TE**FB SERIES BIDIRECTIONAL TVS DIODE ARRAY APPLICATIONS ◆ Cell Phone Handsets and Accessories ◆ Microprocessor based equipment SOD-323 ◆ Personal Digital Assistants (PDA’s) ◆ Notebooks, Desktops, and Servers ◆ Portable Instrumentation ◆ Peripherals ◆ Pagers IEC COMPATIBILITY ◆ IEC61000-4-2 (ESD) ±15kV (air), ±8kV (contact) ◆ IEC61000-4-4 (EFT) 40A (5/50ηs) ◆ IEC61000-4-5 (Lightning) 24A (8/20µs) PIN CONFIGURATION FEATURES ◆ 320 Watts Peak Pulse Power per Line (tp=8/20µs) ◆ Protects one I/O or power line ◆ Low clamping voltage ◆ Working voltages: 3V, 5V, 12V, 15V, 18V, 24V and 36V ◆ Low leakage current MECHANICAL CHARACTERISTICS ◆ JEDEC SOD-323 Package ◆ Molding Compound Flammability Rating : UL 94V-O ◆ Weight 5 Millgrams (Approximate) ◆ Quantity Per Reel : 3,000pcs ◆ Reel Size : 7 inch ◆ Lead Finish : Lead Free REV.2012.5.16 01 | www.spsemi.cn TE**FB SERIES DEVICE CHARACTERISTICS MAXIMUM RATINGS (@ 25℃ Unless Otherwise Specified) PARAMETER SYMBOL VALUE UNITS Peak Pulse Power (tp=8/20µs waveform) PPP 320 Watts Lead Soldering Temperature TL 260 (10 sec.) ℃ Operating Temperature Range TJ -55 ~ 150 ℃ TSTG -55 ~ 150 ℃ Storage Temperature Range ELECTRICAL CHARACTERISTICS PER LINE (@ 25℃ Unless Otherwise Specified) PART NUMBER DEVICE MARKING VRWM VB (V) (V) (max.) (min.) IT VC VC @1A (mA) (max.) (max.) (@A) IR CT (µA) (pF) (max.) (max.) TE03FB 2A 3 4 1 7.5 10.5 20 40 450 TE05FB 2B 5 6 1 9.8 18 17 10 200 TE12FB 2D 12 13.3 1 19 35 12 1 100 TE15FB 2J 15 16.7 1 24 40 10 1 75 TE18FB 2K 18 20.0 1 29 45 9 1 57 TE24FB 2H 24 26.7 1 40 52 7 1 50 TE36FB 2N 36 40 1 40 REV.2012.5.16 1 65 75 5 02| www.spsemi.cn TE**FB SERIES SOD-323 PACKAGE OUTLINE & DIMENSIONS * SOLDERING FOOTPRINT