TSF30H100C SERIES _G14

TSF30H100C thru TSF30H200C
creat by AR
Taiwan Semiconductor
Trench Schottky Rectifier
FEATURES
- Patented Trench Schottky technology
- Excellent high temperature stability
- Low forward voltage
- Low power loss/ High efficiency
- High forward surge capability
- Compliant to RoHS directive 2011/65/EU and
in accordance to WEEE 2002/96/EC
- Halogen-free according to IEC 61249-2-21 definition
ITO-220AB
TYPICAL APPLICATIONS
Trench Schottky barrier rectifier are designed for high frequency
miniature switched mode power supplies such as adapters, lighting
and on-board DC/DC converters.
MECHANICAL DATA
Case: ITO-220AB
Molding compound meets UL 94 V-0 flammability rating
Packing code with suffix "G" means green compound (halogen-free)
Terminal: Matte tin plated leads, solderable per JESD22-B102
Meet JESD 201 class 2 whisker test
Polarity: As marked
Mounting torque: 0.56 Nm max.
Weight: 1.7 g (approximately)
MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS (TA=25°C unless otherwise noted)
PARAMETER
SYMBOL
VRRM
Maximum repetitive peak reverse voltage
per device
Maximum average forward rectified
current
per diode
Peak forward surge current, 8.3 ms single half sine-wave
superimposed on rated load per diode
Voltage rate of change (Rated VR)
Isolation voltage from terminal to heatsink t = 1 min
Instantaneous forward voltage
per diode ( Note1 )
IF = 15A
IF = 30A
Instantaneous reverse current per diode at rated
reverse voltage
TJ = 25°C
TJ = 125°C
Typical thermal resistance
Operating junction temperature range
Storage temperature range
TSF30H
TSF30H
100C
120C
150C
200C
100
120
150
200
30
UNIT
V
A
15
IFSM
150
A
dV/dt
10000
V/μs
VAC
1500
V
VF
TJ = 125°C
TJ = 25°C
TSF30H
IF(AV)
TJ = 25°C
TJ = 125°C
TSF30H
IR
Typ
Max
Typ
Max
Typ
Max
Typ
Max
0.76
0.82
0.80
0.88
0.81
0.90
0.84
0.92
0.64
0.69
0.65
0.73
0.68
0.77
0.70
0.79
0.86
0.92
0.90
0.96
0.89
0.98
0.91
1.00
0.75
0.80
0.78
0.86
0.77
0.86
0.80
0.89
150
V
μA
20
mA
RθJC
4.5
°C/W
TJ
- 55 to +150
°C
TSTG
- 55 to +150
°C
Note 1: Pulse test with pulse width=300μs, 1% duty cycle
Document Number: DS_D1411039
Version: G14
TSF30H100C thru TSF30H200C
Taiwan Semiconductor
ORDERING INFORMATION
PART NO.
PACKING CODE
TSF30HXXXC
(Note 1)
C0
PACKING CODE
SUFFIX
G
PACKAGE
PACKING
ITO-220AB
50 / Tube
Note 1: "xxx" defines voltage from 100V (TSF30H100C) to 200V (TSF30H200C)
EXAMPLE
PREFERRED
PART NO.
TSF30H120C C0G
PART NO.
PACKING CODE
TSF30H120C
C0
PACKING CODE
DESCRIPTION
SUFFIX
G
Green compound
RATINGS AND CHARACTERISTICS CURVES
(TA=25°C unless otherwise noted)
FIG.1 FORWARD CURRENT DERATING CURVE
FIG. 2 TYPICAL FORWARD CHARACTERISTICS
100
40
30
25
20
15
10
WITH HEATSINK
3in x 5in x 0.25in
Al-Plate
5
TSF30H100C
INSTANTANEOUS FORWARD CURRENT (A)
AVERAGE FORWARD CURRENT (A)
35
0
Tj=150°C
10
Tj=125°C
1
Tj=25°C
0.1
0.01
0
25
50
75
100
125
150
0
0.2
0.4
CASE TEMPERATURE (oC)
0.8
1
1.2
1.4
FIG. 4 TYPICAL FORWARD CHARACTERISTICS
FIG. 3 TYPICAL REVERSE CHARACTERISTICS
100
100
TSF30H120C
10
INSTANTANEOUS FORWARD CURRENT (A)
INSTANTANEOUS FORWARD CURRENT (A)
0.6
FORWARD VOLTAGE (V)
Tj=150°C
Tj=125°C
1
Tj=100°C
Tj=25°C
0.1
0.01
0
0.2
0.4
0.6
0.8
FORWARD VOLTAGE (V)
Document Number: DS_D1411039
1
1.2
TSF30H150C
Tj=150°C
10
Tj=125°C
1
Tj=100°C
0.1
Tj=25°C
0.01
0
0.2
0.4
0.6
0.8
1
1.2
1.4
FORWARD VOLTAGE (V)
Version: G14
TSF30H100C thru TSF30H200C
Taiwan Semiconductor
FIG. 5 TYPICAL FORWARD CHARACTERISTICS
FIG. 6 TYPICAL REVERSE CHARACTERISTICS
TSF30H200C
10
TJ=150°C
TJ=125°C
1
TJ
0.1
=100°C
TJ=25°C
0.01
0
0.2
0.4
0.6
0.8
100
INSTANTANEOUS REVERSE CURRENT (mA)
INSTANTANEOUS FORWARD CURRENT (A)
100
1
1.2
TSF30H100C
1
0.01
0.001
TJ=25°C
0.0001
1.4
10
20
30
40
50
60
70
80
90 100
PERCENT OF RATED PEAK REVERSE VOLTAGE.(%)
FIG. 8 TYPICAL REVERSE CHARACTERISTICS
10
INSTANTANEOUS REVERSE CURRENT(mA)
INSTANTANEOUS REVERSE CURRENT(mA)
FIG. 7 TYPICAL REVERSE CHARACTERISTICS
TJ=150°C
1
TJ=125°C
0.1
TJ=100°C
0.01
0.001
0.0001
TJ=25°C
0.00001
10
TSF30H150C
1
TJ=150°C
TJ=125°C
0.1
TJ=100°C
0.01
0.001
0.0001
TJ=25°C
0.00001
10
20
30
40
50
60
70
80
90 100
PERCENT OF RATED PEAK REVERSE VOLTAGE.(%)
10
20
30
40
50
60
70
80
90 100
PERCENT OF RATED PEAK REVERSE VOLTAGE.(%)
FIG. 9 TYPICAL REVERSE CHARACTERISTICS
FIG. 10 TYPICAL JUNCTION CAPACITANCE
10000
10
TSF30H200C
TJ=150°C
1
TSF30H100C
TJ=125°C
0.1
TJ=100°C
CAPACITANCE (pF)
INSTANTANEOUS REVERSE CURRENT(mA)
TJ=125°C
0.1
FORWARD VOLTAGE (V)
TSF30H120C
TJ=150°C
10
0.01
0.001
TJ=25°C
0.0001
1000
TSF30H120C
TSF30H150C
100
TSF30H200C
f=1.0MHz
Vsig=50mVp-p
10
0.00001
10
20
30
40
50
60
70
80
90
PERCENT OF RATED PEAK REVERSE VOLTAGE.(%)
Document Number: DS_D1411039
100
0.1
1
10
100
REVERSE VOLTAGE (V)
Version: G14
TSF30H100C thru TSF30H200C
Taiwan Semiconductor
PACKAGE OUTLINE DIMENSIONS
ITO-220AB
DIM.
Unit (mm)
Unit (inch)
Min
Max
Min
Max
A
4.30
4.70
0.169
0.185
B
2.50
3.16
0.098
0.124
C
2.30
2.96
0.091
0.117
D
0.46
0.76
0.018
0.030
E
6.30
6.90
0.248
0.272
F
9.60
10.30
0.378
0.406
G
3.00
3.40
0.118
0.134
H
0.95
1.45
0.037
0.057
I
0.50
0.90
0.020
0.035
J
2.40
3.20
0.094
0.126
K
14.80
15.50
0.583
0.610
L
-
4.10
-
0.161
M
12.60
13.80
0.496
0.543
N
-
1.80
-
0.071
O
2.41
2.67
0.095
0.105
MARKING DIAGRAM
P/N
= Specific Device Code
G
= Green Compound
YWW
= Date Code
F
= Factory Code
Document Number: DS_D1411039
Version: G14
TSF30H100C thru TSF30H200C
Taiwan Semiconductor
CREAT BY ART
Notice
Specifications of the products displayed herein are subject to change without notice. TSC or anyone on its behalf,
assumes no responsibility or liability for any errors or inaccuracies.
Information contained herein is intended to provide a product description only. No license, express or implied,to
any intellectual property rights is granted by this document. Except as provided in TSC's terms and conditions of
sale for such products, TSC assumes no liability whatsoever, and disclaims any express or implied warranty,
relating to sale and/or use of TSC products including liability or warranties relating to fitness for a particular purpose,
merchantability, or infringement of any patent, copyright, or other intellectual property right.
The products shown herein are not designed for use in medical, life-saving, or life-sustaining applications.
Customers using or seling these products for use in such applications do so at their own risk and agree to fully
indemnify TSC for any damages resulting from such improper use or sale.
Document Number: DS_D1411039
Version: G14