TU03FB-TU24FB Low Capacitance TVS Diode Array APPLICATIONS ◆ Cell Phone Handsets and Accessories ◆ Microprocessor based equipment SOD-323 ◆ Personal Digital Assistants (PDA’s) ◆ Notebooks, Desktops, and Servers ◆ Portable Instrumentation ◆ Peripherals ◆ USB Interface IEC COMPATIBILITY ◆ IEC61000-4-2 (ESD) ±15kV (air), ±8kV (contact) ◆ IEC61000-4-4 (EFT) 40A (5/50ηs) ◆ IEC61000-4-5 (Lightning) 12A (8/20µs) PIN CONFIGURATION FEATURES ◆ 350 Watts Peak Pulse Power per Line (tp=8/20µs) ◆ Protects one I/O line (bidirectional) ◆ Low clamping voltage ◆ Working voltages: 3V, 5V, 8V, 12V, 15V, 24V ◆ Low leakage current MECHANICAL CHARACTERISTICS ◆ JEDEC SOD-323 Package ◆ Molding Compound Flammability Rating : UL 94V-O ◆ Weight 5 Millgrams (Approximate) ◆ Quantity Per Reel : 3,000pcs ◆ Reel Size : 7 inch ◆ Lead Finish : Lead Free TUxxFB DEVICE CHARACTERISTICS MAXIMUM RATINGS (@ 25℃ Unless Otherwise Specified) SYMBOL VALUE UNITS Peak Pulse Power (tp=8/20µs waveform) PPP 350 Watts Lead Soldering Temperature TL 260 (10 sec.) ℃ Operating Temperature Range TJ -55 ~ 150 ℃ TSTG -55 ~ 150 ℃ PARAMETER Storage Temperature Range ELECTRICAL CHARACTERISTICS PER LINE (@ 25℃ Unless Otherwise Specified) PART NUMBER DEVICE MARKING VRWM VB (V) (V) (max.) (min.) TU03FB CC TU05FB AC 5.0 TU08FB BC 8.0 LC12CI TU12FB DC DC TU15FB TU24FB IT VC IR VC (µA) (pF) (@A) (max.) (typ.) @1A (mA) (max.) (max.) CT 4.0 1 5.15 13.9 8 20 0.6 6.0 1 9.80 18.3 8 5 0.6 8.5 1 13.40 18.5 8 2 0.6 12.0 12.0 13.3 13.3 1 19.00 28.6 6 1 1.2 0.6 EC 15.0 16.7 1 24.00 31.8 5 1 0.6 HC 24.0 26.7 1 43.00 56.0 3 1 0.6 3.0 TUxxFB SOD-323 PACKAGE OUTLINE & DIMENSIONS * SOLDERING FOOTPRINT