UM10499 230 V and 120 V reference design using

UM10499
230 V and 120 V reference design using UBA20260
Rev. 1 — 30 September 2011
User manual
Document information
Info
Content
Keywords
UBA20260, step-dimmable, half-bridge CFL driver
Abstract
This document describes the correct use of the UBA20260 step-dimmable
half-bridge Compact Fluorescent Lamp (CFL) driver for 230 V and 120 V
demo boards.
UM10499
NXP Semiconductors
230 V and 120 V reference design using UBA20260
Revision history
Rev
Date
Description
v.1
20110930
first issue
UM10499
User manual
All information provided in this document is subject to legal disclaimers.
Rev. 1 — 30 September 2011
© NXP B.V. 2011. All rights reserved.
2 of 25
UM10499
NXP Semiconductors
230 V and 120 V reference design using UBA20260
1. Introduction
WARNING
Lethal voltage and fire ignition hazard
The non-insulated high voltages that are present when operating this product, constitute a
risk of electric shock, personal injury, death and/or ignition of fire.
This product is intended for evaluation purposes only. It shall be operated in a designated test
area by personnel qualified according to local requirements and labor laws to work with
non-insulated mains voltages and high-voltage circuits. This product shall never be operated
unattended.
1.1 Scope of this document
In this document, a description is given of the UBA20260 demo boards for 230 V and
120 V mains voltages using the UBA20260 power IC. A description is provided, supported
by a set of measurements to show the demo boards characteristics.
The UBA20260 circuit is a half-bridge driver IC setup to drive a typical 23 W burner with a
lamp current of about 240 mA. Similar lamp types with a nominal lamp power of 20 W can
also be driven. The total power drawn from the mains is about 23 W at a nominal mains
voltage of 230 V or 120 V (RMS). The UBA20260 board can easily be configured to drive
different Compact Fluorescent Lamps (CFL) of different power ratings. Driving different
CFL is possible by changing the inductor tap and installing a different lamp capacitor.
The UBA20260 demo board is not recommended for driving lower voltage linear lighting
lamps like the T5 or the T8. For these types of lamps the UBA2014, UBA2021 or
UBA2016 are the best options.
The IC is able to drive lamps up to 23 W provided the maximum junction temperature of
the IC is not exceeded. There are no THD-requirements for mains powers lower than
25 W so that a pre-conditioner function is obsolete.
Remark: Unless otherwise stated all voltages are AC.
The circuit is set up to perform a preheat so the lamp switches on approximately 1 s after
the mains voltage is applied to the board. Lamp current boost value is approximately 1.5.
For detailed design steps, on the 18 W lamp solution or how to setup lamps with other
power ratings see Ref. 2.
The mains voltage operating range is either set for 90 V to 130 V or 200 V to 250 V (RMS)
depending on the board ordered.
The ICs are intended as cost-effective step-dimmable solutions to drive CFL with an
integrated ballast (CFLi). Therefore, the ICs are equipped with a thermal, coil saturation,
over-power and OverCurrent Protection (OCP) and a lamp strike failure time-out.
Remark: If the UBA20260 is used in a non-integrated ballast or a Matchbox type of
ballast, an external lamp detection circuit is required. In addition, the standard circuit must
include extra End Of Life (EOL) protection. Additional circuits can be set up to trigger the
external power-down on the CP pin.
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User manual
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Rev. 1 — 30 September 2011
© NXP B.V. 2011. All rights reserved.
3 of 25
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Small signal part
separate PCB
R20
C170 C171
R11
CPS
C16
D15
C15
D3
DCI(1)
C8
C10
R19
Q1
R17
R4
R31
C6
C9
2
16
C30
6
Q2
X3
4
1
5
D2
X4
R8
C24
Optional PID control
R37
C201
R12
C20
C19
R18
R38
R27
BAW56
C200
R13
R9
CSI
n.c.
9
6
7
8
U1
1
2
3
4
5
6
7
8
9
10
2
3
4
5
R1
C1
C2
CI
1
J1
CF
R35
1
2
3
4
5
6
7
8
9
10
C21
7022-001-13671 PART-B
J2
2
10
UBA20260
X2
K3
11
1
7
C31
12
R2
C3
R3
D14
R36
C23
R15
VDD
C27
C28
C29
CPS
R28
R10
C14
R29
R14
D1
1
TP1
DIM
1
TP2
GND
1
TP3
VDD
R24
D13
1
TP4
CPS
TP5
CPS/EOL
1
TP6 1
EOL
R22
D12
4 of 25
© NXP B.V. 2011. All rights reserved.
R23
C25
C26
R25
Optional EOL circuit
(1) To combine the PCB layout with the UBA20270 reference board, pin 10 is connected but not used.
Fig 1.
Circuit diagram UBA20260 demo board
aaa-000229
UM10499
Q3
230 V and 120 V reference design using UBA20260
Rev. 1 — 30 September 2011
All information provided in this document is subject to legal disclaimers.
1
lamp
connector
13
10
X1
R34
14
RREF
2
HEDADER 10
K2
15
C5
CP
VDD
R33
R39
CB
3
D6
SGND
T1
HBO
D4
C7
R32
GLS
R30
VDD
C12
FS
RV1
PGND
C11
MDL
2 W fused
resistor
GHS
1
R5
C17
SLS
2
R6
R16
L1
R7
K1
D5
D8
NXP Semiconductors
D9
2. Schematic diagrams
UM10499
User manual
Large signal part
D7
UM10499
NXP Semiconductors
230 V and 120 V reference design using UBA20260
3. Safety warning
Connect the board to the mains voltage. Do not touch the board while it is connected to
the mains voltage. An isolated housing is obligatory when used in uncontrolled,
non-laboratory environments. Galvanic isolation of the mains phase using a variable
transformer is always recommended.
019aab174
019aab173
a. Isolated
Fig 2.
b. Not isolated
Variable transformer isolation symbols
4. Specification
aaa-000320
Fig 3.
UM10499
User manual
UBA20260 (120 V) demo board
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Rev. 1 — 30 September 2011
© NXP B.V. 2011. All rights reserved.
5 of 25
UM10499
NXP Semiconductors
230 V and 120 V reference design using UBA20260
aaa-000321
Fig 4.
UBA20260 (230 V) demo board
The UBA20260 demo board is set up to drive a typical 23 W burner. The specification for
each type is as follows:
230 V:
•
•
•
•
•
•
•
Input voltage range: 230 V; 15 %; 50 Hz
Input power: 23 W at 230 V
Input current: 179 mA/228 mA (boost)
Power factor: > 0.55
Running frequency 45 kHz; start frequency 111 kHz
Preheat: 0.7 s
1.5  lamp current boost, set for 50 s
120 V:
•
•
•
•
•
•
•
UM10499
User manual
Input voltage range: 120 V; 15 %; 60 Hz
Input power: 23 W at 120 V
Input current: 328 mA/435 mA (boost)
Power factor: > 0.55
Running frequency 45 kHz; start frequency 111 kHz
Preheat: 0.7 s
1.5  lamp current boost, set for 50 s
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6 of 25
UM10499
NXP Semiconductors
230 V and 120 V reference design using UBA20260
Protective functions:
• Coil saturation set at and
– 230 V: set to 2.3 A
– 120 V: set to 2.8 A
• OverCurrent Protection (OCP):
– 230 V: set to 2.3 A
– 120 V: set to 2.8 A
• Capacitive Mode Protection (CMP)
• OverTemperature Protection (OTP)
• OverPower Protection (OPP)
Burners:
• 230 V: typical burner with a lamp voltage of 95 V (±10 %) and a lamp current of
160 mA (±10 %). Conditions set by resistors R31 and R32
• 120 V: typical burner with a lamp voltage of 110 V (±10 %) and a lamp current of
160 mA (±10 %). Conditions set by resistors R30 and R33
4.1 Board connections
The connection of the lamp and mains supply is shown in Figure 5.
lamp
120 V or 230 V
aaa-000725
Fig 5.
Connecting the lamp and mains supply
4.2 External 6-pin controller connector
The demo board is equipped with an external control connector intended to control the
UBA20260 by a microcontroller or other external control logic. See Figure 6. To be able to
control the dimmer input TP1 properly, remove the SMD resistor R8. The connector
carries 4 signals, two of which are supply lines, the dimmer input and the short CP pin
signal (CPS).
4.2.1 TP4 the CSP/UBA_ON pin
Tp4 the CSP/UBA_ON is a pin that offers multiple functions. For the 120 V version this pin
is used to provide a differential gain path to the UBA20260. It cannot be used as an input
or output.
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User manual
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Rev. 1 — 30 September 2011
© NXP B.V. 2011. All rights reserved.
7 of 25
UM10499
NXP Semiconductors
230 V and 120 V reference design using UBA20260
This pin can be used as an external shutdown function when the UBA20260 is in the burn
state. To set up for external shutdown, remove the differential gain function, R38, R36 and
C29 and install R29.
The CPS pin can be directly short-circuited to ground (TP2 GND) or via an open collector
output of a microcontroller. Short circuiting the CP pin to ground sets the UBA20260 in
Power-down mode. This state continues as long as the IC is supplied via its VDD pin,
consumption is less than 220 A. The current from the CPS pin is < 50 mA. To end
power-down, power cycle the board or short the TP3 (VDD) pin to ground. The current
from this pin is < 500 A when continuously shorted to ground (TP2). When the VDD pin is
shorted to ground, the 470 nF VDD capacitor is discharged. To prevent large discharge
currents, install a 1 k resistor in series with the capacitor.
The VDD pin (TP3) has only a limited supply capability for external logic. Do not load this
pin by more than 2 mA.
6-pin controller
connector
aaa-000322
Fig 6.
External control 6-pin controller connector
4.2.2 TP5 and TP6 End of life
TP5 CPS_EOL is the out put of the external EOL circuit on the demo board. Connect this
pin to TP4 CSP/UBA_ON to use the external EOL. Setup TP for external shutdown for this
application. See Section 4.2.1.
TP6 is the input of the external EOL circuit. Use the auto transformer winding on T1 in
order to use the external EOL. Therefore, remove R30 to R33 and install R39. In addition,
hardwire TP6 to T1 pin 2 and hardwire T1 pin 3 to ground.
UM10499
User manual
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Rev. 1 — 30 September 2011
© NXP B.V. 2011. All rights reserved.
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UM10499
NXP Semiconductors
230 V and 120 V reference design using UBA20260
aaa-000323
Fig 7.
CFL controller board
4.3 Using the auto transformer
The inductor supplied with this board accommodates an auto transformer winding. The
auto transformer winding lowers or raises the working voltage across the resonant tank
capacitor. In addition, it increases the overall efficiency by up to 30 %. Adjust the
auto transformer to the lamp voltage to the lamp type connected to the board for correct
operation. See Ref. 2.
Table 1 shows how to set the auto transformer. The lamp voltage is the nominal lamp
voltage at the rated lamp power when the lamp is not dimmed. The auto transformer is set
up as follows for most of the lamps:
Table 1.
Resistor programming
Lamp voltage
Description
Placement Placement Placement
R39
R30+R33
R31+R32
Vlamp < 95 V
Raise voltage across Cres. The
voltage source charge pump
energy transfer to buffer capacitor
is increased
95 V < Vlamp < 110 V
No auto transformer. Select upon 
lamp voltage during deep dimming
performance
Vlamp > 110 V
Lower voltage across Cres. The
voltage source charge pump
energy transfer to buffer capacitor
is decreased


If the lamp voltage is between 95 V and 110 V, the use of an auto transformer is not
necessary. However, set-up and use the auto transformer in the following situations:
• where the lamp voltage is too high at low dimming levels
• when the bus voltage exceeds the buffer capacitor voltage rating
UM10499
User manual
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Rev. 1 — 30 September 2011
© NXP B.V. 2011. All rights reserved.
9 of 25
UM10499
NXP Semiconductors
230 V and 120 V reference design using UBA20260
Remark: Only short-circuit the resistors indicated; otherwise the inductor winding is
shorted.
1 2
3 4
5
aaa-000305
(1) R39
(2) R32
(3) R33
(4) R31
(5) R30
Fig 8.
UM10499
User manual
Auto transformer set-up resistors
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10 of 25
UM10499
NXP Semiconductors
230 V and 120 V reference design using UBA20260
4.4 Bill Of Materials (BOM)
Table 2 provides detailed component information for the common parts for the UBA20260
230 V and 120 V demo boards.
Table 2.
Common BOM for the UBA20260 230 V and 120 V demo boards
Reference
Description and component
Package
Manufacturer
C1
470 nF; 10 %; 25 V X7R
-
KEMET
C2
100 pF; 5 %; 50 V C0G-NP0
-
Yageo
C3
220 nF; 10 %; 25 V X7R
-
KEMET
C5
1.5 nF; 10 %; 50 V X7R
-
Yageo
C6
330 nF; 10 %; 25 V X7R
-
KEMET
C7
150 nF; 10 %; 25 V X7R
-
AVX
C9
100 nF; 10 %; 50 V X7R
-
Yageo
C10
470 nF; 10 %; 25 V X7R
-
KEMET
C17
3.3 nF; 10 %; 1 KV MKP
-
Cornell Dubilier
C19
22 nF; 5 %; 400 V
-
Panasonic
C20
4.7 nF; 10 %; 1 KV MKP
-
EPCOS
C21
560 pF; 10 %; 1 KV Y5R
-
Vishay BC Components
C23
1 F; 10 %; 16 V X7R
-
Yageo
C24
100 pF; 10 %; 1 KV
-
Murata
C25
100 nF; 10 %; 50 V X7R
-
Yageo
C26
220 nF; 10 %; 16 V X7R
Murata
C27
100 nF; 10 %; 50 V X7R
-
Yageo
C28
100 nF; 10 %; 50 V X7R
-
Yageo
C29
150 nF; 10 %; 50 V X7R
-
KEMET
C30
68 nF; 5 %; 250 V
-
Panasonic
C31
68 nF; 5 %; 250 V
-
Panasonic
D1
Zener diode; 12 V; 500 mW; BZX84J-C12
SOD323
NXP Semiconductors
D2
diode; dual
SOT-323
Multicomp
D3
diodes general-purpose rectifier; 1N4007
-
Fairchild Semiconductors
D4
diodes general-purpose rectifier; 1N4007
-
Fairchild Semiconductors
D5
diodes general-purpose rectifier; 1N4007
-
Fairchild Semiconductors
D6
diodes general-purpose rectifier; 1N4007
-
Fairchild Semiconductors
D7
fast recovery diode; 1 A; 600 V; 1N4937
-
Fairchild Semiconductors
D8
general purpose; switching diodes; 200 V; 200 mA
-
NXP Semiconductors
D9
fast recovery diode; 1 A; 600 V; 1N4937
-
Fairchild Semiconductors
D12
general purpose; switching diodes; 200 V; 200 mA
-
NXP Semiconductors
D13
Zener diode; 12 V; 500 mW; BZX84J-C12
SOD323
NXP Semiconductors
D14
dual-diode; common anode
SOT-323
NXP Semiconductors
D15
not mounted
-
-
J1
pin header; right-angled; 10-pole; 2.54 mm
-
TE Connectivity Electronics or AMP
J2
7022-001-13671 PART-B
-
-
K1
terminal block; 2-pole; 5.08 mm
-
Phoenix contact
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User manual
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UM10499
NXP Semiconductors
230 V and 120 V reference design using UBA20260
Table 2.
Common BOM for the UBA20260 230 V and 120 V demo boards …continued
Reference
Description and component
Package
Manufacturer
K2
terminal block; 2-pole; 5.08 mm
-
Phoenix contact
K3
terminal block; 2-pole; 5.08 mm
-
Phoenix contact
Q3
BC847CW; NPN; 45 V; 100 mA
SOT-323
NXP Semiconductors
R1
33 k; 0.1 W; 1 %; RC22H
-
Yageo
R2
1.2 k; 0.1 W; 1 %; RC22H
-
Yageo
R3
150 ; 0.1 W; 1 %; RC22H
-
Yageo
R4
100 ; 0.1 W; 1 %; RC22H
-
Yageo
R11
not mounted
-
-
R12
not mounted
-
-
R13
not mounted
-
-
R15
not mounted
-
-
R20
not mounted
-
-
R22
not mounted
-
-
R23
100 k; 0.063 W; 1 %; RC02H
-
Yageo
R24
390 k; 0.1 W; 1 %; RC02H
-
Yageo
Yageo
R25
1 M; 0.1 W; 1 %; RC02H
-
R34
not mounted
-
R35
not mounted
-
R37
22 k; 0.1 W; 1 %; RC22H
-
Yageo
Vishay Draloric
R38
330E; 0.1 W; 1 %; CRCW
-
R39
not mounted
-
X1
terminal; black; PK100 for A1
-
Vero
X2
terminal; black; PK100 for A2
-
Vero
X3
terminal; black; PK100 for B1
-
Vero
X4
terminal; black; PK100 for B2
-
Vero
UM10499
User manual
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Rev. 1 — 30 September 2011
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12 of 25
UM10499
NXP Semiconductors
230 V and 120 V reference design using UBA20260
Table 3 provides detailed component information for specific parts of the UBA20260 230 V
demo board.
Table 3.
Delta list of BOM for the UBA20260 (230 V) demo board
Reference Description and component
Package
Manufacturer
C8
-
-
not mounted
C11
47 nF; 5 %; 630 V
-
Panasonic
C12
22 nF; 5 %; 630 V
-
Panasonic
C14
not mounted
-
-
C15
10 µF; 20 %; 400 V; 12000 HRS
-
Rubycon
C16
22 nF; 5 %; 400 V
-
Panasonic
C171
560 pF; 5 %; 1 KV
-
WIMA
L1
Choke; 4700 µH; 0.26 A; 10 %
-
Panasonic
Q1
MOSFET Power; N-Channel QFET; 400 V
-
Fairchild Semiconductors
Q2
MOSFET Power; N-Channel QFET; 400 V
-
Fairchild Semiconductors
R5
not mounted
-
-
R6
not mounted
-
-
R7
4.7 ; 2 W; 10 % EMC
-
Welwyn Components
R8
220 k; 0.250 W; 1 %; RC02H
-
Yageo
R9
220 k; 0.250 W; 1 %; RC02H
-
Yageo
R10
not mounted
-
-
R14
12.4E; 0.250 W; 1 %; CRCW
-
Vishay Dale
R16
not mounted
-
-
R17
not mounted
-
-
R18
2.2E; 0.250 W; 1 %; RC02H
-
Yageo
R19
not mounted
-
-
R27
2.2E; 0.250 W; 1 %; RC02H
-
Yageo
R28
2.2 k; 0.1 W; 1 %; RC02H
-
Yageo
R29
12.4E; 0.250 W; 1 %; CRCW
-
Vishay Dale
R30
0; 0.063 W; RC02H
-
Yageo
R31
not mounted
-
-
R32
not mounted
-
-
R33
0 ; 0.063 W; RC02H
-
Yageo
R36
not mounted
-
-
RV1
VDR; 275 V; 12 J
-
Vishay BC Components
T1
driver transformer; 2.0 mH
-
Xicon
U1
CFL driver; UBA20260
SO16
NXP Semiconductors
UM10499
User manual
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Rev. 1 — 30 September 2011
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UM10499
NXP Semiconductors
230 V and 120 V reference design using UBA20260
Table 4 provides detailed component information for specific parts of the UBA20260 120 V
demo board.
Table 4.
Delta list of BOM for the UBA20260 (120 V) demo board
Reference Description and component
Package
Manufacturer
C8
not mounted
-
-
C11
47 nF; 5 %; 400 V
-
Panasonic
C12
22 nF; 5 %; 400 V
-
Panasonic
C14
not mounted
-
-
C15
22 µF; 20 %; 250 V; AI. EI
-
Rubycon
C16
22 nF; 5 %; 400 V
-
Panasonic
C171
560 pF; 5 %; 1 KV
-
WIMA
L1
Choke; 4700 µH; 0.26 A; 10 %
-
Panasonic
Q1
MOSFET Power; N-Channel QFET; 400 V
-
Fairchild Semiconductors
Q2
MOSFET Power; N-Channel QFET; 400 V
-
Fairchild Semiconductors
R5
not mounted
-
-
R6
not mounted
-
-
R7
4.7 ; 10 %; 2 W EMC
-
Welwyn Components
R8
100 k; 0.250 W; 1 %; WCR
-
Yageo
R9
100 k; 0.250 W; 1 %; WCR
-
Yageo
R10
not mounted
-
-
R14
12.4E; 0.250 W; 1 %; CRCW
-
Vishay Dale
R16
not mounted
-
-
R17
not mounted
-
-
R18
1.8E; 0.330 W; 1 %; ERJ8
-
Yageo
R19
not mounted
-
-
R27
1.8E; 0.330 W; 1 %; ERJ8
-
Panasonic
R28
560 ; 0.1 W; 1 %; RC02H
-
Yageo
R29
12.4E; 0.250 W; 1 %; CRCW
-
Vishay Dale
R30
not mounted
-
-
R31
0 ; 0.063 W; RC02H
-
Yageo
R32
0 ; 0.063 W; RC02H
-
Yageo
R33
not mounted
-
-
R36
330E; 0.1 W; 1 %; CRCW
-
Vishay Draloric
RV1
VDR; 150 V; 20 J
-
Vishay BC Components
T1
driver transformer; 1.0 mH
-
Xicon
U1
CFL driver; UBA20260
SO16
NXP Semiconductors
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User manual
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230 V and 120 V reference design using UBA20260
5. SO16 package thermal considerations
The UBA20260 in the SO16 package is mounted on a separate board perpendicular onto
the main signal PCB. The reason for this is that the IC is not directly subjected to the
thermal radiated heat of the lamp. In this way, distance is created between lamp filaments
and the IC. The horizontal signal PCB acts as a heat shield for thermal radiated heat.
The PCB is mounted horizontally into a lamp base for most applications. However, the
UBA20260 is an SMD component and means the IC is very close to the lamp filaments.
The lamp filaments would directly radiate heat onto the IC and limit the IC drive
capabilities. Therefore, it is recommended to either mount some form of heat shield
between the lamp filaments and the PCB. Alternatively, mount the PCB vertically into the
lamp socket to increases the distance between the IC and lamp filaments.
aaa-000726
Fig 9.
UM10499
User manual
FCC Part 18 conducted EMI measured in live wire
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UM10499
NXP Semiconductors
230 V and 120 V reference design using UBA20260
aaa-000727
Fig 10. FCC Part 18 conducted EMI measured in neutral wire
aaa-000728
Fig 11. EN55015 conducted EMI measured in live wire
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230 V and 120 V reference design using UBA20260
aaa-000724
Fig 12. EN55015 conducted EMI measured in neutral wire
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230 V and 120 V reference design using UBA20260
6. PCB layout
aaa-000230
Fig 13. PCB (top layer)
aaa-000231
Fig 14. PCB (bottom layer)
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230 V and 120 V reference design using UBA20260
7. Inductor specification
3.0-4.0
dot locates term. #1
23.12
10
1
9
2
3
7
4
6
5
14.75 max
22.25 max
term numbers
for reference only
760800031
part must insert fully to
surface A in recommended
grid 0.71 sq
lot code and date code
1.40
2
10.16
3
6
1
3.81
7
4
10
5
dimensions in mm
recommended
p.c. pattern, component side
aaa-000232
Fig 15. Transformer (1 mH)
Transformer electrical specifications, centered at 25 C, are as follows:
DC resistance (at 20 C):
•
•
•
•
1 to 10, 1.7 10 %
2 to 3, 0.8 , 10 %
4 to 5, 0.175 , 10 %
6 to 7, 0.19 , 10 %
Dielectric rating:
• 1 kV (AC), 1 minute tested by applying 1.25 kV (AC) for 1 s between pins 1 to 2
(3 + 6, 4 + 7)
Inductance:
•
•
•
•
UM10499
User manual
1.0 mH 10 %, 10 kHz, 100 mV (AC), 0 mA (DC), 1 to 10, Ls
2.5 H 15 %, 10 kHz, 100 mV (AC), 0 mA (DC), 6 to 7, Ls
2.4 H 15 %, 10 kHz, 100 mV (AC), 0 mA (DC), 4 to 5, Ls
44.0 H 15 %, 10 kHz, 100 mV (AC), 0 mA (DC), 2 to 3, Ls
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Saturation current:
• 2.2 A saturation current causing 20 % roll off from initial inductance.
Turns ratio:
• (1 to 10):(6 to 7), (25.93):(1), 2 %
• (1 to 10):(4 to 5), (25.93):(1), 2 %
• (1 to 10):(2 to 3), (7.25):(1), 2 %
Operating temperature range:
• 40 C to 125 C including temperature rise.
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230 V and 120 V reference design using UBA20260
3.0-4.0
dot locates term. #1
23.12
10
1
9
2
8
3
7
4
6
5
14.61 max
7608000902
part must insert fully to
surface A in recommended
grid 0.71 sq
22.25 max
term numbers
for reference only
lot code and date code
2
1.40
3
6
1
10.16
7
4
10
3.81
5
8
9
dimensions in mm
recommended
p.c. pattern, component side
aaa-000233
Fig 16. Transformer (2 mH)
Transformer electrical specifications centered at 25 C is as follows:
DC resistance (at 20 C):
•
•
•
•
•
1 to 10, 4.5 10 %
2 to 3, 0.75 , 10 %
4 to 5, 0.180 , 10 %
6 to 7, 0.175 , 10 %
8 to 9, 0.42 , 10 %
Dielectric rating:
• 1 kV (AC), 1 minute tested by applying 1.25 kV (AC) for 1 s between pins 1 to 2
(3 + 4, 5 + 6, 7 + 8)
Inductance:
• 2.0 mH 10 %, 10 kHz, 100 mV (AC), 0 mA (DC), 1 to 10, Ls
Saturation current:
• 1.55 A saturation current causing 20 % roll off from initial inductance.
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230 V and 120 V reference design using UBA20260
Turns ratio:
•
•
•
•
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User manual
(1 to 10):(2 to 3), (9.74):(1), 1 %
(1 to 10):(6 to 7), (34.78):(1), 1 %
(1 to 10):(4 to 5), (34.78):(1), 1 %
(1 to 10):(8 to 9), (15.21):(1), 1 %
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8. Abbreviations
Table 5.
Abbreviations
Acronym
Description
CFL
Compact Fluorescent Lamp
CFLi
Compact Fluorescent Lamps with an integrated ballast
CMP
Capacitive Mode Protection
EMC
ElectroMagnetic Compatibility
EMI
ElectroMagnetic Interference
EOL
End Of Life
ESD
ElectroStatic Discharge
MOSFET
Metal-Oxide Semiconductor Field-Effect Transistor
OCP
OverCurrent Protection
OPP
OverPower Protection
PCB
Printed-Circuit Board
RMS
Root Mean Square
9. References
UM10499
User manual
[1]
UBA20260 — Data sheet: 600 V driver IC for step-dimmable compact fluorescent
lamps
[2]
AN10962 — Application note: Step-dimmable CFL using the UBA2026X
[3]
AN10803 — Application note: Triac dimmable CFL application using the
UBA2028/UBA2014/UBA2027
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10. Legal information
10.1 Definitions
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liability for the consequences of
use of such information.
10.2 Disclaimers
Limited warranty and liability — Information in this document is believed to
be accurate and reliable. However, NXP Semiconductors does not give any
representations or warranties, expressed or implied, as to the accuracy or
completeness of such information and shall have no liability for the
consequences of use of such information.
In no event shall NXP Semiconductors be liable for any indirect, incidental,
punitive, special or consequential damages (including - without limitation - lost
profits, lost savings, business interruption, costs related to the removal or
replacement of any products or rework charges) whether or not such
damages are based on tort (including negligence), warranty, breach of
contract or any other legal theory.
Notwithstanding any damages that customer might incur for any reason
whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards
customer for the products described herein shall be limited in accordance
with the Terms and conditions of commercial sale of NXP Semiconductors.
Right to make changes — NXP Semiconductors reserves the right to make
changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
Suitability for use — NXP Semiconductors products are not designed,
authorized or warranted to be suitable for use in life support, life-critical or
safety-critical systems or equipment, nor in applications where failure or
malfunction of an NXP Semiconductors product can reasonably be expected
to result in personal injury, death or severe property or environmental
damage. NXP Semiconductors accepts no liability for inclusion and/or use of
NXP Semiconductors products in such equipment or applications and
therefore such inclusion and/or use is at the customer’s own risk.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty that such applications will be suitable for the
specified use without further testing or modification.
Customers are responsible for the design and operation of their applications
and products using NXP Semiconductors products, and NXP Semiconductors
accepts no liability for any assistance with applications or customer product
design. It is customer’s sole responsibility to determine whether the NXP
Semiconductors product is suitable and fit for the customer’s applications and
products planned, as well as for the planned application and use of
customer’s third party customer(s). Customers should provide appropriate
design and operating safeguards to minimize the risks associated with their
applications and products.
UM10499
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NXP Semiconductors does not accept any liability related to any default,
damage, costs or problem which is based on any weakness or default in the
customer’s applications or products, or the application or use by customer’s
third party customer(s). Customer is responsible for doing all necessary
testing for the customer’s applications and products using NXP
Semiconductors products in order to avoid a default of the applications and
the products or of the application or use by customer’s third party
customer(s). NXP does not accept any liability in this respect.
Safety of high-voltage evaluation products — The non-insulated high
voltages that are present when operating this product, constitute a risk of
electric shock, personal injury, death and/or ignition of fire. This product is
intended for evaluation purposes only. It shall be operated in a designated
test area by personnel that is qualified according to local requirements and
labor laws to work with non-insulated mains voltages and high-voltage
circuits.
The product does not comply with IEC 60950 based national or regional
safety standards. NXP Semiconductors does not accept any liability for
damages incurred due to inappropriate use of this product or related to
non-insulated high voltages. Any use of this product is at customer’s own risk
and liability. The customer shall fully indemnify and hold harmless NXP
Semiconductors from any liability, damages and claims resulting from the use
of the product.
Export control — This document as well as the item(s) described herein
may be subject to export control regulations. Export might require a prior
authorization from competent authorities.
Evaluation products — This product is provided on an “as is” and “with all
faults” basis for evaluation purposes only. NXP Semiconductors, its affiliates
and their suppliers expressly disclaim all warranties, whether express, implied
or statutory, including but not limited to the implied warranties of
non-infringement, merchantability and fitness for a particular purpose. The
entire risk as to the quality, or arising out of the use or performance, of this
product remains with customer.
In no event shall NXP Semiconductors, its affiliates or their suppliers be liable
to customer for any special, indirect, consequential, punitive or incidental
damages (including without limitation damages for loss of business, business
interruption, loss of use, loss of data or information, and the like) arising out
the use of or inability to use the product, whether or not based on tort
(including negligence), strict liability, breach of contract, breach of warranty or
any other theory, even if advised of the possibility of such damages.
Notwithstanding any damages that customer might incur for any reason
whatsoever (including without limitation, all damages referenced above and
all direct or general damages), the entire liability of NXP Semiconductors, its
affiliates and their suppliers and customer’s exclusive remedy for all of the
foregoing shall be limited to actual damages incurred by customer based on
reasonable reliance up to the greater of the amount actually paid by customer
for the product or five dollars (US$5.00). The foregoing limitations, exclusions
and disclaimers shall apply to the maximum extent permitted by applicable
law, even if any remedy fails of its essential purpose.
10.3 Trademarks
Notice: All referenced brands, product names, service names and trademarks
are the property of their respective owners.
All information provided in this document is subject to legal disclaimers.
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11. Contents
1
1.1
2
3
4
4.1
4.2
4.2.1
4.2.2
4.3
4.4
5
6
7
8
9
10
10.1
10.2
10.3
11
Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
Scope of this document . . . . . . . . . . . . . . . . . . 3
Schematic diagrams . . . . . . . . . . . . . . . . . . . . . 4
Safety warning . . . . . . . . . . . . . . . . . . . . . . . . . . 5
Specification. . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
Board connections . . . . . . . . . . . . . . . . . . . . . . 7
External 6-pin controller connector . . . . . . . . . . 7
TP4 the CSP/UBA_ON pin . . . . . . . . . . . . . . . . 7
TP5 and TP6 End of life . . . . . . . . . . . . . . . . . . 8
Using the auto transformer . . . . . . . . . . . . . . . . 9
Bill Of Materials (BOM) . . . . . . . . . . . . . . . . . . 11
SO16 package thermal considerations . . . . . 15
PCB layout . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
Inductor specification . . . . . . . . . . . . . . . . . . . 19
Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . . 23
References . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
Legal information. . . . . . . . . . . . . . . . . . . . . . . 24
Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24
Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 24
Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 24
Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
© NXP B.V. 2011.
All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: [email protected]
Date of release: 30 September 2011
Document identifier: UM10499