RABS15M - Taiwan Semiconductor

RABS15M
Taiwan Semiconductor
CREAT BY ART
1.5A, 1000V
Miniature Fast Recovery Glass Passivated Surface Bridge Rectifier
FEATURES
- Ideal for automated placement, for compact PCB design
- High surge current capability
- Ultrafast reverse recovery time for high frequency
- Negligible leakage current
- Compliant to RoHS Directive 2011/65/EU and
in accordance to WEEE 2002/96/EC
- Halogen-free according to IEC 61249-2-21 definition
ABS-L
- AEC-Q101 qualified
MECHANICAL DATA
Case: Molded plastic body
Molding compound, UL flammability classification rating 94V-0
Packing code with suffix "G" means green compound (halogen-free)
Moisture sensitivity: level 1, per J-STD-020
Terminal: Matte tin plated leads, solderable per JESD22-B102
Meet JESD 201 class 2 whisker test
Polarity: Polarity as marked on the body
Weight: 0.09 g (approximately)
MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS (TA=25°C unless otherwise noted)
SYMBOL
RABS15M
UNIT
Maximum repetitive peak reverse voltage
VRRM
1000
V
Maximum RMS voltage
VRMS
700
V
Maximum DC blocking voltage
VDC
1000
V
Maximum average forward rectified current
IF(AV)
1.5
A
Peak forward surge current, 8.3 ms single half sine-wave
superimposed on rated load
IFSM
50
A
Maximum instantaneous forward voltage (Note 1)
IF= 1.5A
VF
1.30
V
Maximum reverse current
at rated reverse voltage
IR
PARAMETER
TJ=25°C
TJ=125°C
Maximum reverse recovery time per diode (Note 2)
Rating for fusing (t<8.3ms)
Typical thermal resistance
Operating junction temperature range
Storage temperature range
1
200
μA
trr
500
ns
2
10
A2s
It
RθJL
RθJA
26
TJ
- 55 to +150
°C
TSTG
- 55 to +150
°C
70
°C/W
Note 1: Pulse test with PW=300μs, 1% duty cycle
Note 2: Reverse Recovery Test Conditions: IF=0.5A, IR=1.0A, IRR=0.25A
Document Number: DS_D1412015
Version: B15
RABS15M
Taiwan Semiconductor
CREAT BY ART
ORDER INFORMATION (EXAMPLE)
RABS15M REG
Green compound code
Packing code
Part no.
RATINGS AND CHARACTERISTICS CURVES
(TA=25°C unless otherwise noted)
100
1.5
1
0.5
0
0
25
50
75
100
125
150
INSTANTANEOUS REVERSE CURRENT (μA)
2
AVERAGE FORWARD CURRENT (A)
FIG. 2 TYPICAL REVERSE CHARACTERISTICS
FIG.1 MAXIMUM FORWARD CURRENT
DERATING CURVE
TJ=125°C
10
1
0.1
TJ=25°C
0.01
0
LEAD TEMPERATURE (°C)
20
40
60
80
100
PERCENT OF RATED PEAK REVERSE VOLYAGE(%)
FIG. 4 TYPICAL JUNCTION CAPACITANCE
100
100
8.3ms Single Half Sine-Wave
JUNCTION CAPACITANCE (pF) a
PEAK FORWARD SURGE CURRENT (A)
FIG. 3 MAXIMUM NON-REPETITIVE FORWARD
SURGE CURRENT
75
50
25
0
1
10
NUMBER OF CYCLES AT 60 Hz
Document Number: DS_D1412015
100
10
f=1MHz
Vsig=50mVp-p
1
0.1
1
10
100
REVERSE VOLTAGE (V)
Version: B15
RABS15M
Taiwan Semiconductor
CREAT BY ART
FIG. 5 TYPICAL FORWARD CHARACTERISTICS
INSTANTANEOUS FORWARD CURRENT (A)
10
TJ=125°C
1
TJ=25°C
0.1
0
0.2
0.4
0.6
0.8
1
1.2
1.4
1.6
FORWARD VOLTAGE (V)
PACKAGE OUTLINE DIMENSIONS
ABS-L
Unit (mm)
DIM.
Unit (inch)
Min
Max
Min
Max
B
4.30
4.50
0.169
0.177
C
6.25
6.65
0.246
0.262
D
0.60
0.70
0.024
0.028
E
3.90
4.10
0.154
0.161
F
4.90
5.10
0.193
0.201
G
1.25
1.35
0.049
0.053
H
1.20
1.30
0.047
0.051
I
0.05
0.15
0.002
0.006
J
0.30
0.70
0.012
0.028
K
0.15
0.25
0.006
0.010
SUGGESTED PAD LAYOUT
Symbol
Unit (mm)
Unit (inch)
A
1.50
0.059
B
0.90
0.035
C
4.22
0.166
D
7.22
0.284
E
2.05
0.081
F
5.72
0.225
MARKING DIAGRAM
P/N
= Specific Device Code
YW
= Date Code
F
= Factory Code
Document Number: DS_D1412015
Version: B15
RABS15M
Taiwan Semiconductor
CREAT BY ART
Notice
Specifications of the products displayed herein are subject to change without notice. TSC or anyone on its behalf,
assumes no responsibility or liability for any errors or inaccuracies.
Information contained herein is intended to provide a product description only. No license, express or implied,to
any intellectual property rights is granted by this document. Except as provided in TSC's terms and conditions of
sale for such products, TSC assumes no liability whatsoever, and disclaims any express or implied warranty,
relating to sale and/or use of TSC products including liability or warranties relating to fitness for a particular purpose,
merchantability, or infringement of any patent, copyright, or other intellectual property right.
The products shown herein are not designed for use in medical, life-saving, or life-sustaining applications.
Customers using or seling these products for use in such applications do so at their own risk and agree to fully
indemnify TSC for any damages resulting from such improper use or sale.
Document Number: DS_D1412015
Version: B15