UESD6V85CT36 5 Line ESD Protection Diode Array UESD6V85CT36 SC70-6/SC88/SOT363 General Description The UESD6V85CT36 of TVS array is designed to protect sensitive electronics from damage or latch-up due to ESD, for use in applications where board space is at a premium. It is unidirectional device and may be used on lines where the signal polarities are above ground, each device will protect up to five lines. TVS diodes are solid-state devices feature large cross-sectional area junctions for conducting high transient currents, specifically for transient suppression. It offers desirable characteristics for board level protection including fast response time, low clamping voltage, and no device degradation. The UESD6V85CT36 may be used to meet the ESD immunity requirements of IEC 61000-4-2, Level 4. The small package makes them ideal for use in portable electronics such as cell phones, PDAs, notebook computers, and digital cameras. Applications Features Cellular Handsets & Accessories Cordless Phones Personal Digital Assistants(PDAs) Notebooks & Handhelds Portable Instrumentation Digital Cameras Peripherals MP3 Players Top View 6 1 5 4 52C M Pin Configurations Transient Protection for Data Lines to IEC 61000-4-2 (ESD) ±15kV (Air), ±8kV (Contact) Protects Five I/O Lines Ultra-Small SC70-6/SC88/SOT363 Package Working Voltages: 5V Low Leakage Current Low Operating and Clamping Voltage Solid-State Silicon Avalanche Technology 6 2 5 3 4 Marking Pin 1 1 2 3 M: Month Code UESD6V85CT36 SC70-6/SC88/SOT363 Ordering Information Part Number Working Voltage Packaging Type Channel Marking Code Shipping Qty UESD6V85CT36 5.0V SC70-6/SC88/SOT363 5 52C 3000pcs/7Inch Tape & Reel ________________________________________________________________________ http://www.union-ic.com Rev.03 Nov.2014 1/6 UESD6V85CT36 Absolute Maximum Ratings RATING SYMBOL VALUE UNITS Peak Pulse Power (tp = 8/20μs) @ TA≤25ºC PPK 140 Watts Thermal Resistance, Junction to Ambient RθJA 325 ºC/W TL 260 (10 sec.) °C Operating Temperature Storage Temperature TJ TSTG -55 to +125 -55 to +125 °C °C Maximum Junction Temperature TJMAX 150 ºC Lead Soldering Temperature Electrical Characteristics PARAMETER Reverse Stand-Off Voltage Reverse Breakdown Voltage Reverse Leakage Current Clamping Voltage SYMBOL CONDITIONS MIN TYP VRWM 5 V 7.2 V μA It = 1mA IR VRWM = 5V, T=25°C 0.1 IPP =5A, tp = 8/20μs 9.1 IPP =11A, tp = 8/20μs 13 Junction Capacitance CJ Junction Capacitance CJ Pin 1, 3, 4, 5, 6 to 2 VR = 0V, f = 1MHz Pin 1, 3, 4, 5, 6 to 2 VR = 2.5V, f = 1MHz 6.8 UNIT VBR VC 6 MAX V 40 50 pF 30 40 pF ________________________________________________________________________ http://www.union-ic.com Rev.03 Nov.2014 2/6 UESD6V85CT36 Typical Operating Characteristics Non-Repetitive Peak Pulse Power vs. Pulse Time Clamping Voltage vs. Peak Pulse Current Forward Voltage vs. Forward Current Junction Capacitance vs. Reverse Voltage ________________________________________________________________________ http://www.union-ic.com Rev.03 Nov.2014 3/6 UESD6V85CT36 Application Information UESD6V85CT36 ESD protection diode is designed to protect 5 data, I/O, or power supply line. The device is unidirectional and may be used on lines where the signal polarity is above ground. The cathode should be placed towards the line that is to be protected. Device Connection for Protection of Quad Data Lines The UESD6V85CT36 TVS diode array is designed to protect up to five unidirectional data lines. The device as follows: Unidirectional protection of five I/O lines is achieved by connecting pins 1, 3, 4, 5, and 6 to the data lines. Pin 2 is connected to ground. The ground connection should be made directly to the ground plane for best results. The path length is kept as short as possible to reduce the effects of parasitic inductance in the board traces. Circuit Board Layout Recommendations for Suppression of ESD Good circuit board layout is critical for the suppression of ESD induced transients. The following guidelines are recommended: Place the TVS near the input terminals or connectors to restrict transient coupling. Minimize the path length between the TVS and the protected line. Minimize all conductive loops including power and ground loops. The ESD transient return path to ground should be kept as short as possible. Never run critical signals near board edges. Use ground planes whenever possible. For multilayer printed-circuit boards, use ground vias. Keep parallel signal paths to a minimum. Avoid running protection conductors in parallel with unprotected conductor. Minimize all printed-circuit board conductive loops including power and ground loops. Avoid using shared transient return paths to a common ground point. ________________________________________________________________________ http://www.union-ic.com Rev.03 Nov.2014 4/6 UESD6V85CT36 Package Information UESD6V85CT36 SC70-6/SC88/SOT363 Outline Drawing D θ e1 Symbol L e 5 4 1 2 3 L1 E E1 6 20 c b A End View A1 A2 Top View Side View A A1 A2 b c D E E1 e e1 L L1 θ DIMENSIONS MILLIMETERS Min Max 0.900 1.100 0.000 0.100 0.900 1.000 0.150 0.350 0.080 0.150 2.000 2.200 1.150 1.350 2.150 2.450 0.650REF 1.200 1.400 0.525REF 0.260 0.460 0° 8° INCHES Min Max 0.035 0.043 0.000 0.004 0.035 0.039 0.006 0.014 0.003 0.006 0.079 0.087 0.045 0.053 0.085 0.096 0.026REF 0.047 0.055 0.021REF 0.010 0.018 0° 8° Land Pattern 1.94 1.30 0.80 NOTES: 1. Compound dimension: 2.10×1.25; 2. Unit: mm; 3.General tolerance ±0.05mm unless otherwise specified; 4. The layout is just for reference. 0.35 52C M Tape and Reel Orientation ________________________________________________________________________ http://www.union-ic.com Rev.03 Nov.2014 5/6 UESD6V85CT36 IMPORTANT NOTICE The information in this document has been carefully reviewed and is believed to be accurate. Nonetheless, this document is subject to change without notice. Union assumes no responsibility for any inaccuracies that may be contained in this document, and makes no commitment to update or to keep current the contained information, or to notify a person or organization of any update. Union reserves the right to make changes, at any time, in order to improve reliability, function or design and to attempt to supply the best product possible. Union Semiconductor, Inc Add: Unit 606, No.570 Shengxia Road, Shanghai 201210 Tel: 021-51093966 Fax: 021-51026018 Website: www.union-ic.com ________________________________________________________________________ http://www.union-ic.com Rev.03 Nov.2014 6/6