RT9170 - Farnell

RT9170
μA Quiescent Current
300mA CMOS LDO Regulator with 15μ
General Description
Features
The RT9170 is CMOS ultra low quiescent current and low
dropout (ULDO) regulators. The devices are capable of
supplying 300mA of output current continuously.
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Ultra-Low Quiescent Current (Typically 15uA)
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Guaranteed 300mA Output Current
Low Dropout : 240mV at 300mA
Wide Operating Voltage Ranges : 2V to 5.5V
Fast Transient Response
Tight Load and Line Regulation
TTL-Logic-Controlled Enable Input
Current Limiting & Thermal Protection
Only 1uF Output Capacitor Required for Stability
High Power Supply Rejection Ratio
Custom Voltage Available
RoHS Compliant and 100% Lead (Pb)-Free
The RT9170's performance is optimized for batterypowered systems to deliver 15uA ultra low quiescent
current and extremely low dropout voltage. Regulator
ground current increases only slightly in dropout, further
prolonging the battery life. The other features include ultra
low dropout voltage, high output accuracy, current limiting
protection, and high ripple rejection ratio.
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The devices are available in fixed output voltages range of
1.2V to 3.3V with 0.1V per step. The RT9170 regulators
are available in SOT-23-3, SOT-23-5 and 3-lead SOT-89
packages.
Ordering Information
RT9170-
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Applications
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Package Type
V: SOT-23-3
B: SOT-23-5
X : SOT-89
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Cellular Phones and Pagers
Battery-Powered Equipment
Laptop, Palmtops, Notebook Computers
Hand-Held Instruments
PCMCIA Cards
Pin Configurations
(TOP VIEW)
Lead Plating System
P : Pb Free
G : Green (Halogen Free and Pb Free)
Output Voltage
12 : 1.2V
13 : 1.3V
:
32 : 3.2V
33 : 3.3V
VIN
EN
NC
3
5
4
2
2
GND
3
GND VIN VOUT
VOUT
SOT-23-3
SOT-23-5
Note :
Richtek products are :
`
RoHS compliant and compatible with the current require-
`
Suitable for use in SnPb or Pb-free soldering processes.
ments of IPC/JEDEC J-STD-020.
Marking Information
For marking information, contact our sales representative
directly or through a Richtek distributor located in your
area.
DS9170-14 April 2011
1
GND
2
3
VIN VOUT
(TAB)
SOT-89
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1
RT9170
Typical Application Circuit
VIN
VIN
CIN
1uF
VOUT
RT9170-
Chip Enable
EN
xB
VOUT
COUT
1uF
GND
Functional Pin Description
Pin No.
Pin Name
Pin Function
SOT-23-3
SOT-23-5
SOT-89
3
2
2
VIN
Power Input Voltage.
2
3
3
VOU T
Output Voltage.
1
1
1
GND
Ground.
-
5
-
EN
Chip Enable (Active Low).
-
4
-
NC
No Internal Connection.
Function Block Diagram
VIN
+
-
Current Limit
&
Thermal Shutdown
EN
VOUT
GND
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DS9170-14 April 2011
RT9170
Absolute Maximum Ratings
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(Note 1)
Supply Input Voltage ------------------------------------------------------------------------------------------------ 7V
Power Dissipation, PD @ TA = 25°C
SOT-23-3 --------------------------------------------------------------------------------------------------------------- 0.4W
SOT-23-5 --------------------------------------------------------------------------------------------------------------- 0.4W
SOT-89 ----------------------------------------------------------------------------------------------------------------- 0.571W
Package Thermal Resistance (Note 2)
SOT-23-3, θJA --------------------------------------------------------------------------------------------------------- 250°C/W
SOT-23-5, θJA --------------------------------------------------------------------------------------------------------- 250°C/W
SOT-89, θJA ----------------------------------------------------------------------------------------------------------- 175°C/W
Junction Temperature ----------------------------------------------------------------------------------------------- 150°C
Storage Temperature Range --------------------------------------------------------------------------------------- −65° C to 150° C
ESD Susceptibility (Note 3)
HBM (Human Body Mode) ----------------------------------------------------------------------------------------- 2kV
MM (Machine Mode) ------------------------------------------------------------------------------------------------ 200V
Recommended Operating Conditions
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(Note 4)
Supply Input Voltage ------------------------------------------------------------------------------------------------ 2V to 5.5V
Enable Input Voltage ------------------------------------------------------------------------------------------------ 0V to 5.5V
Junction Temperature Range -------------------------------------------------------------------------------------- −40°C to 125°C
Electrical Characteristics
(VIN = VOUT + 1V, CIN = COUT = 1uF, TA = 25° C, unless otherwise specified)
Parameter
Symbol
Test Conditions
Min
Typ
Max
Unit
Output Voltage Accuracy
ΔV OUT
IOUT = 1mA
−2
--
+2
%
Current Limit
ILIM
RLOAD = 1Ω
300
--
--
mA
IQ
VEN ≤ 0.6V, IOUT = 0mA
--
15
--
μA
Dropout Voltage
VDROP
IOUT = 300mA
--
240
--
mV
Line Regulation
ΔV LINE
VIN = (V OUT + 0.3V) to 5.5V,
−0.3
0.018
+0.3
%/V
Quiescent Current
(Note 5)
IOUT = 1mA
Load Regulation
(Note 6)
ΔV LOAD
1mA < IOUT < 300mA
--
0.01
0.04
%/mA
Standby Current
(Note 7)
ISTB Y
VEN ≥ 2V (Shutdown), V IN = 5.5V
--
0.1
--
μA
Logic-Low Voltage
VIL
VIN = 2V to 5.5V, Enable
--
--
0.6
Logic-High Voltage
VIH
VIN = 2V to 5.5V, Shutdown
2
--
--
Power Supply Rejection
PSRR
f = 1kHz, COUT = 1μF
--
−40
--
dB
Thermal Shutdown Temperature
TSD
--
150
--
°C
EN Threshold
DS9170-14 April 2011
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RT9170
Note 1. Stresses listed as the above "Absolute Maximum Ratings" may cause permanent damage to the device. These are for
stress ratings. Functional operation of the device at these or any other conditions beyond those indicated in the
operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended
periods may remain possibility to affect device reliability.
Note 2. θ JA is measured in the natural convection at TA = 25°C on a low effective thermal conductivity test board of
JEDEC 51-3 thermal measurement standard.
Note 3. Devices are ESD sensitive. Handling precaution is recommended.
Note 4. The device is not guaranteed to function outside its operating conditions
Note 5. Quiescent, or ground current, is the difference between input and output currents. It is defined by IQ = IIN - IOUT under no
load condition (IOUT = 0mA). The total current drawn from the supply is the sum of the load current plus the ground pin
current.
Note 6. Regulation is measured at constant junction temperature by using a 20ms current pulse. Devices are tested for load
regulation in the load range from 1mA to 300mA.
Note 7. Standby current is the input current drawn by a regulator when the output voltage is disabled by a shutdown signal
(VEN ≥ 2V). It is measured with VIN = 5.5V.
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DS9170-14 April 2011
RT9170
Typical Operating Characteristics
Temperature Stability
Quiescent Current vs. Load Current
2.55
18
No Load
17
Quiescent Current (uA) 1
Output Voltage (V)1
2.53
2.51
2.49
ILOAD = 250mA
2.47
2.45
2.43
2.41
VIN = 3.5V
VOUT = 2.5V
CIN = 1uF (Ceramic)
COUT = 1uF (Ceramic)
2.39
2.37
16
15
14
13
VIN = 3.5V
VOUT = 2.5V
CIN = 1uF (Ceramic)
COUT = 1uF (Ceramic)
12
11
2.35
10
-35
-15
5
25
45
65
85
105
125
0
0.05
0.1
Temperature (° C)
Quiescent Current vs. Temperature
16
0.25
0.3
Quiescent Current vs. Supply Voltage
16
ILOAD = 200mA
Quiescent Current (uA) 1
Quiescent Current (uA) 1
0.2
18
18
14
No Load
12
10
8
6
VIN = 3.5V
VOUT = 2.5V
CIN = 1uF (Ceramic)
COUT = 1uF (Ceramic)
4
2
-35
-15
5
25
14
12
No Load
10
ILOAD = 200mA
8
6
4
VOUT = 2.5V
CIN = 1uF (Ceramic)
COUT = 1uF (Ceramic)
2
0
0
45
65
85
105
2
125
2.5
3
3.5
4
4.5
5
5.5
Supply Voltage (V)
Temperature (° C)
Output Voltage vs. Supply Voltage
Dropout Voltage vs. Load Current
2.55
300
VOUT = 3.3V
250
2.53
TJ = 125°C
Output Voltage (V)1
Dropout Voltage (mV)
0.15
Load Current (A)
200
TJ = 25°C
150
TJ = -40°C
100
2.51
2.49
2.47
50
VOUT = 2.5V
CIN = 1uF (Ceramic)
COUT = 1uF (Ceramic)
ILOAD = 1mA
2.45
0
0
0.05
0.1
0.15
0.2
Load Current (A)
DS9170-14 April 2011
0.25
0.3
2.5
3
3.5
4
4.5
5
5.5
Supply Voltage (V)
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RT9170
Current Limit vs. Temperature
Load Regulation Deviation vs. Temperature
1.60
-0.0005
1.40
-0.001
Current Limit (A)
Load Regulation Deviation (%/mA)
0
-0.0015
-0.002
-0.0025
-0.003
-0.0035
1.20
1.00
VIN = 5V
VOUT = 3.3V
RL = 1Ω
0.80
-0.004
VOUT = 2.5V
0.60
-0.0045
-35
-15
5
25
45
65
85
105
-50
125
ILOAD = 250mA
3.0
-20
Current Limit (A)
PSRR(dB)1
VIN = 3.5V
VOUT = 2.5V
COUT = 1uF (Ceramic)
0
25
50
75
100
125
Current Limit
PSRR
0
-10
-25
Temperature (° C)
Temperature (° C)
ILOAD = 10mA
-30
-40
-50
2.5
CIN = 10uF (Ceramic) X5R
COUT = 10uF (Ceramic) X5R
VIN = 5V
RL = 1Ω
2.0
1.5
1.0
0.5
-60
0
-70
10
100
1K
10K
100K
1M
Time (5ms/Div)
Frequency (Hz)
6
4
2
VIN = 5V
VOUT = 3.3V
CIN = 1uF (Ceramic)
COUT = 1uF (Ceramic)
ILOAD = 300mA
0
2
0
Time (25ms/DIV)
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Enable Respone
EN Voltage (V) Output Voltage (V)
EN Voltage (V)
Output Voltage (V)
Enable Respone
3
2
1
VIN = 5V
VOUT = 3.3V
CIN = 1uF(Ceramic)
COUT = 1uF(Ceramic)
ILOAD = 300mA
0
2
1
0
Time (5ms/Div)
DS9170-14 April 2011
RT9170
CIN = 1uF (Ceramic)
COUT = 1uF (Ceramic)
Input Voltage
Deviation (V)
VIN = 3.5V, VOUT = 2.5V
TA = 25°C
Line Transient Response
6
250
0
VOUT = 2.5V
5 TA = 25°C
200
0
-200
Time (0.5ms/Div)
COUT = 1uF (Ceramic)
IOUT = 250mA
4
3
≈
≈
≈
≈
Output Voltage
Deviation (mV)
Output Voltage
Deviation (mV)
Load Current (mA)
Load Transient Response
100
0
-100
Time (0.5ms/Div)
Noise
VIN = 3.5V, VOUT = 2.5V
300 IOUT = 250mA
CIN = 1uF (Ceramic)
COUT = 1uF (Ceramic)
Noise(uV)
200
100
0
-100
-200
-300
Times (2.5ms/Div)
DS9170-14 April 2011
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RT9170
Application Information
Like any low-dropout regulator, the RT9170 requires input
and output decoupling capacitors. The device is specifically
designed for portable applications requiring minimum board
space and smallest components. These capacitors must
be correctly selected for good performance (see Capacitor
Characteristics Section). Please note that linear regulators
with a low dropout voltage have high internal loop gains
which require care in guarding against oscillation caused
by insufficient decoupling capacitance.
Input Capacitor
An input capacitance of ≅ 1μF is required between the
device input pin and ground directly (the amount of the
capacitance may be increased without limit). The input
capacitor MUST be located less than 1 cm from the device
to assure input stability (see PCB Layout Section). A lower
ESR capacitor allows the use of less capacitance, while
higher ESR type (like aluminum electrolytic) require more
capacitance.
Capacitor types (aluminum, ceramic and tantalum) can be
mixed in parallel, but the total equivalent input capacitance/
ESR must be defined as above to stable operation.
There are no requirements for the ESR on the input
capacitor, but tolerance and temperature coefficient must
be considered when selecting the capacitor to ensure the
capacitance will be ≅ 1μF over the entire operating
temperature range.
Output Capacitor
The RT9170 is designed specifically to work with very
small ceramic output capacitors. A ceramic capacitor
(temperature characteristics X7R, X5R, Z5U, or Y5V) in
1μF to 10μF with 5mΩ to 50mΩ range is suitable for the
RT9170 application. The recommended minimum
capacitance for the device is 1μF, X5R or X7R dielectric
ceramic, between VOUT and GND for stability, but it may
be increased without limit. Higher capacitance values help
to improve transient.
The output capacitor's ESR is critical because it forms a
zero to provide phase lead which is required for loop
stability.
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No Load Stability
The device will remain stable and in regulation with no
external load. This is specially import in CMOS RAM keepalive applications.
Input-Output (Dropout) Volatge
A regulator's minimum input-to-output voltage differential
(dropout voltage) determines the lowest usable supply
voltage. In battery-powered systems, this determines the
useful end-of-life battery voltage. Because the device uses
a PMOS, its dropout voltage is a function of drain-tosource on-resistance, RDS(ON), multiplied by the load
current :
VDROPOUT = VIN -VOUT = RDS(ON) x IOUT
Current Limit
The RT9170 monitors and controls the PMOS' gate voltage,
limiting the output current to 0.3A (min). The output can
be shorted to ground for an indefinite period of time without
damaging the part.
Short-Circuit Protection
The device is short circuit protected and in the event of a
peak over-current condition, the short-circuit control loop
will rapidly drive the output PMOS pass element off. Once
the power pass element shuts down, the control loop will
rapidly cycle the output on and off until the average power
dissipation causes the thermal shutdown circuit to
respond to servo the on/off cycling to a lower frequency.
Please refer to the section on thermal information for
power dissipation calculations.
Capacitor Characteristics
It is important to note that capacitance tolerance and
variation with temperature must be taken into consideration
when selecting a capacitor so that the minimum required
amount of capacitance is provided over the full operating
temperature range. In general, a good tantalum capacitor
will show very little capacitance variation with temperature,
but a ceramic may not be as good (depending on dielectric
type).
DS9170-14 April 2011
RT9170
Aluminum electrolytics also typically have large
temperature variation of capacitance value.
range of 125°C to -40°C. ESR will vary only about 2X
going from the high to low temperature limits.
Equally important to consider is a capacitor's ESR change
with temperature: this is not an issue with ceramics, as
their ESR is extremely low. However, it is very important
in Tantalum and aluminum electrolytic capacitors. Both
show increasing ESR at colder temperatures, but the
increase in aluminum electrolytic capacitors is so severe
they may not be feasible for some applications.
The increasing ESR at lower temperatures can cause
oscillations when marginal quality capacitors are used (if
the ESR of the capacitor is near the upper limit of the
stability range at room temperature).
Ceramic :
For values of capacitance in the 10μF to 100μF range,
ceramics are usually larger and more costly than
tantalums but give superior AC performance for bypassing high frequency noise because of very low ESR
(typically less than 10mΩ). However, some dielectric types
do not have good capacitance characteristics as a function
of voltage and temperature.
Z5U and Y5V dielectric ceramics have capacitance that
drops severely with applied voltage. A typical Z5U or Y5V
capacitor can lose 60% of its rated capacitance with half
of the rated voltage applied to it. The Z5U and Y5V also
exhibit a severe temperature effect, losing more than 50%
of nominal capacitance at high and low limits of the
temperature range.
X7R and X5R dielectric ceramic capacitors are strongly
recommended if ceramics are used, as they typically
maintain a capacitance range within ±20% of nominal over
full operating ratings of temperature and voltage. Of
course, they are typically larger and more costly than
Z5U/Y5U types for a given voltage and capacitance.
Tantalum :
Solid tantalum capacitors are recommended for use on
the output because their typical ESR is very close to the
ideal value required for loop compensation. They also
work well as input capacitors if selected to meet the ESR
requirements previously listed.
Tantalums also have good temperature stability: a good
quality tantalum will typically show a capacitance value
that varies less than 10-15% across the full temperature
DS9170-14 April 2011
Aluminum :
This capacitor type offers the most capacitance for the
money. The disadvantages are that they are larger in
physical size, not widely available in surface mount, and
have poor AC performance (especially at higher
frequencies) due to higher ESR and ESL.
Compared by size, the ESR of an aluminum electrolytic
is higher than either Tantalum or ceramic, and it also varies
greatly with temperature. A typical aluminum electrolytic
can exhibit an ESR increase of as much as 50X when
going from 25°C down to -40°C.
It should also be noted that many aluminum electrolytics
only specify impedance at a frequency of 120Hz, which
indicates they have poor high frequency performance.
Only aluminum electrolytics that have an impedance
specified at a higher frequency (between 20kHz and
100kHz) should be used for the device. Derating must be
applied to the manufacturer's ESR specification, since it
is typically only valid at room temperature.
Any applications using aluminum electrolytics should be
thoroughly tested at the lowest ambient operating
temperature where ESR is maximum.
Thermal Considerations
The RT9170 series can deliver a current of up to 300mA
over the full operating junction temperature range. However,
the maximum output current must be derated at higher
ambient temperature to ensure the junction temperature
does not exceed 125°C. With all possible conditions, the
junction temperature must be within the range specified
under operating conditions. Power dissipation can be
calculated based on the output current and the voltage
drop across regulator.
PD = (VIN - VOUT) IOUT + VIN IGND
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RT9170
The final operating junction temperature for any set of
conditions can be estimated by the following thermal
equation :
EN
NC
PD (MAX) = ( TJ (MAX) - TA ) / θJA
Where TJ (MAX) is the maximum junction temperature of
the die (125° C) and T A is the maximum ambient
temperature. The junction to ambient thermal resistance
(θJA) for SOT-23-3 and SOT-23-5 packages at recommended
minimum footprint is 250° C/W, 175°C/W for SOT-89
package (θJA is layout dependent). Visit our website in
which “Recommended Footprints for Soldering Surface
Mount Packages” for detail.
VOUT
GND
VIN
PCB Layout
Good board layout practices must be used or instability
can be induced because of ground loops and voltage
drops. The input and output capacitors MUST be directly
connected to the input, output, and ground pins of the
device using traces which have no other currents flowing
through them.
SOT-23-5 Board Layout
The best way to do this is to layout CIN and COUT near the
device with short traces to the VIN, VOUT, and ground pins.
The regulator ground pin should be connected to the
external circuit ground so that the regulator and its
capacitors have a “single point ground” .
It should be noted that stability problems have been seen
in applications where “ vias” to an internal ground plane
were used at the ground points of the device and the
input and output capacitors. This was caused by varying
ground potentials at these nodes resulting from current
flowing through the ground plane. Using a single point
ground technique for the regulator and it's capacitors fixed
the problem. Since high current flows through the traces
going into VIN and coming from VOUT, Kelvin connect the
capacitor leads to these pins so there is no voltage drop
in series with the input and output capacitors.
Optimum performance can only be achieved when the
device is mounted on a PC board according to the diagram
below:
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DS9170-14 April 2011
RT9170
Outline Dimension
H
D
L
C
B
e
A
A1
b
Dimensions In Millimeters
Dimensions In Inches
Symbol
Min
Max
Min
Max
A
0.889
1.295
0.035
0.051
A1
0.000
0.152
0.000
0.006
B
1.397
1.803
0.055
0.071
b
0.356
0.508
0.014
0.020
C
2.591
2.997
0.102
0.118
D
2.692
3.099
0.106
0.122
e
1.803
2.007
0.071
0.079
H
0.080
0.254
0.003
0.010
L
0.300
0.610
0.012
0.024
SOT-23-3 Surface Mount Package
DS9170-14 April 2011
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RT9170
H
D
L
B
C
b
A
A1
e
Dimensions In Millimeters
Dimensions In Inches
Symbol
Min
Max
Min
Max
A
0.889
1.295
0.035
0.051
A1
0.000
0.152
0.000
0.006
B
1.397
1.803
0.055
0.071
b
0.356
0.559
0.014
0.022
C
2.591
2.997
0.102
0.118
D
2.692
3.099
0.106
0.122
e
0.838
1.041
0.033
0.041
H
0.080
0.254
0.003
0.010
L
0.300
0.610
0.012
0.024
SOT-23-5 Surface Mount Package
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DS9170-14 April 2011
RT9170
D
D1
A
B
C
C1
e
e
H
A
b
b1
b
Dimensions In Millimeters
Dimensions In Inches
Symbol
Min
Max
Min
Max
A
1.397
1.600
0.055
0.063
b
0.356
0.483
0.014
0.019
B
2.388
2.591
0.094
0.102
b1
0.406
0.533
0.016
0.021
C
3.937
4.242
0.155
0.167
C1
0.787
1.194
0.031
0.047
D
4.394
4.597
0.173
0.181
D1
1.397
1.753
0.055
0.069
e
1.448
1.549
0.057
0.061
H
0.356
0.432
0.014
0.017
3-Lead SOT-89 Surface Mount Package
Richtek Technology Corporation
Richtek Technology Corporation
Headquarter
Taipei Office (Marketing)
5F, No. 20, Taiyuen Street, Chupei City
5F, No. 95, Minchiuan Road, Hsintien City
Hsinchu, Taiwan, R.O.C.
Taipei County, Taiwan, R.O.C.
Tel: (8863)5526789 Fax: (8863)5526611
Tel: (8862)86672399 Fax: (8862)86672377
Email: [email protected]
Information that is provided by Richtek Technology Corporation is believed to be accurate and reliable. Richtek reserves the right to make any change in circuit design,
specification or other related things if necessary without notice at any time. No third party intellectual property infringement of the applications should be guaranteed
by users when integrating Richtek products into any application. No legal responsibility for any said applications is assumed by Richtek.
DS9170-14 April 2011
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