conversion techniques.
• Easy application
• Small package size (SSOP16)
The UDA1330ATS supports the I2S-bus data format with
word lengths of up to 20 bits, the MSB-justified data format
with word lengths of up to 20 bits and the LSB-justified
serial data format with word lengths of 16, 18 and 20 bits.
• TTL tolerant input pads
• Pin and function compatible with the UDA1320ATS.
Multiple format input interface
The UDA1330ATS can be used in two modes: L3 mode or
the static pin mode.
• L3 mode: I2S-bus, MSB-justified or LSB-justified
16, 18 and 20 bits format compatible
In the L3 mode, all digital sound processing features must
be controlled via the L3 interface, including the selection of
the system clock setting.
• Static pin mode: I2S-bus and LSB-justified
16, 18 and 20 bits format compatible
• 1fs input format data rate.
In the two static modes, the UDA1330ATS can be
operated in the 256fs and 384fs system clock mode.
Muting, de-emphasis for 44.1 kHz and four digital input
formats (I2S-bus or LSB-justified 16, 18, and 20 bits) can
be selected via static pins. The L3 interface cannot be
used in this application mode, so volume control is not
available in this mode.
DAC digital sound processing
• Digital logarithmic volume control in L3 mode
• Digital de-emphasis for 32, 44.1 and 48 kHz sampling
frequencies in L3 mode or 44.1 kHz sampling frequency
in static pin mode
• Soft mute control both in static pin mode and L3 mode.
Advanced audio configuration
• Stereo line output (volume control in L3 mode)
• High linearity, wide dynamic range and low distortion.
ORDERING INFORMATION
PACKAGE
TYPE NUMBER
NAME
UDA1330ATS
2001 Feb 02
SSOP16
DESCRIPTION
plastic shrink small outline package; 16 leads; body width 4.4 mm
2
VERSION
SOT369-1
NXP Semiconductors
Product specification
Low-cost stereo filter DAC
UDA1330ATS
QUICK REFERENCE DATA
SYMBOL
PARAMETER
CONDITIONS
MIN.
TYP.
MAX.
UNIT
Supplies
VDDA
DAC analog supply voltage
VDDD
digital supply voltage
IDDA
DAC analog supply current
2.7
5.0
5.5
V
2.7
5.0
5.5
V
operating
−
9.5
−
mA
power-down
−
400
−
μA
operating
−
7.0
−
mA
power-down
−
250
−
μA
VDDD = 5.0 V
−
5.5
−
mA
VDDD = 3.3 V
−
3.0
−
mA
−40
−
+85
°C
VDDA = 5.0 V
VDDA = 3.3 V
IDDD
Tamb
digital supply current
ambient temperature
Digital-to-analog converter (VDDA = VDDD = 5.0 V)
Vo(rms)
output voltage (RMS value)
note 1
−
1.45
−
V
(THD + N)/S
total harmonic distortion-plus-noise to
signal ratio
at 0 dB
−
−90
−85
dB
at −60 dB; A-weighted
−
−40
−35
dB
S/N
signal-to-noise ratio
code = 0; A-weighted
−
100
95
dB
αcs
channel separation
−
100
−
dB
Digital-to-analog converter (VDDA = VDDD = 3.3 V)
Vo(rms)
output voltage (RMS value)
note 1
−
1.0
−
V
(THD + N)/S
total harmonic distortion-plus-noise to
signal ratio
at 0 dB
−
−85
−
dB
at −60 dB; A-weighted
−
−38
−
dB
S/N
signal-to-noise ratio
code = 0; A-weighted
−
100
−
dB
αcs
channel separation
−
100
−
dB
VDDA = VDDD = 5.0 V
−
75
−
mW
VDDA = VDDD = 3.3 V
−
33
−
mW
Power dissipation
P
power dissipation
playback mode
Note
1. The output voltage scales linearly with the power supply voltage.
2001 Feb 02
3
NXP Semiconductors
Product specification
Low-cost stereo filter DAC
UDA1330ATS
BLOCK DIAGRAM
VSSD
VDDD
handbook, full pagewidth
4
BCK
WS
DATAI
5
1
2
3
DIGITAL INTERFACE
CONTROL
INTERFACE
7
11
10
9
8
APPSEL
APPL0
APPL1
APPL2
APPL3
UDA1330ATS VOLUME/MUTE/DE-EMPHASIS
SYSCLK
6
INTERPOLATION FILTER
NOISE SHAPER
VOUTL
DAC
14
16
DAC
13
15
VDDA
VSSA
12
VOUTR
MGL401
Vref(DAC)
Fig.1 Block diagram.
PINNING
SYMBOL
PIN
DESCRIPTION
BCK
1
bit clock input
WS
2
word select input
DATAI
3
data input
handbook, halfpage
BCK 1
VDDD
4
digital supply voltage
VSSD
5
digital ground
SYSCLK
6
system clock input: 256fs, 384fs
and 512fs
VDDD 4
VSSD 5
16 VOUTR
WS 2
15 VSSA
DATAI 3
14 VOUTL
13 VDDA
UDA1330ATS
12 Vref(DAC)
APPSEL
7
application mode select input
APPL3
8
application input 3
SYSCLK 6
11 APPL0
APPL2
9
application input 2
APPSEL 7
10 APPL1
APPL1
10
application input 1
APPL3 8
APPL0
11
application input 0
Vref(DAC)
12
DAC reference voltage
VDDA
13
analog supply voltage for DAC
VOUTL
14
left channel output
VSSA
15
analog ground
VOUTR
16
right channel output
2001 Feb 02
9
APPL2
MGL402
Fig.2 Pin configuration.
4
NXP Semiconductors
Product specification
Low-cost stereo filter DAC
UDA1330ATS
FUNCTIONAL DESCRIPTION
In the L3 mode, pin APPL0 must be set to LOW. It should
be noted that when the L3 mode is used, an initialization
must be performed when the IC is powered-up.
System clock
The UDA1330ATS operates in slave mode only.
Therefore, in all applications the system devices must
provide the system clock. The system frequency (fsys) is
selectable and depends on the application mode. The
options are: 256fs, 384fs and 512fs for the L3 mode and
256fs or 384fs for the static pin mode. The system clock
must be locked in frequency to the digital interface input
signals.
Multiple format input interface
DATA FORMATS
The digital interface of the UDA1330ATS supports multiple
format inputs (see Fig.3).
Left and right data-channel words are time multiplexed.
The WS signal must have a 50% duty factor for all
LSB-justified formats.
The UDA1330ATS supports sampling frequencies from
8 to 55 kHz.
The BCK clock can be up to 64fs, or in other words the
BCK frequency is 64 times the Word Select (WS)
frequency or less: fBCK ≤ 64 × fWS.
Application modes
The application mode can be set with the three-level
pin APPSEL (see Table 1):
Important: the WS edge MUST fall on the negative edge
of the BCK at all times for proper operation of the digital
interface.
• L3 mode
• Static pin mode with fsys = 384fs
• Static pin mode with fsys = 256fs.
Table 1
The UDA1330ATS also accepts double speed data for
double speed data monitoring purposes
Selecting application mode and system clock
frequency via pin APPSEL
VOLTAGE ON
PIN APPSEL
MODE
fsys
VSSD
L3 mode
256fs, 384fs or 512fs
0.5VDDD
VDDD
L3 MODE
This mode supports the following input formats:
• I2S-bus format with data word length of up to 20 bits
• MSB-justified format with data word length up to 20 bits
384fs
static pin mode
• LSB-justified format with data word length of
16, 18 or 20 bits.
256fs
STATIC PIN MODE
The function of an application input pin (active HIGH)
depends on the application mode (see Table 2).
Table 2
This mode supports the following input formats:
• I2S-bus format with data word length of up to 20 bits
Functions of application input pins
• LSB-justified format with data word length of
16, 18 or 20 bits.
FUNCTION
PIN
L3 MODE
STATIC PIN MODE
APPL0
TEST
MUTE
These four formats are selectable via the static pin codes
SF0 and SF1 (see Table 3).
APPL1
L3CLOCK
DEEM
Table 3
APPL2
L3MODE
SF0
APPL3
L3DATA
SF1
FORMAT
For example, in the static pin mode the output signal can
be soft muted by setting pin APPL0 to HIGH.
De-emphasis can be switched on for 44.1 kHz by setting
pin APPL1 to HIGH; setting pin APPL1 to LOW will disable
de-emphasis.
2001 Feb 02
Input format selection using SF0 and SF1
5
SF0
SF1
I2S-bus
0
0
LSB-justified 16 bits
0
1
LSB-justified 18 bits
1
0
LSB-justified 20 bits
1
1
NXP Semiconductors
Product specification
Low-cost stereo filter DAC
UDA1330ATS
Interpolation filter (DAC)
Filter stream DAC
The digital filter interpolates from 1fs to 128fs by cascading
a recursive filter and an FIR filter (see Table 4).
The FSDAC is a semi-digital reconstruction filter that
converts the 1-bit data stream of the noise shaper to an
analog output voltage. The filter coefficients are
implemented as current sources and are summed at virtual
ground of the output operational amplifier. In this way very
high signal-to-noise performance and low clock jitter
sensitivity is achieved. A post-filter is not needed due to
the inherent filter function of the DAC. On-board amplifiers
convert the FSDAC output current to an output voltage
signal capable of driving a line output.
Table 4
Interpolation filter characteristics
ITEM
CONDITION
VALUE (dB)
Pass-band ripple
0 to 0.45fs
±0.1
>0.55fs
−50
0 to 0.45fs
108
Stop band
Dynamic range
The output voltage of the FSDAC scales linearly with the
power supply voltage.
Noise shaper
The 3rd-order noise shaper operates at 128fs. It shifts
in-band quantization noise to frequencies well above the
audio band. This noise shaping technique enables high
signal-to-noise ratios to be achieved. The noise shaper
output is converted into an analog signal using a Filter
Stream DAC (FSDAC).
2001 Feb 02
Pin compatibility
In the L3 mode the UDA1330ATS can be used on boards
that are designed for the UDA1320ATS.
Remark: It should be noted that the UDA1330ATS is
designed for 5 V operation while the UDA1320ATS is
designed for 3 V operation. This means that the
UDA1330ATS can be used with the UDA1320ATS supply
voltage range, but the UDA1320ATS can not be used with
the 5 V supply voltage.
6
2
>=8
3
1
2
3
MSB
B2
>=8
BCK
MSB
DATA
B2
I2S-BUS
MSB
FORMAT
LEFT
WS
1
2
RIGHT
>=8
3
1
2
>=8
3
BCK
DATA
MSB
B2
LSB
MSB
B2
LSB
MSB
NXP Semiconductors
1
Low-cost stereo filter DAC
book, full pagewidth
2001 Feb 02
RIGHT
LEFT
WS
B2
MSB-JUSTIFIED FORMAT
WS
LEFT
RIGHT
16
15
2
1
16
B15 LSB
MSB
15
2
1
BCK
7
DATA
MSB
B2
B2
B15 LSB
LSB-JUSTIFIED FORMAT 16 BITS
WS
LEFT
RIGHT
18
17
16
15
2
1
18
B17 LSB
MSB
17
16
15
2
1
BCK
DATA
MSB
B2
B3
B4
B2
B3
B4
B17 LSB
LSB-JUSTIFIED FORMAT 18 BITS
WS
LEFT
20
RIGHT
19
18
17
16
15
2
1
20
B19 LSB
MSB
19
18
17
16
15
2
1
BCK
MSB
B2
B3
B4
B5
B6
Fig.3 Digital interface input format data format.
B2
B3
B4
B5
B6
B19 LSB
MBL140
Product specification
LSB-JUSTIFIED FORMAT 20 BITS
UDA1330ATS
DATA
NXP Semiconductors
Product specification
Low-cost stereo filter DAC
UDA1330ATS
L3 INTERFACE
The fundamental timing of data transfers (see Fig.5) is
essentially the same as the address mode. The maximum
input clock frequency and data rate is 64fs.
The following system and digital sound processing
features can be controlled in the L3 mode of the
UDA1330ATS:
• De-emphasis for 32, 44.1 and 48 kHz
Data transfer can only be in one direction, consisting of
input to the UDA1330ATS to program sound processing
and other functional features. All data transfers are by 8-bit
bytes. Data will be stored in the UDA1330ATS after
reception of a complete byte.
• Volume
A multibyte transfer is illustrated in Fig.6.
• System clock frequency
• Data input format
• Soft mute.
Registers
The exchange of data and control information between the
microcontroller and the UDA1330ATS is accomplished
through a serial interface comprising the following signals:
The sound processing and other feature values are stored
in independent registers. The first selection of the registers
is achieved by the choice of data type that is transferred.
This is performed in the address mode using bit 1 and bit 0
(see Table 5).
• L3DATA
• L3MODE
• L3CLOCK.
Table 5
Information transfer through the microcontroller bus is
organized in accordance with the L3 interface format, in
which two different modes of operation can be
distinguished: address mode and data transfer mode.
Selection of data transfer
BIT 1
BIT 0
TRANSFER
0
0
data (volume, de-emphasis, mute)
0
1
not used
Address mode
1
0
The address mode (see Fig.4) is required to select a
device communicating via the L3 interface and to define
the destination registers for the data transfer mode.
status (system clock frequency,
data input format)
1
1
not used
The second selection is performed by the 2 MSBs of the
data byte (bit 7 and bit 6). The other bits in the data byte
(bit 5 to bit 0) represent the value that is placed in the
selected registers.
Data bits 7 to 2 represent a 6-bit device address where
bit 7 is the MSB. The address of the UDA1330ATS is
000101 (bit 7 to bit 2). If the UDA1330ATS receives a
different address, it will deselect its microcontroller
interface logic.
The ‘status’ settings are given in Table 6 and the ‘data’
settings are given in Table 7.
Data transfer mode
The selected address remains active during subsequent
data transfers until the UDA1330ATS receives a new
address command.
2001 Feb 02
8
NXP Semiconductors
Product specification
Low-cost stereo filter DAC
UDA1330ATS
handbook, full pagewidth
L3MODE
tsu(L3)A
th(L3)A
tCLK(L3)L
tsu(L3)A
tCLK(L3)H
th(L3)A
L3CLOCK
Tcy(CLK)(L3)
tsu(L3)DA
th(L3)DA
BIT 0
L3DATA
BIT 7
MGL723
Fig.4 Timing address mode.
handbook, full pagewidth
tstp(L3)
tstp(L3)
L3MODE
tCLK(L3)L
Tcy(CLK)L3
tCLK(L3)H
tsu(L3)D
th(L3)D
L3CLOCK
th(L3)DA
tsu(L3)DA
L3DATA
WRITE
BIT 7
BIT 0
MGL882
Fig.5 Timing data transfer mode.
2001 Feb 02
9
NXP Semiconductors
Product specification
Low-cost stereo filter DAC
UDA1330ATS
tstp(L3)
handbook, full pagewidth
L3MODE
L3CLOCK
L3DATA
address
data byte #1
data byte #2
address
MGL725
Fig.6 Multibyte data transfer.
Programming the features
When the data transfer of type ‘status’ is selected, the features for the system clock frequency and the data input format
can be controlled.
Table 6
Data transfer of type ‘status’
BIT 7
BIT 6
BIT 5
BIT 4
BIT 3
BIT 2
BIT 1
BIT 0
0
0
SC1
SC0
IF2
IF1
IF0
0
REGISTER SELECTED
SC = system clock frequency (2 bits); see Table 8
IF = data input format (3 bits); see Table 9
1
0
0
0
0
0
0
0
not used
When the data transfer of type ‘data’ is selected, the features for volume, de-emphasis and mute can be controlled.
Table 7
BIT 7
Data transfer of type ‘data’
BIT 6
BIT 5
BIT 4
BIT 3
BIT 2
BIT 1
BIT 0
REGISTER SELECTED
0
0
VC5
VC4
VC3
VC2
VC1
VC0
0
1
0
0
0
0
0
0
not used
1
0
0
DE1
DE0
MT
0
0
DE = de-emphasis (2 bits); see Table 10
1
1
0
0
0
0
0
1
default setting
VC = volume control (6 bits); see Table 11
MT = mute (1 bit); see Table 12
2001 Feb 02
10
NXP Semiconductors
Product specification
Low-cost stereo filter DAC
UDA1330ATS
SYSTEM CLOCK FREQUENCY
VOLUME CONTROL
The system clock frequency is a 2-bit value to select the
external clock frequency.
The volume control is a 6-bit value to program the volume
attenuation from 0 to −60 dB and −∞ dB in steps of 1 dB.
Table 8
Table 11 Volume settings
SC1
System clock settings
SC0
FUNCTION
VC5
VC4
VC3
VC2
VC1
VC0
VOLUME (dB)
0
0
512fs
0
0
0
0
0
0
0
0
1
384fs
0
0
0
0
0
1
0
1
0
256fs
0
0
0
0
1
0
−1
1
1
not used
0
0
0
0
1
1
−2
:
:
:
:
:
:
:
−51
DATA FORMAT
1
1
0
0
1
1
The data format is a 3-bit value to select the used data
format.
1
1
0
1
0
0
1
1
0
1
0
1
Table 9
1
1
0
1
1
0
IF2
Data input format settings
IF1
IF0
FORMAT
0
0
0
I2S-bus
0
0
1
LSB-justified 16 bits
0
1
0
LSB-justified 18 bits
0
1
1
LSB-justified 20 bits
1
0
0
MSB-justified
1
0
1
not used
1
1
0
not used
1
1
1
not used
1
1
0
1
1
1
1
1
1
0
0
0
1
1
1
0
0
1
1
1
1
0
1
0
1
1
1
0
1
1
1
1
1
1
0
0
1
1
1
1
0
1
1
1
1
1
1
0
1
1
1
1
1
1
MUTE
DE-EMPHASIS
Mute is a 1-bit value to enable the digital mute.
De-emphasis is a 2-bit value to enable the digital
de-emphasis filter.
Table 12 Mute setting
MT
Table 10 De-emphasis settings
DE1
0
0
1
1
DE0
0
1
0
1
2001 Feb 02
FUNCTION
no de-emphasis
de-emphasis, 32 kHz
de-emphasis, 44.1 kHz
de-emphasis, 48 kHz
11
FUNCTION
0
no muting
1
muting
−52
−54
−57
−60
−∞
NXP Semiconductors
Product specification
Low-cost stereo filter DAC
UDA1330ATS
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 60134).
SYMBOL
PARAMETER
CONDITIONS
MIN.
MAX.
UNIT
VDDD
digital supply voltage
note 1
−
6.0
V
VDDA
analog supply voltage
note 1
−
6.0
V
Txtal(max)
maximum crystal temperature
−
150
°C
Tstg
storage temperature
−65
+125
°C
Tamb
ambient temperature
−40
+85
°C
Ves
electrostatic handling voltage
note 2
−3000
+3000
V
note 3
−250
+250
V
Isc(DAC)
short-circuit current of DAC
output short-circuited to VSSA(DAC) −
450
mA
output short-circuited to VDDA(DAC) −
300
mA
note 4
Notes
1. All supply connections must be made to the same power supply.
2. Equivalent to discharging a 100 pF capacitor via a 1.5 kΩ series resistor.
3. Equivalent to discharging a 200 pF capacitor via a 2.5 μH series inductor.
4. Short-circuit test at Tamb = 0 °C and VDDA = 3 V. DAC operation after short-circuiting cannot be warranted.
HANDLING
Inputs and outputs are protected against electrostatic discharge in normal handling. However, to be totally safe, it is
desirable to take normal precautions appropriate to handling MOS devices.
THERMAL CHARACTERISTICS
SYMBOL
Rth(j-a)
PARAMETER
CONDITIONS
thermal resistance from junction to ambient
in free air
QUALITY SPECIFICATION
In accordance with “SNW-FQ-611-E”.
2001 Feb 02
12
VALUE
UNIT
190
K/W
NXP Semiconductors
Product specification
Low-cost stereo filter DAC
UDA1330ATS
DC CHARACTERISTICS
VDDD = VDDA = 5.0 V; Tamb = 25 °C; RL = 5 kΩ; all voltages referenced to ground (pins VSSA and VSSD); unless
otherwise specified.
SYMBOL
PARAMETER
CONDITIONS
MIN.
TYP.
MAX.
UNIT
Supplies
VDDA
DAC analog supply voltage note 1
2.7
5.0
5.5
V
VDDD
digital supply voltage
2.7
5.0
5.5
V
IDDA
DAC analog supply current VDDA = 5.0 V
operating
−
9.5
−
mA
power-down
−
400
−
μA
operating
−
7.0
−
mA
power-down
−
250
−
μA
VDDD = 5.0 V
−
5.5
−
mA
VDDD = 3.3 V
−
3.0
−
mA
VDDA = VDDD = 5.0 V −
75
−
mW
VDDA = VDDD = 3.3 V −
33
−
mW
note 1
VDDA = 3.3 V
IDDD
digital supply current
Power dissipation
P
power dissipation
playback mode
Digital inputs: pins BCK, WS, DATAI, SYSCLK, APPL0, APPL1, APPL2 and APPL3 (note 2)
VIH
HIGH-level input voltage
VIL
LOW-level input voltage
VDDD = 5.0 V
2.2
−
−
V
VDDD = 3.3 V
1.45
−
−
V
VDDD = 5.0 V
−
−
0.8
V
VDDD = 3.3 V
−
−
0.5
V
⎪ILI⎪
input leakage current
−
−
1
μA
Ci
input capacitance
−
−
10
pF
Three-level input: APPSEL
VIH
HIGH-level input voltage
0.9VDDD
−
VDDD + 0.5 V
VIM
MIDDLE-level input
voltage
0.4VDDD
−
0.6VDDD
V
VIL
LOW-level input voltage
−0.5
−
+0.1VDDD
V
2001 Feb 02
13
NXP Semiconductors
Product specification
Low-cost stereo filter DAC
SYMBOL
UDA1330ATS
PARAMETER
CONDITIONS
MIN.
TYP.
MAX.
UNIT
DAC
Vref(DAC)
reference voltage
with respect to VSSA
0.45VDDA
0.5VDDA
0.55VDDA
V
Io(max)
maximum output current
(THD + N)/S < 0.1%;
RL = 5 kΩ
−
0.36
−
mA
Ro
output resistance
−
0.15
2.0
Ω
RL
load resistance
3
−
−
kΩ
CL
load capacitance
−
−
50
pF
note 3
Notes
1. All supply connections must be made to the same external power supply unit.
2. The digital input pads are TTL compatible at 5 V, but the pads are not 5 V tolerant in the voltage range between
2.7 and 4.5 V.
3. When the DAC drives a capacitive load above 50 pF, a series resistance of 100 Ω must be used to prevent
oscillations in the output operational amplifier.
AC CHARACTERISTICS
fi = 1 kHz; Tamb = 25 °C; RL = 5 kΩ; all voltages referenced to ground (pins VSSA and VSSD); unless otherwise specified.
SYMBOL
PARAMETER
CONDITIONS
TYP.
MAX.
UNIT
Digital-to-analog converter (VDDA = VDDD = 5.0 V)
Vo(rms)
output voltage (RMS value)
1.45
−
V
ΔVo
unbalance between channels
0.1
−
dB
(THD + N)/S total harmonic distortion-plus-noise to
signal ratio
at 0 dB
−90
−85
dB
at −60 dB; A-weighted
−40
−35
dB
S/N
signal-to-noise ratio
code = 0; A-weighted
100
95
dB
αcs
channel separation
100
−
dB
1.0
−
V
Digital-to-analog converter (VDDA = VDDD = 3.3 V)
Vo(rms)
output voltage (RMS value)
ΔVo
unbalance between channels
0.1
−
dB
(THD + N)/S total harmonic distortion-plus-noise to
signal ratio
at 0 dB
−85
−
dB
at −60 dB; A-weighted
−38
−
dB
S/N
signal-to-noise ratio
code = 0; A-weighted
100
−
dB
αcs
channel separation
100
−
dB
PSRR
power supply ripple rejection
60
−
dB
2001 Feb 02
fripple = 1 kHz;
Vripple = 100 mV (p-p)
14
NXP Semiconductors
Product specification
Low-cost stereo filter DAC
UDA1330ATS
TIMING
VDDD = VDDA = 4.5 to 5.5 V; Tamb = −40 to +85 °C; RL = 5 kΩ; all voltages referenced to ground (pins VSSA and VSSD);
unless otherwise specified.
SYMBOL
PARAMETER
CONDITIONS
MIN.
TYP.
MAX.
UNIT
System clock (see Fig.7)
Tsys
system clock cycle time
tCWL
LOW-level system clock pulse width
tCWH
HIGH-level system clock pulse width
fsys = 256fs
71
88
488
ns
fsys = 384fs
47
59
325
ns
fsys = 512fs
36
44
244
ns
fsys < 19.2 MHz
0.3Tsys
−
0.7Tsys
ns
fsys ≥ 19.2 MHz
0.4Tsys
−
0.6Tsys
ns
fsys < 19.2 MHz
0.3Tsys
−
0.7Tsys
ns
fsys ≥ 19.2 MHz
0.4Tsys
−
0.6Tsys
ns
Digital interface (see Fig.8)
Tcy(BCK)
bit clock cycle time
300
−
−
ns
tBCKH
bit clock HIGH time
100
−
−
ns
tBCKL
bit clock LOW time
100
−
−
ns
tr
rise time
−
−
20
ns
tf
fall time
−
−
20
ns
tsu(DATAI)
data input set-up time
20
−
−
ns
th(DATAI)
data input hold time
0
−
−
ns
tsu(WS)
word select set-up time
20
−
−
ns
th(WS)
word select hold time
10
−
−
ns
Control interface L3 mode (see Figs 4 and 5)
Tcy(CLK)L3
L3CLOCK cycle time
500
−
−
ns
tCLK(L3)H
L3CLOCK HIGH time
250
−
−
ns
tCLK(L3)L
L3CLOCK LOW time
250
−
−
ns
tsu(L3)A
L3MODE set-up time for address mode
190
−
−
ns
th(L3)A
L3MODE hold time for address mode
190
−
−
ns
tsu(L3)D
L3MODE set-up time for data transfer
mode
190
−
−
ns
th(L3)D
L3MODE hold time for data transfer
mode
190
−
−
ns
tsu(L3)DA
L3DATA set-up time for data transfer and
address mode
190
−
−
ns
th(L3)DA
L3DATA hold time for data transfer and
address mode
30
−
−
ns
tstp(L3)
L3MODE stop time for data transfer
mode
190
−
−
ns
2001 Feb 02
15
NXP Semiconductors
Product specification
Low-cost stereo filter DAC
UDA1330ATS
t CWH
handbook, full pagewidth
MGR984
t CWL
Tsys
Fig.7 System clock timing.
handbook, full pagewidth
WS
th(WS)
tBCKH
tr
tsu(WS)
tf
BCK
tsu(DATAI)
tBCKL
Tcy(BCK)
th(DATAI)
DATAI
MGL880
Fig.8 Serial interface timing.
2001 Feb 02
16
NXP Semiconductors
Product specification
Low-cost stereo filter DAC
UDA1330ATS
APPLICATION INFORMATION
digital
supply voltage
analog
supply voltage
handbook, full pagewidth
R2
1Ω
C1
R3
1Ω
100 μF
(16 V)
system
clock
R1
SYSCLK
47 Ω
C5
C6
100 nF
(63 V)
VSSA
100 nF
(63 V)
15
VDDA
13
VSSD
5
VDDD
4
6
14
BCK
WS
DATAI
APPSEL
47 μF
(16 V)
1
2
APPL1
APPL2
APPL3
R4
100 Ω
left
output
R5
10 kΩ
3
7
UDA1330ATS
APPL0
VOUTL C2
16
VOUTR
C3
47 μF
(16 V)
R6
100 Ω
right
output
R7
10 kΩ
11
10
9
12
8
Vref(DAC)
C7
100 nF
(63 V)
C4
47 μF
(16 V)
MGL403
Fig.9 Application diagram.
2001 Feb 02
17
NXP Semiconductors
Product specification
Low-cost stereo filter DAC
UDA1330ATS
PACKAGE OUTLINE
SSOP16: plastic shrink small outline package; 16 leads; body width 4.4 mm
D
SOT369-1
E
A
X
c
y
HE
v M A
Z
9
16
Q
A2
A
(A 3)
A1
pin 1 index
θ
Lp
L
1
8
detail X
w M
bp
e
0
2.5
5 mm
scale
DIMENSIONS (mm are the original dimensions)
UNIT
A
max.
A1
A2
A3
bp
c
D (1)
E (1)
e
HE
L
Lp
Q
v
w
y
Z (1)
θ
mm
1.5
0.15
0.00
1.4
1.2
0.25
0.32
0.20
0.25
0.13
5.3
5.1
4.5
4.3
0.65
6.6
6.2
1
0.75
0.45
0.65
0.45
0.2
0.13
0.1
0.48
0.18
10
o
0
Note
1. Plastic or metal protrusions of 0.2 mm maximum per side are not included.
OUTLINE
VERSION
SOT369-1
2001 Feb 02
REFERENCES
IEC
JEDEC
JEITA
EUROPEAN
PROJECTION
ISSUE DATE
99-12-27
03-02-19
MO-152
18
o
NXP Semiconductors
Product specification
Low-cost stereo filter DAC
UDA1330ATS
SOLDERING
If wave soldering is used the following conditions must be
observed for optimal results:
Introduction to soldering surface mount packages
• Use a double-wave soldering method comprising a
turbulent wave with high upward pressure followed by a
smooth laminar wave.
This text gives a very brief insight to a complex technology.
A more in-depth account of soldering ICs can be found in
our “Data Handbook IC26; Integrated Circuit Packages”
(document order number 9398 652 90011).
• For packages with leads on two sides and a pitch (e):
– larger than or equal to 1.27 mm, the footprint
longitudinal axis is preferred to be parallel to the
transport direction of the printed-circuit board;
There is no soldering method that is ideal for all surface
mount IC packages. Wave soldering is not always suitable
for surface mount ICs, or for printed-circuit boards with
high population densities. In these situations reflow
soldering is often used.
– smaller than 1.27 mm, the footprint longitudinal axis
must be parallel to the transport direction of the
printed-circuit board.
Reflow soldering
The footprint must incorporate solder thieves at the
downstream end.
Reflow soldering requires solder paste (a suspension of
fine solder particles, flux and binding agent) to be applied
to the printed-circuit board by screen printing, stencilling or
pressure-syringe dispensing before package placement.
• For packages with leads on four sides, the footprint must
be placed at a 45° angle to the transport direction of the
printed-circuit board. The footprint must incorporate
solder thieves downstream and at the side corners.
Several methods exist for reflowing; for example,
infrared/convection heating in a conveyor type oven.
Throughput times (preheating, soldering and cooling) vary
between 100 and 200 seconds depending on heating
method.
During placement and before soldering, the package must
be fixed with a droplet of adhesive. The adhesive can be
applied by screen printing, pin transfer or syringe
dispensing. The package can be soldered after the
adhesive is cured.
Typical reflow peak temperatures range from
215 to 250 °C. The top-surface temperature of the
packages should preferable be kept below 230 °C.
Typical dwell time is 4 seconds at 250 °C.
A mildly-activated flux will eliminate the need for removal
of corrosive residues in most applications.
Wave soldering
Manual soldering
Conventional single wave soldering is not recommended
for surface mount devices (SMDs) or printed-circuit boards
with a high component density, as solder bridging and
non-wetting can present major problems.
Fix the component by first soldering two
diagonally-opposite end leads. Use a low voltage (24 V or
less) soldering iron applied to the flat part of the lead.
Contact time must be limited to 10 seconds at up to
300 °C.
To overcome these problems the double-wave soldering
method was specifically developed.
When using a dedicated tool, all other leads can be
soldered in one operation within 2 to 5 seconds between
270 and 320 °C.
2001 Feb 02
19
NXP Semiconductors
Product specification
Low-cost stereo filter DAC
UDA1330ATS
Suitability of surface mount IC packages for wave and reflow soldering methods
SOLDERING METHOD
PACKAGE
WAVE
BGA, LFBGA, SQFP, TFBGA
not suitable
suitable(2)
HBCC, HLQFP, HSQFP, HSOP, HTQFP, HTSSOP, SMS
not
PLCC(3), SO, SOJ
suitable
LQFP, QFP, TQFP
SSOP, TSSOP, VSO
REFLOW(1)
suitable
suitable
suitable
not
recommended(3)(4)
suitable
not
recommended(5)
suitable
Notes
1. All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum
temperature (with respect to time) and body size of the package, there is a risk that internal or external package
cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the
Drypack information in the “Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods”.
2. These packages are not suitable for wave soldering as a solder joint between the printed-circuit board and heatsink
(at bottom version) can not be achieved, and as solder may stick to the heatsink (on top version).
3. If wave soldering is considered, then the package must be placed at a 45° angle to the solder wave direction.
The package footprint must incorporate solder thieves downstream and at the side corners.
4. Wave soldering is only suitable for LQFP, TQFP and QFP packages with a pitch (e) equal to or larger than 0.8 mm;
it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.
5. Wave soldering is only suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than 0.65 mm; it is
definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.
2001 Feb 02
20
NXP Semiconductors
Product specification
Low-cost stereo filter DAC
UDA1330ATS
DATA SHEET STATUS
DOCUMENT
STATUS(1)
PRODUCT
STATUS(2)
DEFINITION
Objective data sheet
Development
This document contains data from the objective specification for product
development.
Preliminary data sheet
Qualification
This document contains data from the preliminary specification.
Product data sheet
Production
This document contains the product specification.
Notes
1. Please consult the most recently issued document before initiating or completing a design.
2. The product status of device(s) described in this document may have changed since this document was published
and may differ in case of multiple devices. The latest product status information is available on the Internet at
URL http://www.nxp.com.
DISCLAIMERS
property or environmental damage. NXP Semiconductors
accepts no liability for inclusion and/or use of NXP
Semiconductors products in such equipment or
applications and therefore such inclusion and/or use is at
the customer’s own risk.
Limited warranty and liability ⎯ Information in this
document is believed to be accurate and reliable.
However, NXP Semiconductors does not give any
representations or warranties, expressed or implied, as to
the accuracy or completeness of such information and
shall have no liability for the consequences of use of such
information.
Applications ⎯ Applications that are described herein for
any of these products are for illustrative purposes only.
NXP Semiconductors makes no representation or
warranty that such applications will be suitable for the
specified use without further testing or modification.
In no event shall NXP Semiconductors be liable for any
indirect, incidental, punitive, special or consequential
damages (including - without limitation - lost profits, lost
savings, business interruption, costs related to the
removal or replacement of any products or rework
charges) whether or not such damages are based on tort
(including negligence), warranty, breach of contract or any
other legal theory.
Customers are responsible for the design and operation of
their applications and products using NXP
Semiconductors products, and NXP Semiconductors
accepts no liability for any assistance with applications or
customer product design. It is customer’s sole
responsibility to determine whether the NXP
Semiconductors product is suitable and fit for the
customer’s applications and products planned, as well as
for the planned application and use of customer’s third
party customer(s). Customers should provide appropriate
design and operating safeguards to minimize the risks
associated with their applications and products.
Notwithstanding any damages that customer might incur
for any reason whatsoever, NXP Semiconductors’
aggregate and cumulative liability towards customer for
the products described herein shall be limited in
accordance with the Terms and conditions of commercial
sale of NXP Semiconductors.
NXP Semiconductors does not accept any liability related
to any default, damage, costs or problem which is based
on any weakness or default in the customer’s applications
or products, or the application or use by customer’s third
party customer(s). Customer is responsible for doing all
necessary testing for the customer’s applications and
products using NXP Semiconductors products in order to
avoid a default of the applications and the products or of
the application or use by customer’s third party
customer(s). NXP does not accept any liability in this
respect.
Right to make changes ⎯ NXP Semiconductors
reserves the right to make changes to information
published in this document, including without limitation
specifications and product descriptions, at any time and
without notice. This document supersedes and replaces all
information supplied prior to the publication hereof.
Suitability for use ⎯ NXP Semiconductors products are
not designed, authorized or warranted to be suitable for
use in life support, life-critical or safety-critical systems or
equipment, nor in applications where failure or malfunction
of an NXP Semiconductors product can reasonably be
expected to result in personal injury, death or severe
2001 Feb 02
21
NXP Semiconductors
Product specification
Low-cost stereo filter DAC
UDA1330ATS
Limiting values ⎯ Stress above one or more limiting
values (as defined in the Absolute Maximum Ratings
System of IEC 60134) will cause permanent damage to
the device. Limiting values are stress ratings only and
(proper) operation of the device at these or any other
conditions above those given in the Recommended
operating conditions section (if present) or the
Characteristics sections of this document is not warranted.
Constant or repeated exposure to limiting values will
permanently and irreversibly affect the quality and
reliability of the device.
Quick reference data ⎯ The Quick reference data is an
extract of the product data given in the Limiting values and
Characteristics sections of this document, and as such is
not complete, exhaustive or legally binding.
Non-automotive qualified products ⎯ Unless this data
sheet expressly states that this specific NXP
Semiconductors product is automotive qualified, the
product is not suitable for automotive use. It is neither
qualified nor tested in accordance with automotive testing
or application requirements. NXP Semiconductors accepts
no liability for inclusion and/or use of non-automotive
qualified products in automotive equipment or
applications.
Terms and conditions of commercial sale ⎯ NXP
Semiconductors products are sold subject to the general
terms and conditions of commercial sale, as published at
http://www.nxp.com/profile/terms, unless otherwise
agreed in a valid written individual agreement. In case an
individual agreement is concluded only the terms and
conditions of the respective agreement shall apply. NXP
Semiconductors hereby expressly objects to applying the
customer’s general terms and conditions with regard to the
purchase of NXP Semiconductors products by customer.
In the event that customer uses the product for design-in
and use in automotive applications to automotive
specifications and standards, customer (a) shall use the
product without NXP Semiconductors’ warranty of the
product for such automotive applications, use and
specifications, and (b) whenever customer uses the
product for automotive applications beyond NXP
Semiconductors’ specifications such use shall be solely at
customer’s own risk, and (c) customer fully indemnifies
NXP Semiconductors for any liability, damages or failed
product claims resulting from customer design and use of
the product for automotive applications beyond NXP
Semiconductors’ standard warranty and NXP
Semiconductors’ product specifications.
No offer to sell or license ⎯ Nothing in this document
may be interpreted or construed as an offer to sell products
that is open for acceptance or the grant, conveyance or
implication of any license under any copyrights, patents or
other industrial or intellectual property rights.
Export control ⎯ This document as well as the item(s)
described herein may be subject to export control
regulations. Export might require a prior authorization from
national authorities.
2001 Feb 02
22
NXP Semiconductors
provides High Performance Mixed Signal and Standard Product
solutions that leverage its leading RF, Analog, Power Management,
Interface, Security and Digital Processing expertise
Customer notification
This data sheet was changed to reflect the new company name NXP Semiconductors, including new legal
definitions and disclaimers. No changes were made to the technical content, except for package outline
drawings which were updated to the latest version.
Contact information
For additional information please visit: http://www.nxp.com
For sales offices addresses send e-mail to: [email protected]
© NXP B.V. 2010
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner.
The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed
without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license
under patent- or other industrial or intellectual property rights.
Printed in The Netherlands
753503/05/pp23
Date of release: 2001 Feb 02
Document order number:
9397 750 07939