J175 datasheet - Fairchild Semiconductor

J175 / J176 / MMBFJ175 / MMBFJ176 / MMBFJ177
P-Channel Switch
Description
This device is designed for low-level analog switching
sample-and-hold circuits and chopper-stabilized
amplifiers. Sourced from process 88.
G
TO-92
12
1
3
Straight Lead
Bulk Packing
2
1. Drain
2. Gate
3. Source
3
S
SOT-23
D
Mark: 6W / 6X / 6Y
Note: Source & drain are interchangeable.
Bent Lead
Tape & Reel
Ammo Packing
Figure 1. J175 / J176 Device Package
Figure 2. MMBFJ175 / 176 / 177 Device Package
Ordering Information
Part Number
Marking
Package
Packing Method
J175_D26Z
J175
TO-92 3L
Tape and Reel
J176_D74Z
J176
TO-92 3L
Ammo
MMBFJ175
6W
SOT-23 3L
Tape and Reel
MMBFJ176
6X
SOT-23 3L
Tape and Reel
MMBFJ177
6Y
SOT-23 3L
Tape and Reel
©1997 Fairchild Semiconductor Corporation
J175 / J176 / MMBFJ175 / MMBFJ176 / MMBFJ177 Rev. 1.6
www.fairchildsemi.com
J175 / J176 / MMBFJ175 / MMBFJ176 / MMBFJ177 — P-Channel Switch
September 2015
Stresses exceeding the absolute maximum ratings may damage the device. The device may not function or be operable above the recommended operating conditions and stressing the parts to these levels is not recommended. In addition, extended exposure to stresses above the recommended operating conditions may affect device reliability. The
absolute maximum ratings are stress ratings only. Values are at TA = 25°C unless otherwise noted.
Parameter
Symbol
Value
Unit
VDG
Drain-Gate Voltage
-30
V
VGS
Gate-Source Voltage
30
V
IGF
Forward Gate Current
50
mA
-55 to + 150
°C
TJ, TSTG
Operating and Storage Junction Temperature Range
Notes:
1. These ratings are based on a maximum junction temperature of 150°C.
2. These are steady-state limits. Fairchild Semiconductor should be consulted on applications involving pulsed or
low-duty cycle operations.
Thermal Characteristics
Values are at TA = 25°C unless otherwise noted.
Max.
Symbol
PD
Parameter
Total Device Dissipation
J175 / J176 (3)
MMBFJ175 /
MMBFJ176 /
MMBFJ177 (3)
Unit
350
225
mW
1.8
mW/°C
Derate Above 25°C
2.8
RθJC
Thermal Resistance, Junction to Case
125
RθJA
Thermal Resistance, Junction to Ambient
357
°C/W
556
°C/W
Note:
3. PCB size: FR-4, 76 mm x 114 mm x 1.57 mm (3.0 inch x 4.5 inch x 0.062 inch) with minimum land pattern size.
© 1997 Fairchild Semiconductor Corporation
J175 / J176 / MMBFJ175 / MMBFJ176 / MMBFJ177 Rev. 1.6
www.fairchildsemi.com
2
J175 / J176 / MMBFJ175 / MMBFJ176 / MMBFJ177 — P-Channel Switch
Absolute Maximum Ratings(1),(2)
Values are at TA = 25°C unless otherwise noted.
Symbol
Parameter
Conditions
Min.
Max.
Unit
Off Characteristics
V(BR)GSS
IGSS
VGS(off)
Gate-Source Breakdown Voltage
IG = 1.0 μA, VDS = 0
Gate Reverse Current
VGS = 20 V, VDS = 0
Gate-Source Cut-Off Voltage
30
V
1.0
J175 /
MMBFJ175
3.0
6.0
VDS = -15 V, ID = -10 nA J176 /
MMBFJ176
1.0
4.0
MMBFJ177
0.8
2.5
J175 /
MMBFJ175
-7.0
-60.0
J176 /
MMBFJ176
-2.0
-25.0
MMBFJ177
-1.5
-20.0
nA
V
On Characteristics
IDSS
rDS(on)
Zero-Gate Voltage Drain Current(4) VDS = -15 V, IGS = 0
Drain-Source On Resistance
VDS ≤ 0.1 V, VGS = 0
J175 /
MMBFJ175
125
J176 /
MMBFJ176
250
MMBFJ177
300
mA
Ω
Note:
4. Pulse test: pulse width ≤ 300 μs, duty cycle ≤ 2.0%.
© 1997 Fairchild Semiconductor Corporation
J175 / J176 / MMBFJ175 / MMBFJ176 / MMBFJ177 Rev. 1.6
www.fairchildsemi.com
3
J175 / J176 / MMBFJ175 / MMBFJ176 / MMBFJ177 — P-Channel Switch
Electrical Characteristics
- TRANSCONDUCTANCE (mmhos)
- DRAIN CURRENT (mA)
0.5 V
V GS = 0 V
-12
1.0 V
1.5 V
-8
-4
2.5 V
3.0 V
3.5 V
0
-1
-2
-3
-4
VDS - DRAIN-SOURCE VOLTAGE (V)
-5
100
50
I DSS , g fs @ V DS = 15V,
V GS = 0 PULSED
r DS @ -100 mV, VGS = 0
V GS(off) @ V DS = - 15V,
I D = - 1.0 μA
1
1
V GS (OFF)
16
- DRAIN CURRENT (mA)
V GS(off) = - 4.5 V
-24
- 55°C
25°C
125°C
VGS(off) = 2.5 V
-16
- 55°C
25°C
125°C
VGS(off) = - 4.5 V
- 55°C
25°C
125°C
VGS(off) = 2.5 V
12
8
- 55°C
25°C
125°C
4
D
-8
V DS = - 15 V
I
I D - DRAIN CURRENT (mA)
10
2
5
10
- GATE CUTOFF VOLTAGE (V)
Figure 4. Parameter Interactions
V DS = - 15 V
0
0
1
2
3
VGS - GATE-SOURCE VOLTAGE (V)
0
4
0
g os - OUTPUT CONDUCTANCE ( μ mhos)
20
10
4
1000
100
50
1
2
3
VGS - GATE-SOURCE VOLTAGE (V)
Figure 6. Transfer Characteristics
Figure 5. Transfer Characteristics
- NORMALIZED RESISTANCE ( Ω )
fs
5
-32
V GS(off) @ 5.0V, 10 μA
r DS
r DS =
V GS
1 -________
V GS(off)
5
2
DS
g
10
Figure 3. Common Drain-Source
r
500
I DSS
r DS
g
0
50
fs
I
D
2.0 V
1,000
- DRAIN "ON" RESISTANCE (Ω
Ω)
-16
100
DS
T A = 25°C
TYP V GS(off) = 4.5 V
r
-20
1
0
0.2
0.4
0.6
0.8
1
VGS /VGS(off) - NORMALIZED GATE-SOURCE VOLTAGE (V)
-5.0V
100
-5.0V
-10V
V GS(off) = - 4.5V
-20V
-20V
-10V
10
V GS(off) = - 2.5V
_
1
0.01
_
_
0.1
1
I D - DRAIN CURRENT (mA)
_
10
Figure 8. Output Conductance vs. Drain Current
Figure 7. Normalized Drain Resistance vs.
Bias Voltage
© 1997 Fairchild Semiconductor Corporation
J175 / J176 / MMBFJ175 / MMBFJ176 / MMBFJ177 Rev. 1.6
f = 1.0 kHz
www.fairchildsemi.com
4
J175 / J176 / MMBFJ175 / MMBFJ176 / MMBFJ177 — P-Channel Switch
Typical Performance Characteristics
C is (C rs ) - CAPACITANCE (pF)
g fs - TRANSCONDUCTANCE (mmhos)
100
10
V GS(off) = 2.5V
5
25°C
V GS(off) = 6.0V
- 55°C
25°C
125°C
1
0.5
V DG = -15V
f = 1.0 kHz
0.1
_
0.1
_
_
1
10
I D - DRAIN CURRENT (mA)
_
100
f = 0.1 - 1.0 MHz
C is (V DS = -15V)
10
5
1
C rs (V DS = -15V)
0
r DS - DRAIN "ON" RESISTANCE (Ω)
e n - NOISE VOLTAGE (nV / √ Hz)
100
50
I D = - 0.2 mA
I D = 5.0 mA
5
V DG = - 15V
BW = 6.0 Hz @ f = 10 Hz, 100 Hz
= 0.2f @ f ≥ 1.0 kHz
1
0.01
0.1
1
10
f - FREQUENCY (kHz)
100
1000
500
V DS = -100 mV
V GS(off) = 2.5V
V GS = 0
V GS(off) = 4.5V
V GS(off) = 8.0V
100
50
10
-50
0
50
100
150
T A - AMBIENT TEMPERATURE ( o C)
Figure 12. Channel Resistance vs. Temperature
Figure 11. Noise Voltage vs. Frequency
PD - POWER DISSIPATION (mW)
20
Figure 10. Capacitance vs. Voltage
Figure 9. Transconductance vs. Drain Current
10
4
8
12
16
V GS - GATE-SOURCE VOLTAGE (V)
350
300
TO-92
250
200
150
SOT-23
100
50
0
0
25
50
75
100
o
TEMPERATURE ( C)
125
150
Figure 13. Power Dissipation vs.
Ambient Temperature
© 1997 Fairchild Semiconductor Corporation
J175 / J176 / MMBFJ175 / MMBFJ176 / MMBFJ177 Rev. 1.6
www.fairchildsemi.com
5
J175 / J176 / MMBFJ175 / MMBFJ176 / MMBFJ177 — P-Channel Switch
Typical Performance Characteristics (Continued)
J175 / J176 / MMBFJ175 / MMBFJ176 / MMBFJ177 — P-Channel Switch
Physical Dimensions
Figure 14. 3-Lead, TO-92, Molded, 0.2 In Line Spacing Lead Form
© 1997 Fairchild Semiconductor Corporation
J175 / J176 / MMBFJ175 / MMBFJ176 / MMBFJ177 Rev. 1.6
www.fairchildsemi.com
6
J175 / J176 / MMBFJ175 / MMBFJ176 / MMBFJ177 — P-Channel Switch
Physical Dimensions (Continued)
0.95
2.92±0.20
3
1.40
1.30+0.20
-0.15
1
2.20
2
0.60
0.37
(0.29)
0.95
0.20
1.00
A B
1.90
1.90
LAND PATTERN
RECOMMENDATION
SEE DETAIL A
1.20 MAX
0.10
0.00
(0.93)
0.10
C
C
2.40±0.30
NOTES: UNLESS OTHERWISE SPECIFIED
GAGE PLANE
0.23
0.08
A) REFERENCE JEDEC REGISTRATION
TO-236, VARIATION AB, ISSUE H.
B) ALL DIMENSIONS ARE IN MILLIMETERS.
C) DIMENSIONS ARE INCLUSIVE OF BURRS,
MOLD FLASH AND TIE BAR EXTRUSIONS.
D) DIMENSIONING AND TOLERANCING PER
ASME Y14.5M - 1994.
E) DRAWING FILE NAME: MA03DREV10
0.25
0.20 MIN
(0.55)
SEATING
PLANE
SCALE: 2X
Figure 15. 3-LEAD, SOT23, JEDEC TO-236, LOW PROFILE
© 1997 Fairchild Semiconductor Corporation
J175 / J176 / MMBFJ175 / MMBFJ176 / MMBFJ177 Rev. 1.6
www.fairchildsemi.com
7
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Advance Information
Formative / In Design
Preliminary
First Production
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Datasheet contains the design specifications for product development. Specifications may change
in any manner without notice.
Datasheet contains preliminary data; supplementary data will be published at a later date. Fairchild
Semiconductor reserves the right to make changes at any time without notice to improve design.
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changes at any time without notice to improve the design.
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The datasheet is for reference information only.
Rev. I77
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