RT6010 - Richtek

®
RT6010
Dual Channel High Efficiency and High Accuracy Average
Current Control LED Backlight Buck Controller
General Description
Features
The RT6010 is a dual channel high accuracy average current
control LED backlight buck controller for 2 LED strings w/
o LED binning. Dual MOSFET drivers are specifically
designed to drive two power N-MOSFETs in an
asynchronous buck converter topology. The controller
provides variable LED current control by adjusting the CS
resistor value for digital and linear dimming. The controller
operates with T1/T2 Average Current Control (T2C) topology
to provide high accuracy ±3%. The controller also provides
high efficiency (higher than 95%) under proper setting
without LED binning. The controller provides VIN from 8V
to 450V. It is preferred to operate the controller under a
current ripple of < 30% average current and about 85%
duty to optimize the performance.
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The RT6010 can be easily connected in series by master/
slave synchronization for multiple channel, even for more
than 6-CH. The controller provides SPD (Smart Phase Shift
Dimming) that is easily implemented to synchronize master
and slave ICs. The controller provides both analog and
PWM dimming.
The RT6010 automatically detects LED bar open, LED
bar short to VIN, and LED bar short to GND to prevent
VOUT from over/under voltage damages. The controller
also outputs fault signal with programmable delay to
previous power stage, such as ACDC controller.
Ordering Information
RT6010
Package Type
S :SOP-16
Lead Plating System
G : Green (Halogen Free and Pb Free)
Note :
Richtek products are :
`
RoHS compliant and compatible with the current requirements of IPC/JEDEC J-STD-020.
`
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Fast Average Current Control T2C (T1/T2 Average
Current Control)
Dual MOSFET Drives for Asynchronous Buck
Topology
Provide High Efficiency > 95% and High Accuracy
±3% Channel to Channel Variation
Provide LED w/o Binning
Programmable PWM Constant Off Time
Support both PWM and Analog Dimming
PWM Dimming Duty Down to 1%
OVP for Bar Short with VIN
UVP for Bar Open/Short to GND with
programmable Fault Delay
Support SPD (Smart Phase Shift Dimming) for
Multiple Channel Dimming Solution
V IN POR Detection with EN Pin to Prevent
Malfunction
SOP-16 Package
RoHS Compliant and Halogen Free
Applications
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LCD TV, MNT Display Backlight
DC/DC or ACDC LED Driver Application
General Purpose Constant Current Source
LED Signage and Display
Architectural and Decorative LED Lighting
LED Street Lighting
Pin Configurations
(TOP VIEW)
VCC
DIM/PWM_IN
RT
D_OSC
F_DELAY
FAULT
NC
DPS
16
2
15
3
14
4
13
5
12
6
11
7
10
8
9
VSS
PWM_OUT
RT_OUT
EN
CS2
GATE2
GATE1
CS1
Suitable for use in SnPb or Pb-free soldering processes.
SOP-16
Copyright © 2012 Richtek Technology Corporation. All rights reserved.
DS6010-00 March 2012
is a registered trademark of Richtek Technology Corporation.
www.richtek.com
1
RT6010
Marking Information
RT6010GS : Product Number
RT6010
GSYMDNN
YMDNN : Date Code
Typical Application Circuit
VIN
CIN
120µF/450V
COUT2
0.22µF
COUT1
0.22µF
D2
1
VCC
12V
CVCC
10µF
Chip Enable
13
2
EPWM/IPWM
6
High : Disable SPD Function
Low : Support SPD
8
5
4
CF_DELAY
10nF
CD_OSC
10nF
RT6010
VCC
EN
GATE1
DIM/PWM_IN
CS1
FAULT
GATE2
DPS
F_DELAY
CS2
4.7mH L1
10
Q1
9
11
RCS1
5
Q2
12
RCS2
5
D_OSC
VSS
16
D1
4.7mH L2
NC
7
RT
RT_OUT PWM_OUT
3
14
15
RRT
180k Slave IC
Slave IC
Figure 1
VIN
12V
0.22µF
0.22µF
120µF/450V
0.22µF
0.22µF
5V
5V
50k
VCC
High : Disable SPD Function
Low : Support SPD
10nF
10nF
5
RT_OUT
PWM_OUT
DPS
5
GATE2
F_DELAY
CS2
D_OSC
VSS RT
CS1
FAULT
Q2
RT
180k
Q4
5
CS2
D_OSC
VSS
Q3
GATE1
DIM/PWM_IN
CS1
GATE2
DPS
F_DELAY
Q1
GATE1
D3
4.7mH
RT6010 (Stage_2)
VCC
EN
4.7mH
DIM/PWM_IN
FAULT
D4
4.7mH
RT6010 (Stage_1)
EN
EN
D1
D2
4.7mH
10µF
5
RT_OUT
PWM_OUT
Stage_3 DIM/PWM_IN
Stage_3 RT
FAULT
Figure 2. Synchronization for Multiple Channel_Digital
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is a registered trademark of Richtek Technology Corporation.
DS6010-00 March 2012
RT6010
VIN
0.22µF
0.22µF
120µF/450V
0.22µF
12V 5V
0.22µF
5V
50k
10µF
EN
High : Disable SPD Function
Low : Support SPD
D2
4.7mH
VCC
EN
1k
DIM/PWM_IN
DPS
GATE2
F_DELAY
10nF
10nF
DPS
5
RT
RT_OUT
GATE2
F_DELAY
10nF
5
PWM_OUT
GATE1
180k
Q4
5
CS2
D_OSC
VSS
Q3
CS1
FAULT
Q2
D3
4.7mH
RT6010 (Stage_2)
DIM/PWM_IN
CS2
D_OSC
VSS
VCC
EN
Q1
GATE1
D4
4.7mH
CS1
FAULT
22nF
D1
4.7mH
RT6010 (Stage_1)
5
RT
RT_OUT PWM_OUT
Stage_3 DIM/PWM_IN
Stage_3 RT
FAULT
Figure 3. Synchronization for Multiple Channel_Analog
Functional Pin Description
Pin No.
Pin Name
Pin Function
1
VCC
Power Supply for PWM Controller.
2
DIM/PWM_IN
Dimming PWM Pulse Input or Analog Voltage Input.
3
RT
4
D_OSC
Constant off time setting by connecting proper resistor to VSS.
For analog dimming, D_OSC should be connected to a capacitor to generate
dimming triangle oscillator that is compared with DIM/PWM_IN DC voltage level to
generate PWM dimming pulse. For digital dimming, D_OSC should be connected
to VSS.
5
F_DELAY
Define FAULT pin output delay by connecting to a proper capacitor to prevent false
trigger for UVP and OTP.
6
FAULT
Open drain output fault including UVP, OVP, and OTP (Active Low).
7
NC
No Internal Connection.
8
DPS
Smart Phase Shift Dimming Disable Pin. Pull DPS high to disable function.
9
CS1
Channel 1 Current Sense Input.
10
GATE1
Channel 1 Current Gate Driver Output.
11
GATE2
Channel 2 Current Gate Driver Output.
12
CS2
Channel 2 Current Sense Input.
13
EN
Chip Enable (Active High). Enable PWM system, prefer connect to VIN resistive
voltage divider to guarantee VIN power ready to prevent from PWM malfunction.
14
RT_OUT
15
PWM_OUT
16
VSS
Output for the next RT6010 RT.
SPD (Smart Phase Shift Dimming) output for slave to synchronize dimming phase
shift.
Ground.
Copyright © 2012 Richtek Technology Corporation. All rights reserved.
DS6010-00 March 2012
is a registered trademark of Richtek Technology Corporation.
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RT6010
Function Block Diagram
CS1
EN
+
2V
EN_PWM1
Enable
Average
Control Logic
GATE1
Average
Control Logic
GATE2
-
CS2
DIM/PWM_IN
EN_PWM2
Dimming
Control
PWM_OUT
D_OSC
OSC
DPS
RT
CS1, CS2
10µA
Off_time control
F_DELAY
RT_OUT
FAULT
+
1V
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Protection
OTP
Bar open
Bar short to VIN
Bar short to GND
-
VCC
VSS
is a registered trademark of Richtek Technology Corporation.
DS6010-00 March 2012
RT6010
Absolute Maximum Ratings
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(Note 1)
Supply Voltage, VCC -------------------------------------------------------------------------------------------------------- −0.3V to 15V
D_OSC, PWM_OUT -------------------------------------------------------------------------------------------------------- −0.3V to 7V
Others Pins ------------------------------------------------------------------------------------------------------------------- −0.3V to 15V
Power Dissipation, PD @ TA = 25°C
SOP-16 ------------------------------------------------------------------------------------------------------------------------ 1.176W
Package Thermal Resistance (Note 2)
SOP-16, θJA ------------------------------------------------------------------------------------------------------------------- 85°C/W
Lead Temperature (Soldering, 10 sec.) --------------------------------------------------------------------------------- 260°C
Junction Temperature ------------------------------------------------------------------------------------------------------- 150°C
Storage Temperature Range ---------------------------------------------------------------------------------------------- −65°C to 150°C
ESD Susceptibility (Note 3)
HBM (Human Body Mode) ------------------------------------------------------------------------------------------------ 2kV
MM (Machine Mode) -------------------------------------------------------------------------------------------------------- 200V
Recommended Operating Conditions
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(Note 4)
Control Input Voltage, VCC ------------------------------------------------------------------------------------------------ 12V ±10%
Supply Input Voltage, VIN -------------------------------------------------------------------------------------------------- 8V to 450V
Junction Temperature Range ---------------------------------------------------------------------------------------------- −40°C to 125°C
Ambient Temperature Range ---------------------------------------------------------------------------------------------- −40°C to 85°C
Electrical Characteristics
(TA = 25°C, unless otherwise specified)
Parameter
Symbol
Test Conditions
Min
Typ
Max
Unit
--
4
--
mA
--
--
1
mA
Supply Input
V BOOT = 12V, VDIM/PWM_IN = 5V,
V CSx = 0.3V
Without HV LDO Æ lower shut down
current 1mA
Supply Current
IVCC
Shutdown Current
ISHDN
UVLO Threshold
VUVLO
7
8
9
V
UVLO Hysteresis
ΔV UVLO
--
1
--
V
Logic-High
VIH
2
--
--
Logic-Low
VIL
--
--
0.6
Logic-High
VOH
2.4
--
--
Logic-Low
VOL
--
--
0.4
EN Threshold
--
2
--
V
EN Hysteresis
--
0.2
--
V
--
500
--
mV
2
8
20
μs
DIM/PWN_IN
Threshold Voltage
PWM_OUT
Threshold Voltage
V
V
PWM Controller
CS V REF
On-Time
tON
Recommend
Constant Off-Time
tOFF
Set up by RT(set 66.6kΩ)
0.8
1
1.2
μs
Recommend customer application duty
40
85
90
%
Duty
Copyright © 2012 Richtek Technology Corporation. All rights reserved.
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is a registered trademark of Richtek Technology Corporation.
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RT6010
Parameter
Symbol
PWM Frequency
Test Conditions
Defined by tOFF
Channel-to-Channel
Accuracy
Min
Typ
Max
Unit
50
100
300
kHz
--
1.6
--
%
Protection
OVP
LED string short
--
1
--
V
UVP
LED string no connection
--
100
--
mV
F_DELAY Detect Voltage
Bar open, Bar short to GND, Bar short to
VIN & OTP
0.9
1
1.1
V
F_DELAY Current Source
--
10
--
μA
FAULT Open Drain Ability
--
--
100
Ω
UVP/OVP Blanking Time
--
500
--
ns
--
250
--
ns
OTP
--
160
--
°C
OTP Hysteresis
--
20
--
°C
100
--
600
Hz
5
--
--
μs
--
25
--
ms
--
2.5
--
--
1
--
D_OSC Sourcing Current
--
10
--
μA
D_OSC Sinking Current
--
10
--
μA
UVP Delay Time
To gate off
Dimming
PWM Dimming Frequency
Min Dimming Pulse
Forced Dimming Delay
Time (High)
High-Level
VIH
Low-Level
VIL
D_OSC Input
Force dimming to H when DIM/PWM_IN
goes H for too long
When operating at analog dimming, we
recommend DIM below 2.4V
When operating at analog dimming, we
recommend DIM above 1.1V
V
Driver Capability
Gate Driver Source
VCC = 12V, VGATEX = 9V
--
80
--
mA
Gate Driver Sink
VCC = 12V, VGATEX = 3V
--
200
--
mA
Note 1. Stresses beyond those listed “Absolute Maximum Ratings” may cause permanent damage to the device. These are
stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in
the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions may
affect device reliability.
Note 2. θJA is measured at TA = 25°C on a high effective thermal conductivity four-layer test board per JEDEC 51-7.
Note 3. Devices are ESD sensitive. Handling precaution is recommended.
Note 4. The device is not guaranteed to function outside its operating conditions.
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RT6010
Typical Operating Characteristics
LED Current vs. Output Voltage
110
108
108
106
106
104
LED Current (mA)
LED Current (mA)
LED Current vs. Input Voltage
110
ILED1
102
100
ILED2
98
96
94
VOUT1 = VOUT2 = 90V, 56LEDs,
ILED1 = ILED2 = 100mA, RRT = 180kΩ
92
90
110
120
130
140
150
160
170
180
190
104
ILED1
102
100
ILED2
98
96
94
92
VIN = 120V, ILED1 = ILED2 = 100mA, RRT = 180kΩ
90
200
60
65
70
75
80
85
90
95
100
Output Voltage (V)
Input Voltage (V)
LED Current vs. Temperature
Efficiency vs. Input Voltage
110
100
90
80
ILED1
Efficiency (%)
LED Current (mA)
106
102
ILED2
98
94
70
60
50
40
30
20
VIN = 120V, VOUT1 = VOUT2 = 90V, 56LEDs,
ILED1 = ILED2 = 100mA, RRT = 180kΩ
90
-50
-25
0
25
50
75
100
VOUT1 = VOUT2 = 90V, 56LEDs,
ILED1 = ILED2 = 100mA, RRT = 180kΩ
10
0
125
110
120
130
140
Temperature (°C)
VIN = 120V, VOUT1 = VOUT2 = 90V, 56LEDs
170
100
ILED1
90
ILED2
80
LED Current (mA)
100
LED Current (mA)
160
180
190
200
LED Current vs. PWM Duty Cycle
LED Current vs. Analog Dimming Voltage
120
150
Input Voltage (V)
80
60
40
ILED1
ILED2
70
60
50
40
30
20
20
VIN = 120V, VOUT1 = VOUT2 = 90V, 56LEDs,
RRT = 180kΩ, COUT = 0.22μF
10
0
0
0.6 0.8
1
1.2 1.4 1.6 1.8
2
2.2 2.4 2.6 2.8
Analog Dimming Voltage (V)
Copyright © 2012 Richtek Technology Corporation. All rights reserved.
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0
10
20
30
40
50
60
70
80
90
100
Duty Cycle (%)
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RT6010
LED Current vs. PWM Duty Cycle
PWM Dimming Response
100
90
ILED1
LED Current (mA)
80
PWM
(5V/Div)
ILED2
70
60
I LED1
(100mA/Div)
50
40
30
20
VIN = 120V, VOUT1 = 100V
31LEDs, VOUT2 = 80V, 25LEDs
PWM = 300Hz, COUT = 0.22μF
10
I LED2
(100mA/Div)
VIN = 120V, VOUT1 = VOUT2 = 90V, 56LEDs,
PWM = 300Hz, COUT = 0.22μF, ILED1 = ILED2 = 100mA
0
0
20
40
60
80
Time (50μs/Div)
100
Duty Cycle (%)
PWM Dimming Response
V IN_AC
(500mV/Div)
PWM
(5V/Div)
I LED1
(100mA/Div)
I LED1
(100mA/Div)
I LED2
(100mA/Div)
Non-SPD Function
VIN = 120V, VOUT1 = VOUT2 = 90V, 56LEDs
I LED2
(100mA/Div)
VIN = 120V, VOUT1 = 100V, 31LEDs
VOUT2 = 80V, 25LEDs, PWM = 300Hz
COUT = 0.22μF, ILED1 = ILED2 = 100mA
Time (50μs/Div)
I IN
(100mA/Div)
PWM = 300Hz, PWM Duty = 30%
Time (1ms/Div)
SPD Function
V IN_AC
(500mV/Div)
I LED1
(100mA/Div)
I LED2
(100mA/Div)
VIN = 120V, VOUT1 = VOUT2 = 90V, 56LEDs
I IN
(100mA/Div)
PWM = 300Hz, PWM Duty = 30%
Time (1ms/Div)
Copyright © 2012 Richtek Technology Corporation. All rights reserved.
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is a registered trademark of Richtek Technology Corporation.
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RT6010
Application Information
The RT6010 is a dual channel, high accuracy current control
LED backlight buck controller. The controller is capable of
providing efficiency higher than 95% for LED backlight use.
Current Setting
Current flow through the inductor during charging period
is detected by a sensing resistor, RCS. The RT6010
provides average current mode by dynamically adjusting
VREF. The LED average current can be set as :
IOUT = 500mV
RCS
Constant Off-Time Setting
The RT6010 is a constant off-time control IC. The off-time
can be set via the external RT pin resistance, RRT. The
switching frequency is usually designed to be between
50kHz to 300kHz, so the constant off-time must also meet
the following condition :
VIN - VLED
≤ 300k
tOFF x VIN
tOFF = 15p x RRT
50k ≤
where tOFF is the constant off-time
Smart Phase Shift Dimming
The RT6010 provides dimming function selection via the
DPS pin. If the pin is connected to VCC, the two dimming
signals will be in sync for those two channels. On the
other hand, if the pin is connected to GND, the two dimming
signals will be separated. See Figure below.
DIM/PWM_IN
GATE1
GATE2
DPS = VCC
DIM/PWM_IN
The RT6010 not only provides digital dimming, but also
analog dimming as well. The analog dimming frequency
is set via the D_OSC pin. Note that the minimum dimming
duty is 6.667%. The dimming frequency is set according
to the following equation :
fPWM = 10μA / (CD_OSC × 3V)
where CD_OSC is the capacitor connected from the D_OSC
pin to GND.
Protection Functions
The RT6010 provides various protection features to prevent
damage to the IC during abnormal situations. The features
include over voltage protection, under voltage protection,
and over temperature protection. The protection flow chart
is shown below.
FLT Blanking Delay
An FLT blanking delay function is available for setting the
fault delay time to prevent false triggers for UVP and OTP.
The delay time is set via the external capacitor connected
from the F_DELAY pin to ground. The blanking delay time
can be set according to below equation :
t = CF_DELAY x 1V
10μA
where CF_DELAY is the capacitor connected from the
F_DELAY pin to GND. After VF_DELAY > 1V, a fault signal
will be sent to the FAULT pin.
Over Voltage Protection
The RT6010 provides Over Voltage Protection (OVP) when
the LED cathode becomes shorted to VIN. The OVP
threshold voltage of the CSx pin is approximately 1V. If
OVP is triggered during gate-on period, the controller will
turn off the MOSFET for 400μs. If OVP occurs
consecutively for more than 14 times, the RT6010 will
send a fault signal to the FAULT.
Under Voltage Protection
GATE1
GATE2
DPS = GND
Figure 4. Smart Phase Shift Dimming Via the DPS Pin
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Analog Dimming Frequency Setting
For situations where the LED cathode becomes open or
shorted to GND, the RT6010 provides Under Voltage
Protection (UVP). The threshold voltage of UVP is
approximately 0.1V. If UVP occurs during gate-on period,
the RT6010 will send a fault signal to the FAULT pin after
the fault delay time.
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RT6010
VIN, VCC Power up Start
GATE = Low
OVP TIMES = 0
F_DELAY pull low
FAULT = High
VCC < 3V
VCC > 5V
EN = Low / VCC < UVLO Voltage
EN = High &VCC > UVLO Voltage
After GATE = High for 750ns
Detect CS pin > 1V
GATE = Low
Timing > 400µs
After GATE = High for 750ns
Detect CS pin > 0.1V
OVP TIMES > 14
FAULT = High
F_DELAY Voltage > 1V
GATE Switch
Keep OVP TIMES
F_DELAY pull Low
FAULT = Low
GATE Switch
Keep OVP TIMES
F_DELAY pull Low
FAULT = Low
Tj < 140°C
After GATE = High for 750ns
Detect CS pin < 0.1V
GATE Switch
Keep OVP TIMES
10µA Current Charge
CF_DELAY
GATE = Low
OVP TIMES + 1
F_DELAY pull Low
FAULT = High
After GATE = Low
Detect CS pin > 0.5V
continue 1.4µs
Normal
GATE Switch
Keep OVP TIMES
F_DELAY pull Low
FAULT = High
Tj > 160°C
GATE = Low
Keep OVP TIMES
10µA Current Charge
CF_DELAY
FAULT = High
F_Delay Voltage > 1V
GATE Switch
Keep OVP TIMES
10µA Current Charge
CF_DELAY
GATE = Low
Keep OVP TIMES
10µA Current Charge
CF_DELAY
FAULT = Low
FAULT = Low
Tj < 140°C
GATE Switch
Keep OVP TIMES
F_DELAY pull Low
FAULT = Low
Figure 5. Protection Flow Chart for the RT6010
Over Temperature Protection
MOSFET Selection
To prevent excessive power dissipation from damaging
the device, the RT6010 includes an over temperature
protection feature. When the temperature rises above OTP
temperature, a fault signal will be sent to disable the
channel after the fault delay time. After the die temperature
falls below OTP hysteresis temperature, the channel will
be enabled again.
For operating at high input or output voltages, the power
N-MOSFET switch is typically chosen according to the
drain voltage, V DS , rating and low gate charge.
Consideration of switch on-resistance, RDS(ON), is usually
secondary because switching losses dominate power
loss. The gate driving voltage follows the VCC voltage range,
which is 12V for normal operation. The N-MOSFET must
meet this specification.
Inductor Selection
The inductor current ripple is usually designed below 30%
of its average current. Hence, the recommended inductor
value can be calculated as :
VLED
L>
x t OFF
0.3 x IOUT
where VLED is the LED series voltage drop, tOFF is the
PWM off-time, and IOUT is the LED average current.
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Capacitor Selection
Selecting a suitable capacitor can reduce LED current
ripple and increase LED life-time. Moreover, if the capacitor
has good current sense linearity, it will also ensure that
the current matching is accurate. Note that having too
large of a capacitance will cause the LED current to
respond slowly. The typical value of the capacitor is 0.22μF.
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RT6010
Diode Selection
Ultra-fast diodes are chosen for their low forward voltage
drop and fast switching speed. When selecting ultra-fast
diodes, important parameters such as power dissipation,
reverse voltage rating, and pulsating peak current should
all be taken into consideration. A suitable ultra-fast diode's
reverse voltage rating must be greater than the input
voltage and its average current rating must exceed the
LED average current.
VCC
VIN
EN
Start detect UVP
If VCC and VEN power on before VIN
powers on, UVP fault will be triggered.
Power On
For power on sequence, it is recommended to connect
EN to a resistive voltage divider placed between VIN and
GND to prevent UVP malfunction, as shown below.
VIN
REN1
910k
VCC
12V
Figure 7. (b) UVP Malfunction without REN1, REN2
Resistors
Figure 7. Timing Diagram for Power On Sequence
VCC
EN
REN2
30k
Figure 6. Circuit for Proper Power On Via EN Pin
Thermal Considerations
For continuous operation, do not exceed absolute
maximum junction temperature. The maximum power
dissipation depends on the thermal resistance of the IC
package, PCB layout, rate of surrounding airflow, and
difference between junction and ambient temperature. The
maximum power dissipation can be calculated by the
following formula :
VIN
PD(MAX) = (TJ(MAX) − TA) / θJA
EN
where TJ(MAX) is the maximum junction temperature, TA is
the ambient temperature, and θJA is the junction to ambient
VCC
Start detect UVP
VCC
VIN
EN
thermal resistance.
For recommended operating condition specifications, the
maximum junction temperature is 125°C. The junction to
ambient thermal resistance, θJA, is layout dependent. For
SOP-16 package, the thermal resistance, θJA, is 85°C/W
on a standard JEDEC 51-7 four-layer thermal test board.
The maximum power dissipation at TA = 25°C can be
calculated by the following formula :
PD(MAX) = (125°C − 25°C) / (85°C/W) = 1.176W for
SOP-16 package
Start detect UVP
Figure 7. (a) Proper Start Up with REN1, REN2 Resistors
Copyright © 2012 Richtek Technology Corporation. All rights reserved.
DS6010-00 March 2012
is a registered trademark of Richtek Technology Corporation.
www.richtek.com
11
RT6010
The maximum power dissipation depends on the operating
ambient temperature for fixed T J(MAX) and thermal
resistance, θJA. The derating curve in Figure 8 allows the
designer to see the effect of rising ambient temperature
on the maximum power dissipation.
Maximum Power Dissipation (W)1
1.2
Four-Layer PCB
1.1
Layout Considerations
PCB layout plays an important role for the RT6010. Careful
layout can decrease switching noise for stable operation
and improve performance. For best performance of the
RT6010, the following layout guidelines should be strictly
followed.
`
Current sense feedback resistors, D_OSC capacitor,
F_DELAY capacitor, RT resistor and capacitors for VIN
and VCC should be placed as close to the controller as
possible.
`
Keep the power loops as short as possible to prevent
voltage spikes caused by current transition from one
device to another at high speed as a result of parasitic
components on the circuit board. Therefore, all current
switching loops should be kept as short as possible
with wide traces to minimize the parasitic components.
`
Minimize the trace length between the MOSFET and
the controller. Since the drivers are integrated in the
controller, the driving path should be short and wide to
reduce the parasitic inductance and resistance.
`
The CS1 and CS2 current sense feedback trace should
be kept away from the switching node. Keep the
feedback trace close to the CS1 and CS2 pins. Allow
large area for VIN inductor trace, FET trace, RCS1 and
RCS2 trace, and GND pad.
1.0
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0.0
0
25
50
75
100
125
Ambient Temperature (°C)
Figure 8. Derating Curve of Maximum Power Dissipation
The GND traces should be wide and short.
VCC
GND
VCC
DIM/PWM_IN
RT
D_OSC
F_DELAY
FAULT
NC
DPS
16
2
15
3
14
4
13
5
12
6
11
7
10
8
9
GND
VSS
PWM_OUT
RT_OUT
EN
CS2
GATE2
GATE1
CS1
RCS2
GND C
OUT2
L2
Q1
VIN
L1
CIN
Q2
RCS1
COUT1 +
GND
Current sense feedback resistors, D_OSC
capacitor, F_DELAY capacitor, RT resistor
and capacitors for VIN and VCC should be
placed as close to the controller as possible.
The current sense node
must be near the CS pin.
Place the power components
as close to the IC as possible.
Figure 9. PCB Layout Guide
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12
is a registered trademark of Richtek Technology Corporation.
DS6010-00 March 2012
RT6010
Outline Dimension
H
A
M
B
J
F
C
I
D
Dimensions In Millimeters
Dimensions In Inches
Symbol
Min
Max
Min
Max
A
9.804
10.008
0.386
0.394
B
3.810
3.988
0.150
0.157
C
1.346
1.753
0.053
0.069
D
0.330
0.508
0.013
0.020
F
1.194
1.346
0.047
0.053
H
0.178
0.254
0.007
0.010
I
0.102
0.254
0.004
0.010
J
5.791
6.198
0.228
0.244
M
0.406
1.270
0.016
0.050
16–Lead SOP Plastic Package
Richtek Technology Corporation
5F, No. 20, Taiyuen Street, Chupei City
Hsinchu, Taiwan, R.O.C.
Tel: (8863)5526789
Richtek products are sold by description only. Richtek reserves the right to change the circuitry and/or specifications without notice at any time. Customers should
obtain the latest relevant information and data sheets before placing orders and should verify that such information is current and complete. Richtek cannot
assume responsibility for use of any circuitry other than circuitry entirely embodied in a Richtek product. Information furnished by Richtek is believed to be
accurate and reliable. However, no responsibility is assumed by Richtek or its subsidiaries for its use; nor for any infringements of patents or other rights of third
parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of Richtek or its subsidiaries.
DS6010-00 March 2012
www.richtek.com
13