RT7296E - Richtek

RT7296E
3A, 17V Current Mode Synchronous Step-Down Converter
General Description
Features
The RT7296E is a high-efficiency, 3A current mode

6V to 17V Input Voltage Range
synchronous step-down DC/DC converter with a wide

3A Output Current
input voltage range from 6V to 17V. The device

Internal N-Channel MOSFETs
integrates 80m
low-side

Current Mode Control
MOSFETs to achieve high efficiency conversion. The

Fixed Switching Frequency : 800kHz
current
architecture supports fast

Cycle-by-Cycle Current Limit
transient response and internal compensation. A

TTH Power-Save Mode
cycle-by-cycle current limit function provides protection

External Soft-Start Function
against

Input Under-Voltage Lockout
input

Output Under-Voltage Protection
under-voltage lockout, output under-voltage protection,

Thermal Shutdown
high-side
mode control
shorted output.
complete
protection
and
30m
The RT7296E
functions
such
provides
as
over-current protection, and thermal shutdown. The
Applications
RT7296E is available in the TSOT-23-8 (FC) package.
Ordering Information
RT7296E
Package Type
J8F : TSOT-23-8 (FC)

Industrial and Commercial Low Power Systems

Computer Peripherals

LCD Monitors and TVs

Set-top Boxes
Marking Information
Lead Plating System
G : Green (Halogen Free and Pb Free)
09= : Product Code
DNN : Date Code
09=DNN
Note :
Richtek products are :
 RoHS compliant and compatible with the current
requirements of IPC/JEDEC J-STD-020.
 Suitable for use in SnPb or Pb-free soldering processes.
Simplified Application Circuit
VIN
VIN
RT7296E
BOOT
C3
C1
L1
VOUT
SW
R5
PVCC
C2
R3
TTH
R1
FB
GND
R2
SS
C4
C5
R4
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DS7296E-00
Augist 2015
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RT7296E
Pin Configurations
PVCC
SS
BOOT
8
7
6
5
2
3
4
VIN
SW
GND
TTH
FB
(TOP VIEW)
TSOT-23-8 (FC)
Functional Pin Description
Pin No.
Pin Name
Pin Function
1
TTH
Transition Threshold. Connect a resistor divider to let the RT7296E into power
saving mode under light loads. Connect to PVCC to force RT7296E into CCM.
2
VIN
Power Input. Support 6V to17V Input Voltage. Must bypass with a suitable
large ceramic capacitor at this pin.
3
SW
Switch Node. Connect to external L-C filter.
4
GND
System Ground.
5
BOOT
Bootstrap Supply for High-Side Gate Driver. Connect a 0.1F ceramic
capacitor between the BOOT and SW pins.
6
SS
Soft-Start Control Input. SS control the soft-start period. Connect a capacitor
from SS to GND to set the soft-start period.
7
PVCC
5V Bias Supply Output. Connect a 0.1F capacitor to ground.
8
FB
Feedback Voltage Input. The pin is used to set the output voltage of the
converter to regulate to the desired voltage via a resistive divider. Feedback
reference = 0.8V.
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is a registered trademark of Richtek Technology Corporation.
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RT7296E
Function Block Diagram
TTH
VIN
PVCC
Internal
Regulator
Current
Sense
UVLO
BOOT
UVLO
BOOT
Logic &
Protection
Control
Power
Stage &
Deadtime
Control
+
0.4V
SW
UV
Comparator
HS Switch
Current
Comparator
1pF
50pF
FB
0.807V
400k
+ EA
+
Oscillator
LS Switch
Current
Comparator
Current
Sense
Slope
Compensation
GND
10.5µA
SS
Operation
Under Voltage Lockout Threshold
Over Current Protection
The IC includes an input Under Voltage Lockout
Protection (UVLO). If the input voltage exceeds the
RT7296E provides cycle-by-cycle over current limit
protection. When the inductor current peak value
UVLO rising threshold voltage (3.9V), the converter
resets and prepares
reaches current limit, IC will turn off High Side MOS to
avoid over current.
the PWM for operation. If the input voltage falls below
the UVLO falling threshold voltage (3.25V) during
normal operation, the device stops switching. The
UVLO rising and falling threshold voltage includes a
hysteresis to prevent noise caused reset.
Under Voltage Protection (Hiccup Mode)
Internal Regulator
The internal regulator generates 5V power and drive
internal circuit. When VIN is below 5V, PVCC will drop
RT7296E provides Hiccup Mode of Under Voltage
Protection (UVP). When the FB voltage drops below
half of the feedback reference voltage, VFB, the UVP
function will be triggered and the IC will shut down for a
period of time and then recover automatically. The
Hiccup Mode of UVP can reduce input current in
short-circuit conditions.
with VIN. A capacitor(>0.1F) between PVCC and
GND is required.
Thermal Shutdown
Soft-Start Function
from operating at excessively high temperatures. When
The RT7296E provides external soft-start function. The
the junction temperature is higher than 150oC, the chip
soft-start function is used to prevent large inrush
current while converter is being powered-up. The
soft-start timing can be programmed by the external
capacitor between SS pin and GND. The Chip provides
a 11A charge current for the external capacitor.
will shutdown the switching operation. The chip is
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Augist 2015
Thermal shutdown is implemented to prevent the chip
automatically re-enabled when the junction temperature
cools down by approximately 20oC.
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RT7296E
Absolute Maximum Ratings
(Note 1)

Supply Input Voltage, VIN --------------------------------------------------------------------------------------------- 0.3V to 20V

Switch Voltage, SW ------------------------------------------------------------------------------------------------------ 0.3V to VIN + 0.3V

BOOT to SW, VBOOT – SW --------------------------------------------------------------------------------------------- 0.3V to 6V

Other Pins------------------------------------------------------------------------------------------------------------------- 0.3V to 6V

Power Dissipation, PD @ TA = 25C
TSOT-23-8 (FC) ---------------------------------------------------------------------------------------------------------- 1.428W

Package Thermal Resistance
(Note 2)
TSOT-23-8 (FC), JA --------------------------------------------------------------------------------------------------- 70C/W
TSOT-23-8 (FC), JC --------------------------------------------------------------------------------------------------- 15C/W

Lead Temperature (Soldering, 10 sec.) --------------------------------------------------------------------------- 260C

Junction Temperature --------------------------------------------------------------------------------------------------- 40C to 150C

Storage Temperature Range ----------------------------------------------------------------------------------------- 65C to 150C

ESD Susceptibility
(Note 3)
HBM (Human Body Model) ------------------------------------------------------------------------------------------- 2kV
Recommended Operating Conditions
(Note 4)

Supply Input Voltage, VIN ---------------------------------------------------------------------------------------- 6V to 17V

Junction Temperature Range ---------------------------------------------------------------------------------------- 40C to 125C

Ambient Temperature Range ---------------------------------------------------------------------------------------- 40C to 85C
Electrical Characteristics
(VIN = 12V, TA = 25C, unless otherwise specified)
Parameter
Symbol
Quiescent Current with no Load
at DCDC Output
Feedback Voltage
VFB
Feedback Current
IFB
Switch
On-Resistance
Min
Typ
Max
Unit
VEN = 2V, VFB = 1V, TTH = 0.5V
--
0.8
1
mA
0.799
0.807
0.815
V
--
10
50
nA
VFB = 820mV
High-Side
RDS(ON)H
--
80
--
Low-Side
RDS(ON)L
--
30
--
Under 40% duty-cycle
4.2
5
--
A
From Drain to Source
--
2
--
A
VFB = 0.75V
--
800
--
kHz
VFB < 400mV
--
125
--
kHz
VFB = 0.7V
87
92
--
%
--
60
--
ns
4.9
5.3
5.85
V
--
1.1
--
V
--
5
--
V
--
3
--
%
Current Limit
ILIM
Low-Side Switch Current Limit
Oscillation Frequency
fOSC
Fold-Back Frequency
Maximum Duty-Cycle
DMAX
Minimum On-Time
tON
Input Under-Voltage
Lockout Threshold
Test Conditions
VIN Rising
VUVLO
VIN Rising
Hysteresis VUVLO
PVCC Regulator
VCC
PVCC Load Regulation
VLOAD
IVCC = 5mA
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m
is a registered trademark of Richtek Technology Corporation.
DS7296E-00
Augist 2015
RT7296E
Parameter
Symbol
Test Conditions
Min
Typ
Max
Unit
A
Soft-Start Charge Current
ISS
7.6
10.5
13.4
Thermal Shutdown Temperature
TSD
--
150
--
o
Thermal Shutdown Hysteresis
TSD
--
o
--
20
C
C
Note 1. Stresses listed as the above "Absolute Maximum Ratings" may cause permanent damage to the device. These are for
stress ratings. Functional operation of the device at these or any other conditions beyond those indicated in the
operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended
periods may remain possibility to affect device reliability.
Note 2. JA is measured at TA = 25C on a high effective thermal conductivity four-layer test board per JEDEC 51-7. JC is
measured at the exposed pad of the package.
Note 3. Devices are ESD sensitive. Handling precaution recommended.
Note 4. The device is not guaranteed to function outside its operating conditions.
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RT7296E
Typical Application Circuit
C3
0.1μF
RT7296E
5
2
BOOT
VIN
VIN
6V to 17V
C1
22μF
R6
10
6 SS
C5
22nF
7
C2
0.1μF
R3
91k
SW
3
VOUT
Cff
22pF
PVCC
1 TTH
R4
10k
L1
3.3μH
FB
8
R5
8.2k
R1
40.2k
C4
44μF
R2
13k
GND
4
Table 1. Suggested Component Values
VOUT (V)
R1 (k)
R2 (k)
R5 (k)
Cff (pF)
C4 (F)
L1 (H)
1.0
20.5
84.5
49.9
22
44
1.5
3.3
40.2
13
8.2
22
44
3.3
5.0
40.2
7.68
8.2
22
44
3.3
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RT7296E
Typical Operating Characteristics
Efficiency vs. Output Current
Output Voltage vs. Input Voltage
100
3.46
90
VIN = 12V
70
Output Voltage (V)
Efficiency (%)
3.42
VIN = 6V
80
VIN = 17V
60
50
40
30
20
3.38
3.34
3.30
3.26
3.22
3.18
10
VOUT = 3.3V
VOUT = 3.3V
0
3.14
0
0.5
1
1.5
2
2.5
3
6
7
8
Output Current (A)
10
11
12
14
15
16
17
Output Voltage vs. Output Current
3.46
0.83
3.42
0.82
3.38
Output Voltage (V)
0.84
0.81
0.80
0.79
0.78
0.77
3.34
3.30
3.26
3.22
3.18
IOUT = 1A
0.76
VIN = 12V, VOUT = 3.3V
3.14
-50
-25
0
25
50
75
100
125
0
0.5
1
1.5
2
2.5
Temperature (°C)
Output Current (A)
UVLO Voltage vs. Temperature
Load Transient Response
5.60
3
Rising
5.40
UVLO Voltage (V)
13
Input Voltage (V)
Reference Voltage vs. Temperature
Reference Voltage (V)
9
VOUT
(50mV/Div)
5.20
5.00
VIN = 12V, VOUT = 3.3V, L = 3.3H,
IOUT = 1.5A to 3A to 1.5A
4.80
4.60
4.40
IOUT
(1A/Div)
Falling
4.20
VOUT = 3.3V, IOUT = 0A
4.00
-50
-25
0
25
50
75
100
Temperature (°C)
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Time (200s/Div)
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RT7296E
Output Ripple Voltage
VOUT
(20mV/Div)
VIN = 12V, VOUT = 3.3V,
L = 3.3H, IOUT = 3A
Power On from VIN
VOUT
(2V/Div)
VIN = 12V, VOUT = 3.3V, IOUT = 3A
VIN
(10V/Div)
VLX
(10V/Div)
VLX
(5V/Div)
ILX
(3A/Div)
Time (2s/Div)
Time (5ms/Div)
Power Off from VIN
VOUT
(2V/Div)
VIN = 12V, VOUT = 3.3V, IOUT = 3A
VIN
(10V/Div)
VLX
(10V/Div)
ILX
(3A/Div)
Time (5ms/Div)
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RT7296E
Application Information
The RT7296E is a high voltage buck converter that can
5V
support the input voltage range from 4.5V to 17V and
the input voltage range from 4.5V to 17V and the output
current can be up to 3A.
BOOT
RT7296E
Output Voltage Selection
SW
The resistive voltage divider allows the FB pin to sense
a fraction of the output voltage as shown in Figure 1.
FB
R5
RT7296E
100nF
R1
Figure 2. External Bootstrap Diode
The TTH Voltage setting
VOUT
R2
The TTH voltage is used to be change the transition
GND
threshold between power saving mode and CCM.
Higher TTH voltage gets higher efficiency at light load
Figure 1. Output Voltage Setting
condition but larger output ripple; a lower TTH voltage
For adjustable voltage mode, the output voltage is set
by an external resistive voltage divider according to the
following equation :
can improve output ripple but degrades efficiency
during light load condition. A resistor divider from PVCC
(5V) of RT7296E can help to build TTH voltage, as
 R1 
VOUT  VFB  1 

 R2 
shown in Figure 1. It is recommended that TTH voltage
Where VFB is the feedback reference voltage (0.807V
typ.). Table 2 lists the recommended resistors value for
common output voltages.
should be less than 0.6V.
PVCC
R3
Table 2. Recommended Resistors Value
VOUT (V)
R1 (k)
R2 (k)
R5 (k)
1.0
20.5
84.5
49.9
3.3
40.2
13
8.2
5.0
40.2
7.68
8.2
TTH
RT7296E
R4
GND
Figure 1. TTH Voltage Setting
External Soft-Start Capacitor
External Bootstrap Diode
Connect a 100nF low ESR ceramic capacitor between
the BOOT pin and SW pin. This capacitor provides the
gate driver voltage for the high side MOSFET. It is
recommended to add an external bootstrap diode
between an external 5V and BOOT pin, as shown as
Figure 2, for efficiency improvement when input voltage
is lower than 5.5V or duty ratio is higher than 65% .The
bootstrap diode can be a low cost one such as IN4148
or BAT54. The external 5V can be a 5V fixed input from
system or a 5V output (PVCC) of the RT7296E.
RT7296E provides external soft-start function. The
soft-start function is used to prevent large inrush
current while converter is being powered-up. The
soft-start timing can be programmed by the external
capacitor (CSS) between SS pin and GND. The Chip
provides a 11A charge current (ISS) for the external
capacitor. The soft-start time (tSS, VREF is from 0V to
0.8V) can be calculated by the following formula :
tSS (ms) =
CSS (nF)  1.3
ISS ( A)
Inductor Selection
The inductor value and operating frequency determine
the ripple current according to a specific input and
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RT7296E
output voltage. The ripple current IL increases with
higher VIN and decreases with higher inductance.
the load transient response as described in a later
section. The output ripple, VOUT, is determined by :

V
  V
IL   OUT    1  OUT 
VIN 
 f L  


1
VOUT  IL   ESR 

8fCOUT 

Having a lower ripple current reduces not only the ESR
losses in the output capacitors but also the output
voltage ripple. High frequency with small ripple current
can achieve highest efficiency operation. However, it
requires a large inductor to achieve this goal.
The output ripple will be highest at the maximum input
voltage since IL increases with input voltage. Multiple
capacitors placed in parallel may be needed to meet
the ESR and RMS current handling requirement. Dry
tantalum, special polymer, aluminum electrolytic and
ceramic capacitors are all available in surface mount
packages. Special polymer capacitors offer very low
ESR value. However, it provides lower capacitance
density than other types. Although Tantalum capacitors
For the ripple current selection, the value of IL =
0.3(IMAX) will be a reasonable starting point. The
largest ripple current occurs at the highest VIN. To
guarantee that the ripple current stays below the
specified maximum, the inductor value should be
chosen according to the following equation :
 VOUT
 
VOUT 
L
 1 


 f  IL(MAX)  
VIN(MAX) 

 
The inductor's current rating (caused a 40C
temperature rising from 25C ambient) should be
greater than the maximum load current and its
saturation current should be greater than the short
circuit peak current limit.
have the highest capacitance density, it is important to
only use types that pass the surge test for use in
switching power supplies. Aluminum electrolytic
capacitors have significantly higher ESR. However, it
can be used in cost-sensitive applications for ripple
current rating and long term reliability considerations.
Ceramic capacitors have excellent low ESR
characteristics but can have a high voltage coefficient
and audible piezoelectric effects. The high Q of
ceramic capacitors with trace inductance can also lead
to significant ringing.
CIN and COUT Selection
The input capacitance, CIN, is needed to filter the
Thermal Considerations
trapezoidal current at the source of the top MOSFET.
To prevent large ripple current, a low ESR input
For continuous operation, do not exceed absolute
maximum junction temperature. The maximum power
dissipation depends on the thermal resistance of the IC
package, PCB layout, rate of surrounding airflow, and
capacitor sized for the maximum RMS current should
be used. The RMS current is given by :
IRMS  IOUT(MAX)
VOUT
VIN
VIN
1
VOUT
difference between junction and ambient temperature.
The maximum power dissipation can be calculated by
the following formula :
This formula has a maximum at VIN = 2VOUT, where
IRMS = IOUT/2. This simple worst-case condition is
PD(MAX) = (TJ(MAX)  TA) / JA
commonly used for design because even significant
deviations do not offer much relief.
where TJ(MAX) is the maximum junction temperature,
TA is the ambient temperature, and JA is the junction to
Choose a capacitor rated at a higher temperature than
required. Several capacitors may also be paralleled to
meet size or height requirements in the design. The
selection of COUT is determined by the required
Effective Series Resistance (ESR) to minimize voltage
ripple. Moreover, the amount of bulk capacitance is
also a key for COUT selection to ensure that the control
loop is stable. Loop stability can be checked by viewing
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ambient thermal resistance.
For recommended operating condition specifications,
the maximum junction temperature is 125C. The
junction to ambient thermal resistance, JA, is layout
dependent. For TSOT-23-8 (FC) package, the thermal
resistance, JA, is 70C/W on a standard JEDEC 51-7
four-layer thermal test board. The maximum power
dissipation at TA = 25C can be calculated by the
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RT7296E
following formula :
Layout Considerations
PD(MAX) = (125C  25C) / (70C/W) = 1.428W for
TSOT-23-8 (FC) package
For best performance of the RT7296E, the following
layout guidelines must be strictly followed.
The maximum power dissipation depends on the
operating ambient temperature for fixed TJ(MAX) and
thermal resistance, JA. The derating curve in Figure 4
allows the designer to see the effect of rising ambient
temperature on the maximum power dissipation.

possible.

SW should be connected to inductor by wide and
short trace. Keep sensitive components away from
this trace.
1.6
Maximum Power Dissipation (W)1
Input capacitor must be placed as close to the IC as
Four-Layer PCB

1.4
Keep every trace connected to pin as wide as
possible for improving thermal dissipation.
1.2
1.0
0.8
0.6
0.4
0.2
0.0
0
25
50
75
100
125
Ambient Temperature (°C)
Figure 4. Derating Curve of Maximum Power
Dissipation
SW should be connected to inductor by Wide and
short trace. Keep sensitive components away from
this trace. Suggestion layout trace wider for thermal.
R1 FB
VOUT
4
3
SW
2
6
7
PVCC
GND
VIN
VOUT
CIN COUT
COUT
TTH
8
BOOT
Css
SS
5
SW
CIN
R2
PVCC
The feedback components
must be connected as close
to the device as possible.
GND
Via can help to reduce
power trace and improve
thermal dissipation.
Input capacitor must be placed as close
to the IC as possible. Suggestion layout
trace wider for thermal.
Figure 4. PCB Layout Guide
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RT7296E
Outline Dimension
Dimensions In Millimeters
Symbol
Dimensions In Inches
Min.
Max.
Min.
Max.
A
0.700
1.000
0.028
0.039
A1
0.000
0.100
0.000
0.004
B
1.397
1.803
0.055
0.071
b
0.220
0.380
0.009
0.015
C
2.591
3.000
0.102
0.118
D
2.692
3.099
0.106
0.122
e
0.585
0.715
0.023
0.028
H
0.080
0.254
0.003
0.010
L
0.300
0.610
0.012
0.024
TSOT-23-8 (FC) Surface Mount Package
Richtek Technology Corporation
14F, No. 8, Tai Yuen 1st Street, Chupei City
Hsinchu, Taiwan, R.O.C.
Tel: (8863)5526789
Richtek products are sold by description only. Richtek reserves the right to change the circuitry and/or specifications without notice at any time. Customers should
obtain the latest relevant information and data sheets before placing orders and should verify that such information is current and complete. Richtek cannot assume
responsibility for use of any circuitry other than circuitry entirely embodied in a Richtek product. Information furnished by Richtek is believed to be accurate and
reliable. However, no responsibility is assumed by Richtek or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may
result from its use. No license is granted by implication or otherwise under any patent or patent rights of Richtek or its subsidiaries.
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is a registered trademark of Richtek Technology Corporation.
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