PCA9671 - NXP Semiconductors

PCA9671
Remote 16-bit I/O expander for Fm+ I2C-bus with reset
Rev. 3 — 29 September 2011
Product data sheet
1. General description
The PCA9671 provides general purpose remote I/O expansion for most microcontroller
families via the two-line bidirectional bus (I2C-bus) and is a part of the Fast-mode Plus
(Fm+) family.
The PCA9671 is a drop in upgrade for the PCF8575 providing higher I2C-bus speeds
(1 MHz versus 400 kHz) so that the output can support PWM dimming of LEDs, higher
I2C-bus drive (30 mA versus 3 mA) so that many more devices can be on the bus without
the need for bus buffers, higher total package sink capacity (400 mA versus 100 mA) that
supports having all 25 mA LEDs on at the same time and more device addresses
(64 versus 8) to allow many more devices on the bus without address conflicts.
The difference between the PCA9671 and the PCF8575 is that the interrupt output on the
PCF8575 is replaced by a RESET input on the PCA9671.
The device consists of a 16-bit quasi-bidirectional port and an I2C-bus interface. The
PCA9671 has a low current consumption and includes latched outputs with 25 mA high
current drive capability for directly driving LEDs. The internal Power-On Reset (POR),
hardware reset pin (RESET) or software reset sequence initializes the I/Os as inputs.
2. Features and benefits













1 MHz I2C-bus interface
Compliant with the I2C-bus Fast-mode and Standard-mode
SDA with 30 mA sink capability for 4000 pF buses
2.3 V to 5.5 V operation with 5.5 V tolerant I/Os
16-bit remote I/O pins that default to inputs at power-up
Latched outputs with 25 mA sink capability for directly driving LEDs
Total package sink capability of 400 mA
Active LOW reset input
64 programmable slave addresses using 3 address pins
Readable device ID (manufacturer, device type, and revision)
Low standby current
40 C to +85 C operation
ESD protection exceeds 2000 V HBM per JESD22-A114 and 1000 V CDM per
JESD22-C101
 Latch-up testing is done to JEDEC standard JESD78 which exceeds 100 mA
 Packages offered: SO24, TSSOP24, HVQFN24, DHVQFN24
PCA9671
NXP Semiconductors
Remote 16-bit I/O expander for Fm+ I2C-bus with reset
3. Applications








LED signs and displays
Servers
Industrial control
Medical equipment
PLCs
Cellular telephones
Gaming machines
Instrumentation and test measurement
4. Ordering information
Table 1.
Ordering information
Type
number
Topside
mark
Package
Name
Description
Version
PCA9671D
PCA9671D
SO24
plastic small outline package; 24 leads; body width 7.5 mm
SOT137-1
plastic thin shrink small outline package; 24 leads;
body width 4.4 mm
SOT355-1
PCA9671PW PCA9671PW TSSOP24
PCA9671BQ
9671
DHVQFN24 plastic dual in-line compatible thermal enhanced very thin quad
flat package; no leads; 24 terminals; body 3.5  5.5  0.85 mm
SOT815-1
PCA9671BS
9671
HVQFN24
SOT616-1
PCA9671
Product data sheet
plastic thermal enhanced very thin quad flat package; no leads;
24 terminals; body 4  4  0.85 mm
All information provided in this document is subject to legal disclaimers.
Rev. 3 — 29 September 2011
© NXP B.V. 2011. All rights reserved.
2 of 33
PCA9671
NXP Semiconductors
Remote 16-bit I/O expander for Fm+ I2C-bus with reset
5. Block diagram
PCA9671
AD0
AD1
AD2
SCL
SDA
I2C-BUS
CONTROL
INPUT
FILTER
SHIFT
REGISTER
P00 to P07
I/O
PORT
16 BITS
P10 to P17
RESET
VDD
VSS
write pulse
read pulse
POWER-ON
RESET
002aac244
Fig 1.
Block diagram of PCA9671
write pulse
100 μA
VDD
IOH
Itrt(pu)
data from Shift Register
D
Q
P00 to P07
P10 to P17
FF
IOL
CI
S
power-on reset
VSS
D
Q
FF
read pulse
CI
S
to interrupt logic
data to Shift Register
002aab631
Fig 2.
PCA9671
Product data sheet
Simplified schematic diagram of P00 to P17
All information provided in this document is subject to legal disclaimers.
Rev. 3 — 29 September 2011
© NXP B.V. 2011. All rights reserved.
3 of 33
PCA9671
NXP Semiconductors
Remote 16-bit I/O expander for Fm+ I2C-bus with reset
6. Pinning information
6.1 Pinning
RESET
1
1
2
24 VDD
23 SDA
RESET
AD1
AD1
2
24 VDD
23 SDA
AD2
3
22 SCL
AD2
3
22 SCL
P00
4
21 AD0
P00
4
21 AD0
P01
5
20 P17
P01
5
20 P17
P02
6
19 P16
P02
6
P03
7
18 P15
P03
7
P04
8
17 P14
P04
8
17 P14
P05
9
16 P13
P05
9
16 P13
P06 10
15 P12
P06 10
15 P12
P07 11
14 P11
P07 11
14 P11
VSS 12
13 P10
VSS 12
13 P10
PCA9671D
21 AD0
P01
5
20 P17
P02
6
P03
7
P04
P05
terminal 1
index area
19 P16
P00
1
18 AD0
18 P15
P01
2
17 P17
8
17 P14
P02
3
9
16 P13
P03
4
P06 10
15 P12
P04
5
14 P14
P07 11
14 P11
P05
6
13 P13
Product data sheet
Pin configuration for DHVQFN24
P12 12
9
VSS
P11 11
8
P10 10
7
15 P15
002aac248
Transparent top view
Fig 6.
All information provided in this document is subject to legal disclaimers.
Rev. 3 — 29 September 2011
P07
002aac271
16 P16
PCA9671BS
P06
P10 13
PCA9671BQ
VSS 12
PCA9671
19 SCL
4
20 SDA
22 SCL
P00
21 VDD
23 SDA
3
22 RESET
2
AD2
23 AD1
AD1
Transparent top view
Fig 5.
Pin configuration for TSSOP24
24 AD2
1
Fig 4.
24 VDD
RESET
Pin configuration for SO24
terminal 1
index area
18 P15
002aac246
002aac245
Fig 3.
19 P16
PCA9671PW
Pin configuration for HVQFN24
© NXP B.V. 2011. All rights reserved.
4 of 33
PCA9671
NXP Semiconductors
Remote 16-bit I/O expander for Fm+ I2C-bus with reset
6.2 Pin description
Table 2.
Symbol
Pin description
Pin
Description
SO24, TSSOP24,
DHVQFN24
RESET
1
22
reset input (active LOW)
AD1
2
23
address input 1
AD2
3
24
address input 2
P00
4
1
quasi-bidirectional I/O 00
P01
5
2
quasi-bidirectional I/O 01
P02
6
3
quasi-bidirectional I/O 02
P03
7
4
quasi-bidirectional I/O 03
P04
8
5
quasi-bidirectional I/O 04
P05
9
6
quasi-bidirectional I/O 05
P06
10
7
quasi-bidirectional I/O 06
P07
11
8
quasi-bidirectional I/O 07
VSS
12[1]
9[1]
supply ground
P10
13
10
quasi-bidirectional I/O 10
P11
14
11
quasi-bidirectional I/O 11
P12
15
12
quasi-bidirectional I/O 12
P13
16
13
quasi-bidirectional I/O 13
P14
17
14
quasi-bidirectional I/O 14
P15
18
15
quasi-bidirectional I/O 15
P16
19
16
quasi-bidirectional I/O 16
P17
20
17
quasi-bidirectional I/O 17
AD0
21
18
address input 0
SCL
22
19
serial clock line input
SDA
23
20
serial data line input/output
VDD
24
21
supply voltage
[1]
PCA9671
Product data sheet
HVQFN24
HVQFN24 and DHVQFN24 package die supply ground is connected to both the VSS pin and the exposed
center pad. The VSS pin must be connected to supply ground for proper device operation. For enhanced
thermal, electrical, and board-level performance, the exposed pad needs to be soldered to the board using
a corresponding thermal pad on the board, and for proper heat conduction through the board thermal vias
need to be incorporated in the PCB in the thermal pad region.
All information provided in this document is subject to legal disclaimers.
Rev. 3 — 29 September 2011
© NXP B.V. 2011. All rights reserved.
5 of 33
PCA9671
NXP Semiconductors
Remote 16-bit I/O expander for Fm+ I2C-bus with reset
7. Functional description
Refer to Figure 1 “Block diagram of PCA9671”.
7.1 Device address
Following a START condition, the bus master must send the address of the slave it is
accessing and the operation it wants to perform (read or write). The address of the
PCA9671 is shown in Figure 7. Slave address pins AD2, AD1, and AD0 choose 1 of
64 slave addresses. To conserve power, no internal pull-up resistors are incorporated on
AD2, AD1, and AD0. Address values depending on AD2, AD1, and AD0 can be found in
Table 3 “PCA9671 address map”.
Remark: The General Call address (0000 0000) and the Device ID address (1111 100X)
are reserved and cannot be used as device address. Failure to follow this requirement will
cause the PCA9671 not to acknowledge.
Remark: Reserved I2C-bus addresses must be used with caution since they can interfere
with:
• “reserved for future use” I2C-bus addresses (0000 011, 1111 101, 1111 110, 1111 111)
• slave devices that use the 10-bit addressing scheme (1111 0xx)
• High speed mode (Hs-mode) master code (0000 1xx)
slave address
A6
A5
A4
A3
A2
A1
A0 R/W
programmable
Fig 7.
002aab636
PCA9671 address
The last bit of the first byte defines the operation to be performed. When set to logic 1 a
read is selected, while a logic 0 selects a write operation.
When AD2, AD1 and AD0 are held to VDD or VSS, the same address as the PCF8575 is
applied.
7.1.1 Address maps
Table 3.
PCA9671
Product data sheet
PCA9671 address map
AD2
AD1
AD0
A6
A5
A4
A3
A2
A1
A0
Address (hex)
VSS
SCL
VSS
0
0
1
0
0
0
0
20h
VSS
SCL
VDD
0
0
1
0
0
0
1
22h
VSS
SDA
VSS
0
0
1
0
0
1
0
24h
VSS
SDA
VDD
0
0
1
0
0
1
1
26h
VDD
SCL
VSS
0
0
1
0
1
0
0
28h
VDD
SCL
VDD
0
0
1
0
1
0
1
2Ah
VDD
SDA
VSS
0
0
1
0
1
1
0
2Ch
VDD
SDA
VDD
0
0
1
0
1
1
1
2Eh
All information provided in this document is subject to legal disclaimers.
Rev. 3 — 29 September 2011
© NXP B.V. 2011. All rights reserved.
6 of 33
PCA9671
NXP Semiconductors
Remote 16-bit I/O expander for Fm+ I2C-bus with reset
Table 3.
PCA9671
Product data sheet
PCA9671 address map …continued
AD2
AD1
AD0
A6
A5
A4
A3
A2
A1
A0
Address (hex)
VSS
SCL
SCL
0
0
1
1
0
0
0
30h
VSS
SCL
SDA
0
0
1
1
0
0
1
32h
VSS
SDA
SCL
0
0
1
1
0
1
0
34h
VSS
SDA
SDA
0
0
1
1
0
1
1
36h
VDD
SCL
SCL
0
0
1
1
1
0
0
38h
VDD
SCL
SDA
0
0
1
1
1
0
1
3Ah
VDD
SDA
SCL
0
0
1
1
1
1
0
3Ch
VDD
SDA
SDA
0
0
1
1
1
1
1
3Eh
VSS
VSS
VSS
0
1
0
0
0
0
0
40h
VSS
VSS
VDD
0
1
0
0
0
0
1
42h
VSS
VDD
VSS
0
1
0
0
0
1
0
44h
VSS
VDD
VDD
0
1
0
0
0
1
1
46h
VDD
VSS
VSS
0
1
0
0
1
0
0
48h
VDD
VSS
VDD
0
1
0
0
1
0
1
4Ah
VDD
VDD
VSS
0
1
0
0
1
1
0
4Ch
VDD
VDD
VDD
0
1
0
0
1
1
1
4Eh
VSS
VSS
SCL
0
1
0
1
0
0
0
50h
VSS
VSS
SDA
0
1
0
1
0
0
1
52h
VSS
VDD
SCL
0
1
0
1
0
1
0
54h
VSS
VDD
SDA
0
1
0
1
0
1
1
56h
VDD
VSS
SCL
0
1
0
1
1
0
0
58h
VDD
VSS
SDA
0
1
0
1
1
0
1
5Ah
VDD
VDD
SCL
0
1
0
1
1
1
0
5Ch
VDD
VDD
SDA
0
1
0
1
1
1
1
5Eh
SCL
SCL
VSS
1
0
1
0
0
0
0
A0h
SCL
SCL
VDD
1
0
1
0
0
0
1
A2h
SCL
SDA
VSS
1
0
1
0
0
1
0
A4h
SCL
SDA
VDD
1
0
1
0
0
1
1
A6h
SDA
SCL
VSS
1
0
1
0
1
0
0
A8h
SDA
SCL
VDD
1
0
1
0
1
0
1
AAh
SDA
SDA
VSS
1
0
1
0
1
1
0
ACh
SDA
SDA
VDD
1
0
1
0
1
1
1
AEh
SCL
SCL
SCL
1
0
1
1
0
0
0
B0h
SCL
SCL
SDA
1
0
1
1
0
0
1
B2h
SCL
SDA
SCL
1
0
1
1
0
1
0
B4h
SCL
SDA
SDA
1
0
1
1
0
1
1
B6h
SDA
SCL
SCL
1
0
1
1
1
0
0
B8h
SDA
SCL
SDA
1
0
1
1
1
0
1
BAh
SDA
SDA
SCL
1
0
1
1
1
1
0
BCh
SDA
SDA
SDA
1
0
1
1
1
1
1
BEh
All information provided in this document is subject to legal disclaimers.
Rev. 3 — 29 September 2011
© NXP B.V. 2011. All rights reserved.
7 of 33
PCA9671
NXP Semiconductors
Remote 16-bit I/O expander for Fm+ I2C-bus with reset
Table 3.
PCA9671 address map …continued
AD2
AD1
AD0
A6
A5
A4
A3
A2
A1
A0
Address (hex)
SCL
VSS
VSS
1
1
0
0
0
0
0
C0h
SCL
VSS
VDD
1
1
0
0
0
0
1
C2h
SCL
VDD
VSS
1
1
0
0
0
1
0
C4h
SCL
VDD
VDD
1
1
0
0
0
1
1
C6h
SDA
VSS
VSS
1
1
0
0
1
0
0
C8h
SDA
VSS
VDD
1
1
0
0
1
0
1
CAh
SDA
VDD
VSS
1
1
0
0
1
1
0
CCh
SDA
VDD
VDD
1
1
0
0
1
1
1
CEh
SCL
VSS
SCL
1
1
1
0
0
0
0
E0h
SCL
VSS
SDA
1
1
1
0
0
0
1
E2h
SCL
VDD
SCL
1
1
1
0
0
1
0
E4h
SCL
VDD
SDA
1
1
1
0
0
1
1
E6h
SDA
VSS
SCL
1
1
1
0
1
0
0
E8h
SDA
VSS
SDA
1
1
1
0
1
0
1
EAh
SDA
VDD
SCL
1
1
1
0
1
1
0
ECh
SDA
VDD
SDA
1
1
1
0
1
1
1
EEh
7.2 Software Reset call, and device ID addresses
Two other different addresses can be sent to the PCA9671.
• General Call address: allows to reset the PCA9671 through the I2C-bus upon
reception of the right I2C-bus sequence. See Section 7.2.1 “Software Reset” for more
information.
• Device ID address: allows to read ID information from the device (manufacturer, part
identification, revision). See Section 7.2.2 “Device ID (PCA9671 ID field)” for more
information.
R/W
0
0
0
0
0
0
0
0
002aac155
Fig 8.
General Call address
1
1
1
1
1
0
0
R/W
002aab638
Fig 9.
PCA9671
Product data sheet
Device ID address
All information provided in this document is subject to legal disclaimers.
Rev. 3 — 29 September 2011
© NXP B.V. 2011. All rights reserved.
8 of 33
PCA9671
NXP Semiconductors
Remote 16-bit I/O expander for Fm+ I2C-bus with reset
7.2.1 Software Reset
The Software Reset Call allows all the devices in the I2C-bus to be reset to the power-up
state value through a specific formatted I2C-bus command. To be performed correctly, it
implies that the I2C-bus is functional and that there is no device hanging the bus.
The Software Reset sequence is defined as following:
1. A START command is sent by the I2C-bus master.
2. The reserved General Call I2C-bus address ‘0000 000’ with the R/W bit set to logic 0
(write) is sent by the I2C-bus master.
3. The PCA9671 device(s) acknowledge(s) after seeing the General Call address
‘0000 0000’ (00h) only. If the R/W bit is set to logic 1 (read), no acknowledge is
returned to the I2C-bus master.
4. Once the General Call address has been sent and acknowledged, the master sends
1 byte. The value of the byte must be equal to 06h.
a. The PCA9671 acknowledges this value only. If the byte is not equal to 06h, the
PCA9671 does not acknowledge it.
If more than 1 byte of data is sent, the PCA9671 does not acknowledge any more.
5. Once the right byte has been sent and correctly acknowledged, the master sends a
STOP command to end the Software Reset sequence: the PCA9671 then resets to
the default value (power-up value) and is ready to be addressed again within the
specified bus free time. If the master sends a Repeated START instead, no reset is
performed.
The I2C-bus master must interpret a non-acknowledge from the PCA9671 (at any time) as
a ‘Software Reset Abort’. The PCA9671 does not initiate a reset of its registers.
The unique sequence that initiates a Software Reset is described in Figure 10.
SWRST Call I2C-bus address
S
0
0
0
0
0
START condition
0
0
SWRST data = 06h
0
A
0
0
R/W
acknowledge
from slave(s)
0
0
0
1
1
0
A
P
acknowledge
from slave(s)
PCA9671 is(are) reset.
Registers are set to default power-up values.
002aac281
Fig 10. Software Reset sequence
PCA9671
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 3 — 29 September 2011
© NXP B.V. 2011. All rights reserved.
9 of 33
PCA9671
NXP Semiconductors
Remote 16-bit I/O expander for Fm+ I2C-bus with reset
7.2.2 Device ID (PCA9671 ID field)
The Device ID field is a 3-byte read-only (24 bits) word giving the following information:
• 8 bits with the manufacturer name, unique per manufacturer (for example,
NXP Semiconductors).
• 13 bits with the part identification, assigned by manufacturer, the 7 MSBs with the
category ID and the 6 LSBs with the feature ID (for example, PCA9671 16-bit
quasi-output I/O expander).
• 3 bits with the die revision, assigned by manufacturer (for example, Rev X).
The Device ID is read-only, hardwired in the device and can be accessed as follows:
1. START command.
2. The master sends the Reserved Device ID I2C-bus address ‘1111 100’ with the R/W
bit set to logic 0 (write).
3. The master sends the I2C-bus slave address of the slave device it needs to identify.
The LSB is a ‘Don’t care’ value. Only one device must acknowledge this byte (the one
that has the I2C-bus slave address).
4. The master sends a Re-START command.
Remark: A STOP command followed by a START command will reset the slave state
machine and the Device ID read cannot be performed.
Remark: A STOP command or a Re-START command followed by an access to
another slave device will reset the slave state machine and the Device ID read cannot
be performed.
5. The master sends the Reserved Device ID I2C-bus address ‘1111 100’ with the R/W
bit set to logic 1 (read).
6. The device ID read can be done, starting with the 8 manufacturer bits (first byte +
4 MSB of the second byte), followed by the 13 part identification bits and then the
3 die revision bits (3 LSB of the third byte).
7. The master ends the reading sequence by NACKing the last byte, thus resetting the
slave device state machine and allowing the master to send the STOP command.
Remark: The reading of the Device ID can be stopped anytime by sending a NACK
command.
Remark: If the master continues to ACK the bytes after the third byte, the PCA9671
rolls back to the first byte and keeps sending the Device ID sequence until a NACK
has been detected.
For the PCA9671, the Device ID is as shown in Figure 11.
PCA9671
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 3 — 29 September 2011
© NXP B.V. 2011. All rights reserved.
10 of 33
PCA9671
NXP Semiconductors
Remote 16-bit I/O expander for Fm+ I2C-bus with reset
part identification
0
0
manufacturer
0
0
0
0
0
0
0
0
0
0
1
0
1
0
1
0
0
0
0
category identification
feature identification
revision
0
0
0
002aac249
Fig 11. PCA9671 ID
acknowledge from one
or several slave(s)
1
1
1
1
START condition
1
0
acknowledge from
slave to be identified
don't care
device ID address
S
acknowledge from
slave to be identified
0
0
A A6 A5 A4 A3 A2 A1 A0 X
R/W
I2C-bus slave address of
the device to be identified
acknowledge
from master
A
1
1
1
1
1
0
device ID address
acknowledge
from master
0
1
A
R/W
no acknowledge
from master
M7 M6 M5 M4 M3 M2 M1 M0 A C6 C5 C4 C3 C2 C1 C0 F5 A F4 P3 P2 P1 P0 R2 R1 R0 A
category identification
= 0000001
manufacturer name
= 00000000
P
revision = 000
feature identification
= 010100
STOP
condition
002aac335
If more than 2 bytes are read, the slave device loops back to the first byte (manufacturer byte) and
keeps sending data until the master generates a ‘no acknowledge’.
Fig 12. Device ID field reading
PCA9671
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 3 — 29 September 2011
© NXP B.V. 2011. All rights reserved.
11 of 33
PCA9671
NXP Semiconductors
Remote 16-bit I/O expander for Fm+ I2C-bus with reset
8. I/O programming
8.1 Quasi-bidirectional I/O architecture
The PCA9671’s 16 ports (see Figure 2) are entirely independent and can be used either
as input or output ports. Input data is transferred from the ports to the microcontroller in
the Read mode (see Figure 15). Output data is transmitted to the ports in the Write mode
(see Figure 14).
Every data transmission from the PCA9671 must consist of an even number of bytes, the
first byte will be referred to as P07 to P00, and the second byte as P17 to P10. The third
will be referred to as P07 to P00, and so on.
This quasi-bidirectional I/O can be used as an input or output without the use of a control
signal for data directions. At power-on the I/Os are HIGH. In this mode only a current
source (IOH) to VDD is active. An additional strong pull-up to VDD (Itrt(pu)) allows fast rising
edges into heavily loaded outputs. These devices turn on when an output is written HIGH,
and are switched off by the negative edge of SCL. The I/Os should be HIGH before being
used as inputs. After power-on, as all the I/Os are set HIGH, all of them can be used as
inputs. Any change in setting of the I/Os as either inputs or outputs can be done with the
write mode.
Remark: If a HIGH is applied to an I/O which has been written earlier to LOW, a large
current (IOL) will flow to VSS.
8.2 Writing to the port (Output mode)
To write, the master (microcontroller) first addresses the slave device. By setting the last
bit of the byte containing the slave address to logic 0 the Write mode is entered. The
PCA9671 acknowledges and the master sends the first data byte for P07 to P00. After the
first data byte is acknowledged by the PCA9671, the second data byte P17 to P10 is sent
by the master. Once again, the PCA9671 acknowledges the receipt of the data. Each 8-bit
data is presented on the port lines after it has been acknowledged by the PCA9671.
The number of data bytes that can be sent successively is not limited. After every two
bytes, the previous data is overwritten.
The first data byte in every pair refers to Port 0 (P07 to P00), whereas the second data
byte in every pair refers to Port 1 (P17 to P10). See Figure 13.
first byte
07
06
05
04
03
second byte
02
01
00
A
P07 P06 P05 P04 P03 P02 P01 P00
17
16
15
14
13
12
11
10
A
P17 P16 P15 P14 P13 P12 P11 P10
002aab634
Fig 13. Correlation between bits and ports
PCA9671
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 3 — 29 September 2011
© NXP B.V. 2011. All rights reserved.
12 of 33
PCA9671
NXP Semiconductors
Remote 16-bit I/O expander for Fm+ I2C-bus with reset
SCL
1
2
3
4
5
6
7
8
slave address
data to port 0
SDA S A6 A5 A4 A3 A2 A1 A0 0
START condition
9
R/W
data to port 1
P P 1 P P P P P A P 1 P P P P P P A
A 07
04 03 02 01 00
17
06
15 14 13 12 11 10
P16
acknowledge
from slave
P05
acknowledge
from slave
acknowledge
from slave
write to port
tv(Q)
data output from port
tv(Q)
DATA A0 AND B0 VALID
data A0 and B0 valid
P05 output voltage
P05 pull-up output current
Itrt(pu)
IOH
P16 output voltage
Itrt(pu)
P16 pull-up output current
IOH
002aac250
Fig 14. Write mode (output)
8.3 Reading from a port (Input mode)
All ports programmed as input should be set to logic 1. To read, the master
(microcontroller) first addresses the slave device after it receives the interrupt. By setting
the last bit of the byte containing the slave address to logic 1 the Read mode is entered.
The data bytes that follow on the SDA are the values on the ports.
If the data on the input port changes faster than the master can read, this data may be
lost.
PCA9671
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 3 — 29 September 2011
© NXP B.V. 2011. All rights reserved.
13 of 33
xxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxx x x x xxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxx xx xx xxxxx
xxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxx xxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxx x x
xxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxx
xxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxx xxx
2
3
4
5
6
7
8
9
P1x
P0x
SDA
S
0
1
0
0 A2 A1 A0 1
START condition
NXP Semiconductors
PCA9671
Product data sheet
1
SCL
A
R/W
acknowledge
from slave
DATA 00
A
acknowledge
from master
DATA 11
P1x
P0x
A
acknowledge
from master
A
DATA 00
acknowledge
from master
1
DATA 12
P
no acknowledge
from master
read from port 0
data into port 0
DATA 00
data into port 1
DATA 10
DATA 11
DATA12
002aac251
Transfer of data can be stopped at any moment by a STOP condition. When this occurs, data present at the latest acknowledge phase is valid (output mode).
Fig 15. Read input port register, scenario 1
PCA9671
14 of 33
© NXP B.V. 2011. All rights reserved.
Remote 16-bit I/O expander for Fm+ I2C-bus with reset
Rev. 3 — 29 September 2011
All information provided in this document is subject to legal disclaimers.
read from port 1
xxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxx x x x xxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxx xx xx xxxxx
xxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxx xxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxx x x
xxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxx
xxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxx xxx
2
3
4
5
6
7
8
9
P1x
P0x
SDA
S
0
1
0
0 A2 A1 A0 1
START condition
NXP Semiconductors
PCA9671
Product data sheet
1
SCL
DATA 00
A
R/W
A
A
DATA 10
A
DATA 03
acknowledge
from master
acknowledge
from master
acknowledge
from slave
P1x
P0x
acknowledge
from master
1
DATA 12
P
no acknowledge
from master
read from port 0
tsu(D)
th(D)
data into port 0
DATA 00
DATA 01
DATA 02
DATA 03
th(D)
tsu(D)
data into port 1
DATA 10
DATA 11
DATA12
002aac252
Transfer of data can be stopped at any moment by a STOP condition. When this occurs, data present at the latest acknowledge phase is valid (output mode).
Fig 16. Read input port register, scenario 2
PCA9671
15 of 33
© NXP B.V. 2011. All rights reserved.
Remote 16-bit I/O expander for Fm+ I2C-bus with reset
Rev. 3 — 29 September 2011
All information provided in this document is subject to legal disclaimers.
read from port 1
PCA9671
NXP Semiconductors
Remote 16-bit I/O expander for Fm+ I2C-bus with reset
8.4 Power-on reset
When power is applied to VDD, an internal Power-On Reset (POR) holds the PCA9671 in
a reset condition until VDD has reached VPOR. At that point, the reset condition is released
and the PCA9671 registers and I2C-bus/SMBus state machine will initialize to their default
states. Thereafter VDD must be lowered below 0.2 V to reset the device.
8.5 RESET input
A reset can be accomplished by holding the RESET pin LOW for a minimum of tw(rst). The
PCA9671 registers and I2C-bus state machine will be held in their default state until the
RESET input is once again HIGH.
9. Characteristics of the I2C-bus
The I2C-bus is for 2-way, 2-line communication between different ICs or modules. The two
lines are a serial data line (SDA) and a serial clock line (SCL). Both lines must be
connected to a positive supply via a pull-up resistor when connected to the output stages
of a device. Data transfer may be initiated only when the bus is not busy.
9.1 Bit transfer
One data bit is transferred during each clock pulse. The data on the SDA line must remain
stable during the HIGH period of the clock pulse as changes in the data line at this time
will be interpreted as control signals (see Figure 17).
SDA
SCL
data line
stable;
data valid
change
of data
allowed
mba607
Fig 17. Bit transfer
9.1.1 START and STOP conditions
Both data and clock lines remain HIGH when the bus is not busy. A HIGH-to-LOW
transition of the data line while the clock is HIGH is defined as the START condition (S). A
LOW-to-HIGH transition of the data line while the clock is HIGH is defined as the STOP
condition (P) (see Figure 18).
PCA9671
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 3 — 29 September 2011
© NXP B.V. 2011. All rights reserved.
16 of 33
PCA9671
NXP Semiconductors
Remote 16-bit I/O expander for Fm+ I2C-bus with reset
SDA
SCL
S
P
START condition
STOP condition
mba608
Fig 18. Definition of START and STOP conditions
9.2 System configuration
A device generating a message is a ‘transmitter’; a device receiving is the ‘receiver’. The
device that controls the message is the ‘master’ and the devices which are controlled by
the master are the ‘slaves’ (see Figure 19).
SDA
SCL
MASTER
TRANSMITTER/
RECEIVER
SLAVE
RECEIVER
SLAVE
TRANSMITTER/
RECEIVER
MASTER
TRANSMITTER
MASTER
TRANSMITTER/
RECEIVER
I2C-BUS
MULTIPLEXER
SLAVE
002aaa966
Fig 19. System configuration
9.3 Acknowledge
The number of data bytes transferred between the START and the STOP conditions from
transmitter to receiver is not limited. Each byte of eight bits is followed by one
acknowledge bit. The acknowledge bit is a HIGH level put on the bus by the transmitter,
whereas the master generates an extra acknowledge related clock pulse.
A slave receiver which is addressed must generate an acknowledge after the reception of
each byte. Also a master must generate an acknowledge after the reception of each byte
that has been clocked out of the slave transmitter. The device that acknowledges has to
pull down the SDA line during the acknowledge clock pulse, so that the SDA line is stable
LOW during the HIGH period of the acknowledge related clock pulse; set-up and hold
times must be taken into account.
A master receiver must signal an end of data to the transmitter by not generating an
acknowledge on the last byte that has been clocked out of the slave. In this event, the
transmitter must leave the data line HIGH to enable the master to generate a STOP
condition.
PCA9671
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 3 — 29 September 2011
© NXP B.V. 2011. All rights reserved.
17 of 33
PCA9671
NXP Semiconductors
Remote 16-bit I/O expander for Fm+ I2C-bus with reset
data output
by transmitter
not acknowledge
data output
by receiver
acknowledge
SCL from master
1
2
S
8
9
clock pulse for
acknowledgement
START
condition
002aaa987
Fig 20. Acknowledgement on the I2C-bus
10. Application design-in information
10.1 Bidirectional I/O expander applications
In the 8-bit I/O expander application shown in Figure 21, P00 and P01 are inputs, and P02
to P07 are outputs. When used in this configuration, during a write, the input (P00 and
P01) must be written as HIGH so the external devices fully control the input ports. The
desired HIGH or LOW logic levels may be written to the I/Os used as outputs (P02 to
P07). During a read, the logic levels of the external devices driving the input ports (P00
and P01) and the previous written logic level to the output ports (P02 to P07) will be read.
The GPIO also has a reset line (RESET) that can be connected to an output pin of the
microprocessor. Since the device does not have an interrupt output, changes of the I/Os
can be monitored by reading the input registers. If both a RESET and INT are needed,
use the PCA9673.
VDD
VDD
CORE
PROCESSOR
VDD
SDA
SCL
RESET
A0
A1
A2
P00
P01
P02
P03
P04
P05
P06
P07
temperature sensor
battery status
control for latch
control for switch
control for audio
control for camera
control for MP3
002aac253
Fig 21. Bidirectional I/O expander application
PCA9671
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 3 — 29 September 2011
© NXP B.V. 2011. All rights reserved.
18 of 33
PCA9671
NXP Semiconductors
Remote 16-bit I/O expander for Fm+ I2C-bus with reset
10.2 High current-drive load applications
The GPIO has a maximum sinking current of 25 mA per bit. In applications requiring
additional drive, two port pins in the same octal may be connected together to sink up to
50 mA current. Both bits must then always be turned on or off together. Up to 8 pins (one
octal) can be connected together to drive 200 mA.
VDD
VDD
SDA
SCL
RESET
CORE
PROCESSOR
A0
A1
A2
VDD
P00
P01
P02
P03
P04
P05
P06
P07
LOAD
002aac254
Fig 22. High current-drive load application
11. Limiting values
Table 4.
Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol
Parameter
Min
Max
Unit
VDD
supply voltage
0.5
+6
V
IDD
supply current
-
100
mA
ISS
ground supply current
-
600
mA
VI
input voltage
VSS  0.5
5.5
V
II
input current
-
20
mA
mA
mW
IO
output current
-
50[1]
Ptot
total power dissipation
-
600
P/out
power dissipation per output
-
200
mW
Tstg
storage temperature
65
+150
C
Tamb
ambient temperature
40
+85
C
[1]
PCA9671
Product data sheet
Conditions
operating
Total package (maximum) output current is 600 mA.
All information provided in this document is subject to legal disclaimers.
Rev. 3 — 29 September 2011
© NXP B.V. 2011. All rights reserved.
19 of 33
PCA9671
NXP Semiconductors
Remote 16-bit I/O expander for Fm+ I2C-bus with reset
12. Static characteristics
Table 5.
Static characteristics
VDD = 2.3 V to 5.5 V; VSS = 0 V; Tamb = 40 C to +85 C; unless otherwise specified.
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
Supplies
VDD
supply voltage
2.3
-
5.5
V
IDD
supply current
operating mode; no load;
VI = VDD or VSS; fSCL = 400 kHz
-
200
500
A
Istb
standby current
standby mode; no load;
VI = VDD or VSS
-
2.5
10
A
VPOR
power-on reset voltage
-
1.8
2.0
V
0.5
-
+0.3VDD V
[1]
Input SCL; input/output SDA
VIL
LOW-level input voltage
VIH
HIGH-level input voltage
0.7VDD
-
5.5
V
IOL
LOW-level output current
VOL = 0.4 V
20
-
-
mA
IL
leakage current
VI = VDD or VSS
1
-
+1
A
Ci
input capacitance
VI = VSS
-
4
10
pF
I/Os; P00 to P07 and P10 to P17
LOW-level output current
IOL
VOL = 0.5 V; VDD = 2.3 V
[2]
12
27
-
mA
VOL = 0.5 V; VDD = 3.0 V
[2]
17
35
-
mA
VOL = 0.5 V; VDD = 4.5 V
[2]
25
42
-
mA
[2]
-
-
400
mA
30
150
300
A
IOL(tot)
total LOW-level output current
VOL = 0.5 V; VDD = 4.5 V
IOH
HIGH-level output current
VOH = VSS
Itrt(pu)
transient boosted pull-up current VOH = VSS; see Figure 14
Ci
Co
0.5
1.0
-
mA
input capacitance
[3]
-
4
10
pF
output capacitance
[3]
-
4
10
pF
Input RESET
VIL
LOW-level input voltage
0.5
-
+0.8
V
VIH
HIGH-level input voltage
2
-
5.5
V
ILI
input leakage current
1
-
+1
A
Ci
input capacitance
-
3
5
pF
-
+0.3VDD V
Inputs AD0, AD1, AD2
VIL
LOW-level input voltage
0.5
VIH
HIGH-level input voltage
0.7VDD
-
5.5
V
ILI
input leakage current
1
-
+1
A
Ci
input capacitance
-
3
5
pF
[1]
The power-on reset circuit resets the I2C-bus logic with VDD < VPOR and set all I/Os to logic 1 (with current source to VDD).
[2]
Each bit must be limited to a maximum of 25 mA and the total package limited to 400 mA due to internal busing limits.
[3]
The value is not tested, but verified on sampling basis.
PCA9671
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 3 — 29 September 2011
© NXP B.V. 2011. All rights reserved.
20 of 33
PCA9671
NXP Semiconductors
Remote 16-bit I/O expander for Fm+ I2C-bus with reset
13. Dynamic characteristics
Table 6.
Dynamic characteristics
VDD = 2.3 V to 5.5 V; VSS = 0 V; Tamb = 40 C to +85 C; unless otherwise specified.
Symbol
Parameter
fSCL
SCL clock frequency
tBUF
Conditions
Standard-mode
I2C-bus
Fast-mode I2C-bus
Fast-mode
Plus I2C-bus
Unit
Min
Max
Min
Max
Min
Max
0
100
0
400
0
1000
bus free time between a
STOP and START
condition
4.7
-
1.3
-
0.5
-
s
tHD;STA
hold time (repeated)
START condition
4.0
-
0.6
-
0.26
-
s
tSU;STA
set-up time for a repeated
START condition
4.7
-
0.6
-
0.26
-
s
tSU;STO
set-up time for STOP
condition
4.0
-
0.6
-
0.26
-
s
tHD;DAT
data hold time
kHz
0
-
0
-
0
-
ns
0.3
3.45
0.1
0.9
0.05
0.45
s
300
-
50
-
50
450
ns
tVD;ACK
data valid acknowledge
time
[1]
tVD;DAT
data valid time
[2]
tSU;DAT
data set-up time
250
-
100
-
50
-
ns
tLOW
LOW period of the SCL
clock
4.7
-
1.3
-
0.5
-
s
tHIGH
HIGH period of the SCL
clock
4.0
-
0.6
-
0.26
-
s
tf
fall time of both SDA and
SCL signals
-
300
20 + 0.1Cb [3]
300
-
120
ns
tr
rise time of both SDA and
SCL signals
-
1000
20 + 0.1Cb [3]
300
-
120
ns
tSP
pulse width of spikes that
must be suppressed by
the input filter
-
50
-
50
-
50
ns
[4][5]
[6]
Port timing; CL  100 pF (see Figure 15 and Figure 14)
tv(Q)
data output valid time
-
4
-
4
-
4
s
tsu(D)
data input set-up time
0
-
0
-
0
-
s
th(D)
data input hold time
4
-
4
-
4
-
s
Reset timing (see Figure 24)
tw(rst)
reset pulse width
4
-
4
-
4
-
ns
trec(rst)
reset recovery time
0
-
0
-
0
-
ns
trst
reset time
100
-
100
-
100
-
ns
[1]
tVD;ACK = time for Acknowledgement signal from SCL LOW to SDA (out) LOW.
[2]
tVD;DAT = minimum time for SDA data out to be valid following SCL LOW.
[3]
Cb = total capacitance of one bus line in pF.
[4]
A master device must internally provide a hold time of at least 300 ns for the SDA signal (refer to the VIL of the SCL signal) in order to
bridge the undefined region SCL’s falling edge.
PCA9671
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 3 — 29 September 2011
© NXP B.V. 2011. All rights reserved.
21 of 33
PCA9671
NXP Semiconductors
Remote 16-bit I/O expander for Fm+ I2C-bus with reset
[5]
The maximum tf for the SDA and SCL bus lines is specified at 300 ns. The maximum fall time for the SDA output stage tf is specified at
250 ns. This allows series protection resistors to be connected between the SDA and the SCL pins and the SDA/SCL bus lines without
exceeding the maximum specified tf.
[6]
Input filters on the SDA and SCL inputs suppress noise spikes less than 50 ns.
START
condition
(S)
protocol
bit 7
MSB
(A7)
tSU;STA
tLOW
bit 6
(A6)
tHIGH
bit 0
(R/W)
acknowledge
(A)
STOP
condition
(P)
1 / fSCL
0.7 × VDD
SCL
0.3 × VDD
tBUF
tf
tr
0.7 × VDD
SDA
0.3 × VDD
tSU;DAT
tHD;STA
tHD;DAT
tVD;ACK
tVD;DAT
tSU;STO
002aab175
Rise and fall times refer to VIL and VIH.
Fig 23. I2C-bus timing diagram
ACK or read cycle
START
SCL
SDA
30 %
trst
RESET
50 %
50 %
trec(rst)
50 %
tw(rst)
trst
50 %
P0n, P1n
output off
002aac282
Fig 24. Reset timing
PCA9671
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 3 — 29 September 2011
© NXP B.V. 2011. All rights reserved.
22 of 33
PCA9671
NXP Semiconductors
Remote 16-bit I/O expander for Fm+ I2C-bus with reset
14. Package outline
SO24: plastic small outline package; 24 leads; body width 7.5 mm
SOT137-1
D
E
A
X
c
HE
y
v M A
Z
13
24
Q
A2
A
(A 3)
A1
pin 1 index
θ
Lp
L
1
12
e
detail X
w M
bp
0
5
10 mm
scale
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
UNIT
A
max.
A1
A2
A3
bp
c
D (1)
E (1)
e
HE
L
Lp
Q
v
w
y
mm
2.65
0.3
0.1
2.45
2.25
0.25
0.49
0.36
0.32
0.23
15.6
15.2
7.6
7.4
1.27
10.65
10.00
1.4
1.1
0.4
1.1
1.0
0.25
0.25
0.1
0.01
0.019 0.013
0.014 0.009
0.61
0.60
0.30
0.29
0.05
0.419
0.043
0.055
0.394
0.016
inches
0.1
0.012 0.096
0.004 0.089
0.043
0.039
0.01
0.01
Z
(1)
0.9
0.4
0.035
0.004
0.016
θ
8o
o
0
Note
1. Plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included.
REFERENCES
OUTLINE
VERSION
IEC
JEDEC
SOT137-1
075E05
MS-013
JEITA
EUROPEAN
PROJECTION
ISSUE DATE
99-12-27
03-02-19
Fig 25. Package outline SOT137-1 (SO24)
PCA9671
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 3 — 29 September 2011
© NXP B.V. 2011. All rights reserved.
23 of 33
PCA9671
NXP Semiconductors
Remote 16-bit I/O expander for Fm+ I2C-bus with reset
TSSOP24: plastic thin shrink small outline package; 24 leads; body width 4.4 mm
D
SOT355-1
E
A
X
c
HE
y
v M A
Z
13
24
Q
A2
(A 3)
A1
pin 1 index
A
θ
Lp
L
1
12
bp
e
detail X
w M
0
2.5
5 mm
scale
DIMENSIONS (mm are the original dimensions)
UNIT
A
max.
A1
A2
A3
bp
c
D (1)
E (2)
e
HE
L
Lp
Q
v
w
y
Z (1)
θ
mm
1.1
0.15
0.05
0.95
0.80
0.25
0.30
0.19
0.2
0.1
7.9
7.7
4.5
4.3
0.65
6.6
6.2
1
0.75
0.50
0.4
0.3
0.2
0.13
0.1
0.5
0.2
8o
0o
Notes
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
2. Plastic interlead protrusions of 0.25 mm maximum per side are not included.
OUTLINE
VERSION
SOT355-1
REFERENCES
IEC
JEDEC
JEITA
MO-153
EUROPEAN
PROJECTION
ISSUE DATE
99-12-27
03-02-19
Fig 26. Package outline SOT355-1 (TSSOP24)
PCA9671
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 3 — 29 September 2011
© NXP B.V. 2011. All rights reserved.
24 of 33
PCA9671
NXP Semiconductors
Remote 16-bit I/O expander for Fm+ I2C-bus with reset
DHVQFN24: plastic dual in-line compatible thermal enhanced very thin quad flat package;
no leads; 24 terminals; body 3.5 x 5.5 x 0.85 mm
B
D
SOT815-1
A
A
E
A1
c
detail X
terminal 1
index area
C
e1
terminal 1
index area
e
y1 C
v M C A B
w M C
b
2
y
11
L
12
1
e2
Eh
24
13
23
14
X
Dh
0
2.5
5 mm
scale
DIMENSIONS (mm are the original dimensions)
UNIT
A(1)
max.
A1
b
c
D (1)
Dh
E (1)
Eh
e
e1
e2
L
v
w
y
y1
mm
1
0.05
0.00
0.30
0.18
0.2
5.6
5.4
4.25
3.95
3.6
3.4
2.25
1.95
0.5
4.5
1.5
0.5
0.3
0.1
0.05
0.05
0.1
Note
1. Plastic or metal protrusions of 0.075 mm maximum per side are not included.
REFERENCES
OUTLINE
VERSION
IEC
JEDEC
JEITA
SOT815-1
---
---
---
EUROPEAN
PROJECTION
ISSUE DATE
03-04-29
Fig 27. Package outline SOT815-1 (DHVQFN24)
PCA9671
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 3 — 29 September 2011
© NXP B.V. 2011. All rights reserved.
25 of 33
PCA9671
NXP Semiconductors
Remote 16-bit I/O expander for Fm+ I2C-bus with reset
HVQFN24: plastic thermal enhanced very thin quad flat package; no leads;
24 terminals; body 4 x 4 x 0.85 mm
A
B
D
SOT616-1
terminal 1
index area
A
A1
E
c
detail X
e1
C
1/2
e
e
12
y
y1 C
v M C A B
w M C
b
7
L
13
6
e
e2
Eh
1/2
1
e
18
terminal 1
index area
24
19
X
Dh
0
2.5
5 mm
scale
DIMENSIONS (mm are the original dimensions)
UNIT
A(1)
max.
A1
b
c
D (1)
Dh
E (1)
Eh
e
e1
e2
L
v
w
y
y1
mm
1
0.05
0.00
0.30
0.18
0.2
4.1
3.9
2.25
1.95
4.1
3.9
2.25
1.95
0.5
2.5
2.5
0.5
0.3
0.1
0.05
0.05
0.1
Note
1. Plastic or metal protrusions of 0.075 mm maximum per side are not included.
REFERENCES
OUTLINE
VERSION
IEC
JEDEC
JEITA
SOT616-1
---
MO-220
---
EUROPEAN
PROJECTION
ISSUE DATE
01-08-08
02-10-22
Fig 28. Package outline SOT616-1 (HVQFN24)
PCA9671
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 3 — 29 September 2011
© NXP B.V. 2011. All rights reserved.
26 of 33
PCA9671
NXP Semiconductors
Remote 16-bit I/O expander for Fm+ I2C-bus with reset
15. Handling information
All input and output pins are protected against ElectroStatic Discharge (ESD) under
normal handling. When handling ensure that the appropriate precautions are taken as
described in JESD625-A or equivalent standards.
16. Soldering of SMD packages
This text provides a very brief insight into a complex technology. A more in-depth account
of soldering ICs can be found in Application Note AN10365 “Surface mount reflow
soldering description”.
16.1 Introduction to soldering
Soldering is one of the most common methods through which packages are attached to
Printed Circuit Boards (PCBs), to form electrical circuits. The soldered joint provides both
the mechanical and the electrical connection. There is no single soldering method that is
ideal for all IC packages. Wave soldering is often preferred when through-hole and
Surface Mount Devices (SMDs) are mixed on one printed wiring board; however, it is not
suitable for fine pitch SMDs. Reflow soldering is ideal for the small pitches and high
densities that come with increased miniaturization.
16.2 Wave and reflow soldering
Wave soldering is a joining technology in which the joints are made by solder coming from
a standing wave of liquid solder. The wave soldering process is suitable for the following:
• Through-hole components
• Leaded or leadless SMDs, which are glued to the surface of the printed circuit board
Not all SMDs can be wave soldered. Packages with solder balls, and some leadless
packages which have solder lands underneath the body, cannot be wave soldered. Also,
leaded SMDs with leads having a pitch smaller than ~0.6 mm cannot be wave soldered,
due to an increased probability of bridging.
The reflow soldering process involves applying solder paste to a board, followed by
component placement and exposure to a temperature profile. Leaded packages,
packages with solder balls, and leadless packages are all reflow solderable.
Key characteristics in both wave and reflow soldering are:
•
•
•
•
•
•
Board specifications, including the board finish, solder masks and vias
Package footprints, including solder thieves and orientation
The moisture sensitivity level of the packages
Package placement
Inspection and repair
Lead-free soldering versus SnPb soldering
16.3 Wave soldering
Key characteristics in wave soldering are:
PCA9671
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 3 — 29 September 2011
© NXP B.V. 2011. All rights reserved.
27 of 33
PCA9671
NXP Semiconductors
Remote 16-bit I/O expander for Fm+ I2C-bus with reset
• Process issues, such as application of adhesive and flux, clinching of leads, board
transport, the solder wave parameters, and the time during which components are
exposed to the wave
• Solder bath specifications, including temperature and impurities
16.4 Reflow soldering
Key characteristics in reflow soldering are:
• Lead-free versus SnPb soldering; note that a lead-free reflow process usually leads to
higher minimum peak temperatures (see Figure 29) than a SnPb process, thus
reducing the process window
• Solder paste printing issues including smearing, release, and adjusting the process
window for a mix of large and small components on one board
• Reflow temperature profile; this profile includes preheat, reflow (in which the board is
heated to the peak temperature) and cooling down. It is imperative that the peak
temperature is high enough for the solder to make reliable solder joints (a solder paste
characteristic). In addition, the peak temperature must be low enough that the
packages and/or boards are not damaged. The peak temperature of the package
depends on package thickness and volume and is classified in accordance with
Table 7 and 8
Table 7.
SnPb eutectic process (from J-STD-020C)
Package thickness (mm)
Package reflow temperature (C)
Volume (mm3)
< 350
 350
< 2.5
235
220
 2.5
220
220
Table 8.
Lead-free process (from J-STD-020C)
Package thickness (mm)
Package reflow temperature (C)
Volume (mm3)
< 350
350 to 2000
> 2000
< 1.6
260
260
260
1.6 to 2.5
260
250
245
> 2.5
250
245
245
Moisture sensitivity precautions, as indicated on the packing, must be respected at all
times.
Studies have shown that small packages reach higher temperatures during reflow
soldering, see Figure 29.
PCA9671
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 3 — 29 September 2011
© NXP B.V. 2011. All rights reserved.
28 of 33
PCA9671
NXP Semiconductors
Remote 16-bit I/O expander for Fm+ I2C-bus with reset
maximum peak temperature
= MSL limit, damage level
temperature
minimum peak temperature
= minimum soldering temperature
peak
temperature
time
001aac844
MSL: Moisture Sensitivity Level
Fig 29. Temperature profiles for large and small components
For further information on temperature profiles, refer to Application Note AN10365
“Surface mount reflow soldering description”.
17. Abbreviations
Table 9.
PCA9671
Product data sheet
Abbreviations
Acronym
Description
CDM
Charged Device Model
CMOS
Complementary Metal Oxide Semiconductor
ESD
ElectroStatic Discharge
GPIO
General Purpose Input/Output
HBM
Human Body Model
I2C-bus
Inter-Integrated Circuit bus
I/O
Input/Output
IC
Integrated Circuit
ID
Identification
LED
Light Emitting Diode
LSB
Least Significant Bit
MSB
Most Significant Bit
PLC
Programmable Logic Controller
PWM
Pulse Width Modulation
RAID
Redundant Array of Independent Disks
SMBus
System Management Bus
All information provided in this document is subject to legal disclaimers.
Rev. 3 — 29 September 2011
© NXP B.V. 2011. All rights reserved.
29 of 33
PCA9671
NXP Semiconductors
Remote 16-bit I/O expander for Fm+ I2C-bus with reset
18. Revision history
Table 10.
Revision history
Document ID
Release date
Data sheet status
Change notice
Supersedes
PCA9671 v.3
20110929
Product data sheet
-
PCA9671 v.2
Modifications:
•
Section 2 “Features and benefits”:
– 13th bullet item: deleted phrase “200 V MM per JESD22-A115”
– 15th bullet item: deleted “SSOP24, QSOP24”
•
Table 1 “Ordering information”: removed discontinued products
– removed type number PCA9671DB (SSOP24)
– removed type number PCA9671DK (SSOP24 [also known as QSOP24])
•
Section 6.1 “Pinning”:
– deleted (old) Figure 5, Pin configuration for SSOP24 (QSOP24)
– deleted (old) Figure 6, Pin configuration for SSOP24
•
•
•
Table 2 “Pin description”: deleted “SSOP24, QSOP24” from heading of second column
Figure 23 “I2C-bus timing diagram” modified: added 0.7  VDD and 0.3  VDD level lines
Section 14 “Package outline”:
– deleted package outline SOT340-1 (SSOP24)
– deleted package outline SOT556-1 (SSOP24)
PCA9671 v.2
20100729
Product data sheet
-
PCA9671 v.1
PCA9671 v.1
20061220
Product data sheet
-
-
PCA9671
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 3 — 29 September 2011
© NXP B.V. 2011. All rights reserved.
30 of 33
PCA9671
NXP Semiconductors
Remote 16-bit I/O expander for Fm+ I2C-bus with reset
19. Legal information
19.1 Data sheet status
Document status[1][2]
Product status[3]
Definition
Objective [short] data sheet
Development
This document contains data from the objective specification for product development.
Preliminary [short] data sheet
Qualification
This document contains data from the preliminary specification.
Product [short] data sheet
Production
This document contains the product specification.
[1]
Please consult the most recently issued document before initiating or completing a design.
[2]
The term ‘short data sheet’ is explained in section “Definitions”.
[3]
The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status
information is available on the Internet at URL http://www.nxp.com.
19.2 Definitions
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liability for the consequences of
use of such information.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and title. A short data sheet is intended
for quick reference only and should not be relied upon to contain detailed and
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local NXP Semiconductors sales
office. In case of any inconsistency or conflict with the short data sheet, the
full data sheet shall prevail.
Product specification — The information and data provided in a Product
data sheet shall define the specification of the product as agreed between
NXP Semiconductors and its customer, unless NXP Semiconductors and
customer have explicitly agreed otherwise in writing. In no event however,
shall an agreement be valid in which the NXP Semiconductors product is
deemed to offer functions and qualities beyond those described in the
Product data sheet.
19.3 Disclaimers
Limited warranty and liability — Information in this document is believed to
be accurate and reliable. However, NXP Semiconductors does not give any
representations or warranties, expressed or implied, as to the accuracy or
completeness of such information and shall have no liability for the
consequences of use of such information.
In no event shall NXP Semiconductors be liable for any indirect, incidental,
punitive, special or consequential damages (including - without limitation - lost
profits, lost savings, business interruption, costs related to the removal or
replacement of any products or rework charges) whether or not such
damages are based on tort (including negligence), warranty, breach of
contract or any other legal theory.
Notwithstanding any damages that customer might incur for any reason
whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards
customer for the products described herein shall be limited in accordance
with the Terms and conditions of commercial sale of NXP Semiconductors.
malfunction of an NXP Semiconductors product can reasonably be expected
to result in personal injury, death or severe property or environmental
damage. NXP Semiconductors accepts no liability for inclusion and/or use of
NXP Semiconductors products in such equipment or applications and
therefore such inclusion and/or use is at the customer’s own risk.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty that such applications will be suitable for the
specified use without further testing or modification.
Customers are responsible for the design and operation of their applications
and products using NXP Semiconductors products, and NXP Semiconductors
accepts no liability for any assistance with applications or customer product
design. It is customer’s sole responsibility to determine whether the NXP
Semiconductors product is suitable and fit for the customer’s applications and
products planned, as well as for the planned application and use of
customer’s third party customer(s). Customers should provide appropriate
design and operating safeguards to minimize the risks associated with their
applications and products.
NXP Semiconductors does not accept any liability related to any default,
damage, costs or problem which is based on any weakness or default in the
customer’s applications or products, or the application or use by customer’s
third party customer(s). Customer is responsible for doing all necessary
testing for the customer’s applications and products using NXP
Semiconductors products in order to avoid a default of the applications and
the products or of the application or use by customer’s third party
customer(s). NXP does not accept any liability in this respect.
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) will cause permanent
damage to the device. Limiting values are stress ratings only and (proper)
operation of the device at these or any other conditions above those given in
the Recommended operating conditions section (if present) or the
Characteristics sections of this document is not warranted. Constant or
repeated exposure to limiting values will permanently and irreversibly affect
the quality and reliability of the device.
Terms and conditions of commercial sale — NXP Semiconductors
products are sold subject to the general terms and conditions of commercial
sale, as published at http://www.nxp.com/profile/terms, unless otherwise
agreed in a valid written individual agreement. In case an individual
agreement is concluded only the terms and conditions of the respective
agreement shall apply. NXP Semiconductors hereby expressly objects to
applying the customer’s general terms and conditions with regard to the
purchase of NXP Semiconductors products by customer.
Right to make changes — NXP Semiconductors reserves the right to make
changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
No offer to sell or license — Nothing in this document may be interpreted or
construed as an offer to sell products that is open for acceptance or the grant,
conveyance or implication of any license under any copyrights, patents or
other industrial or intellectual property rights.
Suitability for use — NXP Semiconductors products are not designed,
authorized or warranted to be suitable for use in life support, life-critical or
safety-critical systems or equipment, nor in applications where failure or
Export control — This document as well as the item(s) described herein
may be subject to export control regulations. Export might require a prior
authorization from competent authorities.
PCA9671
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 3 — 29 September 2011
© NXP B.V. 2011. All rights reserved.
31 of 33
PCA9671
NXP Semiconductors
Remote 16-bit I/O expander for Fm+ I2C-bus with reset
Non-automotive qualified products — Unless this data sheet expressly
states that this specific NXP Semiconductors product is automotive qualified,
the product is not suitable for automotive use. It is neither qualified nor tested
in accordance with automotive testing or application requirements. NXP
Semiconductors accepts no liability for inclusion and/or use of
non-automotive qualified products in automotive equipment or applications.
In the event that customer uses the product for design-in and use in
automotive applications to automotive specifications and standards, customer
(a) shall use the product without NXP Semiconductors’ warranty of the
product for such automotive applications, use and specifications, and (b)
whenever customer uses the product for automotive applications beyond
NXP Semiconductors’ specifications such use shall be solely at customer’s
own risk, and (c) customer fully indemnifies NXP Semiconductors for any
liability, damages or failed product claims resulting from customer design and
use of the product for automotive applications beyond NXP Semiconductors’
standard warranty and NXP Semiconductors’ product specifications.
19.4 Trademarks
Notice: All referenced brands, product names, service names and trademarks
are the property of their respective owners.
I2C-bus — logo is a trademark of NXP B.V.
20. Contact information
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: [email protected]
PCA9671
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 3 — 29 September 2011
© NXP B.V. 2011. All rights reserved.
32 of 33
PCA9671
NXP Semiconductors
Remote 16-bit I/O expander for Fm+ I2C-bus with reset
21. Contents
1
2
3
4
5
6
6.1
6.2
7
7.1
7.1.1
7.2
7.2.1
7.2.2
8
8.1
8.2
8.3
8.4
8.5
9
9.1
9.1.1
9.2
9.3
10
10.1
10.2
11
12
13
14
15
16
16.1
16.2
16.3
16.4
17
18
19
19.1
19.2
General description . . . . . . . . . . . . . . . . . . . . . . 1
Features and benefits . . . . . . . . . . . . . . . . . . . . 1
Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
Ordering information . . . . . . . . . . . . . . . . . . . . . 2
Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 3
Pinning information . . . . . . . . . . . . . . . . . . . . . . 4
Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 5
Functional description . . . . . . . . . . . . . . . . . . . 6
Device address . . . . . . . . . . . . . . . . . . . . . . . . . 6
Address maps. . . . . . . . . . . . . . . . . . . . . . . . . . 6
Software Reset call, and device ID
addresses . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Software Reset . . . . . . . . . . . . . . . . . . . . . . . . . 9
Device ID (PCA9671 ID field) . . . . . . . . . . . . . 10
I/O programming . . . . . . . . . . . . . . . . . . . . . . . 12
Quasi-bidirectional I/O architecture . . . . . . . . 12
Writing to the port (Output mode) . . . . . . . . . . 12
Reading from a port (Input mode) . . . . . . . . . 13
Power-on reset . . . . . . . . . . . . . . . . . . . . . . . . 16
RESET input . . . . . . . . . . . . . . . . . . . . . . . . . . 16
Characteristics of the I2C-bus . . . . . . . . . . . . 16
Bit transfer . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
START and STOP conditions . . . . . . . . . . . . . 16
System configuration . . . . . . . . . . . . . . . . . . . 17
Acknowledge . . . . . . . . . . . . . . . . . . . . . . . . . 17
Application design-in information . . . . . . . . . 18
Bidirectional I/O expander applications . . . . . 18
High current-drive load applications . . . . . . . . 19
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . 19
Static characteristics. . . . . . . . . . . . . . . . . . . . 20
Dynamic characteristics . . . . . . . . . . . . . . . . . 21
Package outline . . . . . . . . . . . . . . . . . . . . . . . . 23
Handling information. . . . . . . . . . . . . . . . . . . . 27
Soldering of SMD packages . . . . . . . . . . . . . . 27
Introduction to soldering . . . . . . . . . . . . . . . . . 27
Wave and reflow soldering . . . . . . . . . . . . . . . 27
Wave soldering . . . . . . . . . . . . . . . . . . . . . . . . 27
Reflow soldering . . . . . . . . . . . . . . . . . . . . . . . 28
Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . . 29
Revision history . . . . . . . . . . . . . . . . . . . . . . . . 30
Legal information. . . . . . . . . . . . . . . . . . . . . . . 31
Data sheet status . . . . . . . . . . . . . . . . . . . . . . 31
Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31
19.3
19.4
20
21
Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . .
Trademarks . . . . . . . . . . . . . . . . . . . . . . . . . .
Contact information . . . . . . . . . . . . . . . . . . . .
Contents. . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
31
32
32
33
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
© NXP B.V. 2011.
All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: [email protected]
Date of release: 29 September 2011
Document identifier: PCA9671