RT9187 - Farnell

RT9187
1A, Ultra-Low Dropout, Ultra-Fast CMOS LDO Regulator
The RT9187 is a high-performance, 1A LDO regulator,
offering extremely high PSRR and ultra-low dropout. Ideal
for portable RF and wireless applications with demanding
performance and space requirements.
A noise reduction pin is also available for further reduction
of output noise. Regulator ground current increases only
slightly in dropout, further prolonging the battery life. The
RT9187 also works with low-ESR ceramic capacitors,
reducing the amount of board space necessary for power
applications, critical in hand-held wireless devices.
The RT9187 consumes less than 0.1μA in shutdown mode
and has fast turn-on time less than 40μs. The other features
include ultra-low dropout voltage, high output accuracy,
current limiting protection, and high ripple rejection ratio.
Available in the VDFN-8L 3x3 and SOP-8 (Exposed Pad)
package.
Ordering Information
RT9187(-
)
Package Type
QV : VDFN-8L 3x3 (V-Type)
SP : SOP-8 (Exposed Pad-Option 1)
Lead Plating System
P : Pb Free
G : Green (Halogen Free and Pb Free)
Note :
None : Adjustable Output
Fixed Output Voltage Code
10 : 1.0V
11 : 1.1V
:
32 : 3.2V
33 : 3.3V
1L : 1.34V
Features
Ultra-Low-Noise for RF Application
Ultra-Fast Response in Line/Load Transient
Quick Start-Up (Typically 40μ
μs)
<0.1μ
μA Standby Current When Shutdown
Low Dropout : 240mV at 1A
Wide Operating Voltage Ranges : 2.5V to 5.5V
TTL-Logic-Controlled Shutdown Input
Current Limiting Protection
Thermal Shutdown Protection
Only 2.2μ
μF Output Capacitor Required for Stability
High Power Supply Rejection Ratio
RoHS Compliant and 100% Lead (Pb)-Free
Applications
CDMA/GSM Cellular Handsets
Battery-Powered Equipment
Laptop, Palmtops, Notebook Computers
Hand-Held Instruments
Mini PCI & PCI-Express Cards
PCMCIA & New Cards
Portable Information Appliances
Marking Information
For marking information, contact our sales representative
directly or through a RichTek distributor located in your
area.
Pin Configurations
(TOP VIEW)
VIN
VIN
VOUT
VOUT
8
1
3
GND
General Description
6
4
9
5
2
7
EN
NC
GND
BP/ADJ
Richtek products are :
`
VDFN-8L 3x3
RoHS compliant and compatible with the current requirements of IPC/JEDEC J-STD-020.
`
Suitable for use in SnPb or Pb-free soldering processes.
VIN
8
EN
7
GND
6
9
4
5
VIN
2
NC
VOUT
3
GND
VOUT
BP/ADJ
SOP-8 (Exposed Pad)
DS9187-11 June 2011
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RT9187
Typical Application Circuit
VIN
VIN
CIN
2.2µF
VOUT
COUT
2.2µF
VOUT
RT9187
VIN
VOUT
CIN
2.2µF
R1
RT9187
BP
Chip Enable
VIN
EN
VOUT
COUT
2.2µF
ADJ
CBP
10nF
Chip Enable
EN
GND
GND
Figure 1. Fixed Operation
R2
Figure 2. Adjustable Operation
V
OUT
= 0.8 x ( 1 +
R1 ) Volts
R2
Note : The value of R2 should be less than 80k to
maintain regulation.
Function Pin Description
Pin No.
Pin
Name
Pin Function
Fixed Output
Voltage
Adjustable
Output Voltage
1
1
VIN
Supply Input.
2
2
VIN
Supply Input.
3
3
VOUT
Regulator Output.
4
4
VOUT
Regulator Output.
5
--
BP
Noise Reduction. Connecting a 10nF capacitor to GND to
reduce output noise.
If external feedback resistors are applied, the output voltage will
--
6,
9 (Exposed Pad)
5
ADJ
6,
GND
9 (Exposed Pad)
be:
VOUT = 0.8 × (1+
R1
)V
R2
Ground. The exposed pad must be soldered to a large PCB and
connected to GND for maximum power dissipation.
7
7
NC
No Internal Connection.
8
8
EN
Enable Input Logic, Active High. When the EN goes to a logic
low, the device is in shutdown mode.
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DS9187-11 June 2011
RT9187
Function Block Diagram
VIN
EN
EN
OTP
POR
BIAS
VREF
+
Current Limit
VOUT
ADJ
Quick start
GND
Adjustable
VIN
EN
EN
OTP
POR
BIAS
VREF
+
VOUT
Current Limit
BP
Quick start
Fixed
DS9187-11 June 2011
GND
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RT9187
Absolute Maximum Ratings
(Note 1)
Supply Input Voltage ---------------------------------------------------------------------------------------------------EN Input Voltage --------------------------------------------------------------------------------------------------------Power Dissipation, PD @ TA = 25°C
VDFN-8L 3x3 -------------------------------------------------------------------------------------------------------------SOP-8 (Exposed Pad) -------------------------------------------------------------------------------------------------Package Thermal Resistance (Note 2)
VDFN-8L 3x3, θJC -------------------------------------------------------------------------------------------------------VDFN-8L 3x3, θJA -------------------------------------------------------------------------------------------------------SOP-8 (Exposed Pad), θJC -------------------------------------------------------------------------------------------SOP-8 (Exposed Pad), θJA -------------------------------------------------------------------------------------------Lead Temperature (Soldering, 10 sec.) ----------------------------------------------------------------------------Junction Temperature --------------------------------------------------------------------------------------------------Storage Temperature Range ------------------------------------------------------------------------------------------ESD Susceptibility (Note 3)
HBM -----------------------------------------------------------------------------------------------------------------------MM --------------------------------------------------------------------------------------------------------------------------
Recommended Operating Conditions
6V
6V
1.429W
1.33W
8.2°C/W
70°C/W
15°C/W
75°C/W
260°C
150°C
−65°C to 150°C
2kV
200V
(Note 4)
Supply Input Voltage ---------------------------------------------------------------------------------------------------EN Input Voltage --------------------------------------------------------------------------------------------------------Junction Temperature Range -----------------------------------------------------------------------------------------Ambient Temperature Range ------------------------------------------------------------------------------------------
2.5V to 5.5V
0V to 5.5V
−40°C to 125°C
−40°C to 85°C
Electrical Characteristics
(VIN = VOUT + 1V, VEN = VIN, CIN = COUT = 2.2μF (Ceramic) & CBP = 10nF, TA = 25°C unless otherwise specified)
Parameter
Symbol
Test Conditions
Min
Typ
Max
Unit
−2
0
2
%
0.8
--
4.5
V
Output Voltage Accuracy
(Fixed Output Voltage)
ΔVOUT
Output Voltage Range (Adjustable)
VOUT_Adj
Quiescent Current
IQ
VEN ≥ VIH, IOUT = 0mA
--
380
500
μA
ISTBY
VEN ≤ VIL,VIN = 3.3V
--
0.1
1
μA
ILIM
RLOAD = 0.5Ω, VIN = 3.3V
2
2.8
3
A
IOUT = 0.25A
--
60
100
IOUT = 0.5A
--
120
180
IOUT = 1.0A
--
240
360
ΔVLOAD
VIN = (VOUT + 0.5V)
10mA < I OUT < 1.0A
--
0.4
--
Logic-Low
VIL
VIN = 3.3V
--
--
0.6
Logic-High
VIH
VIN = 3.3V
1.8
--
--
IEN
VIN = 3.3V, Enable
--
0.1
1
Standby Current
(Note 5)
(Note 6)
Current Limit
Dropout Voltage
(Note 7)
Load Regulation
(Note 8)
(Fixed Output Voltage)
EN Threshold Voltage
Enable Pin Current
VDROP
IOUT = 10mA
(Note 9)
mV
%/A
V
μA
To be continued
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DS9187-11 June 2011
RT9187
Parameter
Power Supply
Rejection Rate
f = 100Hz
f = 10kHz
Symbol
PSRR
Test Conditions
IOUT = 300mA
Min
Typ
Max
--
−60
--
--
−50
--
Unit
dB
Line Regulation
ΔVLINE
VIN = (VOUT + 0.5) to 5.5V,
I OUT = 1mA
--
--
0.3
%
Start-Up Time
TStart_Up
RLOAD = 3Ω, 1nF ≤ CBP ≤ 0.1μF
--
40
--
μs
Thermal Shutdown Temperature
TSD
--
170
--
Thermal Shutdown Hysteresis
ΔTSD
--
30
--
Reference Voltage Tolerance
VREF
0.784
0.8
0.816
V
ADJ Pin Current
IADJ
--
10
100
nA
°C
ADJ
VADJ = VREF
Note 1. Stresses listed as the above “Absolute Maximum Ratings” may cause permanent damage to the device. These are for
stress ratings. Functional operation of the device at these or any other conditions beyond those indicated in the operational
sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may
remain possibility to affect device reliability.
Note 2. θJA is measured in natural convection at TA = 25°C on a high effective thermal conductivity four-layer test board of JEDEC
51-7 thermal measurement standard. The measurement case position of θJC is on the exposed pad of the package.
Note 3. Devices are ESD sensitive. Handling precaution is recommended.
Note 4. The device is not guaranteed to function outside its operating conditions.
Note 5. Quiescent, or ground current, is the difference between input and output currents. It is defined by IQ = IIN - IOUT under no
load condition (IOUT = 0mA). The total current drawn from the supply is the sum of the load current plus the ground pin
current.
Note 6. Standby current is the input current drawn by a regulator when the output voltage is disabled by a shutdown signal (VEN
>1.8V ).
Note 7. The dropout voltage is defined as VIN − VOUT, which is measured when VOUT is VOUT(NORMAL) −Σ 100mV.
Note 8. Regulation is measured at constant junction temperature by using a 2ms current pulse. Devices are tested for load
regulation in the load range from 10mA to 1.0A.
Note 9. Performance at -5°C ≤ TA ≤ 85°C is assured by design.
DS9187-11 June 2011
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RT9187
Typical Operating Characteristics
(COUT = 2.2μF/x5R, CBP = 10nF, unless otherwise specified )
Quiescent Current vs. Temperature
Quiescent Current vs. Input Voltage
500
VIN = 3.3V
400
Quiescent Current (uA)
Quiescent Current (uA)
500
300
200
100
400
300
200
100
0
0
-50
-40
300
-25
0
25
50
75
100
125
3
3.5
4
4.5
Temperature (°C)
Input Voltage (V)
Dropout Voltage vs. Load Current
Current Limit
VOUT = 2.8V
5
5.5
VIN = 3.3V
5
Output Current (A)
250
Dropout Voltage (mV)
VIN = 3.3V
200
TJ = 25°C
150
TJ = 125°C
100
TJ = -40°C
4
3
2
1
0
50
0
0.0
0.2
0.4
0.6
0.8
Time (1ms/Div)
1.0
VIN = 3.3V, ILOAD : 560mA
10
5
0
4
2
0
Time (100us/Div)
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EN Pin Voltage (V)
EN Pin Shutdown Response
Output Voltage (V)
Output Voltage (V)
EN Pin Voltage (V)
Load Current (A)
Start Up
4
2
0
2
1
VIN = 3.3V
ILOAD : 560mA
0
Time (25us/Div)
DS9187-11 June 2011
RT9187
Input Voltage
Deviation (V)
VIN = 3.3V to 4.3V, ILOAD : 1A
4.3
3.3
100
0
VIN = 3.3V to 4.3V, ILOAD : 800mA
4.3
3.3
10
0
-10
Time (500us/Div)
Time (500us/Div)
Load Transient Response
Load Transient Response
Load Current (A)
Load Current (A)
-100
VIN = 3.3V, ILOAD : 50mA to 1A
1
0
Output Voltage
Deviation (mV)
Output Voltage
Deviation (mV)
Line Transient Response
Output Voltage
Deviation (mV)
Output Voltage
Deviation (mV)
Input Voltage
Deviation (V)
Line Transient Response
100
0
-100
VIN = 3.3V, ILOAD : 50mA to 800mA
1
0
(1A/Div)
50
0
(50mV/Div)
-50
Time (100us/Div)
Region of Stable COUT ESR vs. Load Current
PSRR
100
VIN = VEN = 3.8V
Region
of Stable
Stable C
COUT
ESR(Ω)
(Ω)
Region of
OUTESR
20
Time (100us/Div)
PSRR (dB)
0
-20
-40
-60
ILOAD = 280mA
ILOAD = 10mA
VIN = 3.3V
10
Unstable Range
VIN = 6.0V
Stable Range
1
0.1
0.01
Simulation Verify
0.001
-80
0.0
10
0.1
100
1.0
1k
10.0
10k
100.0
100k
Frequency (Hz)
DS9187-11 June 2011
1000.0
1M 10000.0
10M
0
0.2
0.4
0.6
0.8
1
Load Current (A)
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RT9187
Outline Dimension
D2
D
L
E
E2
1
e
SEE DETAIL A
b
2
1
2
1
A
A1
A3
DETAIL A
Pin #1 ID and Tie Bar Mark Options
Note : The configuration of the Pin #1 identifier is optional,
but must be located within the zone indicated.
Dimensions In Millimeters
Dimensions In Inches
Symbol
Min
Max
Min
Max
A
0.800
1.000
0.031
0.039
A1
0.000
0.050
0.000
0.002
A3
0.175
0.250
0.007
0.010
b
0.200
0.300
0.008
0.012
D
2.950
3.050
0.116
0.120
D2
2.100
2.350
0.083
0.093
E
2.950
3.050
0.116
0.120
E2
1.350
1.600
0.053
0.063
e
L
0.650
0.425
0.026
0.525
0.017
0.021
V-Type 8L DFN 3x3 Package
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DS9187-11 June 2011
RT9187
H
A
M
EXPOSED THERMAL PAD
(Bottom of Package)
Y
J
X
B
F
C
I
D
Dimensions In Millimeters
Dimensions In Inches
Symbol
Min
Max
Min
Max
A
4.801
5.004
0.189
0.197
B
3.810
4.000
0.150
0.157
C
1.346
1.753
0.053
0.069
D
0.330
0.510
0.013
0.020
F
1.194
1.346
0.047
0.053
H
0.170
0.254
0.007
0.010
I
0.000
0.152
0.000
0.006
J
5.791
6.200
0.228
0.244
M
0.406
1.270
0.016
0.050
X
2.000
2.300
0.079
0.091
Y
2.000
2.300
0.079
0.091
X
2.100
2.500
0.083
0.098
Y
3.000
3.500
0.118
0.138
Option 1
Option 2
8-Lead SOP (Exposed Pad) Plastic Package
Richtek Technology Corporation
Richtek Technology Corporation
Headquarter
Taipei Office (Marketing)
5F, No. 20, Taiyuen Street, Chupei City
5F, No. 95, Minchiuan Road, Hsintien City
Hsinchu, Taiwan, R.O.C.
Taipei County, Taiwan, R.O.C.
Tel: (8863)5526789 Fax: (8863)5526611
Tel: (8862)86672399 Fax: (8862)86672377
Email: [email protected]
Information that is provided by Richtek Technology Corporation is believed to be accurate and reliable. Richtek reserves the right to make any change in circuit design,
specification or other related things if necessary without notice at any time. No third party intellectual property infringement of the applications should be guaranteed
by users when integrating Richtek products into any application. No legal responsibility for any said applications is assumed by Richtek.
DS9187-11 June 2011
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