RT7255 - Richtek

RT7255
1.5A, 18V, 500kHz ACOTTM Synchronous Step-down Converter
Features
General Description
The RT7255 is a synchronous step-down converter
with Advanced Constant On-Time (ACOTTM) mode
control. The ACOTTM provides a very fast transient
response with few external components. The low
impedance internal MOSFET supports high efficiency
operation with wide input voltage range from 4.3V to
18V. The proprietary circuit of the RT7255 supports all
ceramic capacitors.
The output voltage can be adjusted between 0.6V and
8V.
Ordering Information












Input Under-Voltage Lockout
Hiccup Mode Under-Voltage Protection

Thermal Shutdown

RT7255
Package Type
V8 : SOT-23-8
4.3V to 18V Input Voltage Range
Adjustable Soft-Start Time
PGOOD Function
1.5A Output Current
Advanced Constant On-Time Control
Fast Transient Response
Support All Ceramic Capacitors
Up to 95% Efficiency
500kHz Switching Frequency
Adjustable Output Voltage from 0.6V to 8V
Cycle-by-Cycle Current Limit
Applications
Lead Plating System
G : Green (Halogen Free and Pb Free)

A : Hiccup + PSM
B : Non-UVP + PSM
C : Hiccup + PWM
D : Non-UVP + PWM




Industrial and Commercial Low Power Systems
Computer Peripherals
LCD Monitors and TVs
Green Electronics/Appliances
Point of Load Regulation for High-Performance
DSPs, FPGAs, and ASICs
Note :
Richtek products are :

RoHS compliant and compatible with the current
requirements of IPC/JEDEC J-STD-020.

Suitable for use in SnPb or Pb-free soldering processes.
Simplified Application Circuit
L
RT7255
VIN
VIN
VOUT
SW
CBOOT
CIN
BOOT
RPG
CFF
R1
COUT
PGOOD
5V
EN
Enable
SS
FB
R2
GND
CSS
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June 2015
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RT7255
Pin Configurations
Marking Information
EN
PGOOD
0B=DNN
VIN
RT7255AGV8
SW
(TOP VIEW)
8
7
6
5
0B= : Product Code
DNN : Date Code
RT7255BGV8
0A=DNN
SS
GND
BOOT
4
RT7255CGV8
FB
3
2
0A= : Product Code
DNN : Date Code
09=DNN
09= : Product Code
DNN : Date Code
SOT-23-8
RT7255DGV8
06=DNN
06= : Product Code
DNN : Date Code
Functional Pin Description
Pin No.
Pin Name
Pin Function
1
BOOT
Bootstrap Supply for High-Side Gate Driver. Connect a 1F ceramic
capacitor between the BOOT and SW pins.
2
GND
Power Ground.
3
SS
Soft-Start Time Setting. Connect a capacitor from SS to GND to set the
soft-start period.
4
FB
Feedback Voltage Input. The pin is used to set the output voltage of the
converter via a resistive divider. The converter regulates VFB to 0.6V.
5
PGOOD
Power Good Indicator Output.
6
EN
Enable Control Input. Connect EN to a logic-high voltage to enable the IC or
to a logic-low voltage to disable. Do not leave this high impedance input
unconnected.
7
VIN
Power Input. The input voltage range is from 4.3V to 18V. Must bypass with
a suitable large ceramic capacitor at this pin.
8
SW
Switch Node. Connect to external L-C filter.
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is a registered trademark of Richtek Technology Corporation.
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RT7255
Function Block Diagram
BOOT
VIN
PVCC
Reg
VIBIAS
Min.
Off
PVCC
VIN
VREF
UGATE
Control
OC
Driver
SW
LGATE
UV & OV
GND SW
PVCC
SW
Ripple
Gen.
SS
FB
VIN
SW
PGOOD
+
Comparator
On-Time
GND
PWRGN
EN
EN
Operation
The RT7255 is a synchronous step-down converter
with advanced constant on-time control mode. Using
the ACOT control mode can reduce the output
capacitance and fast transient response. It can
minimize the component size without additional
external compensation network.
UVLO Protection
To protect the chip from operating at insufficient supply
voltage, the UVLO is needed. When the input voltage
of VIN is lower than the UVLO falling threshold voltage,
the device will be lockout.
Thermal Shutdown
Current Protection
When the junction temperature exceeds the OTP
The inductor current is monitored via the internal
switches cycle-by-cycle. Once the output voltage drops
under UV threshold, the RT7255 will enter hiccup
mode.
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threshold value, the IC will shut down the switching
operation. Once the junction temperature cools down
and is lower than the OTP lower threshold, the
converter will autocratically resume switching.
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RT7255
Absolute Maximum Ratings
(Note 1)

VIN to GND ------------------------------------------------------------------------------------------------------------- 0.3V to 20V

SW to GND ------------------------------------------------------------------------------------------------------------- 0.3V to 20V
<10ns --------------------------------------------------------------------------------------------------------------------- 5V to 25V

BOOT to GND ---------------------------------------------------------------------------------------------------------- 0.3V to 26V

BOOT to SW------------------------------------------------------------------------------------------------------------ 0.3V to 6V

Other Pins --------------------------------------------------------------------------------------------------------------- 0.3V to 6V

Power Dissipation, PD @ TA = 25C
SOT-23-8 ---------------------------------------------------------------------------------------------------------------- 0.53W

Package Thermal Resistance
(Note 2)
SOT-23-8, JA ---------------------------------------------------------------------------------------------------------- 186.2C/W
SOT-23-8, JC ---------------------------------------------------------------------------------------------------------- 47.4C/W

Lead Temperature (Soldering, 10 sec.) -------------------------------------------------------------------------- 260C

Junction Temperature ------------------------------------------------------------------------------------------------ 150C

Storage Temperature Range --------------------------------------------------------------------------------------- 65C to 150C

ESD Susceptibility
(Note 3)
HBM (Human Body Model) ----------------------------------------------------------------------------------------- 2kV
Recommended Operating Conditions
(Note 4)

Supply Input Voltage ------------------------------------------------------------------------------------------------- 4.3V to 18V

Ambient Temperature Range--------------------------------------------------------------------------------------- 40C to 85C

Junction Temperature Range -------------------------------------------------------------------------------------- 40C to 125C
Electrical Characteristics
(VIN = 12V, TA = 25C, unless otherwise specified)
Parameter
Symbol
Test Conditions
Min
Typ
Max
Unit
Supply Current (Shutdown)
ISHDN
VEN = 0V
--
--
12
A
Supply Current (Quiescent)
IQ
VEN = 2V, VFB = 1V
--
0.5
--
mA
High-Side
RDS(ON)_H
VBST SW = 4.8V
--
230
--
Low-Side
RDS(ON)_L
PVIN = 5V
--
130
--
Current Limit
ILIM
Vally Current
1.7
2.2
2.8
A
Oscillator Frequency
f SW
--
500
--
kHz
Maximum Duty Cycle
DMAX
--
90
--
%
Minimum On-Time
tON
--
60
--
ns
Feedback Threshold Voltage
VFB
591
600
609
mV
1.5
--
--
VEN_L
--
--
0.4
VUVLO
3.55
3.9
4.25
Switch-On Resistance
Enable Input Voltage
Logic-High VEN_H
Logic-Low
VIN Under-Voltage Lockout
Threshold-Rising
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m
V
V
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June 2015
RT7255
Parameter
Symbol
Test Conditions
Min
Typ
Max
Unit
VIN Under-Voltage Lockout
Threshold-Hysteresis
VUVLO
--
340
--
mV
Soft-Start Period
tSS
--
800
--
s
Thermal Shutdown Threshold
TSD
--
160
--
C
Thermal Shutdown Hysteresis
TSD
--
20
--
C
VOUT Discharge Resistance
RDischarge
EN = 0V, VOUT = 0.5V
--
50
100

VFB rising (Good)
87
92
97
VFB falling (Fault)
--
80
--
VSS = 0V
--
4
--
Power Good Threshold
Soft-Start Charge Current
ISS
%
A
Note 1. Stresses beyond those listed “Absolute Maximum Ratings” may cause permanent damage to the device. These are
stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the
operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions may affect
device reliability.
Note 2. JA is measured at TA = 25C on a high effective thermal conductivity four-layer test board per JEDEC 51-7. The
measurement case position of JC is on the lead of the package.
Note 3. Devices are ESD sensitive. Handling precaution recommended.
Note 4. The device is not guaranteed to function outside its operating conditions.
Copyright © 2015 Richtek Technology Corporation. All rights reserved.
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RT7255
Typical Application Circuit
7
VIN
4.3V to 18V
CIN
10μF
5V
RPG
100k
SW
BOOT
5
6
Enable
VIN
RT7255
PGOOD
EN
3 SS
CSS
10nF
FB
L
3.6μH
8
VOUT
1.2V
CBOOT
1μF
1
CFF
R1
10k
COUT
22μF
4
R2
10k
GND 2
Table 1. Suggested Component Values
VOUT (V)
R1 (k)
R2 (k)
L (H)
COUT (F)
CFF (pF)
5
110
15
10
22
39
3.3
115
25.5
6.8
22
33
2.5
25.5
8.06
4.7
22
NC
1.2
10
10
3.6
22
NC
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RT7255
Typical Operating Characteristics
Efficiency vs. Load Current
Efficiency vs. Load Current
100
100
PWM
90
80
80
70
VIN = 5V
60
VIN = 9V
50
VIN = 12V
Efficiency (%)
Efficiency (%)
PSM
90
VIN = 17V
40
30
70
60
VIN = 5V
50
VIN = 9V
40
VIN = 12V
30
VIN = 17V
20
20
10
10
VOUT = 1.2V
0
0
0.3
0.6
0.9
1.2
VOUT = 1.2V
0
0.01
1.5
0.1
1
10
Load Current (A)
Load Current (A)
Referecnce Voltage vs. Input Voltage
Reference vs. Temperature
0.610
0.610
PWM
PWM
Reference Voltage (V)
Referecnec Voltage(V)
0.608
0.605
0.603
0.600
0.598
0.595
0.605
VIN = 18V
VIN = 12V
0.600
VIN = 9V
VIN = 4.5V
0.595
0.593
VIN = 4.5V to 18V, V OUT = 1.2V, IOUT = 0A
VIN = 4.5V to 18V, V OUT = 1.2V, IOUT = 0A
0.590
0.590
4.5
6.5
8.5
10.5
12.5
14.5
16.5
-50
18.5
-25
25
50
Output Voltage vs. Load Current
100
125
Output Voltage vs. Load Current
1.230
1.250
PWM
PSM
1.222
Output Voltage (V)
1.234
VIN = 17V
VIN = 12V
1.214
1.206
VIN = 9V
VIN = 5V
1.198
1.218
1.202
VIN = 17V
VIN = 12V
1.186
VIN = 4.5V
VIN = 5V
VOUT = 1.2V
VOUT = 1.2V
1.170
1.190
0
0.3
0.6
0.9
1.2
Load Current (A)
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Temperature (°C)
Input Voltage(V)
Output Voltage (V)
0
June 2015
1.5
0
0.3
0.6
0.9
1.2
1.5
Load Current (A)
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RT7255
Switching Frequency. vs. Input Voltage
Switching Frequency vs. Temperature
600
650
PWM
Switching Frequency (kHz)1
Switcing Frequency (kHz)1
PWM
590
580
570
560
550
540
530
520
510
VOUT = 1.2V, IOUT = 0A
630
610
VIN = 18V
590
VIN = 12V
VIN = 6V
570
VIN = 4.5V
550
530
510
490
470
VOUT = 1.2V
450
500
4
5
6
7
8
9 10 11 12 13 14 15 16 17 18
-50
-25
0
25
50
75
100
125
Temperature (°C)
Input Voltage (V)
Current Limit vs. Temperature
3.0
2.8
Current Limit (A)
2.6
2.4
VIN = 18V
2.2
VIN = 12V
2.0
VIN = 6V
1.8
1.6
1.4
1.2
1.0
-50
-25
0
25
50
75
100
125
Temperature (°C)
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RT7255
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RT7255
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is a registered trademark of Richtek Technology Corporation.
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RT7255
Application Information
Inductor Selection
The ripple current was selected at 0.6A and, as long as
Selecting an inductor involves specifying its inductance
and also its required peak current. The exact inductor
value is generally flexible and is ultimately chosen to
obtain the best mix of cost, physical size, and circuit
efficiency. Lower inductor values benefit from reduced
we use the calculated 3.6H inductance, that should be
the actual ripple current amount. The ripple current and
required peak current as below :
size and cost and they can improve the circuit's
transient response, but they increase the inductor
ripple current and output voltage ripple and reduce the
efficiency due to the resulting higher peak currents.
Conversely, higher inductor values increase efficiency,
but the inductor will either be physically larger or have
higher resistance since more turns of wire are required
and transient response will be slower since more time
is required to change current (up or down) in the
inductor. A good compromise between size, efficiency,
and transient response is to use a ripple current (IL)
about 20% to 40% of the desired full output load
current. Calculate the approximate inductor value by
selecting the input and output voltages, the switching
frequency (f SW ), the maximum output current
(IOUT(MAX)) and estimating a IL as some percentage of
that current.
L=
VOUT   VIN  VOUT 
VIN  fSW  IL
Once an inductor value is chosen, the ripple current
(IL) is calculated to determine the required peak
inductor current.
VOUT   VIN  VOUT 
VIN  fSW  L
I
IL(PEAK) = IOUT(MAX)  L
2
IL
IL(VALLY) = IOUT(MAX) 
2
IL =
Considering the Typical Operating Circuit for 1.2V
output at 1.5A and an input voltage of 12V, using an
inductor ripple of 0.6A (40%), the calculated inductance
value is :
1.2  12  1.2 
L=
= 3.6μH
12  500kHz  0.6
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1.2  12  1.2 
= 0.6A
12  500kHz  3.6μH
and IL(PEAK) = 1.5A  0.6 = 1.8A
2
IL =
Inductor's saturation current should be chosen over
IC's current limit.
Input Capacitor Selection
The input filter capacitors are needed to smooth out the
switched current drawn from the input power source
and to reduce voltage ripple on the input. The actual
capacitance value is less important than the RMS
current rating (and voltage rating, of course). The RMS
input ripple current (IRMS) is a function of the input
voltage, output voltage, and load current :
IRMS = IOUT(MAX) 
VOUT
VIN
VIN
1
VOUT
Ceramic capacitors are most often used because of
their low cost, small size, high RMS current ratings, and
robust surge current capabilities. However, take care
when these capacitors are used at the input of circuits
supplied by a wall adapter or other supply connected
through long, thin wires. Current surges through the
inductive wires can induce ringing at the RT7255 input
which could potentially cause large, damaging voltage
spikes at VIN. If this phenomenon is observed, some
bulk input capacitance may be required. Ceramic
capacitors (to meet the RMS current requirement) can
be placed in parallel with other types such as tantalum,
electrolytic, or polymer (to reduce ringing and
overshoot).
Choose capacitors rated at higher temperatures than
required. Several ceramic capacitors may be paralleled
to meet the RMS current, size, and height requirements
of the application. The typical operating circuit use
10F and one 0.1F low ESR ceramic capacitors on
the input.
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RT7255
Output Capacitor Selection
The RT7255 is optimized for ceramic output capacitors
and best performance will be obtained using them. The
total output capacitance value is usually determined by
the desired output voltage ripple level and transient
response requirements for sag (undershoot on positive
load steps) and soar (overshoot on negative load
steps).
Output Ripple
Output ripple at the switching frequency is caused by
the inductor current ripple and its effect on the output
capacitor's ESR and stored charge. These two ripple
components are called ESR ripple and capacitive ripple.
Since ceramic capacitors have extremely low ESR and
relatively little capacitance, both components are
similar in amplitude and both should be considered if
ripple is critical.
VRIPPLE = VRIPPLE(ESR)  VRIPPLE(C)
VRIPPLE(ESR) = IL  RESR
VRIPPLE(C) =
IL
8  COUT  fSW
For the Typical Operating Circuit for 1.2V output and an
inductor ripple of 0.46A, with 1 x 22F output
capacitance each with about 5m ESR including PCB
trace resistance, the output voltage ripple components
are :
VRIPPLE(ESR) = 0.46A  5m = 2.3mV
0.46A
= 5.227mV
8  22μF  500kHz
= 2.3mV  5.227mV = 7.527mV
VRIPPLE(C) =
VRIPPLE
Output Transient Undershoot and Overshoot
In addition to voltage ripple at the switching frequency,
the output capacitor and its ESR also affect the voltage
sag (undershoot) and soar (overshoot) when the load
steps up and down abruptly. The ACOT transient
response is very quick and output transients are
usually small.
However, the combination of small ceramic output
capacitors (with little capacitance), low output voltages
(with little stored charge in the output capacitors), and
low duty cycle applications (which require high
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inductance to get reasonable ripple currents with high
input voltages) increases the size of voltage variations
in response to very quick load changes. Typically, load
changes occur slowly with respect to the IC's 500kHz
switching frequency.
But some modern digital loads can exhibit nearly
instantaneous load changes and the following section
shows how to calculate the worst-case voltage swings
in response to very fast load steps.
The output voltage transient undershoot and overshoot
each have two components : the voltage steps caused
by the output capacitor's ESR, and the voltage sag and
soar due to the finite output capacitance and the
inductor current slew rate. Use the following formulas
to check if the ESR is low enough (typically not a
problem with ceramic capacitors) and the output
capacitance is large enough to prevent excessive sag
and soar on very fast load step edges, with the chosen
inductor value.
The amplitude of the ESR step up or down is a function
of the load step and the ESR of the output capacitor :
VESR _STEP = IOUT x RESR
The amplitude of the capacitive sag is a function of the
load step, the output capacitor value, the inductor value,
the input-to-output voltage differential, and the
maximum duty cycle. The maximum duty cycle during a
fast transient is a function of the on-time and the
minimum off-time since the ACOTTM control scheme
will ramp the current using on-times spaced apart with
minimum off-times, which is as fast as allowed.
Calculate the approximate on-time (neglecting
parasitics) and maximum duty cycle for a given input
and output voltage as :
tON =
VOUT
tON
and DMAX =
VIN  fSW
tON  tOFF(MIN)
The actual on-time will be slightly longer as the IC
compensates for voltage drops in the circuit, but we
can neglect both of these since the on-time increase
compensates for the voltage losses. Calculate the
output voltage sag as :
VSAG =
L  (IOUT )2
2  COUT   VIN(MIN)  DMAX  VOUT 
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RT7255
The amplitude of the capacitive soar is a function of the
load step, the output capacitor value, the inductor value
and the output voltage :
steady-state stability of the circuit. Choose a suitable
capacitor value that following below step.

VSOAR =
Get the BW the quickest method to do transient
response form no load to full load. Confirm the
damping frequency. The damping frequency is BW.
L  (IOUT )
2  COUT  VOUT
2
Output Capacitors Stability Criteria
The RT7255's ACOTTM control architecture uses an
internal virtual inductor current ramp and other
compensation that ensures stability with any
reasonable output capacitor. The internal ramp allows
the IC to operate with very low ESR capacitors and the
IC is stable with very small capacitances. Therefore,
output capacitor selection is nearly always a matter of
meeting output voltage ripple and transient response
requirements, as discussed in the previous sections.
For the sake of the unusual application where ripple
voltage is unimportant.
Any ESR in the output capacitor lowers the required
minimum output capacitance, sometimes considerably.
For the rare application where that is needed and
useful, the equation including ESR is given here :
VOUT
COUT 
2  fSW  VIN  (RESR  13647  L  VOUT )
As can be seen, setting RESR to zero and simplifying
the equation yields the previous simpler equation. To
allow for the capacitor's temperature and bias voltage
coefficients, use at least double the calculated
capacitance and use a good quality dielectric such as
X5R or X7R with an adequate voltage rating since
ceramic capacitors exhibit considerable capacitance
reduction as their bias voltage increases.
Feed-forward Capacitor (Cff)
The RT7255 is optimized for ceramic output capacitors
and for low duty cycle applications. However for
high-output voltages, with high feedback attenuation,
the circuit's response becomes over-damped and
transient response can be slowed. In high-output
voltage circuits (VOUT > 3.3V) transient response is
improved by adding a small “feed-forward” capacitor
(Cff) across the upper FB divider resistor (Figure 1), to
increase the circuit's Q and reduce damping to speed
up the transient response without affecting the
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BW
VOUT
R1
Cff
FB
RT7255
R2
GND
Figure 1. Cff Capacitor Setting

Cff can be calculated base on below equation :
Cff 
1
2  3.1412  R1 BW  0.8
External Soft-Start (SS)
The RT7255 provides soft-start function. The soft-start
function is used to prevent large inrush current while
converter is being powered-up. The soft-start timing
can be programmed by the external capacitor CSS
between SS and GND. An internal current source ISS
(6A) charges an external capacitor to build a soft-start
ramp voltage. The VFB voltage will track the internal
ramp voltage during soft-start interval. The typical soft
start time is calculated as follows :
Soft-Start time tSS = CSS x 0.6 / 6A
The available capacitance range is from 2.7nF to
120nF. Do not leave SS unconnected
Enable Operation (EN)
For automatic start-up the high-voltage EN pin can be
connected to VIN, through a 100k resistor. Its large
hysteresis band makes EN useful for simple delay and
timing circuits. EN can be externally pulled to VIN by
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RT7255
adding a resistor-capacitor delay (REN and CEN in
Figure 2). Calculate the delay time using EN's internal
threshold where switching operation begins (1.4V,
typical).
An external MOSFET can be added to implement
digital control of EN when no system voltage above 2V
is available (Figure 3). In this case, a 100kpull-up
resistor, REN, is connected between VIN and the EN
pin. MOSFET Q1 will be under logic control to pull
down the EN pin. To prevent enabling circuit when VIN
is smaller than the VOUT target value or some other
desired voltage level, a resistive voltage divider can be
placed between the input voltage and ground and
Output Voltage Setting
Set the desired output voltage using a resistive divider
from the output to ground with the midpoint connected
to FB. The output voltage is set according to the
following equation :
VOUT = 0.6 x (1 + R1 / R2)
VOUT
R1
FB
RT7255
GND
connected to EN to create an additional input under
voltage lockout threshold (Figure 4).
Figure 5. Output Voltage Setting
Place the FB resistors within 5mm of the FB pin.
Choose R2 between 10k and 100k to minimize
EN
VIN
REN
EN
RT7255
CEN
power consumption without excessive noise pick-up
and calculate R1 as follows :
GND
R1 
Figure 2. External Timing Control
VIN
REN
100k
R2  (VOUT  0.6)
0.6
For output voltage accuracy, use divider resistors with
1% or better tolerance.
EN
RT7255
Q1
Enable
GND
Figure 3. Digital Enable Control Circuit
VIN
R2
REN1
EN
REN2
RT7255
GND
Figure 4. Resistor Divider for Lockout Threshold
Setting
External BOOT Bootstrap Diode
When the input voltage is lower than 5.5V it is
recommended to add an external bootstrap diode
between VIN (or VINR) and the BOOT pin to improve
enhancement of the internal MOSFET switch and
improve efficiency. The bootstrap diode can be a low
cost one such as 1N4148 or BAT54.
External BOOT Capacitor Series Resistance
The internal power MOSFET switch gate driver is
optimized to turn the switch on fast enough for low
power loss and good efficiency, but also slow enough
to reduce EMI. Switch turn-on is when most EMI occurs
since VSW rises rapidly. During switch turn-off, SW is
discharged relatively slowly by the inductor current
during the deadtime between high-side and low-side
switch on-times. In some cases it is desirable to reduce
EMI further, at the expense of some additional power
dissipation. The switch turn-on can be slowed by
placing a small (<47) resistance between BOOT and
the external bootstrap capacitor. This will slow the
Copyright © 2015 Richtek Technology Corporation. All rights reserved.
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14
is a registered trademark of Richtek Technology Corporation.
DS7255-00
June 2015
RT7255
high-side switch turn-on and VSW's rise. To remove the
resistor from the capacitor charging path (avoiding poor
enhancement due to undercharging the BOOT
Thermal Considerations
capacitor), use the external diode shown in Figure 6 to
charge the BOOT capacitor and place the resistance
between BOOT and the capacitor/diode connection.
dissipation depends on the thermal resistance of the IC
package, PCB layout, rate of surrounding airflow, and
difference between junction and ambient temperature.
The maximum power dissipation can be calculated by
the following formula :
5V
For continuous operation, do not exceed absolute
maximum junction temperature. The maximum power
PD(MAX) = (TJ(MAX)  TA) / JA
RT7255
0.1μF
SW
Figure 6. External Bootstrap Diode
Over-Temperature Protection
The RT7255 features an Over-Temperature Protection
(OTP) circuitry to prevent from overheating due to
excessive power dissipation. The OTP will shut down
switching operation when junction temperature
exceeds 150C. Once the junction temperature cools
down by approximately 20C, the converter will resume
operation. To maintain continuous operation, the
maximum junction temperature should be lower than
125C.
Under-Voltage Protection
Hiccup Mode
For the Hiccup, it provides Hiccup Mode Under Voltage
Protection (UVP). When the VFB voltage drops below
0.4V, the UVP function will be triggered to shut down
switching operation. If the UVP condition remains for a
period, theRT7255 will retry automatically. When the
UVP condition is removed, the converter will resume
operation. The UVP is disabled during soft-start period.
Clamp Mode
For the Clamp, it provides Current limit protection,
Under Voltage Protection (UVP) is disable, when the
UV condition is removed, the converter will resume
operation.
where TJ(MAX) is the maximum junction temperature,
TA is the ambient temperature, and JA is the junction to
ambient thermal resistance.
For recommended operating condition specifications,
the maximum junction temperature is 125C. The
junction to ambient thermal resistance, JA, is layout
dependent. For SOT-23-8 package, the thermal
resistance, JA, is 186.2C/W on a standard four-layer
thermal test board. The maximum power dissipation at
TA = 25C can be calculated by the following formula :
PD(MAX) = (125C  25C) / (186.2C/W) = 0.53W for
SOT-23-8 package
The maximum power dissipation depends on the
operating ambient temperature for fixed TJ(MAX) and
thermal resistance, JA. The derating curve in Figure 7
allows the designer to see the effect of rising ambient
temperature on the maximum power dissipation.
0.6
Maximum Power Dissipation (W)1
BOOT
Four-Layer PCB
0.5
0.4
0.3
0.2
0.1
0.0
0
25
50
75
100
125
Ambient Temperature (°C)
Figure 7. Derating Curve of Maximum Power
Dissipation
Copyright © 2015 Richtek Technology Corporation. All rights reserved.
DS7255-00
June 2015
is a registered trademark of Richtek Technology Corporation.
www.richtek.com
15
RT7255
Layout Considerations
For best performance of the RT7255, the following

SW node is with high frequency voltage swing and
should be kept at small area. Keep analog
components away from the SW node to prevent
stray capacitive noise pick-up. Components near
the RT7255

An example of PCB layout guide is shown in Figure
for reference.
layout guidelines must be strictly followed.

Input capacitor must be placed as close to the IC as
possible.

Keep the traces of the main current paths as short
and wide as possible.
SW should be connected to inductor by Wide and
short trace. Keep sensitive components away from
this trace. Suggestion layout trace wider for thermal.
COUT
VOUT
Keep sensitive components away
from this trace. Suggestion layout
trace wider for thermal.
COUT
SW
CS* R
S*
VIN
6
EN
5
4
VOUT
3
R1 FB
2
CSSGND
SS
SW
7
BOOT
8
Suggestion layout trace
wider for thermal.
PGOOD
GND
CIN
REN
CIN
VIN
5V
Input capacitor must be placed as close
to the IC as possible. Suggestion layout
trace wider for thermal.
RPG
R2
The REN component must be connected to VIN.
Suggestion layout trace wider for thermal.
The feedback components
must be connected as close
to the device as possible.
Figure 8. PCB Layout Guide
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16
is a registered trademark of Richtek Technology Corporation.
DS7255-00
June 2015
RT7255
Outline Dimension
Dimensions In Millimeters
Symbol
Dimensions In Inches
Min
Max
Min
Max
A
1.000
1.450
0.039
0.057
A1
0.000
0.150
0.000
0.006
B
1.500
1.700
0.059
0.067
b
0.220
0.500
0.009
0.020
C
2.600
3.000
0.102
0.118
D
2.800
3.000
0.110
0.118
e
0.585
0.715
0.023
0.028
H
0.100
0.220
0.004
0.009
L
0.300
0.600
0.012
0.024
SOT-23-8 Surface Mount Package
Richtek Technology Corporation
14F, No. 8, Tai Yuen 1st Street, Chupei City
Hsinchu, Taiwan, R.O.C.
Tel: (8863)5526789
Richtek products are sold by description only. Richtek reserves the right to change the circuitry and/or specifications without notice at any time. Customers should
obtain the latest relevant information and data sheets before placing orders and should verify that such information is current and complete. Richtek cannot assume
responsibility for use of any circuitry other than circuitry entirely embodied in a Richtek product. Information furnished by Richtek is believed to be accurate and
reliable. However, no responsibility is assumed by Richtek or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may
result from its use. No license is granted by implication or otherwise under any patent or patent rights of Richtek or its subsidiaries.
Copyright © 2015 Richtek Technology Corporation. All rights reserved.
DS7255-00
June 2015
is a registered trademark of Richtek Technology Corporation.
www.richtek.com
17