FDBL86563_F085 Fairchild Semiconductor Corporation

FDBL86563_F085
N-Channel PowerTrench® MOSFET
60 V, 240 A, 1.5 mΩ
Features
„ Typical RDS(on) = 1.1 mΩ at VGS = 10V, ID = 80 A
„ Typical Qg(tot) = 130 nC at VGS = 10V, ID = 80 A
D
„ UIS Capability
„ RoHS Compliant
„ Qualified to AEC Q101
Applications
G
„ Automotive Engine Control
„ PowerTrain Management
S
„ Solenoid and Motor Drivers
„ Integrated Starter/Alternator
For current package drawing, please refer to the Fairchild web‐
site at http://www.fairchildsemi.com/dwg/PS/PSOF08A.pdf.
„ Primary Switch for 12V Systems
MOSFET Maximum Ratings TJ = 25°C unless otherwise noted.
Symbol
VDSS
Drain-to-Source Voltage
VGS
ID
EAS
PD
Parameter
Ratings
60
Units
V
±20
V
Gate-to-Source Voltage
Drain Current - Continuous (VGS=10) (Note 1)
TC = 25°C
240
Pulsed Drain Current
TC = 25°C
See Figure 4
Single Pulse Avalanche Energy
(Note 2)
614
A
mJ
Power Dissipation
357
W
Derate Above 25oC
2.38
W/oC
TJ, TSTG Operating and Storage Temperature
RθJC
Thermal Resistance, Junction to Case
RθJA
Maximum Thermal Resistance, Junction to Ambient
-55 to + 175
oC
0.42
oC/W
43
oC/W
(Note 3)
Notes:
1: Current is limited by silicon.
2: Starting TJ = 25°C, L = 0.3mH, IAS = 64A, VDD = 60V during inductor charging and VDD = 0V during time in avalanche.
3: RθJA is the sum of the junction-to-case and case-to-ambient thermal resistance, where the case thermal reference is defined as the solder
mounting surface of the drain pins. RθJC is guaranteed by design, while RθJAis determined by the board design. The maximum rating
presented here is based on mounting on a 1 in2 pad of 2oz copper.
Package Marking and Ordering Information
Device Marking
FDBL86563
Device
FDBL86563_F085
©2015 Fairchild Semiconductor Corporation
FDBL86563_F085 Rev. 1.0
Package
MO-299A
Reel Size
13"
1
Tape Width
24mm
Quantity
2000 units
www.fairchildsemi.com
FDBL86563_F085 N-Channel PowerTrench® MOSFET
June 2015
Symbol
Parameter
Test Conditions
Min.
Typ.
Max.
Units
Off Characteristics
BVDSS
Drain-to-Source Breakdown Voltage
IDSS
Drain-to-Source Leakage Current
IGSS
Gate-to-Source Leakage Current
ID = 250μA, VGS = 0V
VDS = 60V,
VGS = 0V
60
-
-
V
-
-
1
μA
TJ = 25oC
TJ = 175oC (Note 4)
-
-
1
mA
-
-
±100
nA
2.0
2.9
4.0
V
-
1.1
1.5
mΩ
-
2.1
2.9
mΩ
VGS = ±20V
On Characteristics
VGS(th)
RDS(on)
Gate to Source Threshold Voltage
Drain to Source On Resistance
VGS = VDS, ID = 250μA
ID = 80A,
VGS= 10V
TJ = 25oC
TJ = 175oC (Note 4)
Dynamic Characteristics
Ciss
Input Capacitance
Coss
Output Capacitance
Crss
Reverse Transfer Capacitance
Rg
Gate Resistance
f = 1MHz
Qg(ToT)
Total Gate Charge at 10V
VGS = 0 to 10V
Qg(th)
Threshold Gate Charge
VGS = 0 to 2V
Qgs
Gate-to-Source Gate Charge
Qgd
Gate-to-Drain “Miller“ Charge
VDS = 30V, VGS = 0V,
f = 1MHz
VDD = 48V
ID = 80A
-
10300
-
pF
-
2590
-
pF
-
270
-
pF
-
4.3
-
Ω
-
130
169
nC
-
19
-
nC
-
48
-
nC
-
20
-
nC
ns
Switching Characteristics
ton
Turn-On Time
-
-
160
td(on)
Turn-On Delay
-
30
-
ns
tr
Rise Time
-
77
-
ns
td(off)
Turn-Off Delay
-
78
-
ns
tf
Fall Time
-
57
-
ns
toff
Turn-Off Time
-
-
200
ns
V
VDD = 30V, ID = 80A,
VGS = 10V, RGEN = 6Ω
Drain-Source Diode Characteristics
VSD
Source-to-Drain Diode Voltage
trr
Reverse-Recovery Time
Qrr
Reverse-Recovery Charge
ISD =80A, VGS = 0V
-
-
1.25
ISD = 40A, VGS = 0V
-
-
1.2
V
IF = 80A, dISD/dt = 100A/μs,
VDD=48V
-
94
140
ns
-
131
200
nC
Note:
4: The maximum value is specified by design at TJ = 175°C. Product is not tested to this condition in production.
©2015 Fairchild Semiconductor Corporation
FDBL86563_F085 Rev. 1.0
2
www.fairchildsemi.com
FDBL86563_F085 N-Channel PowerTrench® MOSFET
Electrical Characteristics TJ = 25°C unless otherwise noted.
1.0
0.8
0.6
0.4
0.2
0.0
VGS = 10V
350
ID, DRAIN CURRENT (A)
POWER DISSIPATION MULTIPLIER
400
1.2
CURRENT LIMITED
BY SILICON
300
250
200
150
100
50
0
25
50
75
100
125
150
TC, CASE TEMPERATURE(oC)
0
175
25
50
75
100
125
150
175
TC, CASE TEMPERATURE(oC)
200
Figure 2. Maximum Continuous Drain Current vs.
Case Temperature
Figure 1. Normalized Power Dissipation vs. Case
Temperature
NORMALIZED THERMAL
IMPEDANCE, ZθJC
2
DUTY CYCLE - DESCENDING ORDER
1
D = 0.50
0.20
0.10
0.05
0.02
0.01
0.1
PDM
t1
t2
NOTES:
DUTY FACTOR: D = t1/t2
PEAK TJ = PDM x ZθJA x RθJA + TC
SINGLE PULSE
0.01
-5
10
-4
10
-3
-2
-1
0
10
10
10
t, RECTANGULAR PULSE DURATION(s)
1
10
10
Figure 3. Normalized Maximum Transient Thermal Impedance
10000
TC = 25oC
IDM, PEAK CURRENT (A)
VGS = 10V
FOR TEMPERATURES
ABOVE 25oC DERATE PEAK
CURRENT AS FOLLOWS:
1000
175 - TC
I = I2
150
100
SINGLE PULSE
10
-5
10
-4
10
-3
-2
-1
10
10
10
t, RECTANGULAR PULSE DURATION(s)
0
10
1
10
Figure 4. Peak Current Capability
©2015 Fairchild Semiconductor Corporation
FDBL86563_F085 Rev. 1.0
3
www.fairchildsemi.com
FDBL86563_F085 N-Channel PowerTrench® MOSFET
Typical Characteristics
2000
1000
If R = 0
tAV = (L)(IAS)/(1.3*RATED BVDSS - VDD)
If R ≠ 0
tAV = (L/R)ln[(IAS*R)/(1.3*RATED BVDSS - VDD) +1]
IAS, AVALANCHE CURRENT (A)
ID, DRAIN CURRENT (A)
1000
100
100us
10 OPERATION IN THIS
AREA MAY BE
LIMITED BY rDS(on)
1
1ms
10ms
100ms
SINGLE PULSE
TJ = MAX RATED
TC = 25oC
0.1
0.1
IS, REVERSE DRAIN CURRENT (A)
ID, DRAIN CURRENT (A)
150
TJ = -55oC
50
0
2
3
4
5
6
7
VGS, GATE TO SOURCE VOLTAGE (V)
TJ = 25 oC
1
0.2
0.4
0.6
0.8
1.0
1.2
VGS
150
80μs PULSE WIDTH
Tj=25oC
100
TJ = 175 oC
10
350
ID, DRAIN CURRENT (A)
ID, DRAIN CURRENT (A)
200
1000 10000
Figure 8. Forward Diode Characteristics
15V Top
10V
8V
7V
6V
5.5V
5V Bottom
250
100
VSD, BODY DIODE FORWARD VOLTAGE (V)
VGS
300
10
VGS = 0 V
100
0.1
0.0
8
Figure 7. Transfer Characteristics
350
1
350
TJ = 25oC
TJ = 175oC
0.1
Figure 6. Unclamped Inductive Switching
Capability
250
100
0.01
NOTE: Refer to Fairchild Application Notes AN7514 and AN7515
VDD = 5V
200
STARTING TJ = 150oC
tAV, TIME IN AVALANCHE (ms)
PULSE DURATION = 80μs
DUTY CYCLE = 0.5% MAX
300
STARTING TJ = 25oC
10
1
0.001
1
10
100 200
VDS, DRAIN TO SOURCE VOLTAGE (V)
Figure 5. Forward Bias Safe Operating Area
350
100
50
300
15V Top
10V
8V
7V
6V
5.5V
5V Bottom
250
200
150
100
80μs PULSE WIDTH
Tj=175oC
50
0
0
0
1
2
3
4
VDS, DRAIN TO SOURCE VOLTAGE (V)
5
0
Figure 9. Saturation Characteristics
©2015 Fairchild Semiconductor Corporation
FDBL86563_F085 Rev. 1.0
1
2
3
4
VDS, DRAIN TO SOURCE VOLTAGE (V)
5
Figure 10. Saturation Characteristics
4
www.fairchildsemi.com
FDBL86563_F085 N-Channel PowerTrench® MOSFET
Typical Characteristics
ID = 80A
NORMALIZED
DRAIN TO SOURCE ON-RESISTANCE
rDS(on), DRAIN TO SOURCE
ON-RESISTANCE (mΩ)
50
PULSE DURATION = 80μs
DUTY CYCLE = 0.5% MAX
40
30
20
TJ = 175oC
TJ = 25oC
10
0
2
4
6
8
VGS, GATE TO SOURCE VOLTAGE (V)
10
Figure 11. RDSON vs. Gate Voltage
2.0
1.6
1.2
0.8
ID = 80A
VGS = 10V
0.4
-80
-40
0
40
80
120
160
TJ, JUNCTION TEMPERATURE(oC)
200
Figure 12. Normalized RDSON vs. Junction
Temperature
1.10
VGS = VDS
ID = 250μA
1.2
ID = 5mA
1.05
0.9
1.00
0.6
0.95
0.3
0.0
-80
-40
0
40
80
120
160
TJ, JUNCTION TEMPERATURE(oC)
0.90
-80
200
Figure 13. Normalized Gate Threshold Voltage vs.
Temperature
VGS, GATE TO SOURCE VOLTAGE(V)
Ciss
10000
1000
Coss
Crss
100
f = 1MHz
VGS = 0V
10
0.1
1
10
VDS, DRAIN TO SOURCE VOLTAGE (V)
100
Figure 15. Capacitance vs. Drain to Source
Voltage
©2015 Fairchild Semiconductor Corporation
FDBL86563_F085 Rev. 1.0
-40
0
40
80
120
160
TJ, JUNCTION TEMPERATURE (oC)
200
Figure 14. Normalized Drain to Source
Breakdown Voltage vs. Junction Temperature
100000
CAPACITANCE (pF)
PULSE DURATION = 80μs
DUTY CYCLE = 0.5% MAX
NORMALIZED DRAIN TO SOURCE
BREAKDOWN VOLTAGE
NORMALIZED GATE
THRESHOLD VOLTAGE
1.5
2.4
10
ID = 80A
VDD = 30V
8
VDD =24V
VDD = 36V
6
4
2
0
0
30
60
90
120
Qg, GATE CHARGE(nC)
150
Figure 16. Gate Charge vs. Gate to Source
Voltage
5
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FDBL86563_F085 N-Channel PowerTrench® MOSFET
Typical Characteristics
AccuPower™
AttitudeEngine™
Awinda®
AX-CAP®*
BitSiC™
Build it Now™
CorePLUS™
CorePOWER™
CROSSVOLT™
CTL™
Current Transfer Logic™
DEUXPEED®
Dual Cool™
EcoSPARK®
EfficentMax™
ESBC™
®
®
Fairchild
Fairchild Semiconductor®
FACT Quiet Series™
FACT®
FAST®
FastvCore™
FETBench™
FPS™
F-PFS™
FRFET®
Global Power ResourceSM
GreenBridge™
Green FPS™
Green FPS™ e-Series™
Gmax™
GTO™
IntelliMAX™
ISOPLANAR™
Marking Small Speakers Sound Louder
and Better™
MegaBuck™
MICROCOUPLER™
MicroFET™
MicroPak™
MicroPak2™
MillerDrive™
MotionMax™
MotionGrid®
MTi®
MTx®
MVN®
mWSaver®
OptoHiT™
OPTOLOGIC®
OPTOPLANAR®
®*
®
tm
Power Supply WebDesigner™
PowerTrench®
PowerXS™
Programmable Active Droop™
QFET®
QS™
Quiet Series™
RapidConfigure™
™
Saving our world, 1mW/W/kW at a time™
SignalWise™
SmartMax™
SMART START™
Solutions for Your Success™
SPM®
STEALTH™
SuperFET®
SuperSOT™-3
SuperSOT™-6
SuperSOT™-8
SupreMOS®
SyncFET™
Sync-Lock™
TinyBoost®
TinyBuck®
TinyCalc™
TinyLogic®
TINYOPTO™
TinyPower™
TinyPWM™
TinyWire™
TranSiC™
TriFault Detect™
TRUECURRENT®*
μSerDes™
UHC®
Ultra FRFET™
UniFET™
VCX™
VisualMax™
VoltagePlus™
XS™
Xsens™
仙童 ™
*Trademarks of System General Corporation, used under license by Fairchild Semiconductor.
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Definition of Terms
Datasheet Identification
Product Status
Definition
Advance Information
Formative / In Design
Datasheet contains the design specifications for product development. Specifications
may change in any manner without notice.
Preliminary
First Production
Datasheet contains preliminary data; supplementary data will be published at a later
date. Fairchild Semiconductor reserves the right to make changes at any time without
notice to improve design.
No Identification Needed
Full Production
Datasheet contains final specifications. Fairchild Semiconductor reserves the right to
make changes at any time without notice to improve the design.
Obsolete
Not In Production
Datasheet contains specifications on a product that is discontinued by Fairchild
Semiconductor. The datasheet is for reference information only.
Rev. I74
©2015 Fairchild Semiconductor Corporation
FDBL86563_F085 Rev. 1.0
6
www.fairchildsemi.com
FDBL86563_F085 N-Channel PowerTrench® MOSFET
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