RENESAS R5F2M122ADSP

Preliminary Datasheet
Specifications in this document are tentative and subject to change.
R8C/M11A Group, R8C/M12A Group
RENESAS MCU
1.
R01DS0010EJ0010
Rev.0.10
Aug 25, 2010
Overview
1.1
Features
The R8C/M11A Group and R8C/M12A Group of single-chip microcontrollers (MCUs) incorporate the R8C CPU
core, which provides sophisticated instructions for a high level of efficiency. With 1 Mbyte of address space, the
CPU core is capable of executing instructions at high speed. In addition, it features a multiplier for high-speed
arithmetic processing.
Power consumption is low, and additional power control is possible by selecting the operating mode. These MCUs
are designed to suppress unnecessary radiation of noise and improve noise tolerance with countermeasure circuits.
Integration of many peripheral functions on the same chip, including multifunction timer and serial interface,
reduces the number of system components.
The R8C/M11A Group and R8C/M12A Group include data flash (1 KB × 2 blocks).
1.1.1
Applications
Home appliances, office equipment, audio equipment, consumer products, etc.
R01DS0010EJ0010 Rev.0.10
Aug 25, 2010
Page 1 of 45
Under development
Preliminary document
Specifications in this document are tentative and subject to change.
R8C/M11A Group, R8C/M12A Group
1.1.2
1. Overview
Differences between Groups
Table 1.1 lists the Specification Comparison between R8C/M11A Group and R8C/M12A Group. The
explanations in the chapters which follow apply to the R8C/M12A Group only unless otherwise specified.
Table 1.1
Specification Comparison between R8C/M11A Group and R8C/M12A Group
Item
Interrupts
Function
External interrupt inputs
I/O ports
Number of pins
R8C/M11A Group
6 (INT × 3, key input × 3)
14
Non-provided pins:
P1_0/AN0/TRCIOD/KI0
P3_3/IVCMP3/TRCCLK/INT3
P3_4/IVREF3/TRCIOC/INT2
P3_5/TRCIOD/KI2/VCOUT3
P4_2/TRBO/TXD0/KI3
P4_5/INT0/ADTRG
Number of CMOS I/O ports
11
Non-provided ports:
P1_0, P3_3, P3_4, P3_5, P4_2,
P4_5
Number of high-current drive 5
ports
Non-provided ports:
P3_3, P3_4, P3_5
A/D converter Number of A/D channels
5 channels
Non-provided port: AN0
Comparator B Number of channels
Comparator B1
R01DS0010EJ0010 Rev.0.10
Aug 25, 2010
R8C/M12A Group
8 (INT × 4, key input × 4)
20
17
8
6 channels
Comparator B1, comparator B3
Page 2 of 45
Under development
Preliminary document
Specifications in this document are tentative and subject to change.
R8C/M11A Group, R8C/M12A Group
1. Overview
Table 1.2 lists the R8C/M11A Group Register Settings. These settings correspond to the specification
differences between the R8C/M11A Group and R8C/M12A Group.
Table 1.2
Related
Function
INT3
R8C/M11A Group Register Settings
Register Name Address
INTEN
INTF0
ISCR0
ILVLD
IRR3
KIEN
KI0
Comparator B3 ILVL2
interrupt
IRR2
P1_0
PD1
P1
PUR1
POD1
PML1
P3_3, P3_4,
PD3
P3_5
P3
PUR3
DRR3
POD3
PML3
PMH3
P4_2, P4_5
AN0
Comparator B
PD4
P4
PUR4
POD4
PML4
PMH4
ADINSEL
WCMPR
WCB3INTR
R01DS0010EJ0010 Rev.0.10
Aug 25, 2010
Bit
Setting Method for Access
00038h
0003Ah
0003Ch
0004Dh
00053h
0003Eh
INT3EN
INT3F0, INT3F1
INT3SA, INT3SB
ILVLD0, ILVLD1
IRI3
KI0EN, KI0PL
Reserved bit. Set to 0.
Reserved bits. Set to 0.
Reserved bits. Set to 0.
Reserved bits. Set to 0.
Reserved bit.
Reserved bits. Set to 0.
00042h
00052h
000A9h
000AFh
000B5h
000C1h
000C8h
000ABh
000B1h
000B7h
000BDh
000C3h
000CCh
000CDh
ILVL24, ILVL25
IRCMP3
PD1_0
P1_0
PU1_0
POD1_0
P10SEL0, P10SEL1
PD3_3, PD3_4, PD3_5
P3_3, P3_4, P3_5
PU3_3, PU3_4, PU3_5
DRR3_3, DRR3_4, DRR3_5
POD3_3, POD3_4, POD3_5
P33SEL0, P33SEL1
P34SEL0, P34SEL1,
P35SEL0, P35SEL1
PD4_2, PD4_5
P4_2, P4_5
PU4_2, PU4_5
POD4_2, POD4_5
P42SEL0, P42SEL1
P45SEL0, P45SEL1
CH0, ADGSEL0, ADGSEL1
WCB3M0, WCB3OUT
All bits
Reserved bits. Set to 0.
Reserved bit.
Reserved bit. Set to 0.
Reserved bit. Set to 0.
Reserved bit. Set to 0.
Reserved bit. Set to 0.
Reserved bits. Set to 0.
Reserved bits. Set to 0.
Reserved bits. Set to 0.
Reserved bits. Set to 0.
Reserved bits. Set to 0.
Reserved bits. Set to 0.
Reserved bits. Set to 0.
Reserved bits. Set to 0.
000ACh
000B2h
000B8h
000C4h
000CEh
000CFh
0009Dh
00180h
00182h
Reserved bits. Set to 0.
Reserved bits. Set to 0.
Reserved bits. Set to 0.
Reserved bits. Set to 0.
Reserved bits. Set to 0.
Reserved bits. Set to 0.
Do not set to 000.
Reserved bits. Set to 0.
Reserved register. No access is allowed.
Page 3 of 45
Under development
Preliminary document
Specifications in this document are tentative and subject to change.
R8C/M11A Group, R8C/M12A Group
1.1.3
1. Overview
Specifications
Tables 1.3 and 1.4 outline the Specifications.
Table 1.3
Item
CPU
Memory
Specifications (1)
Function
Central processing
unit
ROM, RAM,
data flash
Reset sources
Voltage
Voltage detection
detection
circuit
Watchdog timer
Clock
Clock generation
circuits
Power control
Interrupts
I/O ports
Timer
Programmable I/O
ports
Timer RJ2
Timer RB2
Timer RC
Serial
UART0
interface
A/D converter
Comparator B
R01DS0010EJ0010 Rev.0.10
Aug 25, 2010
Description
R8C CPU core
• Number of fundamental instructions: 89
• Minimum instruction execution time:
50 ns (f(XIN) = 20 MHz, VCC = 2.7 V to 5.5 V)
200 ns (f(XIN) = 5 MHz, VCC = 1.8 V to 5.5 V)
• Multiplier: 16 bits × 16 bits → 32 bits
• Multiply-accumulate instruction: 16 bits × 16 bits + 32 bits → 32 bits
• Operating mode: Single-chip mode (address space: 1 Mbyte)
See Table 1.5 Product List.
• Hardware reset by RESET
• Power-on reset
• Watchdog timer reset
• Software reset
• Reset by voltage detection 0
Voltage detection with two check points:
Voltage detection 0, voltage detection 1 (detection levels selectable)
• 14 bits × 1 (with prescaler)
• Reset start function selectable
• Count source protection function selectable
• 3 circuits: XIN clock oscillation circuit,
high-speed on-chip oscillator (with frequency adjustment function),
low-speed on-chip oscillator
• Oscillation stop detection: XIN clock oscillation stop detection function
• Clock frequency divider circuit integrated
• Standard operating mode
• Wait mode (CPU stopped, peripheral functions in operation)
• Stop mode (CPU and peripheral functions stopped)
• Number of interrupt vectors: 69
• External interrupt inputs: 8 (INT × 4, key input × 4)
• Priority levels: 2
• CMOS I/O: 17 (pull-up resistor selectable)
• High-current drive ports: 8
16 bits × 1
Timer mode, pulse output mode (output level inverted every period),
event counter mode, pulse width measurement mode, pulse period
measurement mode
8 bits × 1 (with 8-bit prescaler) or 16 bits × 1 (selectable)
Timer mode, programmable waveform generation mode (PWM output),
programmable one-shot generation mode, programmable wait one-shot
generation mode
16 bits × 1 (with 4 capture/compare registers)
Timer mode (output compare function, input capture function),
PWM mode (3 outputs), PWM2 mode (1 PWM output)
Clock synchronous serial I/O. Also used for asynchronous serial I/O.
• Resolution: 10 bits × 6 channels
• Sample and hold function, sweep mode
2 circuits
Page 4 of 45
Under development
Preliminary document
Specifications in this document are tentative and subject to change.
R8C/M11A Group, R8C/M12A Group
Table 1.4
Item
Flash memory
1. Overview
Specifications (2)
Function
Operating frequency/
Power supply voltage
Temperature range
Package
Description
• Program/erase voltage for program ROM: VCC = 1.8 V to 5.5 V
• Program/erase voltage for data flash: VCC = 1.8 V to 5.5 V
• Program/erase endurance:10,000 times (data flash)
10,000 times (program ROM)
• Program security: ID code check, protection enabled by lock bit
• Debug functions: On-chip debug, on-board flash rewrite function
f(XIN) = 20 MHz (VCC = 2.7 V to 5.5 V)
f(XIN) = 5 MHz (VCC = 1.8 V to 5.5 V)
-20 °C to 85 °C (N version)
-40 °C to 85 °C (D version) (1)
14-pin TSSOP: [Package code] PTSP0014JA-B
14-pin DIP: [Package code] PRDP0014AC-A
20-pin LSSOP: [Package code] PLSP0020JB-A
20-pin DIP: [Package code] PRDP0020AD-A
Note:
1. Specify the D version if its functions are to be used.
R01DS0010EJ0010 Rev.0.10
Aug 25, 2010
Page 5 of 45
Under development
Preliminary document
Specifications in this document are tentative and subject to change.
R8C/M11A Group, R8C/M12A Group
1.2
1. Overview
Product List
Table 1.5 lists the Product List. Figure 1.1 shows the Product Part Number Structure.
Table 1.5
Group Name
Product List
Part No.
R8C/M11A
Group
R5F2M110ANSP (D)
R5F2M111ANSP (D)
R5F2M112ANSP (D)
R5F2M110ANDD (D)
R5F2M111ANDD (D)
R5F2M112ANDD (D)
R5F2M110ADSP (D)
R5F2M111ADSP (D)
R5F2M112ADSP (D)
R8C/M12A
R5F2M120ANSP (D)
Group
R5F2M121ANSP (D)
R5F2M122ANSP (D)
R5F2M120ANDD (D)
R5F2M121ANDD (D)
R5F2M122ANDD (D)
R5F2M120ADSP (D)
R5F2M121ADSP (D)
R5F2M122ADSP (D)
(D): Under development
Current of Aug 2010
Internal ROM Capacity
Program ROM
Data Flash
2 Kbytes
1 Kbyte × 2
4 Kbytes
1 Kbyte × 2
8 Kbytes
1 Kbyte × 2
2 Kbytes
1 Kbyte × 2
4 Kbytes
1 Kbyte × 2
8 Kbytes
1 Kbyte × 2
2 Kbytes
1 Kbyte × 2
4 Kbytes
1 Kbyte × 2
8 Kbytes
1 Kbyte × 2
2 Kbytes
1 Kbyte × 2
4 Kbytes
1 Kbyte × 2
8 Kbytes
1 Kbyte × 2
2 Kbytes
1 Kbyte × 2
4 Kbytes
1 Kbyte × 2
8 Kbytes
1 Kbyte × 2
2 Kbytes
1 Kbyte × 2
4 Kbytes
1 Kbyte × 2
8 Kbytes
1 Kbyte × 2
Internal RAM
Capacity
256 bytes
384 bytes
512 bytes
256 bytes
384 bytes
512 bytes
256 bytes
384 bytes
512 bytes
256 bytes
384 bytes
512 bytes
256 bytes
384 bytes
512 bytes
256 bytes
384 bytes
512 bytes
Package Type
Remarks
PTSP0014JA-B
N version
PRDP0014AC-A
PTSP0014JA-B
D version
PLSP0020JB-A
N version
PRDP0020AD-A
PLSP0020JB-A
D version
Part No. R 5 F 2MX X X A N SP
Package type:
SP: PTSP0014JA-B, PLSP0020JB-A
DD: PRDP0014AC-A, PRDP0020AD-A
Classification
N: Operating ambient temperature -20 °C to 85 °C
D: Operating ambient temperature -40 °C to 85 °C
ROM capacity
0: 2 KB
1: 4 KB
2: 8 KB
Number of pins
1: 14 pins
2: 20 pins
R8C/MXXA Group
R8C/Mx Series
Memory type
F: Flash memory
Renesas MCU
Renesas semiconductor
Figure 1.1
Product Part Number Structure
R01DS0010EJ0010 Rev.0.10
Aug 25, 2010
Page 6 of 45
Under development
Preliminary document
Specifications in this document are tentative and subject to change.
R8C/M11A Group, R8C/M12A Group
1.3
1. Overview
Block Diagram
Figure 1.2 shows the Block Diagram.
8
I/O ports
4
Port P1
Port P3
4
1
Port P4
Port PA
Peripheral functions
Timers
Timer RJ2 (16 bits × 1)
Timer RB2 (8 bits × 1
or 16 bits × 1)
Timer RC (16 bits × 1)
UART
Clock synchronous serial I/O
Clock asynchronous serial I/O
System clock generation
circuit
XIN-XOUT
High-speed on-chip oscillator
Low-speed on-chip oscillator
Comparator B
Voltage detection circuit
Watchdog timer
(14 bits)
A/D converter
(10 bits × 6 channels)
R8C CPU core
R0H
R1H
R0L
R1L
R2
R3
Memory
SB
ISP
INTB
A0
A1
FB
ROM (1)
USP
RAM (2)
PC
FLG
Multiplier
Notes:
1. ROM size varies with the product.
2. RAM size varies with the product.
Figure 1.2
Block Diagram
R01DS0010EJ0010 Rev.0.10
Aug 25, 2010
Page 7 of 45
Under development
Preliminary document
Specifications in this document are tentative and subject to change.
R8C/M11A Group, R8C/M12A Group
1.4
1. Overview
Pin Assignment
Figures 1.3 and 1.4 show Pin Assignment (Top View). Table 1.6 lists the Pin Name Information by Pin Number.
P3_7/ADTRG/TRJO/TRCIOD
1
14
P1_1/AN1/TRCIOA/TRCTRG/KI1
RESET/PA_0
2
13
P1_2/AN2/TRCIOB/KI2
P4_7/XOUT/INT2
3
R8C/M11A Group
12
P1_3/AN3/TRCIOC/KI3/TRBO
VSS/AVSS
4
11
P1_4/AN4/TXD0/RXD0/INT0/TRCIOB
P4_6/XIN/RXD0/TXD0/INT1/
VCOUT1/TRJIO
5
PTSP0014JA-B
PRDP0014AC-A
(Top view)
10
P1_5/RXD0/TRJIO/INT1/VCOUT1
VCC/AVCC
6
9
P1_6/IVREF1/CLK0/TRJO/TRCIOB
MODE
7
8
P1_7/AN7/IVCMP1/INT1/TRJIO/TRCCLK
Note:
1. Confirm the pin 1 position on the package by referring to Package Dimensions.
Figure 1.3
R8C/M11A Group Pin Assignment (Top View)
P4_2/TRBO/TXD0/KI3
1
20
P1_0/AN0/TRCIOD/KI0
P3_7/ADTRG/TRJO/TRCIOD
2
19
P1_1/AN1/TRCIOA/TRCTRG/KI1
RESET/PA_0
3
18
P1_2/AN2/TRCIOB/KI2
P4_7/XOUT/INT2
4
17
P1_3/AN3/TRCIOC/KI3/TRBO
VSS/AVSS
5
16
P1_4/AN4/TXD0/RXD0/INT0/TRCIOB
P4_6/XIN/RXD0/TXD0/INT1/
VCOUT1/TRJIO
6
15
P1_5/RXD0/TRJIO/INT1/VCOUT1
VCC/AVCC
7
14
P1_6/IVREF1/CLK0/TRJO/TRCIOB
MODE
8
13
P1_7/AN7/IVCMP1/INT1/TRJIO/TRCCLK
P3_5/TRCIOD/KI2/VCOUT3
9
12
P4_5/INT0/ADTRG
P3_4/IVREF3/TRCIOC/INT2
10
11
P3_3/IVCMP3/TRCCLK/INT3
R8C/M12A Group
PLSP0020JB-A
PRDP0020AD-A
(Top view)
Note:
1. Confirm the pin 1 position on the package by referring to Package Dimensions.
Figure 1.4
R8C/M12A Group Pin Assignment (Top View)
R01DS0010EJ0010 Rev.0.10
Aug 25, 2010
Page 8 of 45
Under development
Preliminary document
Specifications in this document are tentative and subject to change.
R8C/M11A Group, R8C/M12A Group
Table 1.6
1. Overview
Pin Name Information by Pin Number
Pin Number
R8C/M11A R8C/M12A Control Pin
Group
Group
Port
1
P4_2
1
2
P3_7
2
3
PA_0
3
4
4
5
6
7
RESET
XOUT
Interrupt
KI3
I/O Pins for Peripheral Functions
A/D Converter,
Serial
Timer
Comparator B,
Interface
Voltage Detection Circuit
TRBO
TXD0
TRJO/TRCIOD
ADTRG
P4_7
INT2
5
6
VSS/AVSS
XIN
P4_6
INT1
TRJIO
7
8
9
VCC/AVCC
MODE
P3_5
KI2
TRCIOD
VCOUT3
10
P3_4
INT2
TRCIOC
IVREF3
11
P3_3
INT3
TRCCLK
IVCMP3
INT0
ADTRG
AN7/IVCMP1
RXD0/TXD0
VCOUT1
12
P4_5
8
13
P1_7
INT1
TRJIO/TRCCLK
9
10
14
15
P1_6
P1_5
INT1
TRJO/TRCIOB
TRJIO
CLK0
RXD0
IVREF1
VCOUT1
11
16
P1_4
INT0
TRCIOB
RXD0/TXD0
AN4
12
17
P1_3
KI3
TRBO/TRCIOC
AN3
13
18
P1_2
KI2
TRCIOB
AN2
14
19
P1_1
KI1
TRCIOA/TRCTRG
AN1
20
P1_0
KI0
TRCIOD
AN0
R01DS0010EJ0010 Rev.0.10
Aug 25, 2010
Page 9 of 45
Under development
Preliminary document
Specifications in this document are tentative and subject to change.
R8C/M11A Group, R8C/M12A Group
1.5
1. Overview
Pin Functions
Table 1.7 lists the Pin Functions.
Table 1.7
Pin Functions
Item
Pin Name
Power supply input VCC, VSS
I/O
—
Analog power
supply input
Reset input
—
MODE
XIN clock input
XIN clock output
INT interrupt input
Key input interrupt
I/O ports
Timer RJ2
Timer RB2
Timer RC
Serial interface
A/D converter
Comparator B
AVCC, AVSS
I
Description
Apply 1.8 V through 5.5 V to the VCC pin.
Apply 0 V to the VSS pin.
Power supply input for the A/D converter.
Connect a capacitor between pins AVCC and AVSS.
Applying a low level to this pin resets the MCU.
RESET
MODE
XIN
XOUT
I
I
O
Connect this pin to the VCC pin via a resistor.
I/O for the XIN clock generation circuit.
Connect a ceramic resonator or a crystal oscillator between
pins XIN and XOUT. (1)
To use an external clock, input it to the XIN pin and leave the
XOUT pin open.
INT0 to INT3
I
INT interrupt input.
Key input interrupt input.
KI0 to KI3
P1_0 to P1_7,
P3_0 to P3_5, P3_7,
P4_2, P4_5 to P4_7,
PA_0
TRJIO
TRJO
TRBO
TRCCLK
TRCTRG
TRCIOA, TRCIOB,
TRCIOC, TRCIOD
CLK0
RXD0
TXD0
AN0 to AN4, AN7
ADTRG
IVCMP1, IVCMP3
IVREF1, IVREF3
VCOUT1, VCOUT3
I
I/O
I/O
O
O
I
I
I/O
CMOS I/O ports.
Each port has an I/O select direction register, enabling
switching input and output for each port.
For input ports other than PA_0, the presence or absence of a
pull-up resistor can be selected by a program.
P1_2 to P1_5, P3_3 to P3_5, and P3_7 can be used as LED
drive ports.
Timer RJ2 I/O.
Pulse output.
Timer RB2 output.
External clock input.
External trigger input.
Timer RC I/O.
I/O
I
O
I
I
Transfer clock I/O.
Serial data input.
Serial data output.
Analog input for the A/D converter.
External trigger input for the A/D converter.
I
I
O
Analog voltage input for comparator B.
Reference voltage input for comparator B.
Comparison result output for comparator B.
Note:
1. Contact the oscillator manufacturer for oscillation characteristics.
R01DS0010EJ0010 Rev.0.10
Aug 25, 2010
Page 10 of 45
Under development
Preliminary document
Specifications in this document are tentative and subject to change.
R8C/M11A Group, R8C/M12A Group
2.
2. Central Processing Unit (CPU)
Central Processing Unit (CPU)
Figure 2.1 shows the 13 CPU Registers. The registers, R0, R1, R2, R3, A0, A1, and FB form a single register bank.
The CPU has two register banks.
b31
b15
b0
R2
R0H (R0 high-order byte) R0L (R1 low-order byte)
R3
R1H (R0 high-order byte) R1L (R1 low-order byte)
R2
Data registers (1)
R3
A0
Address registers (1)
A1
Frame base register (1)
FB
b19
b15
b0
INTBH
INTBL
Interrupt table register
The higher 4 bits of INTB are INTBH and
the lower 16 bits of INTB are INTBL.
b19
b0
Program counter
PC
b15
b0
USP
User stack pointer
ISP
Interrupt stack pointer
SB
Static base register
b15
b0
FLG
b15
b8
IPL
b7
U
Flag register
b0
I
O B S Z D C
Carry flag
Debug flag
Zero flag
Sign flag
Register bank select flag
Overflow flag
Interrupt enable flag
Stack pointer select flag
Reserved bits
Processor interrupt priority level
Reserved bit
Note:
1. These registers form a single register bank.
The CPU has two register banks.
Figure 2.1
CPU Registers
R01DS0010EJ0010 Rev.0.10
Aug 25, 2010
Page 11 of 45
Under development
Preliminary document
Specifications in this document are tentative and subject to change.
R8C/M11A Group, R8C/M12A Group
2.1
2. Central Processing Unit (CPU)
Data Registers (R0, R1, R2, and R3)
R0 is a 16-bit register for transfer, arithmetic, and logic operations. The same applies to R1 through R3.
R0 can be split into high-order (R0H) and low-order (R0L) registers to be used separately as 8-bit data registers.
The same applies to R1H and R1L. R2 can be combined with R0 and used as a 32-bit data register (R2R0). In the
same way as with R0 and R2, R3 and R1 can be used as a 32-bit data register (R3R1).
2.2
Address Registers (A0 and A1)
A0 is a 16-bit register for address register indirect addressing and address register relative addressing. It is also
used for transfer, arithmetic, and logic operations. A1 functions in the same manner as A0. A1 can be combined
with A0 and used as a 32-bit address register (A1A0).
2.3
Frame Base Register (FB)
FB is a 16-bit register used for FB relative addressing.
2.4
Interrupt Table Register (INTB)
INTB is a 20-bit register that indicates the start address of a relocatable interrupt vector table.
2.5
Program Counter (PC)
PC is a 20-bit register that indicates the address of the next instruction to be executed.
2.6
User Stack Pointer (USP) and Interrupt Stack Pointer (ISP)
The stack pointers (SP), USP and ISP, are each 16 bits wide. The U flag of the FLG register is used to switch
between USP and ISP.
2.7
Static Base Register (SB)
SB is a 16-bit register used for SB relative addressing.
2.8
Flag Register (FLG)
FLG is an 11-bit register that indicates the CPU state.
2.8.1
Carry Flag (C)
The C flag retains carry, borrow, or shift-out bits that have been generated in the arithmetic and logic unit.
2.8.2
Debug Flag (D)
The D flag is for debugging only. It must only be set to 0.
2.8.3
Zero Flag (Z)
The Z flag is set to 1 when an arithmetic operation results in 0. Otherwise it is set to 0.
2.8.4
Sign Flag (S)
The S flag is set to 1 when an arithmetic operation results in a negative value. Otherwise it is set to 0.
2.8.5
Register Bank Select Flag (B)
Register bank 0 is selected when the B flag is 0. Register bank 1 is selected when this flag is 1.
2.8.6
Overflow Flag (O)
The O flag is set to 1 when an operation results in an overflow. Otherwise it is set to 0.
R01DS0010EJ0010 Rev.0.10
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R8C/M11A Group, R8C/M12A Group
2.8.7
2. Central Processing Unit (CPU)
Interrupt Enable Flag (I)
The I flag enables maskable interrupts. Interrupts are disabled when the I flag is 0, and are enabled when the I
flag is 1. The I flag is set to 0 when an interrupt request is acknowledged.
2.8.8
Stack Pointer Select Flag (U)
ISP is selected when the U flag is 0. USP is selected when the U flag is 1. The U flag is set to 0 when a hardware
interrupt request is acknowledged or the INT instruction for a software interrupt numbered from 0 to 31 is
executed.
2.8.9
Processor Interrupt Priority Level (IPL)
IPL is 3 bits wide and assigns eight processor interrupt priority levels from 0 to 7. If a requested interrupt has
higher priority than IPL, the interrupt is enabled. If IPL is set to levels from 2 to 7, all maskable interrupt
requests are disabled.
2.8.10
Reserved Bit
The write value must be 0. The read value is undefined.
R01DS0010EJ0010 Rev.0.10
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Under development
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Specifications in this document are tentative and subject to change.
R8C/M11A Group, R8C/M12A Group
3.
3. Address Space
Address Space
3.1
Memory Map
Figure 3.1 shows the Memory Map. The R8C/M11A Group and R8C/M12A Group have a 1-Mbyte address space
from addresses 00000h to FFFFFh. The internal ROM (program ROM) is allocated at lower addresses, beginning
with address 0FFFFh. For example, an 8-Kbyte internal ROM area is allocated at addresses 0E000h to 0FFFFh.
The fixed interrupt vector table is allocated at addresses 0FFDCh to 0FFFFh. The start address of each interrupt
routine is stored here.
The internal ROM (data flash) is allocated at addresses 03000h to 037FFh.
The internal RAM is allocated at higher addresses, beginning with address 00400h. For example, a 512-byte
internal RAM area is allocated at addresses 00400h to 005FFh. The internal RAM is used not only for data storage
but also as a stack area when a subroutine is called or when an interrupt request is acknowledged.
Special function registers (SFRs) are allocated at addresses 00000h to 02FFFh. Peripheral function control registers
are allocated here. All unallocated spaces within the SFRs are reserved and cannot be accessed by users.
00000h
002FFh
SFR
(See 3.2 Special
Function Registers
(SFRs))
00400h
Internal RAM
0XXXXh
0FFD8h
Reserved area
0FFDCh
Undefined instruction
03000h
Overflow
Internal ROM
(data flash) (1)
BRK instruction
Address match
037FFh
Single-step
0YYYYh
Watchdog timer, oscillation stop detection, voltage monitor 1
(Reserved)
Internal ROM
(program ROM)
0FFFFh
(Reserved)
Reset
0FFFFh
Expanded area
FFFFFh
Notes:
1. Data flash indicates block A (1 Kbyte) and block B (1 Kbyte).
2. The blank areas are reserved. No access is allowed.
Part Number
Internal ROM
Internal RAM
Capacity
Address 0YYYYh
Capacity
Address 0XXXXh
R5F2M110ANSP, R5F2M110ANDD, R5F2M110ADSP,
R5F2M120ANSP, R5F2M120ANDD, R5F2M120ADSP
2 Kbytes
0F800h
256 bytes
004FFh
R5F2M111ANSP, R5F2M111ANDD, R5F2M111ADSP,
R5F2M121ANSP, R5F2M121ANDD, R5F2M121ADSP
4 Kbytes
0F000h
384 bytes
0057Fh
R5F2M112ANSP, R5F2M112ANDD, R5F2M112ADSP,
R5F2M122ANSP, R5F2M122ANDD, R5F2M122ADSP
8 Kbytes
0E000h
512 bytes
005FFh
Figure 3.1
Memory Map
R01DS0010EJ0010 Rev.0.10
Aug 25, 2010
Page 14 of 45
Under development
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Specifications in this document are tentative and subject to change.
R8C/M11A Group, R8C/M12A Group
3.2
3. Address Space
Special Function Registers (SFRs)
An SFR (special function register) is a control register for a peripheral function. Tables 3.1 to 3.8 list the SFR
Information. Table 3.9 lists the ID Code Area and Option Function Select Area.
Table 3.1
Address
00000h
00001h
00002h
00003h
00004h
00005h
00006h
00007h
00008h
00009h
0000Ah
0000Bh
0000Ch
0000Dh
0000Eh
0000Fh
00010h
00011h
00012h
SFR Information (1) (1)
Register Name
Symbol
After Reset
Processor Mode Register 0
PM0
00h
Module Standby Control Register
MSTCR
00013h
00014h
00015h
00016h
00017h
00018h
00019h
0001Ah
0001Bh
0001Ch
0001Dh
0001Eh
0001Fh
00020h
00021h
00022h
00023h
00024h
00025h
00026h
00027h
00028h
00029h
0002Ah
0002Bh
0002Ch
0002Dh
0002Eh
0002Fh
00030h
Protect Register
PRCR
00h (2)
01110111b (3)
00h
Hardware Reset Protect Register
HRPR
00h
External Clock Control Register
On-Chip Oscillator Control Register
System Clock f Control Register
System Clock f Select Register
Clock Stop Control Register
Clock Control Register When Returning
Oscillation Stop Detection Register
EXCKCR
OCOCR
SCKCR
PHISEL
CKSTPR
CKRSCR
BAKCR
00h
00h
00h
00h
00h
00h
00h
Reset Interrupt Select Register
RISR
00031h
00032h
00033h
00034h
Watchdog Timer Reset Register
Watchdog Timer Start Register
Watchdog Timer Control Register
Count Source Protection Mode Register
WDTR
WDTS
WDTC
CSPR
WDTIR
10000000b (4)
00h (5)
FFh
FFh
01000000b
10000000b (4)
00h (5)
00h
INTEN
00h
Watchdog Timer Interrupt Control Register
00035h
00036h
00037h
External Input Enable Register
00038h
00039h
Notes:
1. The blank areas are reserved. No access is allowed.
2. The MSTINI bit in the OFS2 register is 0.
3. The MSTINI bit in the OFS2 register is 1.
4. The CSPROINI bit in the OFS register is 0.
5. The CSPROINI bit in the OFS register is 1.
R01DS0010EJ0010 Rev.0.10
Aug 25, 2010
Page 15 of 45
Under development
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Specifications in this document are tentative and subject to change.
R8C/M11A Group, R8C/M12A Group
Table 3.2
Address
0003Ah
0003Bh
0003Ch
0003Dh
0003Eh
0003Fh
00040h
00041h
00042h
00043h
00044h
00045h
00046h
00047h
00048h
00049h
0004Ah
0004Bh
0004Ch
0004Dh
0004Eh
0004Fh
00050h
00051h
00052h
00053h
00054h
00055h
00056h
00057h
00058h
00059h
0005Ah
0005Bh
0005Ch
3. Address Space
SFR Information (2) (1)
Register Name
Symbol
After Reset
INT Input Filter Select Register 0
INTF0
00h
INT Input Edge Select Register 0
ISCR0
00h
Key Input Enable Register
KIEN
00h
Interrupt Priority Level Register 0
ILVL0
00h
Interrupt Priority Level Register 2
Interrupt Priority Level Register 3
Interrupt Priority Level Register 4
Interrupt Priority Level Register 5
Interrupt Priority Level Register 6
Interrupt Priority Level Register 7
Interrupt Priority Level Register 8
Interrupt Priority Level Register 9
Interrupt Priority Level Register A
Interrupt Priority Level Register B
Interrupt Priority Level Register C
Interrupt Priority Level Register D
Interrupt Priority Level Register E
ILVL2
ILVL3
ILVL4
ILVL5
ILVL6
ILVL7
ILVL8
ILVL9
ILVLA
ILVLB
ILVLC
ILVLD
ILVLE
00h
00h
00h
00h
00h
00h
00h
00h
00h
00h
00h
00h
00h
Interrupt Monitor Flag Register 0
Interrupt Monitor Flag Register 1
Interrupt Monitor Flag Register 2
External Interrupt Flag Register
IRR0
IRR1
IRR2
IRR3
00h
00h
00h
00h
Voltage Monitor Circuit Edge Select Register
VCAC
00h
Voltage Detect Register 2
VCA2
Voltage Detection 1 Level Select Register
Voltage Monitor 0 Circuit Control Register
VD1LS
VW0C
VW1C
00100100b (2)
00000100b (3)
00000111b
1100X011b (2)
1100X010b (3)
10001010b
RSTFR
0000XXXXb (4)
FR18S0
FR18S1
Value when shipped
Value when shipped
FRV1
FRV2
Value when shipped
Value when shipped
Voltage Monitor 1 Circuit Control Register
0005Dh
0005Eh
Reset Source Determination Register
0005Fh
00060h
00061h
00062h
00063h
High-Speed On-Chip Oscillator 18.432 MHz Control Register 0
00064h
High-Speed On-Chip Oscillator 18.432 MHz Control Register 1
00065h
00066h
High-Speed On-Chip Oscillator Control Register 1
00067h
High-Speed On-Chip Oscillator Control Register 2
00068h
00069h
0006Ah
0006Bh
0006Ch
0006Dh
0006Eh
0006Fh
00070h
00071h
00072h
00073h
00074h
00075h
00076h
00077h
00078h
00079h
X: Undefined
Notes:
1. The blank areas are reserved. No access is allowed.
2. The LVDAS bit in the OFS register is 0.
3. The LVDAS bit in the OFS register is 1.
4. The value after a reset differs depending on the reset source.
R01DS0010EJ0010 Rev.0.10
Aug 25, 2010
Page 16 of 45
Under development
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Specifications in this document are tentative and subject to change.
R8C/M11A Group, R8C/M12A Group
Table 3.3
3. Address Space
SFR Information (3) (1)
Address
Register Name
0007Ah
0007Bh
0007Ch
0007Dh
0007Eh
0007Fh
UART0 Transmit/Receive Mode Register
00080h
UART0 Bit Rate Register
00081h
UART0 Transmit Buffer Register
00082h
00083h
UART0 Transmit/Receive Control Register 0
00084h
UART0 Transmit/Receive Control Register 1
00085h
UART0 Receive Buffer Register
00086h
00087h
UART0 Interrupt Flag and Enable Register
00088h
00089h
0008Ah
0008Bh
0008Ch
0008Dh
0008Eh
0008Fh
00090h
00091h
00092h
00093h
00094h
00095h
00096h
00097h
A/D Register 0
00098h
00099h
A/D Register 1
0009Ah
0009Bh
A/D Mode Register
0009Ch
A/D Input Select Register
0009Dh
A/D Control Register 0
0009Eh
A/D Interrupt Control Status Register
0009Fh
000A0h
000A1h
000A2h
000A3h
000A4h
000A5h
000A6h
000A7h
000A8h
Port P1 Direction Register
000A9h
000AAh
Port P3 Direction Register
000ABh
Port P4 Direction Register
000ACh
Port PA Direction Register
000ADh
000AEh
Port P1 Register
000AFh
000B0h
Port P3 Register
000B1h
Port P4 Register
000B2h
Port PA Register
000B3h
000B4h
Pull-Up Control Register 1
000B5h
000B6h
Pull-Up Control Register 3
000B7h
Pull-Up Control Register 4
000B8h
Port I/O Function Control Register
000B9h
000BAh
Drive Capacity Control Register 1
000BBh
000BCh
Drive Capacity Control Register 3
000BDh
000BEh
000BFh
X: Undefined
Note:
1. The blank areas are reserved. No access is allowed.
R01DS0010EJ0010 Rev.0.10
Aug 25, 2010
Symbol
After Reset
U0MR
U0BRG
U0TBL
U0TBH
U0C0
U0C1
U0RBL
U0RBH
U0IR
00h
XXh
XXh
XXh
00001000b
00000010b
XXh
XXh
00h
AD0L
AD0H
AD1L
AD1H
ADMOD
ADINSEL
ADCON0
ADICSR
XXh
000000XXb
XXh
000000XXb
00h
00h
00h
00h
PD1
00h
PD3
PD4
PDA
00h
00h
00h
P1
00h
P3
P4
PA
00h
00h
00h
PUR1
00h
PUR3
PUR4
PINSR
00h
00h
00h
DRR1
00h
DRR3
00h
Page 17 of 45
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R8C/M11A Group, R8C/M12A Group
Table 3.4
Address
000C0h
000C1h
000C2h
000C3h
000C4h
000C5h
000C6h
000C7h
000C8h
000C9h
000CAh
000CBh
000CCh
000CDh
000CEh
000CFh
000D0h
000D1h
000D2h
000D3h
000D4h
000D5h
000D6h
000D7h
000D8h
000D9h
000DAh
000DBh
000DCh
000DDh
000DEh
000DFh
000E0h
000E1h
000E2h
000E3h
000E4h
000E5h
000E6h
3. Address Space
SFR Information (4) (1)
Register Name
Symbol
After Reset
Open-Drain Control Register 1
POD1
00h
Open-Drain Control Register 3
Open-Drain Control Register 4
Port PA Mode Control Register
POD3
POD4
PAMCR
00h
00h
00010001b
Port 1 Function Mapping Register 0
Port 1 Function Mapping Register 1
PML1
PMH1
00h
00h
Port 3 Function Mapping Register 0
Port 3 Function Mapping Register 1
Port 4 Function Mapping Register 0
Port 4 Function Mapping Register 1
PML3
PMH3
PML4
PMH4
00h
00h
00h
00h
Port 1 Function Mapping Expansion Register
PMH1E
00h
Port 4 Function Mapping Expansion Register
PMH4E
00h
Timer RJ Counter Register
TRJ
Timer RJ Control Register
Timer RJ I/O Control Register
Timer RJ Mode Register
Timer RJ Event Select Register
Timer RJ Interrupt Request and Status Register
TRJCR
TRJIOC
TRJMR
TRJISR
TRJIR
FFh
FFh
00h
00h
00h
00h
00h
Timer RB Control Register
Timer RB One-Shot Control Register
Timer RB I/O Control Register
Timer RB Mode Register
Timer RB Prescaler Register (2)
Timer RB Primary/Secondary Register (Lower 8 Bits) (3)
Timer RB Primary Register (2)
Timer RB Primary Register (Higher 8 Bits) (3)
Timer RB Secondary Register (2)
Timer RB Secondary Register (Higher 8 Bits) (3)
Timer RB Interrupt Request and Status Register
Timer RC Counter
TRBCR
TRBOCR
TRBIOC
TRBMR
TRBPRE
00h
00h
00h
00h
FFh
TRBPR
FFh
TRBSC
FFh
TRBIR
TRCCNT
00h
00h
00h
FFh
FFh
FFh
FFh
FFh
FFh
FFh
FFh
01001000b
00h
01110000b
01110000b
10001000b
10001000b
00011000b
00h
01111111b
11110000b
00h
000E7h
000E8h
000E9h
Timer RC General Register A
000EAh
000EBh
Timer RC General Register B
000ECh
000EDh
Timer RC General Register C
000EEh
000EFh
Timer RC General Register D
000F0h
000F1h
Timer RC Mode Register
000F2h
Timer RC Control Register 1
000F3h
Timer RC Interrupt Enable Register
000F4h
Timer RC Status Register
000F5h
Timer RC I/O Control Register 0
000F6h
Timer RC I/O Control Register 1
000F7h
Timer RC Control Register 2
000F8h
Timer RC Digital Filter Function Select Register
000F9h
Timer RC Output Enable Register
000FAh
Timer RC A/D Conversion Trigger Control Register
000FBh
Timer RC Waveform Output Manipulation Register
000FCh
000FDh
000FEh
000FFh
Notes:
1. The blank areas are reserved. No access is allowed.
2. The TCNT16 bit in the TRBMR register is 0.
3. The TCNT16 bit in the TRBMR register is 1.
R01DS0010EJ0010 Rev.0.10
Aug 25, 2010
TRCGRA
TRCGRB
TRCGRC
TRCGRD
TRCMR
TRCCR1
TRCIER
TRCSR
TRCIOR0
TRCIOR1
TRCCR2
TRCDF
TRCOER
TRCADCR
TRCOPR
Page 18 of 45
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R8C/M11A Group, R8C/M12A Group
Table 3.5
3. Address Space
SFR Information (5) (1)
Address
Register Name
00100h
00101h
00102h
00103h
00104h
00105h
00106h
00107h
00108h
00109h
0010Ah
0010Bh
0010Ch
0010Dh
0010Eh
0010Fh
00110h
00111h
00112h
00113h
00114h
00115h
00116h
00117h
00118h
00119h
0011Ah
0011Bh
0011Ch
0011Dh
0011Eh
0011Fh
00120h
00121h
00122h
00123h
00124h
00125h
00126h
00127h
00128h
00129h
0012Ah
0012Bh
0012Ch
0012Dh
0012Eh
0012Fh
00130h
00131h
00132h
00133h
00134h
00135h
00136h
00137h
00138h
00139h
0013Ah
0013Bh
0013Ch
0013Dh
0013Eh
0013Fh
Note:
1. The blank areas are reserved. No access is allowed.
R01DS0010EJ0010 Rev.0.10
Aug 25, 2010
Symbol
After Reset
Page 19 of 45
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R8C/M11A Group, R8C/M12A Group
Table 3.6
3. Address Space
SFR Information (6) (1)
Address
Register Name
00140h
00141h
00142h
00143h
00144h
00145h
00146h
00147h
00148h
00149h
0014Ah
0014Bh
0014Ch
0014Dh
0014Eh
0014Fh
00150h
00151h
00152h
00153h
00154h
00155h
00156h
00157h
00158h
00159h
0015Ah
0015Bh
0015Ch
0015Dh
0015Eh
0015Fh
00160h
00161h
00162h
00163h
00164h
00165h
00166h
00167h
00168h
00169h
0016Ah
0016Bh
0016Ch
0016Dh
0016Eh
0016Fh
00170h
00171h
00172h
00173h
00174h
00175h
00176h
00177h
00178h
00179h
0017Ah
0017Bh
0017Ch
0017Dh
0017Eh
0017Fh
Note:
1. The blank areas are reserved. No access is allowed.
R01DS0010EJ0010 Rev.0.10
Aug 25, 2010
Symbol
After Reset
Page 20 of 45
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R8C/M11A Group, R8C/M12A Group
Table 3.7
3. Address Space
SFR Information (7) (1)
Address
Register Name
Comparator B Control Register
00180h
Comparator B1 Interrupt Control Register
00181h
Comparator B3 Interrupt Control Register
00182h
00183h
00184h
00185h
00186h
00187h
00188h
00189h
0018Ah
0018Bh
0018Ch
0018Dh
0018Eh
0018Fh
00190h
00191h
00192h
00193h
00194h
00195h
00196h
00197h
00198h
00199h
0019Ah
0019Bh
0019Ch
0019Dh
0019Eh
0019Fh
001A0h
001A1h
001A2h
001A3h
001A4h
001A5h
001A6h
001A7h
001A8h
Flash Memory Status Register
001A9h
Flash Memory Control Register 0
001AAh
Flash Memory Control Register 1
001ABh
Flash Memory Control Register 2
001ACh
Flash Memory Refresh Control Register
001ADh
001AEh
001AFh
001B0h
001B1h
001B2h
001B3h
001B4h
001B5h
001B6h
001B7h
001B8h
001B9h
001BAh
001BBh
001BCh
001BDh
001BEh
001BFh
Note:
1. The blank areas are reserved. No access is allowed.
R01DS0010EJ0010 Rev.0.10
Aug 25, 2010
Symbol
WCMPR
WCB1INTR
WCB3INTR
00h
00h
00h
After Reset
FST
FMR0
FMR1
FMR2
FREFR
10000000b
00h
00h
00h
00h
Page 21 of 45
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R8C/M11A Group, R8C/M12A Group
Table 3.8
3. Address Space
SFR Information (8) (1)
Address
Register Name
Address Match Interrupt Register 0
001C0h
001C1h
001C2h
Address Match Interrupt Enable Register 0
001C3h
Address Match Interrupt Register 1
001C4h
001C5h
001C6h
Address Match Interrupt Enable Register 1
001C7h
001C8h
001C9h
001CAh
001CBh
001CCh
001CDh
001CEh
001CFh
001D0h
001D1h
001D2h
001D3h
001D4h
001D5h
001D6h
001D7h
001D8h
001D9h
001DAh
001DBh
001DCh
001DDh
001DEh
001DFh
001E0h
001E1h
001E2h
001E3h
001E4h
001E5h
001E6h
001E7h
001E8h
001E9h
001EAh
001EBh
001ECh
001EDh
001EEh
001EFh
001F0h
001F1h
001F2h
001F3h
001F4h
001F5h
001F6h
001F7h
001F8h
001F9h
001FAh
001FBh
001FCh
001FDh
001FEh
001FFh
Note:
1. The blank areas are reserved. No access is allowed.
R01DS0010EJ0010 Rev.0.10
Aug 25, 2010
Symbol
AIADR0L
AIADR0M
AIADR0H
AIEN0
AIADR1L
AIADR1M
AIADR1H
AIEN1
After Reset
00h
00h
00h
00h
00h
00h
00h
00h
Page 22 of 45
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R8C/M11A Group, R8C/M12A Group
Table 3.9
3. Address Space
ID Code Area and Option Function Select Area
Address
Area Name
Symbol
After Reset
:
Option Function Select Register 2
OFS2
(Note 1)
0FFDBh
:
ID1
(Note 2)
0FFDFh
:
ID2
(Note 2)
0FFE3h
:
ID3
(Note 2)
0FFEBh
:
ID4
(Note 2)
0FFEFh
:
ID5
(Note 2)
0FFF3h
:
ID6
(Note 2)
0FFF7h
:
ID7
(Note 2)
0FFFBh
:
Option Function Select Register
OFS
(Note 1)
0FFFFh
Notes:
1. The option function select area is allocated in the flash memory, not in the SFRs. Set appropriate values as ROM data by a program.
Do not perform an additional write to the option function select area. Erasure of the block including the option function select area causes the
option function select area to be set to FFh.
2. The ID code area is allocated in the flash memory, not in the SFRs. Set appropriate values as ROM data by a program.
Do not perform an additional write to the ID code area. Erasure of the block including the ID code area causes the ID code area to be set to FFh.
R01DS0010EJ0010 Rev.0.10
Aug 25, 2010
Page 23 of 45
Under development
Preliminary document
Specifications in this document are tentative and subject to change.
R8C/M11A Group, R8C/M12A Group
4.
4. Electrical Characteristics
Electrical Characteristics
Table 4.1
Absolute Maximum Ratings
Symbol
Parameter
Condition
VCC/AVCC Power supply voltage
VI
Input voltage
XIN
XIN-XOUT oscillation on
(oscillation circuit used) (1)
XIN-XOUT oscillation off
(oscillation circuit not used) (1)
Other pins
VO
Output voltage
XOUT
XIN-XOUT oscillation on
(oscillation circuit used) (1)
XIN-XOUT oscillation off
(oscillation circuit not used) (1)
Other pins
Pd
Power consumption
Topr
Operating ambient temperature
Tstg
Storage temperature
-40 °C ≤ Topr ≤ 85 °C
Rated Value
Unit
-0.3 to 6.5
V
-0.3 to 1.9
V
-0.3 to Vcc + 0.3
V
-0.3 to Vcc + 0.3
V
-0.3 to 1.9
V
-0.3 to Vcc + 0.3
V
-0.3 to Vcc + 0.3
V
500
mW
-20 to 85 (N version)/
-40 to 85 (D version)
°C
-60 to 150
°C
Note:
1. When the oscillation circuit is used: bits CKPT1 to CKPT0 in the EXCKCR register are set to 11b
When the oscillation circuit is not used: bits CKPT1 to CKPT0 in the EXCKCR register are set to any value other than 11b
R01DS0010EJ0010 Rev.0.10
Aug 25, 2010
Page 24 of 45
Under development
Preliminary document
Specifications in this document are tentative and subject to change.
R8C/M11A Group, R8C/M12A Group
Table 4.2
4. Electrical Characteristics
Recommended Operating Conditions
Symbol
Parameter
Standard
Condition
Unit
Min.
Typ.
Max.
VCC/AVCC Power supply voltage
1.8
—
5.5
V
VSS/AVSS
Power supply voltage
—
0
—
V
VIH
Input high voltage
Other than CMOS input
CMOS input
VIL
Input low voltage
0.8 Vcc
—
Vcc
V
4.0 V ≤ Vcc ≤ 5.5 V
0.65 Vcc
—
Vcc
V
2.7 V ≤ Vcc < 4.0 V
0.7 Vcc
—
Vcc
V
1.8 V ≤ Vcc < 2.7 V
0.8 Vcc
—
Vcc
V
0
—
0.2 Vcc
V
Other than CMOS input
CMOS input
4.0 V ≤ Vcc ≤ 5.5 V
0
—
0.4 Vcc
V
2.7 V ≤ Vcc < 4.0 V
0
—
0.3 Vcc
V
1.8 V ≤ Vcc < 2.7 V
0
—
0.2 Vcc
V
IOH(sum)
Peak sum output high
current
Sum of all pins IOH(peak)
—
—
-160
mA
IOH(sum)
Average sum output high
current
Sum of all pins IOH(avg)
—
—
-80
mA
IOH(peak)
Peak output high current
mA
When drive capacity is low
—
—
-10
When drive capacity is high (5)
—
—
-40
mA
When drive capacity is low
—
—
-5
mA
When drive capacity is high (5)
IOH(avg)
Average output high current
—
—
-20
mA
IOL(sum)
Peak sum output low
current
Sum of all pins IOL(peak)
—
—
160
mA
IOL(sum)
Average sum output low
current
Sum of all pins IOL(avg)
—
—
80
mA
IOL(peak)
Peak output low current
IOL(avg)
Average output low current
When drive capacity is low
—
—
10
mA
When drive capacity is high (5)
—
—
40
mA
When drive capacity is low
—
—
5
mA
—
—
20
mA
MHz
When drive capacity is high
f(XIN)
XIN oscillation frequency
XIN clock input oscillation frequency
(5)
2.7 V ≤ Vcc ≤ 5.5 V
2
—
20
1.8 V ≤ Vcc < 2.7 V
2
—
5
MHz
2.7 V ≤ Vcc ≤ 5.5 V
0
—
20
MHz
1.8 V ≤ Vcc < 2.7 V
0
—
5
MHz
High-speed on-chip oscillator oscillation frequency (3) 1.8 V ≤ Vcc ≤ 5.5 V
—
20
—
MHz
fLOCO
Low-speed on-chip oscillator oscillation frequency (4) 1.8 V ≤ Vcc ≤ 5.5 V
—
125
—
kHz
—
System clock frequency
2.7 V ≤ Vcc ≤ 5.5 V
—
—
20
MHz
1.8 V ≤ Vcc < 2.7 V
—
—
5
MHz
fs
CPU clock frequency
2.7 V ≤ Vcc ≤ 5.5 V
0
—
20
MHz
1.8 V ≤ Vcc < 2.7 V
0
—
5
MHz
fHOCO
Notes:
1. Vcc = 1.8 V to 5.5 V and Topr = -20 °C to 85 °C (N version)/-40 °C to 85 °C (D version), unless otherwise specified.
2. The average output current indicates the average value of current measured during 100 ms.
3. For details, see Table 4.10 High-Speed On-Chip Oscillator Circuit Electrical Characteristics.
4. For details, see Table 4.11 Low-Speed On-Chip Oscillator Circuit Electrical Characteristics.
5. The pins with high drive capacity are P1_2, P1_3, P1_4, P1_5, P3_3, P3_4, P3_5, and P3_7.
P1
P3
P4
Figure 4.1
30 pF
Ports P1, P3, and P4 Timing Measurement Circuit
R01DS0010EJ0010 Rev.0.10
Aug 25, 2010
Page 25 of 45
Under development
Preliminary document
Specifications in this document are tentative and subject to change.
R8C/M11A Group, R8C/M12A Group
Table 4.3
A/D Converter Characteristics
Symbol
Parameter
—
Resolution
—
Absolute accuracy
φAD
4. Electrical Characteristics
A/D conversion clock
—
Permissible signal source
impedance
Condition
Standard
Min.
Typ.
Max.
Unit
—
—
10
Bit
AVcc = 5.0 V
AN0 to AN4, AN7 input
—
—
±3
LSB
AVcc = 3.0 V
AN0 to AN4, AN7 input
—
—
±5
LSB
AVcc = 1.8 V
AN0 to AN4, AN7 input
—
—
±5
LSB
4.0 V ≤ AVcc ≤ 5.5 V (2)
2
—
20
MHz
3.2 V ≤ AVcc ≤ 5.5 V (2)
2
—
16
MHz
2.7 V ≤ AVcc ≤ 5.5 V (2)
2
—
10
MHz
1.8 V ≤ AVcc ≤ 5.5 V
2
—
5
MHz
(2)
3
kΩ
tCONV
Conversion time
AVcc = 5.0 V, φAD = 20 MHz
2.15
—
—
µs
tSAMP
Sampling time
φAD = 20 MHz
0.75
—
—
µs
VIA
Analog input voltage
0
—
AVcc
V
Notes:
1. Vcc/AVcc = 1.8 V to 5.5 V and Vss = 0 V and Topr = -20 °C to 85 °C (N version)/-40 °C to 85 °C (D version), unless otherwise
specified.
2. The A/D conversion result will be undefined in stop mode, or when the flash memory is in low-current-consumption read mode
or stopped. Do not perform A/D conversion in these states. Do not enter these states during A/D conversion.
Table 4.4
Comparator B Electrical Characteristics
Symbol
Parameter
Condition
Standard
Min.
Typ.
Max.
Unit
Vref
IVREF1, IVREF3 input reference voltage
VI
IVCMP1, IVCMP3 input voltage
0
—
Vcc - 1.4
-0.3
—
Vcc + 0.3
V
—
Offset
V
—
5
100
mV
td
Comparator output delay time (2)
VI = Vref ± 100 mV
—
0.1
—
µs
ICMP
Comparator operating current
Vcc = 5.0 V
—
17.5
—
µA
Notes:
1. Vcc = 2.7 V to 5.5 V and Topr = -20 °C to 85 °C (N version)/-40 °C to 85 °C (D version), unless otherwise specified.
2. When the digital filter is disabled.
R01DS0010EJ0010 Rev.0.10
Aug 25, 2010
Page 26 of 45
Under development
Preliminary document
Specifications in this document are tentative and subject to change.
R8C/M11A Group, R8C/M12A Group
Table 4.5
4. Electrical Characteristics
Flash Memory (Program ROM) Electrical Characteristics
Symbol
Parameter
Condition
Standard
Min.
Typ.
Unit
Max.
10,000 (3)
—
—
times
Byte programming time
(program/erase endurance ≤ 1,000
times)
—
80
—
µs
Byte programming time
(program/erase endurance > 1,000
times)
—
160
—
µs
—
Program/erase endurance (2)
—
—
—
Block erase time
—
0.12
—
s
td(SR-SUS)
Transition time to suspend
—
—
0.25 + CPU clock
× 3 cycles
ms
—
Time from suspend until erase restart
—
—
30 + CPU clock
× 1 cycle
µs
td(CMDRST
Time from when command is forcibly
terminated until reading is enabled
—
—
30 + CPU clock
× 1 cycle
µs
READY)
—
Program/erase voltage
1.8
—
5.5
V
—
Read voltage
1.8
—
5.5
V
—
Program/erase temperature
0
—
60
°C
10
—
—
years
—
Data hold time
(7)
Ambient temperature = 85 °C
Notes:
1. Vcc = 2.7 V to 5.5 V and Topr = 0 °C to 60 °C, unless otherwise specified.
2. Definition of program/erase endurance
The number of program/erase cycles is defined on a per-block basis.
If the number of cycles is 10,000, each block can be erased 10,000 times.
For example, if 1,024 cycles of 1-byte-write are performed to different addresses in 1 Kbyte of block A, and then the block is
erased, the number of cycles is counted as one. Note, however, that the same address must not be programmed more than
once before completion of an erase (overwriting prohibited).
3. This indicates the number of times up to which all electrical characteristics can be guaranteed after the last programming/
erase operation. Operation is guaranteed for any number of operations in the range of 1 to the specified minimum (Min).
4. In a system that executes multiple programming operations, the actual erase count can be reduced by shifting the write
addresses in sequence and programming so that as much of the flash memory as possible is used before performing an erase
operation. For example, when programming in 16-byte units, the effective number of rewrites can be minimized by
programming up to 128 units before erasing them all in one operation. It is also advisable to retain data on the number of
erase operations for each block and establish a limit for the number of erase operations performed.
5. If an error occurs during a block erase, execute a clear status register command and then a block erase command at least
three times until the erase error does not occur.
6. For information on the program/erase failure rate, contact a Renesas technical support representative.
7. The data hold time includes the time that the power supply is off and the time the clock is not supplied.
R01DS0010EJ0010 Rev.0.10
Aug 25, 2010
Page 27 of 45
Under development
Preliminary document
Specifications in this document are tentative and subject to change.
R8C/M11A Group, R8C/M12A Group
Table 4.6
4. Electrical Characteristics
Flash Memory (Blocks A and B of Data Flash) Electrical Characteristics
Symbol
Parameter
Standard
Condition
Min.
Typ.
Unit
Max.
10,000 (3)
—
—
times
Byte programming time
—
150
—
µs
—
Block erase time
—
0.05
1
s
td(SR-SUS)
Time delay from suspend request until
suspend
—
—
0.25 + CPU clock
× 3 cycles
ms
—
Time from suspend until erase restart
—
—
30 + CPU clock
× 1 cycle
µs
td(CMDRST- Time from when command is forcibly
READY)
stopped until reading is enabled
—
—
30 + CPU clock
× 1 cycle
µs
—
Program/erase endurance (2)
—
—
Program/erase voltage
1.8
—
5.5
V
—
Read voltage
1.8
—
5.5
V
—
Program/erase temperature
-20
(N version)
—
85
°C
-40
(D version)
—
85
°C
10
—
—
years
—
Data hold time (7)
Ambient temperature = 85 °C
Notes:
1. Vcc = 2.7 V to 5.5 V and Topr = -20 °C to 85 °C (N version)/-40 °C to 85 °C (D version), unless otherwise specified.
2. Definition of program/erase endurance
The number of program/erase cycles is defined on a per-block basis.
If the number of cycles is 10,000, each block can be erased 10,000 times.
For example, if 1,024 cycles of 1-byte-write are performed to different addresses in 1 Kbyte of block A, and then the block is
erased, the number of cycles is counted as one. Note, however, that the same address must not be programmed more than
once before completion of an erase (overwriting prohibited).
3. This indicates the number of times up to which all electrical characteristics can be guaranteed after the last programming/
erase operation. Operation is guaranteed for any number of operations in the range of 1 to the specified minimum (Min).
4. In a system that executes multiple program operations, the actual erase count can be reduced by shifting the write addresses
in sequence and programming so that as much of the flash memory as possible is used before performing an erase operation.
For example, when programming in 16-byte units, the effective number of rewrites can be minimized by programming up to
128 units before erasing them all in one operation. It is also advisable to retain data on the number of erase operations for
each block and establish a limit for the number of erase operations performed.
5. If an error occurs during a block erase, execute a clear status register command and then a block erase command at least
three times until the erase error does not occur.
6. For information on the program/erase failure rate, contact a Renesas technical support representative.
7. The data hold time includes the time that the power supply is off and the time the clock is not supplied.
Suspend request
(FMR21)
FST7
FST6
Clock-dependent
time
Fixed time
Access restart
td(SR-SUS)
FST6, FST7: Bits in FST register
FMR21: Bit in FMR2 register
Figure 4.2
Transition Time until Suspend
R01DS0010EJ0010 Rev.0.10
Aug 25, 2010
Page 28 of 45
Under development
Preliminary document
Specifications in this document are tentative and subject to change.
R8C/M11A Group, R8C/M12A Group
Table 4.7
Symbol
Vdet0
4. Electrical Characteristics
Voltage Detection 0 Circuit Electrical Characteristics
Parameter
Condition
Standard
Unit
Min.
Typ.
Max.
Voltage detection level Vdet0_0 (2)
1.80
1.90
2.05
V
Voltage detection level Vdet0_1 (2)
2.15
2.35
2.50
V
Voltage detection level Vdet0_2 (2)
2.70
2.85
3.05
V
(2)
3.55
3.80
4.05
V
When Vcc decreases from 5 V
to (Vdet0_0 - 0.1) V
—
30
—
µs
VC0E = 1, Vcc = 5.0 V
—
1.5
—
µA
—
—
100
µs
Voltage detection level Vdet0_3
—
Voltage detection 0 circuit response time
—
Self power consumption in voltage detection
circuit
td(E-A)
Wait time until voltage detection circuit
operation starts (4)
(3)
Notes:
1. The measurement condition is Vcc = 1.8 V to 5.5 V and Topr = -20 °C to 85 °C (N version)/-40 °C to 85 °C (D version).
2. Select the voltage detection level with bits VDSEL0 and VDSEL1 in the OFS register.
3. The response time is from when the voltage passes Vdet0 until the voltage monitor 0 reset is generated.
4. The wait time is necessary for the voltage detection circuit to operate when the VC0E bit in the VCA2 register is set to 0 and
then 1.
Table 4.8
Symbol
Vdet1
Voltage Detection 1 Circuit Electrical Characteristics
Parameter
Standard
Min.
Typ.
Max.
Unit
Voltage detection level Vdet1_1 (2)
When Vcc decreases
2.15
2.35
2.55
V
Voltage detection level Vdet1_3 (2)
When Vcc decreases
2.45
2.65
2.85
V
Voltage detection level Vdet1_5 (2)
When Vcc decreases
2.75
2.95
3.15
V
Voltage detection level Vdet1_7
(2)
When Vcc decreases
3.00
3.25
3.55
V
Voltage detection level Vdet1_9
(2)
When Vcc decreases
3.30
3.55
3.85
V
Voltage detection level Vdet1_B (2)
When Vcc decreases
3.60
3.85
4.15
V
Voltage detection level Vdet1_D (2)
When Vcc decreases
3.90
4.15
4.45
V
(2)
When Vcc decreases
4.20
4.45
4.75
V
Voltage detection level Vdet1_F
—
Condition
Hysteresis width at the rising of Vcc in
voltage detection 1 circuit
Vdet1_1 to Vdet1_5 selected
—
0.07
—
V
Vdet1_7 to Vdet1_F selected
—
0.10
—
V
—
Voltage detection 1 circuit response time (3)
When Vcc decreases from 5 V
to (Vdet1_0 - 0.1) V
—
60
150
µs
—
Self power consumption in voltage detection
circuit
VC1E = 1, Vcc = 5.0 V
—
1.7
—
µA
td(E-A)
Wait time until voltage detection circuit
operation starts (4)
—
—
100
µs
Notes:
1. The measurement condition is Vcc = 1.8 V to 5.5 V and Topr = -20 °C to 85 °C (N version)/-40 °C to 85 °C (D version).
2. Select the voltage detection level with bits VD1S1 to VD1S3 in the VD1LS register.
3. The response time is from when the voltage passes Vdet1 until the voltage monitor 1 interrupt request is generated.
4. The wait time is necessary for the voltage detection circuit to operate when the VC1E bit in the VCA2 register is set to 0 and
then 1.
R01DS0010EJ0010 Rev.0.10
Aug 25, 2010
Page 29 of 45
Under development
Preliminary document
Specifications in this document are tentative and subject to change.
R8C/M11A Group, R8C/M12A Group
Table 4.9
4. Electrical Characteristics
Power-On Reset Circuit (2)
Symbol
Parameter
Condition
External power Vcc rise gradient
trth
Standard
Min.
Typ.
Max.
0
—
50,000
Unit
mV/msec
Notes:
1. The measurement condition is Topr = -20 °C to 85 °C (N version)/-40 °C to 85 °C (D version), unless otherwise specified.
2. To use the power-on reset function, enable the voltage monitor 0 reset by setting the LVDAS bit in the OFS register to 0.
Vdet0 (1)
trth
trth
0.5 V
External power Vcc
Voltage detection 0
circuit response time
tw(por) (2)
Internal reset signal
(low active)
1
× 256
fLOCO
1
× 256
fLOCO
Notes:
1. Vdet0 indicates the voltage detection level of the voltage detection 0 circuit. For details, see 7. Voltage Detection Circuit
in the User’s Manual: Hardware.
2. tw(por) is required for a power-on reset to be enabled with the external power Vcc held below the valid voltage (0.5 V) to
enable a power-on reset. When Vcc decreases with voltage monitor 0 reset disabled and then turns on, maintain tw(por) for
1 ms or more.
Figure 4.3
Power-On Reset Circuit Electrical Characteristics
R01DS0010EJ0010 Rev.0.10
Aug 25, 2010
Page 30 of 45
Under development
Preliminary document
Specifications in this document are tentative and subject to change.
R8C/M11A Group, R8C/M12A Group
Table 4.10
Symbol
—
4. Electrical Characteristics
High-Speed On-Chip Oscillator Circuit Electrical Characteristics
Parameter
Condition
Standard
Unit
Min.
Typ.
Max.
High-speed on-chip oscillator frequency after Vcc = 5.0 V, Topr = 25 °C
reset is cleared
TBD
20
TBD
MHz
High-speed on-chip oscillator frequency
when the FR18S0 register adjustment value
is written into the FRV1 register and the
FR18S1 register adjustment value into the
FRV2 register (2)
TBD
18.432
TBD
MHz
Vcc = 2.7 V to 5.5 V
-20 °C ≤ Topr ≤ 85 °C
TBD
—
TBD
%
Vcc = 2.7 V to 5.5 V
-40 °C ≤ Topr ≤ 85 °C
TBD
—
TBD
%
Vcc = 2.2 V to 5.5 V
-20 °C ≤ Topr ≤ 85 °C
TBD
—
TBD
%
Vcc = 2.2 V to 5.5 V
-40 °C ≤ Topr ≤ 85 °C
TBD
—
TBD
%
Vcc = 1.8 V to 5.5 V
-20 °C ≤ Topr ≤ 85 °C
TBD
—
TBD
%
Vcc = 1.8 V to 5.5 V
-40 °C ≤ Topr ≤ 85 °C
TBD
—
TBD
%
High-speed on-chip oscillator frequency
dependence on temperature and power
supply voltage (3)
—
Oscillation stabilization time
Vcc = 5.0 V, Topr = 25 °C
—
100
450
µs
—
Self power consumption at oscillation
Vcc = 5.0 V, Topr = 25 °C
—
400
—
µA
Notes:
1. Vcc = 1.8 V to 5.5 V, Topr = -20 °C to 85 °C (N version)/-40 °C to 85 °C (D version), unless otherwise specified.
2. This enables the setting errors of bit rates such as 9600 bps and 38400 bps to be 0 % when the serial interface is used in
UART mode.
3. This indicates the precision error for the oscillation frequency of the high-speed on-chip oscillator.
Table 4.11
Symbol
Low-Speed On-Chip Oscillator Circuit Electrical Characteristics
Parameter
Condition
Standard
Min.
Typ.
Max.
Unit
fLOCO
Low-speed on-chip oscillator frequency
60
125
250
—
Oscillation stabilization time
Vcc = 5.0 V, Topr = 25 °C
—
10
100
kHz
µs
—
Self power consumption at oscillation
Vcc = 5.0 V, Topr = 25 °C
—
2
—
µA
Note:
1. Vcc = 1.8 V to 5.5 V, Topr = -20 °C to 85 °C (N version)/-40 °C to 85 °C (D version), unless otherwise specified.
Table 4.12
Symbol
td(P-R)
Power Supply Circuit Timing Characteristics
Parameter
Condition
Standard
Min.
Typ.
Max.
—
—
2,000
Time for internal power supply stabilization
during power-on (2)
Unit
µs
Notes:
1. The measurement condition is Vcc = 1.8 V to 5.5 V and Topr = 25 °C.
2. Wait time until the internal power supply generation circuit stabilizes during power-on.
R01DS0010EJ0010 Rev.0.10
Aug 25, 2010
Page 31 of 45
Under development
Preliminary document
Specifications in this document are tentative and subject to change.
R8C/M11A Group, R8C/M12A Group
Table 4.13
DC Characteristics (1) [4.0 V ≤ Vcc ≤ 5.5 V]
Symbol
VOH
4. Electrical Characteristics
Parameter
Output high voltage
Condition
IOH = -5 mA
Output low voltage
P1_2, P1_3, P1_4, P1_5,
When drive
IOL = 20 mA
P3_3, P3_4, P3_5, P3_7 (2) capacity is high
When drive
IOL = 5 mA
capacity is low
IOL = 5 mA
P1_0, P1_1, P1_6, P1_7,
P4_2, P4_5, P4_6, P4_7,
PA_0
Unit
Typ.
Max.
—
Vcc
V
—
Vcc
V
Vcc - 2.0
—
Vcc
V
—
—
2.0
V
—
—
2.0
V
—
—
2.0
V
—
V
P1_2, P1_3, P1_4, P1_5,
When drive
IOH = -20 mA Vcc - 2.0
P3_3, P3_4, P3_5, P3_7 (2) capacity is high
When drive
IOH = -5 mA Vcc - 2.0
capacity is low
P1_0, P1_1, P1_6, P1_7,
P4_2, P4_5, P4_6, P4_7,
PA_0
VOL
Standard
Min.
INT0, INT1, INT2, INT3,
KI0, KI1, KI2, KI3,
TRJIO, TRCIOA, TRCIOB,
TRCIOC, TRCIOD,
RXD0, CLK0
Vcc = 5 V
0.1
1.2
RESET
Vcc = 5 V
0.1
1.2
—
V
VI = 5 V, Vcc = 5.0 V
—
—
5.0
µA
—
—
-5.0
µA
25
50
100
kΩ
2.2
—
MΩ
—
—
V
VT+-VT-
Hysteresis
IIH
Input high current
IIL
Input low current
VI = 0 V, Vcc = 5.0 V
RPULLUP
Pull-up resistance
VI = 0 V, Vcc = 5.0 V
RfXIN
Feedback resistance XIN
—
VRAM
RAM hold voltage
In stop mode
1.8
Notes:
1. 4.0 V ≤ Vcc ≤ 5.5 V and Topr = -20 °C to 85 °C (N version)/-40 °C to 85 °C (D version), f(XIN) = 20 MHz, unless otherwise
specified.
2. High drive capacity can also be used while the peripheral output function is used.
R01DS0010EJ0010 Rev.0.10
Aug 25, 2010
Page 32 of 45
Under development
Preliminary document
Specifications in this document are tentative and subject to change.
R8C/M11A Group, R8C/M12A Group
Table 4.14
4. Electrical Characteristics
DC Characteristics (2) [4.0 V ≤ Vcc ≤ 5.5 V]
(Topr = -20 °C to 85 °C (N version)/-40 °C to 85 °C (D version), unless otherwise
specified)
Condition
Oscillation
Circuit
Symbol Parameter
ICC
Power
supply
current (1)
CPU
Clock
XIN (2)
HighSpeed
LowSpeed
20 MHz
Off
125 kHz
No
division
16 MHz
Off
125 kHz
10 MHz
Off
20 MHz
Low-PowerConsumption
Setting
Standard
Unit
Other
Min.
Typ. (3)
Max.
—
—
3
7.0
mA
No
division
—
—
2.5
6.0
mA
125 kHz
No
division
—
—
1.7
—
mA
Off
125 kHz
Division
by 8
—
—
1.5
—
mA
16 MHz
Off
125 kHz
Division
by 8
—
—
1.2
—
mA
10 MHz
Off
125 kHz
Division
by 8
—
—
1.0
—
mA
Off
20 MHz
125 kHz
No
division
—
3.5
7.5
mA
Off
20 MHz
125 kHz
Division
by 8
—
2.0
—
mA
Off
4 MHz (4)
125 kHz
Division
by 16
MSTTRC = 1
—
1.0
—
mA
Low-speed
on-chip
oscillator
mode
Off
Off
125 kHz
Division
by 8
FMR27 = 1
LPE = 0
—
60
270
µA
Wait mode
Off
Off
125 kHz
—
VC1E = 0
VC0E = 0
LPE = 1
Peripheral
clock supplied
during WAIT
instruction
execution
—
15
100
µA
Off
Off
125 kHz
—
VC1E = 0
VC0E = 0
LPE = 1
WCKSTP = 1
Peripheral
clock stopped
during WAIT
instruction
execution
—
4.0
90
µA
Off
Off
Off
—
VC1E = 0
VC0E = 0
STPM = 1
Topr = 25 °C
Peripheral
clock stopped
—
1.0
4.0
µA
Off
Off
Off
—
VC1E = 0
VC0E = 0
STPM = 1
Topr = 85 °C
Peripheral
clock stopped
—
1.5
—
µA
High-speed
clock mode
High-speed
on-chip
oscillator
mode
Stop mode
Notes:
1.
2.
3.
4.
On-Chip Oscillator
Vcc = 4.0 V to 5.5 V, single-chip mode, output pins are open, and other pins are connected to Vss.
When the XIN input is a square wave.
Vcc = 5.0 V
Set the system clock to 4 MHz with the PHISEL register.
R01DS0010EJ0010 Rev.0.10
Aug 25, 2010
Page 33 of 45
Under development
Preliminary document
Specifications in this document are tentative and subject to change.
R8C/M11A Group, R8C/M12A Group
4. Electrical Characteristics
Timing Requirements (Vcc = 5 V, Vss = 0 V at Topr = 25 °C, unless otherwise specified)
Table 4.15
XIN Input
Symbol
Standard
Parameter
Min.
Max.
Unit
tc(XIN)
XIN input cycle time
50
—
ns
tWH(XIN)
XIN input high width
24
—
ns
tWL(XIN)
XIN input low width
24
—
ns
tC(XIN)
Vcc = 5 V
tWH(XIN)
XIN input
tWL(XIN)
Figure 4.4
XIN Input Timing When Vcc = 5 V
Table 4.16
TRJIO Input
Symbol
Standard
Parameter
Min.
Max.
Unit
tc(TRJIO)
TRJIO input cycle time
100
—
ns
tWH(TRJIO)
TRJIO input high width
40
—
ns
tWL(TRJIO)
TRJIO input low width
40
—
ns
tC(TRJIO)
Vcc = 5 V
tWH(TRJIO)
TRJIO input
tWL(TRJIO)
Figure 4.5
TRJIO Input Timing When Vcc = 5 V
R01DS0010EJ0010 Rev.0.10
Aug 25, 2010
Page 34 of 45
Under development
Preliminary document
Specifications in this document are tentative and subject to change.
R8C/M11A Group, R8C/M12A Group
Table 4.17
4. Electrical Characteristics
Serial Interface
Symbol
Standard
Parameter
Min.
Max.
Unit
tc(CK)
CLK0 input cycle time
200
—
tW(CKH)
CLK0 input high width
100
—
ns
tW(CKL)
CLK0 input low width
100
—
ns
td(C-Q)
TXD0 output delay time
—
50
ns
th(C-Q)
TXD0 hold time
0
—
ns
tsu(D-C)
RXD0 input setup time
50
—
ns
th(C-D)
RXD0 input hold time
90
—
ns
tC(CK)
ns
Vcc = 5 V
tW(CKH)
CLK0
tW(CKL)
th(C-Q)
TXD0
td(C-Q)
tsu(D-C)
th(C-D)
RXD0
Figure 4.6
Serial Interface Timing When Vcc = 5 V
Table 4.18
External Interrupt INTi Input, Key Input Interrupt KIi (i = 0 to 3)
Symbol
tW(INH)
tW(INL)
Standard
Parameter
INTi input high width, KIi input high width
Max.
250 (1)
—
ns
(2)
—
ns
250
INTi input low width, KIi input low width
Unit
Min.
Notes:
1. When the digital filter is enabled by the INTi input filter select bit, the INTi input high width is (1/digital filter clock frequency × 3)
or the minimum value of the standard, whichever is greater.
2. When the digital filter is enabled by the INTi input filter select bit, the INTi input low width is (1/digital filter clock frequency × 3)
or the minimum value of the standard, whichever is greater.
Vcc = 5 V
tW(INL)
INTi input
KIi input
(i = 0 to 3)
Figure 4.7
tW(INH)
Timing for External Interrupt INTi Input and Key Input Interrupt KIi When Vcc = 5 V
R01DS0010EJ0010 Rev.0.10
Aug 25, 2010
Page 35 of 45
Under development
Preliminary document
Specifications in this document are tentative and subject to change.
R8C/M11A Group, R8C/M12A Group
Table 4.19
DC Characteristics (3) [2.7 V ≤ Vcc < 4.0 V]
Symbol
VOH
4. Electrical Characteristics
Parameter
Output high voltage
Condition
Output low voltage
Unit
Typ.
Max.
P1_2, P1_3, P1_4, P1_5,
When drive
IOH = -5 mA
P3_3, P3_4, P3_5, P3_7 (2) capacity is high
When drive
IOH = -1 mA
capacity is low
Vcc - 0.5
—
Vcc
V
Vcc - 0.5
—
Vcc
V
IOH = -1 mA
Vcc - 0.5
—
Vcc
V
P1_2, P1_3, P1_4, P1_5,
When drive
IOL = 5 mA
P3_3, P3_4, P3_5, P3_7 (2) capacity is high
When drive
IOL = 1 mA
capacity is low
—
—
0.5
V
—
—
0.5
V
IOL = 1 mA
—
—
0.5
V
—
V
P1_0, P1_1, P1_6, P1_7,
P4_2, P4_5, P4_6, P4_7,
PA_0
VOL
Standard
Min.
P1_0, P1_1, P1_6, P1_7,
P4_2, P4_5, P4_6, P4_7,
PA_0
INT0, INT1, INT2, INT3,
KI0, KI1, KI2, KI3,
TRJIO, TRCIOA, TRCIOB,
TRCIOC, TRCIOD,
RXD0, CLK0
Vcc = 3 V
0.1
0.4
RESET
Vcc = 3 V
0.1
0.5
—
V
VI = 3 V, Vcc = 3.0 V
—
—
4.0
µA
—
—
-4.0
µA
42
84
168
kΩ
2.2
—
MΩ
—
—
V
VT+-VT-
Hysteresis
IIH
Input high current
IIL
Input low current
VI = 0 V, Vcc = 3.0 V
RPULLUP
Pull-up resistance
VI = 0 V, Vcc = 3.0 V
RfXIN
Feedback resistance XIN
—
VRAM
RAM hold voltage
In stop mode
1.8
Notes:
1. 2.7 V ≤ Vcc < 4.0 V and Topr = -20 °C to 85 °C (N version)/-40 °C to 85 °C (D version), f(XIN) = 10 MHz, unless otherwise
specified.
2. High drive capacity can also be used while the peripheral output function is used.
R01DS0010EJ0010 Rev.0.10
Aug 25, 2010
Page 36 of 45
Under development
Preliminary document
Specifications in this document are tentative and subject to change.
R8C/M11A Group, R8C/M12A Group
Table 4.20
4. Electrical Characteristics
DC Characteristics (4) [2.7 V ≤ Vcc < 4.0 V]
(Topr = -20 °C to 85 °C (N version)/-40 °C to 85 °C (D version), unless otherwise
specified)
Condition
Oscillation
Circuit
Symbol Parameter
ICC
Power
supply
current (1)
CPU
Clock
XIN (2)
HighSpeed
LowSpeed
20 MHz
Off
125 kHz
No
division
16 MHz
Off
125 kHz
10 MHz
Off
20 MHz
Low-PowerConsumption
Setting
Standard
Unit
Other
Min.
Typ. (3)
Max.
—
—
3.0
7.0
mA
No
division
—
—
2.5
6.0
mA
125 kHz
No
division
—
—
1.6
5.0
mA
Off
125 kHz
Division
by 8
—
—
1.5
—
mA
16 MHz
Off
125 kHz
Division
by 8
—
—
1.2
—
mA
10 MHz
Off
125 kHz
Division
by 8
—
—
0.9
4.5
mA
Off
20 MHz
125 kHz
No
division
—
3.5
7.5
mA
Off
20 MHz
125 kHz
Division
by 8
—
2.0
—
mA
Off
10 MHz (4) 125 kHz
No
division
—
2.2
—
mA
Off
10 MHz (4) 125 kHz
Division
by 8
—
1.4
—
mA
Off
4 MHz (4)
125 kHz
Division
by 16
MSTTRC = 1
—
1.0
—
mA
Low-speed
on-chip
oscillator
mode
Off
Off
125 kHz
Division
by 8
FMR27 = 1
LPE = 0
—
60
260
µA
Wait mode
Off
Off
125 kHz
—
VC1E = 0
VC0E = 0
LPE = 1
Peripheral
clock supplied
during WAIT
instruction
execution
—
15
90
µA
Off
Off
125 kHz
—
VC1E = 0
VC0E = 0
LPE = 1
WCKSTP = 1
Peripheral
clock stopped
during WAIT
instruction
execution
—
4.0
80
µA
Off
Off
Off
—
VC1E = 0
VC0E = 0
STPM = 1
Topr = 25 °C
Peripheral
clock stopped
—
1.0
4.0
µA
Off
Off
Off
—
VC1E = 0
VC0E = 0
STPM = 1
Topr = 85 °C
Peripheral
clock stopped
—
1.5
—
µA
High-speed
clock mode
High-speed
on-chip
oscillator
mode
Stop mode
Notes:
1.
2.
3.
4.
On-Chip Oscillator
Vcc = 2.7 V to 4.0 V, single-chip mode, output pins are open, and other pins are connected to Vss.
When the XIN input is a square wave.
Vcc = 3.0 V
Set the system clock to 10 MHz or 4 MHz with the PHISEL register.
R01DS0010EJ0010 Rev.0.10
Aug 25, 2010
Page 37 of 45
Under development
Preliminary document
Specifications in this document are tentative and subject to change.
R8C/M11A Group, R8C/M12A Group
4. Electrical Characteristics
Timing Requirements (Vcc = 3 V, Vss = 0 V at Topr = 25 °C, unless otherwise specified)
Table 4.21
XIN Input
Symbol
Standard
Parameter
Min.
Max.
Unit
tc(XIN)
XIN input cycle time
50
—
ns
tWH(XIN)
XIN input high width
24
—
ns
tWL(XIN)
XIN input low width
24
—
ns
tC(XIN)
Vcc = 3 V
tWH(XIN)
XIN input
tWL(XIN)
Figure 4.8
XIN Input Timing When Vcc = 3 V
Table 4.22
TRJIO Input
Symbol
Standard
Parameter
Min.
Max.
Unit
tc(TRJIO)
TRJIO input cycle time
300
—
ns
tWH(TRJIO)
TRJIO input high width
120
—
ns
tWL(TRJIO)
TRJIO input low width
120
—
ns
tC(TRJIO)
Vcc = 3 V
tWH(TRJIO)
TRJIO input
tWL(TRJIO)
Figure 4.9
TRJIO Input Timing When Vcc = 3 V
R01DS0010EJ0010 Rev.0.10
Aug 25, 2010
Page 38 of 45
Under development
Preliminary document
Specifications in this document are tentative and subject to change.
R8C/M11A Group, R8C/M12A Group
Table 4.23
4. Electrical Characteristics
Serial Interface
Symbol
Standard
Parameter
Min.
Max.
Unit
tc(CK)
CLK0 input cycle time
300
—
tW(CKH)
CLK0 input high width
150
—
ns
tW(CKL)
CLK0 input low width
150
—
ns
td(C-Q)
TXD0 output delay time
—
80
ns
th(C-Q)
TXD0 hold time
0
—
ns
tsu(D-C)
RXD0 input setup time
70
—
ns
th(C-D)
RXD0 input hold time
90
—
ns
tC(CK)
ns
Vcc = 3 V
tW(CKH)
CLK0
tW(CKL)
th(C-Q)
TXD0
td(C-Q)
tsu(D-C)
th(C-D)
RXD0
Figure 4.10
Table 4.24
Serial Interface Timing When Vcc = 3 V
External Interrupt INTi Input, Key Input Interrupt KIi (i = 0 to 3)
Symbol
tW(INH)
tW(INL)
Standard
Parameter
INTi input high width, KIi input high width
Max.
380 (1)
—
ns
(2)
—
ns
380
INTi input low width, KIi input low width
Unit
Min.
Notes:
1. When the digital filter is enabled by the INTi input filter select bit, the INTi input high width is (1/digital filter clock frequency × 3)
or the minimum value of the standard, whichever is greater.
2. When the digital filter is enabled by the INTi input filter select bit, the INTi input low width is (1/digital filter clock frequency × 3)
or the minimum value of the standard, whichever is greater.
Vcc = 3 V
tW(INL)
INTi input
KIi input
(i = 0 to 3)
Figure 4.11
tW(INH)
Timing for External Interrupt INTi Input and Key Input Interrupt KIi When Vcc = 3 V
R01DS0010EJ0010 Rev.0.10
Aug 25, 2010
Page 39 of 45
Under development
Preliminary document
Specifications in this document are tentative and subject to change.
R8C/M11A Group, R8C/M12A Group
Table 4.25
DC Characteristics (5) [1.8 V ≤ Vcc < 2.7 V]
Symbol
VOH
4. Electrical Characteristics
Parameter
Output high voltage
Condition
Output low voltage
Unit
Typ.
Max.
P1_2, P1_3, P1_4, P1_5,
When drive
IOH = -2 mA
P3_3, P3_4, P3_5, P3_7 (2) capacity is high
When drive
IOH = -1 mA
capacity is low
Vcc - 0.5
—
Vcc
V
Vcc - 0.5
—
Vcc
V
IOH = -1 mA
Vcc - 0.5
—
Vcc
V
P1_2, P1_3, P1_4, P1_5,
When drive
IOL = 2 mA
P3_3, P3_4, P3_5, P3_7 (2) capacity is high
When drive
IOL = 1 mA
capacity is low
—
—
0.5
V
—
—
0.5
V
IOL = 1 mA
—
—
0.5
V
—
V
P1_0, P1_1, P1_6, P1_7,
P4_2, P4_5, P4_6, P4_7,
PA_0
VOL
Standard
Min.
P1_0, P1_1, P1_6, P1_7,
P4_2, P4_5, P4_6, P4_7,
PA_0
INT0, INT1, INT2, INT3,
KI0, KI1, KI2, KI3,
TRJIO, TRCIOA, TRCIOB,
TRCIOC, TRCIOD,
RXD0, CLK0
Vcc = 2.2 V
0.05
0.20
RESET
Vcc = 2.2 V
0.05
0.20
—
V
—
—
4.0
µA
—
—
-4.0
µA
70
140
300
kΩ
2.2
—
MΩ
—
—
V
VT+-VT-
Hysteresis
IIH
Input high current
IIL
Input low current
VI = 0 V, Vcc = 2.2 V
RPULLUP
Pull-up resistance
VI = 0 V, Vcc = 2.2 V
RfXIN
Feedback resistance XIN
—
VRAM
RAM hold voltage
In stop mode
1.8
VI = 2.2 V, Vcc = 2.2 V
Notes:
1. 1.8 V ≤ Vcc < 2.7 V and Topr = -20 °C to 85 °C (N version)/-40 °C to 85 °C (D version), f(XIN) = 5 MHz, unless otherwise
specified.
2. High drive capacity can also be used while the peripheral output function is used.
R01DS0010EJ0010 Rev.0.10
Aug 25, 2010
Page 40 of 45
Under development
Preliminary document
Specifications in this document are tentative and subject to change.
R8C/M11A Group, R8C/M12A Group
Table 4.26
4. Electrical Characteristics
DC Characteristics (6) [1.8 V ≤ Vcc < 2.7 V]
(Topr = -20 °C to 85 °C (N version)/-40 °C to 85 °C (D version), unless otherwise
specified)
Condition
Oscillation
Circuit
Symbol Parameter
ICC
Power
supply
current (1)
CPU
Clock
XIN (2)
HighSpeed
LowSpeed
5 MHz
Off
125 kHz
No
division
5 MHz
Off
125 kHz
Division
by 8
Off
5 MHz (4)
125 kHz
Off
5 MHz (4)
Off
Low-speed
on-chip
oscillator
mode
Wait mode
High-speed
clock mode
High-speed
on-chip
oscillator
mode
Stop mode
Notes:
1.
2.
3.
4.
On-Chip Oscillator
Low-PowerConsumption
Setting
Standard
Unit
Other
Min.
Typ. (3)
Max.
—
—
1.0
—
mA
—
—
0.6
—
mA
No
division
—
1.6
6.5
mA
125 kHz
Division
by 8
—
1.1
—
mA
4 MHz (4)
125 kHz
Division
by 16
MSTTRC = 1
—
1.0
—
mA
Off
Off
125 kHz
Division
by 8
FMR27 = 1
LPE = 0
—
60
200
µA
Off
Off
125 kHz —
VC1E = 0
VC0E = 0
LPE = 1
Peripheral
clock supplied
during WAIT
instruction
execution
—
15
90
µA
Off
Off
125 kHz —
VC1E = 0
VC0E = 0
LPE = 1
WCKSTP = 1
Peripheral
clock stopped
during WAIT
instruction
execution
—
4.0
80
µA
Off
Off
Off
—
VC1E = 0
VC0E = 0
STPM = 1
Topr = 25 °C
Peripheral
clock stopped
—
1.0
4.0
µA
Off
Off
Off
—
VC1E = 0
VC0E = 0
STPM = 1
Topr = 85 °C
Peripheral
clock stopped
—
1.5
—
µA
Vcc = 1.8 V to 2.7 V, single-chip mode, output pins are open, and other pins are connected to Vss.
When the XIN input is a square wave.
Vcc = 2.2 V
Set the system clock to 5 MHz or 4 MHz with the PHISEL register.
R01DS0010EJ0010 Rev.0.10
Aug 25, 2010
Page 41 of 45
Under development
Preliminary document
Specifications in this document are tentative and subject to change.
R8C/M11A Group, R8C/M12A Group
4. Electrical Characteristics
Timing Requirements (Vcc = 2.2 V, Vss = 0 V at Topr = 25 °C, unless otherwise specified)
Table 4.27
XIN Input
Symbol
Standard
Parameter
Min.
Max.
Unit
tc(XIN)
XIN input cycle time
200
—
ns
tWH(XIN)
XIN input high width
90
—
ns
tWL(XIN)
XIN input low width
90
—
ns
tC(XIN)
Vcc = 2.2 V
tWH(XIN)
XIN input
tWL(XIN)
Figure 4.12
Table 4.28
XIN Input Timing When Vcc = 2.2 V
TRJIO Input
Symbol
Standard
Parameter
Min.
Max.
Unit
tc(TRJIO)
TRJIO input cycle time
500
—
ns
tWH(TRJIO)
TRJIO input high width
200
—
ns
tWL(TRJIO)
TRJIO input low width
200
—
ns
tC(TRJIO)
Vcc = 2.2 V
tWH(TRJIO)
TRJIO input
tWL(TRJIO)
Figure 4.13
TRJIO Input Timing When Vcc = 2.2 V
R01DS0010EJ0010 Rev.0.10
Aug 25, 2010
Page 42 of 45
Under development
Preliminary document
Specifications in this document are tentative and subject to change.
R8C/M11A Group, R8C/M12A Group
Table 4.29
4. Electrical Characteristics
Serial Interface
Symbol
Standard
Parameter
Min.
Max.
Unit
tc(CK)
CLK0 input cycle time
800
—
tW(CKH)
CLK0 input high width
400
—
ns
tW(CKL)
CLK0 input low width
400
—
ns
td(C-Q)
TXD0 output delay time
—
200
ns
th(C-Q)
TXD0 hold time
0
—
ns
tsu(D-C)
RXD0 input setup time
150
—
ns
th(C-D)
RXD0 input hold time
90
—
ns
tC(CK)
ns
Vcc = 2.2 V
tW(CKH)
CLK0
tW(CKL)
th(C-Q)
TXD0
td(C-Q)
tsu(D-C)
th(C-D)
RXD0
Figure 4.14
Table 4.30
Serial Interface Timing When Vcc = 2.2 V
External Interrupt INTi Input, Key Input Interrupt KIi (i = 0 to 3)
Symbol
tW(INH)
tW(INL)
Standard
Parameter
INTi input high width, KIi input high width
Max.
1,000 (1)
—
ns
(2)
—
ns
1,000
INTi input low width, KIi input low width
Unit
Min.
Notes:
1. When the digital filter is enabled by the INTi input filter select bit, the INTi input high width is (1/digital filter clock frequency × 3)
or the minimum value of the standard, whichever is greater.
2. When the digital filter is enabled by the INTi input filter select bit, the INTi input low width is (1/digital filter clock frequency × 3)
or the minimum value of the standard, whichever is greater.
Vcc = 2.2 V
tW(INL)
INTi input
KIi input
(i = 0 to 3)
Figure 4.15
tW(INH)
Timing for External Interrupt INTi Input and Key Input Interrupt KIi When Vcc = 2.2 V
R01DS0010EJ0010 Rev.0.10
Aug 25, 2010
Page 43 of 45
Under development
Preliminary document
Specifications in this document are tentative and subject to change.
R8C/M11A Group, R8C/M12A Group
Package Dimensions
Package Dimensions
Diagrams showing the latest package dimensions and mounting information are available in the “Packages” section of
the Renesas Electronics website.
JEITA Package Code
P-TSSOP14-4.4x5-0.65
RENESAS Code
PTSP0014JA-B
*1
Previous Code
TTP-14DV
MASS[Typ.]
0.05g
D
F
14
8
NOTE)
1. DIMENSIONS"*1 (Nom)"AND"*2"
DO NOT INCLUDE MOLD FLASH.
2. DIMENSION"*3"DOES NOT
INCLUDE TRIM OFFSET.
HE
c
*2
E
bp
Index mark
Terminal cross section
( Ni/Pd/Au plating )
Reference
Symbol
7
1
*3
Z
bp
x
M
L1
A
e
A1
θ
L
y
Detail F
R01DS0010EJ0010 Rev.0.10
Aug 25, 2010
D
E
A2
A1
A
bp
b1
c
c1
θ
HE
e
x
y
Z
L
L1
Dimension in Millimeters
Min Nom Max
5.00 5.30
4.40
0.03 0.07 0.10
1.10
0.15 0.20 0.25
0.10 0.15 0.20
0°
8°
6.20 6.40 6.60
0.65
0.13
0.10
0.83
0.4 0.5 0.6
1.0
Page 44 of 45
Under development
Preliminary document
Specifications in this document are tentative and subject to change.
R8C/M11A Group, R8C/M12A Group
JEITA Package Code
P-LSSOP20-4.4x6.5-0.65
RENESAS Code
PLSP0020JB-A
Previous Code
20P2F-A
MASS[Typ.]
0.1g
11
*1
E
20
HE
Package Dimensions
NOTE)
1. DIMENSIONS "*1" AND "*2"
DO NOT INCLUDE MOLD FLASH.
2. DIMENSION "*3" DOES NOT
INCLUDE TRIM OFFSET.
F
1
Index mark
10
c
A1
Reference
Symbol
D
A
L
*2
A2
*3
e
y
bp
Detail F
D
E
A2
A
A1
bp
c
HE
e
y
L
R01DS0010EJ0010 Rev.0.10
Aug 25, 2010
Dimension in Millimeters
Min
6.4
4.3
Nom Max
6.5 6.6
4.4 4.5
1.15
1.45
0.1 0.2
0
0.17 0.22 0.32
0.13 0.15 0.2
0°
10°
6.2 6.4 6.6
0.53 0.65 0.77
0.10
0.3 0.5 0.7
Page 45 of 45
REVISION HISTORY
Rev.
Date
R8C/M11A Group, R8C/M12A Group Datasheet
Description
Page
Summary
0.01
Jan 14, 2010
—
First Edition issued
0.10
Aug 25, 2010
—
Document No. “REJ03B0308” → “R01DS0010EJ”
2, 3
1.1.2 Differences between Groups added
4
Table 1.3 “Reset by voltage detection 0” deleted
5
Table 1.4 “... ROM: VCC = 2.7 V to 5.5 V” → “... ROM: VCC = 1.8 V to 5.5 V”,
“1,000 times (program ROM)” → “10,000 times (program ROM)”,
Note 1 added
6
Table 1.5 revised
8
Figures 1.3 and 1.4 revised
9
Table 1.6 revised
11 to 43
2. Central Processing Unit (CPU), 3. Address Space, 4. Electrical Characteristics
added
All trademarks and registered trademarks are the property of their respective owners.
C-1
General Precautions in the Handling of MPU/MCU Products
The following usage notes are applicable to all MPU/MCU products from Renesas. For detailed usage notes
on the products covered by this manual, refer to the relevant sections of the manual. If the descriptions under
General Precautions in the Handling of MPU/MCU Products and in the body of the manual differ from each
other, the description in the body of the manual takes precedence.
1. Handling of Unused Pins
Handle unused pins in accord with the directions given under Handling of Unused Pins in the
manual.
 The input pins of CMOS products are generally in the high-impedance state. In operation
with an unused pin in the open-circuit state, extra electromagnetic noise is induced in the
vicinity of LSI, an associated shoot-through current flows internally, and malfunctions occur
due to the false recognition of the pin state as an input signal become possible. Unused
pins should be handled as described under Handling of Unused Pins in the manual.
2. Processing at Power-on
The state of the product is undefined at the moment when power is supplied.
 The states of internal circuits in the LSI are indeterminate and the states of register
settings and pins are undefined at the moment when power is supplied.
In a finished product where the reset signal is applied to the external reset pin, the states
of pins are not guaranteed from the moment when power is supplied until the reset
process is completed.
In a similar way, the states of pins in a product that is reset by an on-chip power-on reset
function are not guaranteed from the moment when power is supplied until the power
reaches the level at which resetting has been specified.
3. Prohibition of Access to Reserved Addresses
Access to reserved addresses is prohibited.
 The reserved addresses are provided for the possible future expansion of functions. Do
not access these addresses; the correct operation of LSI is not guaranteed if they are
accessed.
4. Clock Signals
After applying a reset, only release the reset line after the operating clock signal has become
stable. When switching the clock signal during program execution, wait until the target clock
signal has stabilized.
 When the clock signal is generated with an external resonator (or from an external
oscillator) during a reset, ensure that the reset line is only released after full stabilization of
the clock signal. Moreover, when switching to a clock signal produced with an external
resonator (or by an external oscillator) while program execution is in progress, wait until
the target clock signal is stable.
5. Differences between Products
Before changing from one product to another, i.e. to one with a different part number, confirm
that the change will not lead to problems.
 The characteristics of MPU/MCU in the same group but having different part numbers may
differ because of the differences in internal memory capacity and layout pattern. When
changing to products of different part numbers, implement a system-evaluation test for
each of the products.
Notice
1.
All information included in this document is current as of the date this document is issued. Such information, however, is subject to change without any prior notice. Before purchasing or using any Renesas
Electronics products listed herein, please confirm the latest product information with a Renesas Electronics sales office. Also, please pay regular and careful attention to additional and different information to
be disclosed by Renesas Electronics such as that disclosed through our website.
2.
Renesas Electronics does not assume any liability for infringement of patents, copyrights, or other intellectual property rights of third parties by or arising from the use of Renesas Electronics products or
technical information described in this document. No license, express, implied or otherwise, is granted hereby under any patents, copyrights or other intellectual property rights of Renesas Electronics or
others.
3.
You should not alter, modify, copy, or otherwise misappropriate any Renesas Electronics product, whether in whole or in part.
4.
Descriptions of circuits, software and other related information in this document are provided only to illustrate the operation of semiconductor products and application examples. You are fully responsible for
the incorporation of these circuits, software, and information in the design of your equipment. Renesas Electronics assumes no responsibility for any losses incurred by you or third parties arising from the
use of these circuits, software, or information.
5.
When exporting the products or technology described in this document, you should comply with the applicable export control laws and regulations and follow the procedures required by such laws and
regulations. You should not use Renesas Electronics products or the technology described in this document for any purpose relating to military applications or use by the military, including but not limited to
the development of weapons of mass destruction. Renesas Electronics products and technology may not be used for or incorporated into any products or systems whose manufacture, use, or sale is
prohibited under any applicable domestic or foreign laws or regulations.
6.
Renesas Electronics has used reasonable care in preparing the information included in this document, but Renesas Electronics does not warrant that such information is error free. Renesas Electronics
7.
Renesas Electronics products are classified according to the following three quality grades: "Standard", "High Quality", and "Specific". The recommended applications for each Renesas Electronics product
assumes no liability whatsoever for any damages incurred by you resulting from errors in or omissions from the information included herein.
depends on the product's quality grade, as indicated below. You must check the quality grade of each Renesas Electronics product before using it in a particular application. You may not use any Renesas
Electronics product for any application categorized as "Specific" without the prior written consent of Renesas Electronics. Further, you may not use any Renesas Electronics product for any application for
which it is not intended without the prior written consent of Renesas Electronics. Renesas Electronics shall not be in any way liable for any damages or losses incurred by you or third parties arising from the
use of any Renesas Electronics product for an application categorized as "Specific" or for which the product is not intended where you have failed to obtain the prior written consent of Renesas Electronics.
The quality grade of each Renesas Electronics product is "Standard" unless otherwise expressly specified in a Renesas Electronics data sheets or data books, etc.
"Standard":
Computers; office equipment; communications equipment; test and measurement equipment; audio and visual equipment; home electronic appliances; machine tools;
personal electronic equipment; and industrial robots.
"High Quality": Transportation equipment (automobiles, trains, ships, etc.); traffic control systems; anti-disaster systems; anti-crime systems; safety equipment; and medical equipment not specifically
designed for life support.
"Specific":
Aircraft; aerospace equipment; submersible repeaters; nuclear reactor control systems; medical equipment or systems for life support (e.g. artificial life support devices or systems), surgical
implantations, or healthcare intervention (e.g. excision, etc.), and any other applications or purposes that pose a direct threat to human life.
8.
You should use the Renesas Electronics products described in this document within the range specified by Renesas Electronics, especially with respect to the maximum rating, operating supply voltage
range, movement power voltage range, heat radiation characteristics, installation and other product characteristics. Renesas Electronics shall have no liability for malfunctions or damages arising out of the
use of Renesas Electronics products beyond such specified ranges.
9.
Although Renesas Electronics endeavors to improve the quality and reliability of its products, semiconductor products have specific characteristics such as the occurrence of failure at a certain rate and
malfunctions under certain use conditions. Further, Renesas Electronics products are not subject to radiation resistance design. Please be sure to implement safety measures to guard them against the
possibility of physical injury, and injury or damage caused by fire in the event of the failure of a Renesas Electronics product, such as safety design for hardware and software including but not limited to
redundancy, fire control and malfunction prevention, appropriate treatment for aging degradation or any other appropriate measures. Because the evaluation of microcomputer software alone is very difficult,
please evaluate the safety of the final products or system manufactured by you.
10. Please contact a Renesas Electronics sales office for details as to environmental matters such as the environmental compatibility of each Renesas Electronics product. Please use Renesas Electronics
products in compliance with all applicable laws and regulations that regulate the inclusion or use of controlled substances, including without limitation, the EU RoHS Directive. Renesas Electronics assumes
no liability for damages or losses occurring as a result of your noncompliance with applicable laws and regulations.
11. This document may not be reproduced or duplicated, in any form, in whole or in part, without prior written consent of Renesas Electronics.
12. Please contact a Renesas Electronics sales office if you have any questions regarding the information contained in this document or Renesas Electronics products, or if you have any other inquiries.
(Note 1)
"Renesas Electronics" as used in this document means Renesas Electronics Corporation and also includes its majority-owned subsidiaries.
(Note 2)
"Renesas Electronics product(s)" means any product developed or manufactured by or for Renesas Electronics.
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