UESD6V8Lxx Low Capacitance TVS Diode Array for ESD Protection UESD6V8L4A SC70-5/SC88A/SOT353 UESD6V8L4B SC89-5/SOT553/SOT665 UESD6V8L5A6 SC70-6/SC88/SOT363 UESD6V8L5B SC89-6/SOT563/SOT666 General Description The UESD6V8Lxx of TVS diode array is designed to protect sensitive electronics from damage or latch-up due to ESD, for use in applications where board space is at a premium. It is unidirectional device and may be used on lines where the signal polarities are above ground. UESD6V8L4A and UESD6V8L4B protect up to four lines while UESD6V8L5A6 and UESD6V8L5B will protect up to five lines. TVS diodes are solid-state devices feature large cross-sectional area junctions for conducting high transient currents, specifically for transient suppression. It offers desirable characteristics for board level protection including fast response time, low operating, low clamping voltage, and no device degradation. The UESD6V8Lxx may be used to meet the immunity requirements of IEC 61000-4-2, level 4. The small package makes them ideal for use in portable electronics such as cell phones, PDA’s, notebook computers, and digital cameras. The UESD6V8Lxx is fabricated using dual diffusion technology, offer low junction capacitance (20pF), which is required in high speed signal protection application. . Applications Features z z z z z z z z z Cellular Handsets & Accessories Cordless Phones Personal Digital Assistants (PDA’s) Notebooks & Handhelds Portable Instrumentation Digital Cameras Peripherals MP3 Players z z z z z Transient protection for data lines to IEC 61000-4-2 (ESD) ±15kV (air), ±8kV (contact) Ultra-small package Working Voltages: 5V Low Leakage current Low clamping voltage Solid-state silicon avalanche technology Ordering Information Part Number Working Voltage Packaging Type UESD6V8L4A SC70-5/SC88A/SOT353 UESD6V8L4B SC89-5/SOT553/SOT665 UESD6V8L5A6 UESD6V8L5B 5.0V SC70-6/SC88/SOT363 SC89-6/SOT563/SOT666 Channel 4 5 Marking Code UKA Shipping Qty USB 3000pcs/ 7Inch Reel U6A UB ________________________________________________________________________ http://www.union-ic.com Rev.02 Jul.2012 1/10 UESD6V8Lxx Pin Configurations 1 5 2 3 1 5 2 4 UESD6V8L4A SC70-5/SC88A/SOT353 3 4 1 6 1 6 2 5 2 5 3 4 3 4 UESD6V8L4B SC89-5/SOT553/SOT665 UESD6V8L5A6 SC70-6/SC88/SOT363 UESD6V8L5B SC89-6/SOT563/SOT666 M: Month Code UESD6V8L4B SC89-5/SOT553/SOT665 M: Month Code UESD6V8L5A6 SC70-6/SC88/SOT363 M: Month Code UESD6V8L5B SC89-6/SOT563/SOT666 Top View M: Month Code UESD6V8L4A SC70-5/SC88A/SOT353 ________________________________________________________________________ http://www.union-ic.com Rev.02 Jul.2012 2/10 UESD6V8Lxx Absolute Maximum Ratings Rating Peak Pulse Power (tp = 8/20μs) Symbol Value Unit Lead Soldering Temperature PPK TL 55 260(10 sec.) Watts °C Operating Temperature TJ -55 to +125 °C Storage Temperature TSTG -55 to +125 °C Maximum Junction Temperature TJMAX 150 °C Electrical Characteristics Parameter Reverse Stand-Off Voltage Reverse Breakdown Voltage Reverse Leakage Current Clamping Voltage Symbol Conditions Min Typ Max Unit 5 V 6.8 7.2 V 0.005 0.1 μA VRWM VBR It = 1mA IR VRWM = 5V, T=25°C VC Junction Capacitance CJ Junction Capacitance CJ 6 IPP =1A, tp = 8/20μS 6 IPP =2A, tp = 8/20μS 8 IPP =5A, tp = 8/20μS 10.8 Pin 1,3,4,5,6 to 2 VR = 0V, f = 1MHz Pin 1,3,4,5,6 to 2 VR = 2.5V, f = 1MHz V 20 25 pF 12 17 pF ________________________________________________________________________ http://www.union-ic.com Rev.02 Jul.2012 3/10 UESD6V8Lxx Typical Operating Characteristics Non-Repetitive Peak Pulse Power vs. Pulse Time Clamping Voltage vs. Peak Pulse Current 11 10 Clamping Voltage - Vc (V) Peak Pulse Power - Ppk(kW) 10 1 0.1 9 8 Waveform parameters: tr=8uS td=20uS 7 6 0.01 0.1 0 1 10 100 1 2 1000 Forward Voltage vs. Forward Current 3 4 5 Peak Pulse Current - Ipp (A) Pulse Duration - tp(uS) Junction Capacitance vs. Reverse Voltage 5.0 25 4.5 20 3.5 Capacitance-(pF) Forward Voltage-Vf(V) 4.0 3.0 2.5 2.0 1.5 1.0 15 10 5 0.5 0.0 0 0 1 2 3 4 Forward Current-If(A) 5 6 0 1 2 3 4 Revers Voltage-Vr(V) ________________________________________________________________________ http://www.union-ic.com Rev.02 Jul.2012 4/10 5 UESD6V8Lxx Application Information UESD6V8Lxx can use as unidirectional lines or bidirectional lines protector. For example, UESD6V8L4B can use as a four unidirectional lines protector, and also can use as a three bidirectional lines protector (as figure1 shows). For bidirectional applications, the junction capacitance between I/O ports and ground is half of the single TVS’s junction capacitance, that is to say the typical value of the junction capacitance between I/O ports and ground is 6pF. The break down voltage of these two series connection TVS is a forwards voltage (about 0.7V) higher than a single TVS’s. Figure1: UESD6V8L4B use as three bidirectional lines protector Circuit Board Layout Recommendations for Suppression of ESD Good circuit board layout is critical for the suppression of ESD induced transients. The following guidelines are recommended: 1. Place the TVS near the input terminals or connectors to restrict transient coupling. 2. Minimize the path length between the TVS and the protected line. 3. Minimize all conductive loops including power and ground loops. 4. The ESD transient return path to ground should be kept as short as possible. 5. Never run critical signals near board edges. 6. Use ground planes whenever possible. For multilayer printed-circuit boards, use ground vias. 7. Keep parallel signal paths to a minimum. 8. Avoid running protection conductors in parallel with unprotected conductor. 9. Minimize all printed-circuit board conductive loops including power and ground loops. 10. Avoid using shared transient return paths to a common ground point. ________________________________________________________________________ http://www.union-ic.com Rev.02 Jul.2012 5/10 UESD6V8Lxx Package Information UESD6V8L4A SC70-5/SC88A/SOT353 Outline Drawing Symbol A A1 A2 b c D E E1 e e1 L L1 θ DIMENSIONS MILLIMETERS INCHES Min Max Min Max 0.900 1.100 0.035 0.043 0.000 0.100 0.000 0.004 0.900 1.000 0.035 0.039 0.150 0.350 0.006 0.014 0.080 0.150 0.003 0.006 2.000 2.200 0.079 0.087 1.150 1.350 0.045 0.053 2.150 2.450 0.085 0.096 0.650REF 0.026REF 1.200 1.400 0.047 0.055 0.525REF 0.021REF 0.260 0.460 0.010 0.018 0° 8° 0° 8° Land Pattern NOTES: 1. Compound dimension: 2.10×1.25; 2. Unit: mm; 3. General tolerance ±0.05mm unless otherwise specified; 4. The layout is just for reference. Tape and Reel Orientation ________________________________________________________________________ http://www.union-ic.com Rev.02 Jul.2012 6/10 UESD6V8Lxx UESD6V8L4B SC89-5/SOT553/SOT665 Outline Drawing Symbol A A1 b c D E E1 e L θ DIMENSIONS MILLIMETERS INCHES Min Max Min Max 0.525 0.620 0.021 0.024 0.000 0.050 0.000 0.002 0.150 0.300 0.006 0.012 0.090 0.180 0.004 0.007 1.500 1.700 0.059 0.067 1.100 1.300 0.043 0.051 1.500 1.700 0.059 0.067 0.450 0.550 0.018 0.022 0.100 0.300 0.004 0.012 7°REF 7°REF *: The maximum length is 0.10mm. Land Pattern NOTES: 1. Compound dimension: 1.60×1.20; 2. Unit: mm; 3. General tolerance ±0.05mm unless otherwise specified; 4. The layout is just for reference. Tape and Reel Orientation ________________________________________________________________________ http://www.union-ic.com Rev.02 Jul.2012 7/10 UESD6V8Lxx UESD6V8L5A6 SC70-6/SC88/SOT363 Outline Drawing Symbol A A1 A2 b c D E E1 e e1 L L1 θ DIMENSIONS MILLIMETERS INCHES Min Max Min Max 0.900 1.100 0.035 0.043 0.000 0.100 0.000 0.004 0.900 1.000 0.035 0.039 0.150 0.350 0.006 0.014 0.080 0.150 0.003 0.006 2.000 2.200 0.079 0.087 1.150 1.350 0.045 0.053 2.150 2.450 0.085 0.096 0.650REF 0.026REF 1.200 1.400 0.047 0.055 0.525REF 0.021REF 0.260 0.460 0.010 0.018 0° 8° 0° 8° Land Pattern NOTES: 1. Compound dimension: 2.10×1.25; 2. Unit: mm; 3. General tolerance ±0.05mm unless otherwise specified; 4. The layout is just for reference. Tape and Reel Orientation ________________________________________________________________________ http://www.union-ic.com Rev.02 Jul.2012 8/10 UESD6V8Lxx UESD6V8L5B SC89-6/SOT563/SOT666 Outline Drawing Symbol A A1 b c D E E1 e L θ DIMENSIONS MILLIMETER INCHES S Min Max Min Max 0.525 0.600 0.021 0.024 0.000 0.050 0.000 0.002 0.150 0.300 0.006 0.012 0.090 0.180 0.004 0.007 1.500 1.700 0.059 0.067 1.100 1.300 0.043 0.051 1.500 1.700 0.059 0.067 0.450 0.550 0.018 0.022 0.100 0.300 0.004 0.012 7°REF 7°REF Land Pattern NOTES: 1. Compound dimension: 1.60×1.20; 2. Unit: mm; 3.General tolerance ±0.05mm unless otherwise specified; 4. The layout is just for reference. Tape and Reel Orientation ________________________________________________________________________ http://www.union-ic.com Rev.02 Jul.2012 9/10 UESD6V8Lxx IMPORTANT NOTICE The information in this document has been carefully reviewed and is believed to be accurate. Nonetheless, this document is subject to change without notice. Union assumes no responsibility for any inaccuracies that may be contained in this document, and makes no commitment to update or to keep current the contained information, or to notify a person or organization of any update. Union reserves the right to make changes, at any time, in order to improve reliability, function or design and to attempt to supply the best product possible. Union Semiconductor, Inc Add: 2F, No. 3, Lane 647 Songtao Road, Shanghai 201203 Tel: 021-51093966 Fax: 021-51026018 Website: www.union-ic.com ________________________________________________________________________ http://www.union-ic.com Rev.02 Jul.2012 10/10