SS22L thru SS215L Taiwan Semiconductor CREAT BY ART FEATURES Surface Mount Schottky Barrier Rectifier - Low power loss, high efficiency - Ideal for automated placement - Guardring for overvoltage protection - High surge current capability - Moisture sensitivity level: level 1, per J-STD-020 - Compliant to RoHS Directive 2011/65/EU and in accordance to WEEE 2002/96/EC - Halogen-free according to IEC 61249-2-21 definition MECHANICAL DATA Case: Sub SMA Sub SMA Molding compound, UL flammability classification rating 94V-0 Base P/N with suffix "G" on packing code - halogen-free Base P/N with prefix "H" on packing code - AEC-Q101 qualified Terminal: Matte tin plated leads, solderable per JESD22-B102 Meet JESD 201 class 1A whisker test with prefix "H" on packing code meet JESD 201 class 2 whisker test Polarity: Indicated by cathode band Weight: 0.019 g (approximately) MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS (TA=25℃ unless otherwise noted) PARAMETER SYMBOL Marking code SS SS SS SS SS SS SS SS 22L 23L 24L 25L 26L 29L 22L 23L 24L 25L 26L 29L 20L 2AL 210L 215L UNIT Maximum repetitive peak reverse voltage VRRM 20 30 40 50 60 90 100 150 V Maximum RMS voltage VRMS 14 21 28 35 42 63 70 105 V Maximum DC blocking voltage VDC 20 30 40 50 60 90 100 150 V Maximum average forward rectified current IF(AV) 2 A Peak forward surge current, 8.3 ms single half sine-wave superimposed on rated load IFSM 50 A Maximum instantaneous forward voltage (Note 1) @ 2A Maximum reverse current @ rated VR TJ=25 ℃ TJ=100 ℃ TJ=125 ℃ VF 0.50 0.70 0.4 IR 15 10 - - - 5 dV/dt 10000 Typical thermal resistance RθJL RθJA 17 75 Storage temperature range TJ TSTG 0.95 V 0.1 Voltage rate of change (Rated VR) Operating junction temperature range 0.85 - 55 to +125 V/μs O - 55 to +150 - 55 to +150 mA C/W O C O C Note 1: Pulse test with PW=300μs, 1% duty cycle Document Number: DS_D1308031 Version: L13 SS22L thru SS215L Taiwan Semiconductor ORDERING INFORMATION PART NO. AEC-Q101 PACKING GREEN COMPOUND QUALIFIED CODE RU RV RT MT RQ MQ R3 RF R2 M2 CODE SS2XL (Note 1) Prefix "H" PACKAGE PACKING Sub SMA Sub SMA Sub SMA Sub SMA Sub SMA Sub SMA Sub SMA Sub SMA Sub SMA Sub SMA 1,800 / 7" Plastic reel (8mm tape) 3,000 / 7" Plastic reel (8mm tape) 7,500 / 13" Paper reel (8mm tape) 7,500 / 13" Plastic reel (8mm tape) 10,000 / 13" Paper reel (8mm tape) 10,000 / 13" Plastic reel (8mm tape) 1,800 / 7" Plastic reel (12mm tape) 3,000 / 7" Plastic reel (12mm tape) 7,500 / 13" Paper reel (12mm tape) 7,500 / 13" Plastic reel (12mm tape) RH Sub SMA 10,000 / 13" Paper reel (12mm tape) MH Sub SMA 10,000 / 13" Plastic reel (12mm tape) Suffix "G" Note 1: "x" defines voltage from 20V (SS22L) to 150V (SS215L) EXAMPLE PREFERRED P/N PART NO. SS26L RU SS26L SS26L RUG SS26L SS26LHRU AEC-Q101 QUALIFIED GREEN COMPOUND PACKING CODE DESCRIPTION CODE RU RU H SS26L G Green compound RU AEC-Q101 qualified RATINGS AND CHARACTERISTICS CURVES (TA=25℃ unless otherwise noted) PEAK FORWARD SURGE CURRENT (A) AVERAGE FORWARD CURRENT (A FIG.1 FORWARD CURRENT DERATING CURVE 2.5 2 1.5 SS25L-SS215L SS22L-SS24L 1 0.5 RESISTIVE OR INDUCTIVE LOAD 0 50 60 70 80 90 FIG. 2 MAXIMUM NON-REPETITIVE FORWARD SURGE CURRENT 50 8.3ms Single Half Sine-Wave JEDEC Method 40 30 20 10 0 100 110 120 130 140 150 160 170 1 10 LEAD TEMPERATURE (oC) NUMBER OF CYCLES AT 60 Hz FIG. 4 TYPICAL REVERSE CHARACTERISTICS FIG. 3 TYPICAL FORWARD CHARACTERISTICS 100 INSTANTANEOUS REVERSE A CURRENT (mA) INSTANTANEOUS FORWARD A CURRENT (A) 100 SS25L-SS26L 10 100 SS215L SS22L-SS24L 1 SS22L-SS24L SS25L-SS215L TJ=125℃ 10 1 0.1 TJ=75℃ 0.01 SS29L-SS210L TJ=25℃ 0.001 0 0.1 0 0.2 0.4 0.6 0.8 1 1.2 1.4 1.6 20 40 60 80 100 120 140 PERCENT OF RATED PEAK REVERSE VOLYAGE(%) FORWARD VOLTAGE (V) Document Number: DS_D1308031 Version: L13 SS22L thru SS215L Taiwan Semiconductor FIG. 5 TYPICAL JUNCTION CAPACITANCE FIG. 6 TYPICAL TRANSIENT THERMAL IMPEDANCE 100 f=1.0MHz Vslg=50mVp-p 10 0.1 1 10 100 TRANSIENT THERMAL IMPEDANCE (℃/W) JUNCTION CAPACITANCE (pF) a 1000 100 10 1 0.1 0.01 0.1 1 10 100 T-PULSE DURATION(S) REVERSE VOLTAGE (V) PACKAGE OUTLINE DIMENSIONS Unit (mm) DIM. Unit (inch) Min Max Min Max B 1.70 1.90 0.067 0.075 C 2.70 2.90 0.106 0.114 D 0.16 0.30 0.006 0.012 E 1.23 1.43 0.048 0.056 F 0.80 1.20 0.031 0.047 G 3.40 3.80 0.134 0.150 H 2.45 2.60 0.096 0.102 I 0.35 0.85 0.014 0.033 J 0.00 0.10 0.000 0.004 SUGGESTED PAD LAYOUT Symbol Unit (mm) Unit (inch) A 1.4 0.055 B 1.2 0.047 C 3.1 0.122 D 1.9 0.075 E 4.3 0.169 MARKING DIAGRAM P/N = Marking Code G = Green Compound YW = Date Code F = Factory Code Document Number: DS_D1308031 Version: L13 SS22L thru SS215L Taiwan Semiconductor CREAT BY ART Notice Specifications of the products displayed herein are subject to change without notice. TSC or anyone on its behalf, assumes no responsibility or liability for any errors inaccuracies. Information contained herein is intended to provide a product description only. No license, express or implied,to any intellectual property rights is granted by this document. Except as provided in TSC's terms and conditions of sale for such products, TSC assumes no liability whatsoever, and disclaims any express or implied warranty, relating to sale and/or use of TSC products including liability or warranties relating to fitness for a particular purpose, merchantability, or infringement of any patent, copyright, or other intellectual property right. The products shown herein are not designed for use in medical, life-saving, or life-sustaining applications. Customers using or seling these products for use in such applications do so at their own risk and agree to fully indemnify TSC for any damages resulting from such improper use or sale. Document Number: DS_D1308031 Version: L13