Technologies Leading at Specialty S C Chien VP of Specialty Technology and Corporate Marketing 27th May, 2015 Outline • Paving the Way for IoT • Greener and Smarter Automotive • Summary 2 IoT Redirects Foundry Focus Main IoT Applications & Key Technologies IOT Wearable Smart City Smart Home/ Building LP MCU LP MCU LP MCU LP MCU LP MCU LP MCU BT/BLE HP AP HP AP HP AP Display Zigbee PLC WiFi BT/BLE Zigbee BT/BLE 2G/3G/4G RFID NFC GPS Charger PMIC Zigbee PLC WiFi BT/BLE RFID NFC GPS Display Display Sensor Display Display Display Charger PMIC PMIC Charger PMIC Energy Harvesting Charger PMIC Sensor Sensor PMIC Sensor Remote Healthcare Smart Retail/ Logistic Smart Transport Sensor Sensor : eNVM : Cutting Edge Logic/MM : MMRF 4 : eHV : BCD : CIS, MEMS IoT Redirects Foundry Focus • Power Behavior: • From “Active/Standby” to “Sleep/Wakeup” • Low Power Throughout All Design stages • Specialty Outweighs Logic • Sensing & Connecting Major, Computing Minor • Mainstream Nodes Major, Leading Nodes Minor • Deep Fusion Outweighs Single Variant • eNVM + RF + Logic 5 Low Power Throughout All Design Stages • More Sleep Modes Are Applied • Active Power Reduced by Lower Vcc and DVFS Active Power Active Sleep Sleep time 6 Specialty Outweighs Logic – Complete Portfolios .6um .5um .35um .25um .18um .15um .13um 90nm 65nm 40nm .11um 80nm 55nm 28nm 14nm 10nm Logic/MS RF eNVM HV CIS BCD MEMS Available RF SOI Developing uLP option 7 JDP/Customization Updated Nov, 2014 Deep Fusion Rather Than Single Variant Ultra Low Power Logic/MM/RF + eNVM Technology Tech. Node 28nm uLP 40nm uLP eNVM eNVM 12” 8” 8”/12” Logic/MMRF 55nm uLP eNVM 110nm AE (Al) eNVM 180nm LL eNVM Time 8 IoT/ uLP Solutions Ultra Low Power Fusion Solution uLP IP uLP Standard Cell Lib uLP Memory Complier BLE 4.1 uLP Device uLP + RFCMOS Platform Low Vcc 5V LDMOS uHVt/LVt device uLP SRAM bit-cell uLP eFlash Cost effective SONOS High High performance SST 10 Advantages of uLP Solutions • Example: 40nm Power Saving to Extend Battery Lifetime Active Power Device Leakage SRAM Cell Leakage save 35% 10 times lower save 75% 11 Optimized Solutions by Applications eFlash Macro Density High performance (SST) 8Mb Cost effective solution (SONOS) eFlash Macro Area % of a Chip 12 IoT Summary • IoT Redirects Foundry Focus • • • • Power > Cost > Performance From “Active/Standby” to “Sleep/Wakeup” Specialty Outweighs Logic Deep Fusion Outweighs Single Variant • UMC, Your Best IoT Foundry Partner • Full Spectrum Offering and Through Nodes’ • • Experience on Specialty Technologies Ultra Low Power Fusion Solutions Offered for Designs Best C/P Solution 13 Future Automotive Industry Steering Deeper Supply Chain Collaboration IC Technology Enables Greener & Smarter Car Smarter Fuel engine efficiency Infotainment EV or HEV Greener ADAS 15 More ECU/IC Used in a Car • ADAS, Infotainment, EV/HEV and Fuel Efficiency Require More ECU (electronic control unit) Average # of ECU in a car 100 75 Chip content per car: $495 $350 50 ’11 2011 2015 Source: iHS 2014 16 2019 IC insight ‘15 Comprehensive Portfolios for Auto .6um .5um .35um .25um .18um .15um .13um 90nm 65nm 40nm .11um 80nm 55nm 28nm 14nm 10nm Logic/MS RF eNVM HV CIS PMIC MEMS Available Developing JDP/Customization 17 Updated May 2015 Automotive Product Full Scope Auto Solutions Full Scope of ECU Module/Component Makers’ Requirements Foundry Solutions Liability Certification, TS16949 etc. Capacity Biz Continuity Productivity Auto Grade Technology Solution Reliability AEC Q-100 Qual Quality Turnkey Service Longevity Auto Service Pkg 18 Production Proven Services • Porting Approach • Long History with IDM/Fab-lite Proprietary Technology Porting Success. Including Logic/MM, RFCMOS, eNVM and BCD etc. • Platform Solutions • Main Stream MCU and PMIC Applications • Tj 175oC Characterization for Grade 0 • Auto Grade Process, IP, Modeling 19 Automotive Standard Certification • Continuous TS16949 Certification for All Sites Since 2004 TS16949:2013 Hsinchu site TS16949:2013 Tainan site TS16949:2013 Singapore site TS16949:2013 China site Validity : 2013/6/3 ~ 2016/6/2 Validity : 2013/6/3 ~ 2016/6/2 Validity : 2013/6/3 ~ 2016/6/2 Validity : 2013/4/6 ~ 2016/4/5 20 UMC’s Automotive Achievement 8+ major car OEMs Qualify grade-0 product within10 quarters UMC’s auto process adopted by 40+ technology families established for automotive products 70+ production T/O (2010~) 240K+ wafers shipped (2010~) 21 Summary • Auto Certified Foundry With Full Scope of Automotive Solutions • UMC is Awarded DJ Sustainability Foundry • Commit to Auto Longevity Production Support • Your Trusted Foundry Partner to Grow Together 22 Thank You !!!