REI Datasheet - Rochester Electronics

REI Datasheet
MM74C901, MM74C902
Hex Inverting TTL Buffer, Hex Non-Inverting TTL Buffer
The MM74C901 and MM74C902 hex buffers employ complementary MOS to achieve wide supply
operating range, low power consumption, and high noise immunity. These buffers provide direct
interface from PMOS into CMOS or TTL and direct interface from CMOS to TTL or CMOS operating
at a reduced VCC supply.
Rochester Electronics
Manufactured Components
Rochester branded components are
manufactured using either die/wafers
purchased from the original suppliers
or Rochester wafers recreated from the
original IP. All recreations are done with
the approval of the OCM.
Parts are tested using original factory
test programs or Rochester developed
test solutions to guarantee product
meets or exceeds the OCM data sheet.
Quality Overview
•
•
•
•
ISO-9001
AS9120 certification
Qualified Manufacturers List (QML) MIL-PRF-38535
• Class Q Military
• Class V Space Level
Qualified Suppliers List of Distributors (QSLD)
•
Rochester
is a critical supplier to DLA and
meets all industry and DLA standards.
Rochester Electronics, LLC is committed to supplying
products that satisfy customer expectations for
quality and are equal to those originally supplied by
industry manufacturers.
The original manufacturer’s datasheet accompanying this document reflects the performance
and specifications of the Rochester manufactured version of this device. Rochester Electronics
guarantees the performance of its semiconductor products to the original OEM specifications.
‘Typical’ values are for reference purposes only. Certain minimum or maximum ratings may be
based on product characterization, design, simulation, or sample testing.
© 2014 Rochester Electronics, LLC. All Rights Reserved 01202014
To learn more, please visit www.rocelec.com
Revised January 1999
MM74C901 • MM74C902
Hex Inverting TTL Buffer •
Hex Non-Inverting TTL Buffer
General Description
Features
The MM74C901 and MM74C902 hex buffers employ complementary MOS to achieve wide supply operating range,
low power consumption, and high noise immunity. These
buffers provide direct interface from PMOS into CMOS or
TTL and direct interface from CMOS to TTL or CMOS
operating at a reduced VCC supply.
■ Wide supply voltage range:
■ Guaranteed noise margin:
■ High noise immunity:
3.0V to 15V
1.0V
0.45 VCC (typ.)
■ TTL compatibility: Fan out of 2 driving standard TTL
Ordering Code:
Order Number
MM74C901M
Package Number
Package Description
M14A
14-Lead Small Outline Integrated Circuit (SOIC), JEDEC MS-120, 0.150” Narrow
MM74C901N
N14A
14-Lead Plastic Dual-In-Line Package (PDIP), JEDEC MS-011, 0.300” Wide
MM74C902M
M14A
14-Lead Small Outline Integrated Circuit (SOIC), JEDEC MS-120, 0.150” Narrow
MM74C902N
N14A
14-Lead Plastic Dual-In-Line Package (PDIP), JEDEC MS-011, 0.300” Wide
Devices also available in Tape and Reel. Specify by appending the suffix letter “X” to the ordering code.
Connection Diagrams
Pin Assignments for DIP and SOIC
MM74C901
MM74C902
Top View
Top View
Logic Diagrams
MM74C901
CMOS to TTL Inverting Buffer
© 1999 Fairchild Semiconductor Corporation
DS005909.prf
MM74C902
CMOS to TTL Buffer
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MM74C901 • MM74C902 Hex Inverting TTL Buffer • Hex Non-Inverting TTL Buffer
October 1987
MM74C901 • MM74C902
Absolute Maximum Ratings(Note 1)
Operating VCC Range
−0.3V to VCC + 0.3V
Voltage at Any Pin
−0.3V to +15V
MM74C902
−0.3V to +15V
Storage Temperature Range (TS)
(Soldering, 10 seconds)
260°C
−65°C to +150°C
Power Dissipation (PD)
Dual-In-Line
700 mW
Small Outline
500 mW
Note 1: “Absolute Maximum Ratings” are those values beyond which the
safety of the device cannot be guaranteed. Except for “Operating Temperature Range” they are not meant to imply that the devices should be operated at these limits. The table of “Electrical Characteristics” provides
conditions for actual device operation.
Operating Temperature Range (TA)
MM74C901, MM74C902,
18V
Lead Temperature (TL)
Voltage at Any Input Pin
MM74C901
3.0V to 15V
Absolute Maximum VCC
−40°C to +85°C
DC Electrical Characteristics
Min/Max limits apply across temperature range unless otherwise noted
Symbol
Parameter
Conditions
Min
Typ
Max
Units
CMOS TO CMOS
V IN(1)
Logical “1” Input Voltage
V IN(0)
Logical “0” Input Voltage
V OUT(1)
Logical “1” Output Voltage
V CC = 5.0V
3.5
V CC = 10V
8.0
V
V
V CC = 5.0V
V CC = 10V
V OUT(0)
Logical “0” Output Voltage
1.5
V
2.0
V
V CC = 5.0V, IO = −10 µA
4.5
V
V CC = 10V, IO = −10 µA
9.0
V
V CC = 5.0V
0.5
V
V CC = 10V
1.0
V
1.0
µA
I IN(1)
Logical “1” Input Current
V CC = 15V, VIN = 15V
I IN(0)
Logical “0” Input Current
V CC = 15V, VIN = 0V
I CC
Supply Current
V CC = 15V
0.005
−1.0
−0.005
0.05
µA
15
µA
0.8
V
TTL TO CMOS
V IN(1)
Logical “1” Input Voltage
V CC = 4.75V
V IN(0)
Logical “0” Input Voltage
V CC = 4.75V
V CC − 1.5
V
CMOS TO TTL
V IN(1)
V IN(0)
Logical “1” Input Voltage
MM74C901
V CC = 4.75V
4.25
V
MM74C902
V CC = 4.75V
V CC − 1.5
V
Logical “0” Input Voltage
MM74C901
V CC = 4.75V
1.0
V
MM74C902
V CC = 4.75V
1.5
V
V OUT(1)
Logical “1” Output Voltage
V OUT(0)
Logical “0” Output Voltage
V CC = 4.75V, IO = −800 µA
2.4
V
MM74C901
V CC = 4.75V, IO = 2.6 mA
0.4
V
MM74C902
V CC = 4.75V, IO = 3.2 mA
0.4
V
OUTPUT DRIVE (See Family Characteristics Data Sheet) (Short Circuit Current)
(MM74C901)
I SOURCE
I SOURCE
I SINK
I SINK
Output Source Current
V CC = 5.0V, VOUT = 0V
(P-Channel)
T A = 25°C, VIN = 0V
Output Source Current
V CC = 10V, VOUT = 0V
(P-Channel)
T A = 25°C, VIN = 0V
Output Sink Current
V CC = 5.0V, VOUT = VCC
(N-Channel)
T A = 25°C, VIN = VCC
Output Sink Current
V CC = 5.0V, VOUT = 0.4V
(N-Channel)
T A = 25°C, VIN = VCC
(MM74C902)
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2
−5.0
mA
−20
mA
9.0
mA
3.8
mA
Symbol
I SOURCE
I SOURCE
I SINK
I SINK
(Continued)
Parameter
Conditions
Output Source Current
V CC = 5.0V, VOUT = 0V
(P-Channel)
T A = 25°C, VIN = VCC
Output Source Current
V CC = 10V, VOUT = 0V
(P-Channel)
T A = 25°C, VIN = VCC
Output Sink Current
V CC = 5.0V, VOUT = VCC
(N-Channel)
T A = 25°C, VIN = 0V
Output Sink Current
V CC = 5.0V, VOUT = 0.4V
(N-Channel)
T A = 25°C, VIN = 0V
AC Electrical Characteristics
Min
Typ
Max
Units
−5.0
mA
−20
mA
9.0
mA
3.8
mA
(Note 2)
TA = 25°C, CL = 50 pF, unless otherwise noted
Symbol
Parameter
Conditions
Min
Typ
Max
Units
MM74C901
t pd1
t pd0
Propagation Delay Time
V CC = 5.0V
38
70
ns
to a Logical “1”
V CC = 10V
22
30
ns
Propagation Delay Time
V CC = 5.0V
21
35
ns
to a Logical “0”
V CC = 10V
13
20
ns
C IN
Input Capacitance
Any Input (Note 3)
14
pF
C PD
Power Dissipation Capacity
Per Buffer (Note 4)
30
pF
MM74C902
t pd1
t pd0
Propagation Delay Time
V CC = 5.0V
57
90
ns
to a Logical “1”
V CC = 10V
27
40
ns
Propagation Delay Time
V CC = 5.0V
54
90
ns
to a Logical “0”
V CC = 10V
25
40
ns
C IN
Input Capacitance
Any Input (Note 3)
5.0
pF
C PD
Power Dissipation Capacity
Per Buffer (Note 4)
50
pF
Note 2: AC Parameters are guaranteed by DC correlated testing.
Note 3: Capacitance is guaranteed by periodic testing.
Note 4: CPD determines the no load AC power consumption of any CMOS device. For complete explanation see Family Characteristics application note
AN-90.
Typical Application
CMOS to TTL or CMOS at a Lower VCC
Note: V CC1 = VCC2
3
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MM74C901 • MM74C902
DC Electrical Characteristics
MM74C901 • MM74C902
AC Test Circuit and Switching Time Waveforms
CMOS to CMOS
Note: Delays measured with input tr, tf = 20 ns.
Typical Performance Characteristics
Typical Propagation Delay to a Logical “0” for the
MM74C901
Typical Propagation Delay to a Logical “1” for the
MM74C901
Typical Propagation Delay to a Logical “0” for the
MM74C902
Typical Propagation Delay to a Logical “1” for the
MM74C902
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4
MM74C901 • MM74C902
Physical Dimensions inches (millimeters) unless otherwise noted
14-Lead Plastic Dual-In-Line Package (PDIP), JEDEC MS-120, 0.150” Narrow
Package Number M14A
5
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MM74C901 • MM74C902 Hex Inverting TTL Buffer • Hex Non-Inverting TTL Buffer
Physical Dimensions inches (millimeters) unless otherwise noted (Continued)
14-Lead Plastic Dual-In-Line Package (PDIP), JEDEC MS-001, 0.300” Wide
Package Number N14A
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FAIRCHILD’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT
DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF FAIRCHILD
SEMICONDUCTOR CORPORATION. As used herein:
2. A critical component in any component of a life support
1. Life support devices or systems are devices or systems
device or system whose failure to perform can be reawhich, (a) are intended for surgical implant into the
sonably expected to cause the failure of the life support
body, or (b) support or sustain life, and (c) whose failure
device or system, or to affect its safety or effectiveness.
to perform when properly used in accordance with
instructions for use provided in the labeling, can be reasonably expected to result in a significant injury to the
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user.
Fairchild does not assume any responsibility for use of any circuitry described, no circuit patent licenses are implied and Fairchild reserves the right at any time without notice to change said circuitry and specifications.