RB751V-40WS Taiwan Semiconductor Small Signal Product Low VF SMD Schottky Barrier Diode FEATURES - Low power loss, high current capability, low VF - Surface mount device type - Moisture sensitivity level (MSL): 1 - Packing code with suffix "G" means green compound (halogen-free) SOD-323F MECHANICAL DATA - Case : Flat lead SOD-323F small outline plastic package - Molding compound, UL flammability classification rating 94V-0 - Terminal: Matte tin plated, lead free, solderable per MIL-STD-202, Method 208 guaranteed - High temperature soldering guaranteed : 260°C/10s - Polarity: Indicated by cathode band - Weight : 4.6 ± 0.5 mg - Marking Code : S8 MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS (TA=25℃ unless otherwise noted) PARAMETER SYMBOL VALUE UNIT PD 200 mW VRRM 40 V Reverse Voltage VR 30 V Mean Forward Current IO 30 mA Power Dissipation Repetitive Peak Reverse Voltage Non-Repetitive Peak Forward Surge Current 60Hz for 1 Cyc. IFSM 0.2 (Note) RθJA 500 TJ ,TSTG -40 to +125 Thermal Resistance (Junction to Ambient) Junction and Storage Temperature Range PARAMETER A o C/W o C SYMBOL TYP MAX Forward Voltage IF = 1 mA VF - 0.37 V Reverse Leakage Current VR = 30 V IR - 0.5 μA VR = 1V , f = 1.0 MHz CJ 2 - pF Junction Capacitance UNIT Note: Valid provided that electrodes are kept at ambient temeprature. Document Number: DS_S1411002 Version: C14 RB751V-40WS Taiwan Semiconductor Small Signal Product RATINGS AND CHARACTERISTICS CURVES (TA=25℃ unless otherwise noted) Fig. 2 Admissible Power Dissipation Curve Fig. 1 Typical Forward Characteristics 300 100 250 Powe Dissipation (mW) IF, Forward Current (mA) TA=25oC 10 1 0.1 200 150 100 50 0 0 0.01 0 0.2 0.4 0.6 0.8 20 40 1 60 80 100 120 140 Ambient Temperature (oC) VF, Forward Voltage (V) Fig. 4 Typical Reverse Characteristics Fig. 3 Typical Junction Capacitance Fig. 3 10000 4 IR, Leakage Current (nA) Junction Capacitance (pF) 5 3 2 1 0 TA=125oC 1000 TA=25oC 100 10 0 2 4 6 8 Reverse Voltage (V) Document Number: DS_S1411002 10 12 14 0 5 10 15 20 25 30 35 Reverse Voltage (V) Version: C14 RB751V-40WS Taiwan Semiconductor Small Signal Product ORDERING INFORMATION PART NO. PACKING PACKING CODE SUFFIX (Note 1) CODE SUFFIX PART NO. RB751V-40WS -xx RR G R9 PACKAGE SOD-323F PACKING 3,000 / 7" Reel 10,000 / 13" Reel Note 1: Part No. Suffix „-xx “ would be used for special requirement EXAMPLE PART NO. PART NO. RB751V-40WS RR RB751V-40WS RR RB751V-40WS RRG RB751V-40WS RR G Multiple manufacture source Green compound RR G Define manufacture source Green compound RB751V-40WS-B0 RRG RB751V-40WS Document Number: DS_S1411002 SUFFIX -B0 PACKING CODE PACKING CODE PREFERRED P/N SUFFIX DESCRIPTION Multiple manufacture source Version: C14 RB751V-40WS Taiwan Semiconductor Small Signal Product PACKAGE OUTLINE DIMENSIONS SOD-323F DIM. Unit (mm) Unit (inch) Min Max Min Max A 1.15 1.35 0.045 0.053 B 2.30 2.80 0.091 0.110 C 0.25 0.40 0.010 0.016 D 1.60 1.80 0.063 0.071 E 0.80 1.10 0.031 0.043 F 0.05 0.25 0.002 0.010 SUGGEST PAD LAYOUT Unit (mm) Unit (inch) Typ. Typ. A 0.63 0.025 B 0.83 0.033 C 1.60 0.063 D 2.86 0.113 DIM. Document Number: DS_S1411002 Version: C14 RB751V-40WS Taiwan Semiconductor Small Signal Product Notice Specifications of the products displayed herein are subject to change without notice. TSC or anyone on its behalf, assumes no responsibility or liability for any errors or inaccuracies. Information contained herein is intended to provide a product description only. No license, express or implied,to any intellectual property rights is granted by this document. Except as provided in TSC's terms and conditions of sale for such products, TSC assumes no liability whatsoever, and disclaims any express or implied warranty, relating to sale and/or use of TSC products including liability or warranties relating to fitness for a particular purpose, merchantability, or infringement of any patent, copyright, or other intellectual property right. The products shown herein are not designed for use in medical, life-saving, or life-sustaining applications. Customers using or seling these products for use in such applications do so at their own risk and agree to fully indemnify TSC for any damages resulting from such improper use or sale. Document Number: DS_S1411002 Version: C14