FGD3440G2_F085 - Fairchild Semiconductor

FGB3440G2_F085 / FGD3440G2_F085
FGP3440G2_F085
EcoSPARK®2 335mJ, 400V, N-Channel Ignition IGBT
Features
Applications
o
„ SCIS Energy = 335mJ at TJ = 25 C
„ Automotive lgnition Coil Driver Circuits
„ Logic Level Gate Drive
„ Coil On Plug Applications
„ Qualified to AEC Q101
„ RoHS Compliant
Package
Symbol
JEDEC TO-263AB
D²-Pak
JEDEC TO-220AB
E
C
G
COLLECTOR
G
E
R1
GATE
JEDEC TO-252AA
D-Pak
R2
G
E
EMITTER
COLLECTOR
(FLANGE)
Device Maximum Ratings TA = 25°C unless otherwise noted
Parameter
Symbol
BVCER Collector to Emitter Breakdown Voltage (IC = 1mA)
Ratings
400
Units
V
BVECS
Emitter to Collector Voltage - Reverse Battery Condition (IC = 10mA)
28
V
ESCIS25
Self Clamping Inductive Switching Energy (Note 1)
335
mJ
195
mJ
ESCIS150 Self Clamping Inductive Switching Energy (Note 2)
IC25
Collector Current Continuous, at VGE = 4.0V, TC = 25°C
26.9
A
IC110
Collector Current Continuous, at VGE = 4.0V, TC = 110°C
25
A
VGEM
Gate to Emitter Voltage Continuous
±10
V
Power Dissipation Total, at TC = 25°C
166
W
1.1
W/oC
PD
Power Dissipation Derating, for TC > 25oC
TJ
Operating Junction Temperature Range
-40 to +175
o
C
TSTG
Storage Junction Temperature Range
-40 to +175
o
C
TL
Max. Lead Temp. for Soldering (Leads at 1.6mm from case for 10s)
300
o
C
TPKG
Max. Lead Temp. for Soldering (Package Body for 10s)
260
o
C
ESD
Electrostatic Discharge Voltage at100pF, 1500Ω
@2014 Fairchild Semiconductor Corporation
FGB3440G2_F085 / FGD3440G2_F085 / FGP3440G2_F085 Rev.C3
4
1
kV
www.fairchildsemi.com
FGB3440G2_F085 / FGD3440G2_F085 / FGP3440G2_F085
May 2014
Device Marking
Device
Package
FGB3440G2
FGB3440G2_F085
FGD3440G2
FGD3440G2_F085
TO-263AB
TO-252AA
FGP3440G2
FGP3440G2_F085
TO-220AB
Reel Size
330mm
Tape Width
24mm
800
330mm
16mm
N/A
2500
50
Tube
Quantity
Electrical Characteristics TA = 25°C unless otherwise noted
Symbol
Parameter
Test Conditions
Min
Typ
Max Units
Off State Characteristics
BVCER
ICE = 2mA, VGE = 0,
Collector to Emitter Breakdown Voltage RGE = 1KΩ,
TJ = -40 to 150oC
370
400
430
V
BVCES
ICE = 10mA, VGE = 0V,
Collector to Emitter Breakdown Voltage RGE = 0,
TJ = -40 to 150oC
390
420
450
V
BVECS
Emitter to Collector Breakdown Voltage
ICE = -20mA, VGE = 0V,
TJ = 25°C
28
-
-
V
BVGES
Gate to Emitter Breakdown Voltage
IGES = ±2mA
±12
±14
-
V
Collector to Emitter Leakage Current
VCE = 250V, RGE=1KΩ
-
-
25
μA
-
-
1
mA
IECS
Emitter to Collector Leakage Current
VEC = 24V,
-
-
1
-
-
40
R1
Series Gate Resistance
R2
Gate to Emitter Resistance
ICER
TJ = 25oC
TJ = 150oC
TJ = 25oC
TJ = 150oC
mA
-
120
-
Ω
10K
-
30K
Ω
-
1.1
1.2
V
-
1.3
1.45
V
-
1.6
1.75
V
-
-
335
mJ
On State Characteristics
VCE(SAT) Collector to Emitter Saturation Voltage ICE = 6A, VGE = 4V,
VCE(SAT) Collector to Emitter Saturation Voltage ICE = 10A, VGE = 4.5V,
VCE(SAT) Collector to Emitter Saturation Voltage ICE = 15A, VGE = 4.5V,
L = 3.0 mHy, VGE = 5V
Self Clamped Inductive Switching
ESCIS
RG = 1KΩ, (Note 1)
TJ = 25oC
TJ = 150oC
TJ = 150oC
o
TJ = 25 C
Notes:
1: Self Clamping Inductive Switching Energy(ESCIS25) of 335mJ is based on the test conditions that is starting
TJ=25 oC; L=3mHy, ISCIS=15A,VCC=100V during inductor charging and VCC=0V during the time in clamp .
2: Self Clamping
Inductive Switching Energy (ESCIS150) of 195mJ is based on the test conditions that is starting
TJ=150 oC; L=3mHy, ISCIS=11.4A,VCC=100V during inductor charging and VCC=0V during the time in clamp.
@2014 Fairchild Semiconductor Corporation
FGB3440G2_F085 / FGD3440G2_F085 / FGP3440G2_F085 Rev.C3
2
www.fairchildsemi.com
FFGB3440G2_F085 / FGD3440G2_F085 / FGP3440G2_F085
Package Marking and Ordering Information
Symbol
Parameter
Test Conditions
Min
Typ
-
24
Max Units
Dynamic Characteristics
QG(ON)
Gate Charge
ICE = 10A, VCE = 12V,
VGE = 5V
o
nC
1.3
1.7
2.2
0.75
1.2
1.8
VCE = 12V, ICE = 10A
-
2.8
-
V
Current Turn-On Delay Time-Resistive VCE = 14V, RL = 1Ω
VGE = 5V, RG = 1KΩ
Current Rise Time-Resistive
TJ = 25oC,
-
1.0
4
μs
-
2.0
7
μs
-
5.3
15
μs
-
2.3
15
μs
-
-
0.9
oC/W
VGE(TH)
Gate to Emitter Threshold Voltage
ICE = 1mA, VCE = VGE,
VGEP
Gate to Emitter Plateau Voltage
TJ = 25 C
-
TJ = 150oC
V
Switching Characteristics
td(ON)R
trR
td(OFF)L
tfL
Current Turn-Off Delay Time-Inductive VCE = 300V, L = 1mH,
VGE = 5V, RG = 1KΩ
Current Fall Time-Inductive
ICE =6.5A, TJ = 25oC,
Thermal Characteristics
RθJC
Thermal Resistance Junction to Case
@2014 Fairchild Semiconductor Corporation
FGB3440G2_F085 / FGD3440G2_F085 / FGP3440G2_F085 Rev.C3
3
www.fairchildsemi.com
FGB3440G2_F085 / FGD3440G2_F085 / FGP3440G2_F085
Electrical Characteristics TA = 25°C unless otherwise noted
ISCIS, INDUCTIVE SWITCHING CURRENT (A)
ISCIS, INDUCTIVE SWITCHING CURRENT (A)
100
RG = 1KΩ, VGE = 5V, VCE = 100V
o
TJ = 25 C
10
o
TJ = 150 C
1
10
SCIS Curves valid for Vclamp Voltages of <430V
100
tCLP, TIME IN CLAMP (μS)
1000
1.20
10
o
TJ = 150 C
0
SCIS Curves valid for Vclamp Voltages of <430V
0
6
9
L, INDUCTANCE (mHy)
12
15
ICE = 10A
1.40
VGE = 4.0V
VGE = 3.7V
1.35
1.30
VGE = 8V
1.25
VGE = 5V
1.05
1.10
-75 -50 -25 0 25 50 75 100 125 150 175
o
TJ, JUNCTION TEMPERTURE ( C)
Figure 3. Collector to Emitter On-State Voltage
vs. Junction Temperature
ICE, COLLECTOR TO EMITTER CURRENT (A)
Figure 4. Collector to Emitter On-State Voltage
vs. Junction Temperature
30
VGE = 8.0V
VGE = 5.0V
VGE = 4.5V
VGE = 4.0V
20
VGE = 3.7V
10
o
TJ = -40 C
1
2
3
4
VCE, COLLECTOR TO EMITTER VOLTAGE (V)
Figure 5. Collector to Emitter On-State Voltage
vs. Collector Current
@2014 Fairchild Semiconductor Corporation
FGB3440G2_F085 / FGD3440G2_F085 / FGP3440G2_F085 Rev.C3
VGE = 4.5V
VGE = 8V
1.15
1.00
-75 -50 -25 0 25 50 75 100 125 150 175
o
TJ, JUNCTION TEMPERTURE ( C)
0
VGE = 5V
1.20
VGE = 4.5V
0
3
1.45
1.10
ICE, COLLECTOR TO EMITTER CURRENT (A)
o
TJ = 25 C
1.50
VGE = 4.0V
1.15
20
Figure 2. Self Clamped Inductive Switching
Current vs. Inductance
ICE = 6A
VGE = 3.7V
RG = 1KΩ, VGE = 5V, VCE = 100V
VCE, COLLECTOR TO EMITTER VOLTAGE (V)
VCE, COLLECTOR TO EMITTER VOLTAGE (V)
Figure 1. Self Clamped Inductive Switching
Current vs. Time in Clamp
30
30
VGE = 8.0V
VGE = 5.0V
VGE = 4.5V
VGE = 4.0V
20
VGE = 3.7V
10
o
0
TJ = 25 C
0
1
2
3
4
VCE, COLLECTOR TO EMITTER VOLTAGE (V)
Figure 6. Collector to Emitter On-State Voltage
vs. Collector Current
4
www.fairchildsemi.com
FGB3440G2_F085 / FGD3440G2_F085 / FGP3440G2_F085
Typical Performance Curves
ICE, COLLECTOR TO EMITTER CURRENT (A)
ICE, COLLECTOR TO EMITTER CURRENT (A)
(Continued)
30
VGE = 8.0V
VGE = 5.0V
VGE = 4.5V
VGE = 4.0V
20
VGE = 3.7V
10
o
0
TJ = 175 C
0
1
2
3
4
VCE, COLLECTOR TO EMITTER VOLTAGE (V)
30
VCE = 5V
20
TJ = 25oC
TJ = -40oC
0
VTH, THRESHOLD VOLTAGE (V)
ICE, DC COLLECTOR CURRENT (A)
20
10
50
75
100
125
150
o
TC, CASE TEMPERATURE( C)
1
2
3
VGE, GATE TO EMITTER VOLTAGE (V)
2.0
VCE = VGE
ICE = 1mA
1.8
1.6
1.4
1.2
1.0
-50
175
Figure 9. DC Collector Current vs. Case
Temperature
-25
0
25 50 75 100 125 150 175
TJ, JUNCTION TEMPERATURE(oC)
Figure 10. Threshold Voltage vs. Junction
Temperature
10000
12
VECS = 24V
SWITCHING TIME (μS)
LEAKAGE CURRENT (μA)
ICE = 6.5A, VGE = 5V, RG = 1KΩ
1000
100
10
VCES = 300V
1
8
4
0
25
0
25 50 75 100 125 150 175
o
TJ, JUNCTION TEMPERATURE ( C)
Figure 11. Leakage Current vs. Junction
Temperature
@2014 Fairchild Semiconductor Corporation
FGB3440G2_F085 / FGD3440G2_F085 / FGP3440G2_F085 Rev.C3
Inductive tOFF
6
2
-25
Resistive tOFF
10
VCES = 250V
0.1
-50
4
Figure 8. Transfer Characteristics
VGE = 4.0V
0
25
TJ = 175oC
10
Figure 7. Collector to Emitter On-State Voltage
vs. Collector Current
30
PULSE DURATION = 80μs
DUTY CYCLE = 0.5% MAX
Resistive tON
50
75
100
125
150
o
TJ, JUNCTION TEMPERATURE ( C)
175
Figure 12. Switching Time vs. Junction
Temperature
5
www.fairchildsemi.com
FGB3440G2_F085 / FGD3440G2_F085 / FGP3440G2_F085
Typical Performance Curves
VGS, GATE TO EMITTER VOLTAGE(V)
(Continued)
CAPACITANCE (pF)
2000
f = 1MHz
VGE = 0V
1600
CIES
1200
800
CRES
400
0
COES
5
10
15
20
VDS, DRAIN TO SOURCE VOLTAGE (V)
25
10
o
ICE = 10A, TJ = 25 C
8
VCE = 6V
6
VCE = 12V
4
2
0
0
10
BVCER, BREAKDOWN VOLTAGE (V)
Figure 13. Capacitance vs. Collector to Emitter
Voltage
20
30
40
50
Qg, GATE CHARGE(nC)
60
70
Figure 14. Gate Charge
440
ICER = 10mA
420
o
TJ = -40 C
o
TJ = 25 C
400
o
TJ = 175 C
380
10
100
RG, SERIES GATE RESISTANCE (Ω)
1000
6000
Figure 15. Break down Voltage vs. Series Gate Resistance
2
DUTY CYCLE - DESCENDING ORDER
NORMALIZED THERMAL
IMPEDANCE, ZθJC
1
D = 0.50
0.2
PDM
0.1
0.1
0.01
-5
10
0.05
t1
0.02
t2
NOTES:
DUTY FACTOR: D = t1/t2
PEAK TJ = PDM x ZθJC x RθJC + TC
0.01
SINGLE PULSE
-4
10
-3
-2
10
10
t, RECTANGULAR PULSE DURATION(s)
-1
10
1
Figure 16. IGBT Normalized Transient Thermal Impedance, Junction to Case
@2014 Fairchild Semiconductor Corporation
FGB3440G2_F085 / FGD3440G2_F085 / FGP3440G2_F085 Rev.C3
6
www.fairchildsemi.com
FGB3440G2_F085 / FGD3440G2_F085 / FGP3440G2_F085
Typical Performance Curves
L
VCC
R
or
L
C
PULSE
GEN
RG
G
LOAD
C
RG = 1KΩ
DUT
G
+
DUT
5V
E
VCC
E
Figure 17. Inductive Switching Test Circuit
Figure 18. tON and tOFF Switching Test Circuit
BVCES
VCE
tP
VCE
L
C
VARY tP TO OBTAIN
REQUIRED PEAK ISCIS
VGE
ISCIS
VCC
+
RG
G
VCC
DUT
-
E
tP
0V
ISCIS
0
0.01Ω
tAV
Figure 19. Energy Test Circuit
@2014 Fairchild Semiconductor Corporation
FGB3440G2_F085 / FGD3440G2_F085 / FGP3440G2_F085 Rev.C3
Figure 20. Energy Waveforms
7
www.fairchildsemi.com
FGB3440G2_F085 / FGD3440G2_F085 / FGP3440G2_F085
Test Circuit and Waveforms
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Definition of Terms
Datasheet Identification
Product Status
Definition
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Datasheet contains the design specifications for product development. Specifications
may change in any manner without notice.
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First Production
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Rev. I68