0 COMMODITY: SURFACE MOUNT LED SMD SPECIFICATION Part No: 1SC5050VGB00CB05 Characters § 5.0mm×5.0mm SMT LED , 1.5mm THICKNESS. § LOW POWER CONSUMPTION. § VIEWING ANGLE 120°. § VARIOUS COLORS AND LENS TYPES AVAILABLE. § PACKAGE: 1000 PCS/REEL. ITEM MATERIALS Resin(Mold) Silicone Lens Color Water Transparent Red AlGaInP Dice Green InGaN Blue InGaN Absolute Maximum Ratings（Ta=25℃） Value Item Unit Symbol Red 0000000000000000000000000000000000000000000000000000000 Green Blue Power Dissipation PD 120 120 120 mW DC Forward Current IF 30 30 30 mA Pulsed Forward Current IFP 100※ 100 ※ 100 ※ mA Reverse Voltage Operating Temperature VR 5 5 5 V 00000000000000 Storage Temperature 0 0 Soldering Temperature△ 0 Topr -40~ +80 ℃ Tstg -40 ~ +100 ℃ Tsol 260for5sec△ ℃ ※ Duty 1/10， Pulse Width 0.1ms . △Soldering time max 10sec. please refer to IF-Ta diagram of curves for the temperature during application 0 0 0 Electrical-Optical Characteristics（Ta=25℃） Parameter Forward Voltage Luminous intensity Value Unit Test condition 2.5 V If=20mA 3.2 3.7 V If=20mA 3.2 3.7 V If=20mA R 700 ﹍ mcd If=20mA G 1750 ﹍ mcd If=20mA ﹍ mcd If=20mA 635 (nm) If=20mA 535 (nm) If=20mA Symbol Vf Iv Min. Typ. Max. R 1.7 2.0 G 2.8 B 2.8 320 B 0000000000000000000000000000000000000000000000000000000 Wavelength Reverse Current λd Ir ﹍ R 620 G 520 B 463 ﹍ 473 (nm) If=20mA ﹍ ﹍ 10 μA Vr=5V R:If=20mA G: If=20mA B: If=20mA ﹍ ﹍ Deg 2θ1/2 Viewing angle 120 00000000000000 0 0 ▲ 1.Luminous intensity (IV) ±10%, Forward Voltage (VF) ±0.1V, Wavelength(λd) ±0.5nm 0 2.IS standard testing 0 0 0 Outline Dimensions 0000000000000000000000000000000000000000000000000000000 00000000000000 0 0 0 § All dimensions are in millimeters. Tolerance is ±0.1 ㎜ unless other specified § Specifications are subject to change without notice. § 0 0 0 COMMODITY: SURFACE MOUNT CHIP LED SMD SPECIFICATION DEVICE NUMBER: 1SC5050VGB00CB05 Fig.2 Relative Luminous Intensity-IF (Ta=25℃) Forward Current IF(mA) Relative Luminous Intensity Fig.1 IF-VF(Ta=25℃) 0000000000000000000000000000000000000000000000000000000 Forward Voltage VF(V) 00000000000000 0 0 0 Wavelength λd (nm) Fig.5 IF-Ta Fig.4 Relative Luminous Intensity-Ta Relative Luminous Intensity Relative Luminous Intensity Fig.3 Wavelength Characteristics (Ta=25℃) Forward Current IF(mA) Ambient Temperature Ta (℃) Forward Current IF(mA) Directive Characteristics（Ta=25℃） 0 0 Ambient Temperature Ta (℃) 0 Reflow Profile Reflow Temp/Time 0000000000000000000000000000000000000000000000000000000 00000000000000 0 0 0 NOTES: 1. We recommend the reflow temperature 240℃(±5℃).the maximum soldering temperature should be limited to 260℃. 2. Don’t cause stress to the silicone resin while it is exposed to high temperature. 3. Number of reflow process shall be 1 time. 0 0 0 Test circuit and handling precautions Test circuit Handling precautions 0000000000000000000000000000000000000000000000000000000 1. Over-current-proof Customer must apply resistors for protection; otherwise slight voltage shift will cause big current change (Burn out will happen). 2.Storage 2.1 It is recommended to store the products in the following conditions: Humidity: 60% R.H. Max. Temperature : 5℃~30℃(41℉~86℉) 2.2 Shelf life in sealed bag: 12 month at ＜5℃~30℃ and ＜60% R.H. after the package is 00000000000000 Opened, the products should be used within a week or they should be keeping to stored at 0 ≦20%R.H. with zip-lock sealed. 0 0 3.Baking It is recommended to baking before soldering when the pack is unsealed after 24hrs. The conditions are as followings: 3.1 70±3℃ x(12~24hrs) and ＜5%RH, taped reel type 3.2 100±3℃ x(45min~1hr), bulk type 3.3 130±3℃ x(15~30min), bulk type 0 0 0 Test items and results of reliability Environmental Sequence Type Test Item Test Conditions Note Number of Damaged Temperature Cycle -45℃ 30min ↑↓20 min 105℃ 30min 100 cycle 0/22 Thermal Shock -10℃ 15min ↑↓5sec 100℃ 15min 100 cycle 0/22 10 cycle 0/22 1000 hrs 0/22 1000 hrs 0/22 1000 hrs 0/22 1000 hrs 0/22 500 hrs 0/22 1000 hrs 0/22 High Humidity Heat Cycle High Temperature Storage 30℃⇔ 65℃ 90%RH 24hrs/1cycle Ta=100℃ 0000000000000000000000000000000000000000000000000000000 Humidity Heat Storage Low Temperature Storage Operation Sequence Life Test High Humidity Heat Life Test 00000000000000 0 Low Temperature Life Test 0 0 Ta=85℃ RH=85% Ta=-40℃ Ta=25℃ IF=20mA 85℃ RH=85% IF=10mA Ta=-20℃ IF=20mA 0 0 0 5050 Full-Color High Performance SMD Top LEDs Packaging Specifications z Feeding Direction z Dimensions of Reel (Unit: mm) 0000000000000000000000000000000000000000000000000000000 z Dimensions of Tape (Unit: mm) 00000000000000 0 0 0 NOTES 1. Empty component pockets are sealed with top cover tape; 2. The maximum number of missing smds is two; 3. The cathode is oriented towards the tape sprocket hole in accordance with ANSI/EIA RS-481 specifications; 4. 1,000pcs/Reel 0 0 0 5050 Full-Color High Performance SMD Top LEDs Packaging Specifications z Packaging specifications 0000000000000000000000000000000000000000000000000000000 00000000000000 0 NOTES: 0 Reeled products (The most numbers of products are 1,000pcs) packed in a seal off 0 moisture-proof bag along with a desiccant one by one, Seven moisture-proof bag of maximums (total maximum number of products are 4,000pcs) packed in an inside box (size: about 238mm x about 194mm x about 102mm) and four inside boxes of maximums are put in the outside box (size: about 410mm x about 254mm x about 229mm) Together with buffer material, and it is packed. (Part No., Lot No., quantity should appear on the label on the moisture-proof bag, part No. And quantity should appear on the insertion request form on the cardboard box.) . 0 0 0 LED Usage and Handling Instructions No.1、soldering A、It is not better to be manual soldering B、Reflow soldering： 1、Soldering according to the following temperature chart is highly recommended 0000000000000000000000000000000000000000000000000000000 2、Soldering paste Use soldering paste with the melting point at 230℃ is recommended No.2、Collet 1、Abnormal situation caused by improper setting of collet 00000000000000 To choose the right collet is the key issue in improving the product’s quality. LED is different 0 from other electronic components, which is not only about electrical output but also for optical output. 0 This characteristic made LED more fragile in the process of SMT. If the collet’s lowering down height 0 is not well set, it will bring damage to the gold wire at the time of collet’s picking up and loading which will cause the LED fail to light up, light up now and then or other quality problems 2、How to choose the collet During SMT, please choose the collet that has larger outer diameter than the lighting area of lens, in case that improper position of collet will damage the gold wire inside the LED. Different collets fit for different products, please refer to the following pictures cross out:. 0 0 0 Outer diameter of collet should be larger than the lighting area Outer diameter of collet Picture 1（√） Picture 2（×） 3、How to set the height of collet The reason why for top view SMD, the height of collet before it presses downward will directly affect the quality of products during SMT is that if the collect go down too much, it will press lens and cause the distortion or breaking of gold wire. The setting of collet position should follow the pictures belowed. 0000000000000000000000000000000000000000000000000000000 Picture 3（√） Picture 4（×） 00000000000000 0 No.3、Other points for attention 0 A、No pressure should be exerted to the epoxy shell of the SMD under high temperature. 0 B、Do not scratch or wipe the lens since the lens and gold wire inside are rather fragile and cross out easy to break. C、LED should be used as soon as possible when being taken out of the original package, and should be stored in anti-moisture and anti-ESD package. No.4、This usage and handling instruction is only for your reference. 0 0