RT7238B/C/D/E

®
RT7238B/C/D/E
8A, 23V, 500kHz Synchronous Step-Down Converter
with 3.3V/5V LDO
General Description
Features
The RT7238B/C/D/E is an advanced constant on-time
(ACOTTM) mode synchronous step-down converter. The
main control loop of RT7238B/C/D/E using an advanced
constant on-time (ACOTTM) mode control which provides
a very fast transient response. The RT7238B/C/D/E
operates from 8V to 23V input voltage. For the RT7238D,
the output voltage can be adjusted between 0.9V to 5V.






Ordering Information
RT7238

Package Type
QUF : UQFN-10L 3x3 (FC) (U-Type)

Lead Plating System
G : Green (Halogen Free and Pb Free)


Output Voltage
B : 3.35V
C : 5.1V
D : Adjustable
E : 5V



Note :
Applications
Richtek products are :


RoHS compliant and compatible with the current require-

ments of IPC/JEDEC J-STD-020.

Advanced Constant On-Time (ACOT) Control
8V to 23V (RT7238B/C/D/E) Input Voltage Range @
8A Output Current
ACOTTM Mode Performs Fast Transient Response
ACOTTM Architecture to Enable all MLCC Output
Capacitor Usage
Fixed 500kHz Switching Frequency
High Efficient Internal Power MOSFET Switch
 27mΩ
Ω (High-Side) and 10mΩ
Ω (Low-Side)
Adjustable Output Voltage from 0.9V to 5V
(RT7238D)
Fixed 3.3V (RT7238B/D) or 5V (RT7238C/E) LDO
Output Supplies 70mA
Pre-biased Soft-Start
Cycle-by-Cycle Over-Current Protection
Input Under-Voltage Lockout
Thermal Shutdown
Output Over/Under-Voltage Protection

Suitable for use in SnPb or Pb-free soldering processes.


Industrial and Commercial Low Power Systems
Computer Peripherals
LCD Monitors and TVs
Green Electronics/Appliances
Point of Load Regulation for High-Performance DSPs,
FPGAs, and ASICs
Simplified Application Circuit
RT7238B
VIN PGOOD
VIN
CIN
GND
VLDO
VEN1
VEN2
LDO
CLDO
BOOT
VIN
VPGOOD
CIN
CBOOT
RT7238C/E
VIN PGOOD
BOOT
GND
VOUT
EN1
EN2
VOUT
COUT
LX
VLDO
VEN
LDO
CLDO
EN
Copyright © 2015 Richtek Technology Corporation. All rights reserved.
DS7238B/C/D/E-01 April 2015
VOUT
VIN
CBOOT
L1
L1
LX
VPGOOD
CIN
GND
VOUT
COUT
RT7238D
PGOOD
VIN
BOOT
VLDO
VILMT
VEN
L1
FB
ILMT
EN
VOUT
LX
LDO
CLDO
VPGOOD
CBOOT
BYP
CFF(opt)
VBYP
CBYP
R1
COUT
R2
is a registered trademark of Richtek Technology Corporation.
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1
RT7238B/C/D/E
Marking Information
Pin Configurations
(TOP VIEW)
RT7238BGQUF
YMDNN : Date Code
RT7238CGQUF
4R= : Product Code
6
7
5
8
VIN
9
GND
8
VIN
9
GND
8
VIN
9
GND
4
3
2
10
1
YMDNN : Date Code
RT7238B
LDO
4R=YM
DNN
BOOT
LDO
VOUT
NC
PGOOD
EN1
LX
YB=YM
DNN
EN2
YB= : Product Code
RT7238DGQUF
4V= : Product Code
YMDNN : Date Code
6
7
5
4
3
2
10
1
LX
4V=YM
DNN
BOOT
NC
VOUT
NC
PGOOD
EN
RT7238C/E
BYP
RT7238EGQUF
6L= : Product Code
YMDNN : Date Code
BOOT
LDO
FB
ILMT
PGOOD
EN
6
7
5
4
3
2
1
10
LX
6L=YM
DNN
RT7238D
UQFN-10L 3x3 (FC)
Copyright © 2015 Richtek Technology Corporation. All rights reserved.
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is a registered trademark of Richtek Technology Corporation.
DS7238B/C/D/E-01 April 2015
RT7238B/C/D/E
Functional Pin Description
RT7238B
Pin No.
Pin Name
Pin Function
1
EN1
Enable Control Input of the DC/DC Regulator. Pull this pin high to turn on the
regulator. Do not leave this pin floating.
2
PGOOD
Power Good Indicator. Open-drain output when the output voltage is within 91%
to 120% of regulation point.
3
NC
No Internal Connection.
4
VOUT
Output. Connect to the Output of DC/DC Regulator. The pin also provide the
bypass input for internal LDO.
5
LDO
Internal 3.3V LDO Output. Power supply for internal analog circuits and driving
circuit. Bypass a 2.2F capacitor to GND. This pin is also capable of sourcing
70mA current for external load.
6
BOOT
Bootstrap Supply for High-Side Gate Driver. Decouple this pin to LX pin with a
0.1F ceramic capacitor.
7
EN2
Enable Control Input of the IC and Internal LDO. Pull this pin high to turn on the
IC and internal LDO. Do not leave this pin floating.
8
VIN
Power Input. Decouple this pin to GND pin with a at least 10F ceramic capacitor.
9
GND
Ground.
10
LX
Switch Node. Connect this pin to the external inductor.
RT7238C/E
Pin No.
Pin Name
Pin Function
1
EN
Enable Control of the DC/DC Regulator. Pull this pin high to turn on the regulator.
Do not leave this pin floating.
2
PGOOG
Power Good Indicator. Open-drain output when the output voltage is within 91%
to 120% of regulation point.
NC
No Internal Connection.
4
VOUT
Output. Connect to the output of DC/DC regulator. The pin also provide the
bypass input for internal LDO.
6
BOOT
Bootstrap Supply for High-Side Gate Driver. Decouple this pin to LX pin with a
0.1F ceramic capacitor.
7
LDO
Internal 5V LDO Output. Power supply for internal analog circuits and driving
circuit. Bypass a 2.2F capacitor to GND. This pin is also capable of sourcing
70mA current for external load.
8
VIN
Power Input. Decouple this pin to GND pin with a at least 10F ceramic cap.
9
GND
Ground.
10
LX
Switch Node. Connect this pin to the external inductor.
3, 5
Copyright © 2015 Richtek Technology Corporation. All rights reserved.
DS7238B/C/D/E-01 April 2015
is a registered trademark of Richtek Technology Corporation.
www.richtek.com
3
RT7238B/C/D/E
RT7238D
Pin No.
Pin Name
Pin Function
1
EN
Enable Control Input. Pull this pin high to turn on the IC. Do not leave this pin
floating.
2
PGOOD
Power Good Indicator. Open-drain output when the output voltage is within 91%
to 120% of regulation point.
3
ILMT
Current Limit Setting. The current limit is set to 8A, 12A or 16A when this pin is
pulled low, floating or pulled high, respectively.
4
FB
Feedback Voltage Input. Connect this pin to the center point of the output resistor
divider to program the output voltage.
5
LDO
Internal 3.3V LDO Output. Power supply for internal analog circuits and driving
circuit. Bypass a 2.2F capacitor to GND. This pin is also capable sourcing 70mA
current for external load.
6
BOOT
Decouple this pin to LX pin with a 0.1F Ceramic Capacitor.
7
BYP
Bypass Input for the Internal LDO. BYP is externally connected to the output of
switching regulator. When the BYP voltage rises above the bypass switch turn-on
threshold, the LDO regulator shuts down and the LDO pin is connected to the BYP
pin through an internal switch.
8
VIN
Power Input. Decouple this pin to GND with a at least 10F ceramic capacitor.
9
GND
Ground.
10
LX
Switch Node. Connect this pin to the external inductor.
Function Block Diagram
RT7238B
VIN
BOOT
Input
UVLO
3.9V
LX
EN1
EN2
PWM
Control
&
Protect
Logic
Internal
SST
Thermal
Protection
0.6V
VOUT
-
Current
Sense
+
GND
-
PGOOD
+
LDO
VIN
3.1V
+
EN2
3.3V
LDO
-
Copyright © 2015 Richtek Technology Corporation. All rights reserved.
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is a registered trademark of Richtek Technology Corporation.
DS7238B/C/D/E-01 April 2015
RT7238B/C/D/E
RT7238C/E
VIN
BOOT
Input
UVLO
3.9V
LX
EN
Internal
SST
PWM
Control
&
Protect
Logic
Thermal
Protection
0.6V
VOUT
-
Current
Sense
+
-
GND
+
PGOOD
VIN
RT7238C : 4.8V
RT7238E : 4.7V
5V
LDO
+
-
LDO
RT7238D
VIN
Input
UVLO
3.9V
BOOT
ILMT
LX
EN
+
0.8V
PWM
Control
&
Protect
Logic
-
Internal
SST
-
Current
Sense
Thermal
Protection
0.6V
FB
+
GND
PGOOD
+
VIN
3.1V
+
LDO
3.3V
LDO
-
BYP
Copyright © 2015 Richtek Technology Corporation. All rights reserved.
DS7238B/C/D/E-01 April 2015
is a registered trademark of Richtek Technology Corporation.
www.richtek.com
5
RT7238B/C/D/E
Absolute Maximum Ratings











(Note 1)
Supply Voltage, VIN -------------------------------------------------------------------------------------------Enable Pin Voltage, VEN, EN1, EN2 --------------------------------------------------------------------------Switch Voltage, VLX -------------------------------------------------------------------------------------------Boot Voltage, VBOOT ------------------------------------------------------------------------------------------Other I/O Pin Voltages ---------------------------------------------------------------------------------------Power Dissipation, PD @ TA = 25°C
UQFN-10L 3x3 (FC) -------------------------------------------------------------------------------------------Package Thermal Resistance (Note 2)
UQFN-10L 3x3 (FC), θJA -------------------------------------------------------------------------------------Junction Temperature -----------------------------------------------------------------------------------------Lead Temperature (Soldering, 10 sec.) -------------------------------------------------------------------Storage Temperature Range --------------------------------------------------------------------------------ESD Susceptibility (Note 3)
HBM (Human Body Model) -----------------------------------------------------------------------------------
Recommended Operating Conditions



−0.3V to 27V
−0.3V to 27V
−0.3V to (VIN + 0.3V)
(VLX − 0.3V) to (VLX + 6V)
−0.3V to 6 V
3.33W
30°C/W
150°C
260°C
−65°C to 150°C
2kV
(Note 4)
Supply Input Voltage, VIN (RT7238B/C/D/E) -------------------------------------------------------------- 8V to 23V
Junction Temperature Range ---------------------------------------------------------------------------------- −40°C to 125°C
Ambient Temperature Range ---------------------------------------------------------------------------------- −40°C to 85°C
Electrical Characteristics
(VIN = 12V, TA = 25°C, unless otherwise specified)
Parameter
Symbol
Test Conditions
Min
Typ
Max
VEN1 = 0, VEN2 = 0 (RT7238B)
--
5
15
VEN = 0 (RT7238D)
--
5
15
VEN = 0 (RT7238C/E)
IOUT = 0, VOUT = 3.35V x 105%
VEN1 = VEN2 = 2V (RT7238B)
IOUT = 0, VFB = VREF x 105%
VEN = 2V (RT7238D)
IOUT = 0, VOUT = 5.1V x 105%
VEN = 2V (RT7238C/E)
--
35
45
--
--
110
--
--
110
--
--
110
0.8
--
--
--
--
0.3
VEN > 4.5V
--
140
--
VEN  4.5V
--
1
--
(RT7238B)
3.316
3.35
3.383
(RT7238C)
5.049
5.1
5.151
(RT7238E)
4.95
5
5.05
Unit
Supply Current
Supply Current (Shutdown)
Supply Current (Quiescent)
ISHDN
IQ
A
A
Logic Threshold
EN Input Voltage
Logic-High VIH
Logic-Low
EN Input Current
VIL
IEN
V
A
Output Voltage
Output Voltage Setpoint
VOUT
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V
is a registered trademark of Richtek Technology Corporation.
DS7238B/C/D/E-01 April 2015
RT7238B/C/D/E
Parameter
Symbol
Test Conditions
Min
Typ
Max
Unit
0.594
0.6
0.606
V
50
--
50
nA
Feedback Voltage
Feedback Reference Voltage VREF
(RT7238D)
Feedback Current
VFB = 4V (RT7238D)
IFB
On-Resistance
High-Side
Switch
On-Resistance Low-Side
RDS(ON)_H
--
27
--
RDS(ON)_L
--
10
--
Discharge FET RON
RDis
--
50
--

(RT7238B/C/E)
9
--
--
A
ILMT = ”0”
8
--
--
12
--
--
16
--
--
m
Current Limit
Bottom FET Current limit
ILIM
ILMT = Floating
(RT7238D)
ILMT = ”1”
A
ILMT Rising Threshold
VILMTH
VLDO
 0.8
--
VLDO
V
ILMT Falling Threshold
VILMTL
--
--
0.8
V
0.45
0.5
0.55
MHz
Oscillator Frequency
Oscillator Frequency
fOSC
On-Time Timer Control
Minimum On-Time
TON(MIN)
--
50
--
ns
Minimum Off-Time
TOFF(MIN)
--
200
--
ns
Soft-Start
Soft-Start Time
TSS
From EN/EN1 High to PGOOD High
--
1.5
--
ms
Input UVLO Threshold
VUVLO
Wake up
--
--
3.9
V
UVLO Hysteresis
VHYS
--
0.35
--
V
115
120
125
%
Output Over-Voltage
Hysteresis
--
3
--
%
Output Over-Voltage Delay
Time
--
20
--
s
UVLO
Output Over-Voltage Protection
Output Over-Voltage
Threshold
VFB Rising
Output Under-Voltage Protection
Output Under-Voltage
Threshold
VFB Falling
56
59
62
%
Output Under-Voltage Delay
Time
FB Forced Below UV Threshold
--
2
--
s
UV Blank Time
From EN/EN1 High
--
1.5
--
ms
Copyright © 2015 Richtek Technology Corporation. All rights reserved.
DS7238B/C/D/E-01 April 2015
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RT7238B/C/D/E
Parameter
Symbol
Test Conditions
Min
Typ
Max
Unit
88
91
94
%
--
6
--
%
--
10
--
s
(RT7238B/D)
3.267
3.3
3.333
(RT7238C/E)
4.95
5
5.05
100
120
160
mA
--
3
5

(RT7238B/D)
--
3.1
--
(RT7238C)
--
4.8
--
(RT7238E)
--
4.7
--
(RT7238B/D)
--
0.2
--
(RT7238C/E)
--
0.1
--
TSD
--
150
--
C
TSD
--
25
--
C
Power Good
Power Good Threshold
VFB Rising (Good)
Power Good Hysteresis
Power Good Delay Time
VFB Rising (Good)
LDO Regulator
LDO Output Voltage
VLDO
LDO Output Current Limit
ILMTLDO
V
Bypass Switch
Bypass Switch RON
Bypass Switch Turn-on
Voltage
Rbyp
Vbyp_on
Bypass Switch Switchover
Hysteresis
Thermal Shutdown
Thermal Shutdown
Threshold
Thermal Shutdown
Hysteresis
V
V
Note 1. Stresses beyond those listed “Absolute Maximum Ratings” may cause permanent damage to the device. These are
stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in
the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions may
affect device reliability.
Note 2. θJA is measured at TA = 25°C on a high effective thermal conductivity four-layer test board per JEDEC 51-7.
Note 3. Devices are ESD sensitive. Handling precaution is recommended.
Note 4. The device is not guaranteed to function outside its operating conditions.
Copyright © 2015 Richtek Technology Corporation. All rights reserved.
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is a registered trademark of Richtek Technology Corporation.
DS7238B/C/D/E-01 April 2015
RT7238B/C/D/E
Typical Application Circuit
VIN
8V to 23V
VLDO
3.3V
RT7238B
2
PGOOD
CIN
10µF x 2 9
BOOT 6
GND
8
CLDO
2.2µF
VEN1
VEN2
VIN
8V to 23V
VLDO
5V
VLDO
3.3V
VILMT
VEN
5 LDO
LX
1 EN1
7 EN2
VOUT
7
CLDO
2.2µF
LDO
VOUT
1 EN
8
CIN
10µF x 2 9
CLDO
2.2µF
LX
RT7238D
VIN
GND
5 LDO
3 ILMT
1 EN
PGOOD
FB
BYP
CBOOT
0.1µF
L1
VOUT
3.35V/8A
COUT
22µF x 4
4
10
VPGOOD
CBOOT
0.1µF
L1
VOUT
5.1V/8A
COUT
22µF x 4
2.2µH
4
2
BOOT 6
LX
VPGOOD
2.2µH
RT7238C/E
2
VIN
PGOOD
CIN
10µF x 2 9
BOOT 6
GND
Copyright © 2015 Richtek Technology Corporation. All rights reserved.
DS7238B/C/D/E-01 April 2015
10
8
VEN
VIN
8V to 23V
VIN
10
VPGOOD
CBOOT
0.1µF
L1
1µH
CFF(opt)
4
7
CBYP
4.7µF
VBYP
R1
15k
VOUT
1.05V/8A
COUT
22µF x 4
R2
20k
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RT7238B/C/D/E
Typical Operating Characteristics
Efficiency vs. Output Current
100.0
Efficiency vs. Output Current
100.0
RT7238B
95.0
Efficiency (%)
95.0
Efficiency (%)
RT7238C
VIN = 8V
VIN = 12V
VIN = 19V
90.0
VIN = 8V
VIN = 12V
VIN = 19V
90.0
85.0
85.0
EN = 2V
EN1 = EN2 = 2V
80.0
0.001
0.010
0.100
1.000
80.0
0.001
10.000
0.010
Output Current (A)
Efficiency (%)
Switching Frequency (kHz)1
RT7238D
VIN = 8V
VIN = 12V
VIN = 19V
90.0
85.0
80.0
RT7238B
500.0
400.0
VIN = 8V
VIN = 12V
VIN = 19V
300.0
200.0
100.0
EN1 = EN2 = 2V
EN = 2V, VOUT = 1.05V
75.0
0.001
0.010
0.100
1.000
0.0
0.001
10.000
0.010
Output Current (A)
Switching Frequency (kHz)1
Switching Frequency (kHz)1
RT7238C
500.0
VIN = 8V
VIN = 12V
VIN = 19V
300.0
200.0
100.0
0.010
0.100
1.000
Output Current (A)
Copyright © 2015 Richtek Technology Corporation. All rights reserved.
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10
10.000
RT7238D
500.0
VIN = 8V
VIN = 12V
VIN = 19V
400.0
300.0
200.0
100.0
EN = 2V
0.0
0.001
1.000
Switching Frequency vs. Output Current
600.0
400.0
0.100
Output Current (A)
Switching Frequency vs. Output Current
600.0
10.000
Switching Frequency vs. Output Current
600.0
95.0
1.000
Output Current (A)
Efficiency vs. Output Current
100.0
0.100
10.000
EN = 2V, VOUT = 1.05V
0.0
0.001
0.010
0.100
1.000
10.000
Output Current (A)
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DS7238B/C/D/E-01 April 2015
RT7238B/C/D/E
Quiescent Current vs. Input Voltage
Quiescent Current vs. Input Voltage
120
RT7238B
110
Quiescent Current (μA)
Quiescent Current (μA)
120
100
90
80
RT7238C
110
100
90
80
VIN = 12V, EN1 = EN2 = 2V, No Switching
VIN = 12V, EN = 2V, No Switching
70
70
5
7
9
11
13
15
17
19
21
23
5
7
9
Input Voltage (V)
Shutdown Current (μA)1
Quiescent Current (μA)
110
100
90
80
9
11
13
15
17
21
23
19
21
11
10
9
8
7
5
23
7
9
11
13
15
17
19
21
23
Input Voltage (V)
Shutdown Current vs. Input Voltage
Shutdown Current vs. Input Voltage
12
RT7238C
RT7238D
11
37
Shutdown Current (μA)1
Shutdown Current (μA)1
19
RT7238B
Input Voltage (V)
38
17
VIN = 12V, EN1 = EN2 = GND
VIN = 12V, EN = 2V, No Switching
70
7
15
Shutdown Current vs. Input Voltage
12
RT7238D
5
13
Input Voltage (V)
Quiescent Current vs. Input Voltage
120
11
36
35
34
33
10
9
8
7
6
VIN = 12V, EN = GND
32
VIN = 12V, EN = GND
5
5
7
9
11
13
15
17
19
21
Input Voltage (V)
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DS7238B/C/D/E-01 April 2015
23
5
7
9
11
13
15
17
19
21
23
Input Voltage (V)
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RT7238B/C/D/E
Output Voltage vs. Output Current
3.4
Output Voltage vs. Output Current
5.4
RT7238B
3.4
VIN = 19V
VIN = 12V
VIN = 8V
3.3
Output Voltage (V)
Output Voltage (V)
RT7238C
5.3
3.3
3.2
5.2
5.1
VIN = 19V
VIN = 12V
VIN = 8V
5.0
4.9
4.8
4.7
3.2
4.6
EN1 = EN2 = 2V
3.1
0.001
0.01
0.1
1
EN = 2V
4.5
0.001
10
0.01
Output Current (A)
LDO Output Voltage (V)
Output Voltage (V)
VIN = 19V
VIN = 12V
VIN = 8V
1.05
RT7238B
3.40
3.35
3.30
VIN = 8V
VIN = 12V
VIN = 19V
3.25
3.20
EN1 = GND, EN2 = 2V
EN = 2V, R1 = 15.4k, R2 = 20k
3.15
0.01
0.1
1
10
0
0.02
Output Current (A)
RT7238C
5.15
5.10
5.05
5.00
4.95
VIN = 8V
VIN = 12V
VIN = 19V
4.90
4.85
0.06
0.08
LDO Output Voltage vs. Output Current
3.45
LDO Output Voltage (V)
LDO Output Voltage (V)
5.20
0.04
Output Current (A)
LDO Output Voltage vs. Output Current
5.25
10
LDO Output Voltage vs. Output Current
3.45
RT7238D
1.00
0.001
1
Output Current (A)
Output Voltage vs. Output Current
1.10
0.1
4.80
RT7238D
3.40
3.35
3.30
VIN = 8V
VIN = 12V
VIN = 19V
3.25
3.20
EN = GND
EN = 2V
3.15
4.75
0.00
0.02
0.04
0.06
Output Current (A)
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12
0.08
0
0.02
0.04
0.06
0.08
Output Current (A)
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DS7238B/C/D/E-01 April 2015
RT7238B/C/D/E
Start-Up through EN2
Start-Up through EN1
RT7238B
RT7238B
VOUT
(2V/Div)
VOUT
(2V/Div)
IL
(2A/Div)
IL
(2A/Div)
PGOOD
(2V/Div)
VLDO
(2V/Div)
EN1
(9V/Div)
EN2
(9V/Div)
VIN = 12V, EN2 = 2V, No Load
VIN = 12V, EN1 = 2V, No Load
Time (500μs/Div)
Time (500μs/Div)
Start-Up through EN
Start-Up through EN
RT7238C
RT7238D
VOUT
(2V/Div)
IL
(2A/Div)
VOUT
(400mV/Div)
EN
(9V/Div)
PGOOD
(5V/Div)
EN
(9V/Div)
IL
(2A/Div)
VIN = 12V, No Load
PGOOD
(3V/Div)
VIN = 12V, No Load
Time (500μs/Div)
Time (500μs/Div)
Power-Off through EN1
Power-Off through EN2
RT7238B
RT7238B
VOUT
(2V/Div)
VOUT
(2V/Div)
IL
(2A/Div)
IL
(2A/Div)
PGOOD
(2V/Div)
VLDO
(2V/Div)
EN1
(9V/Div)
VIN = 12V, EN2 = 2V, No Load
Time (5ms/Div)
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EN2
(9V/Div)
VIN = 12V, EN1 = 2V, No Load
Time (10ms/Div)
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RT7238B/C/D/E
Power-Off through EN
Power-Off through EN
RT7238C
VOUT
(2V/Div)
VOUT
(500mV/Div)
PGOOD
(2V/Div)
IL
(2A/Div)
IL
(2A/Div)
PGOOD
(5V/Div)
EN
(9V/Div)
RT7238D
VIN = 12V, No Load
EN
(9V/Div)
VIN = 12V, No Load
Time (2ms/Div)
Time (2ms/Div)
Load Transient Response
Load Transient Response
RT7238C
RT7238B
VOUT
(100mV/Div)
VOUT
(100mV/Div)
IL
(6A/Div)
IL
(6A/Div)
LX
(9V/Div)
LX
(9V/Div)
VIN = 12V, EN1 = EN2 = 2V
VIN = 12V, EN = 2V
Time (100μs/Div)
Time (100μs/Div)
Load Transient Response
Over Voltage Protection
RT7238D
VOUT
(60mV/Div)
VOUT
(2V/Div)
IL
(6A/Div)
LX
(9V/Div)
PGOOD
(2V/Div)
IL
(6A/Div)
VIN = 12V, EN = 2V
Time (100μs/Div)
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RT7238B
LX
(9V/Div)
VIN = 12V, VOUT = 5V, EN1 = EN2 = 2V
Time (100μs/Div)
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RT7238B/C/D/E
Over Voltage Protection
Over Voltage Protection
RT7238C
RT7238D
VOUT
(4V/Div)
VOUT
(1V/Div)
PGOOD
(5V/Div)
IL
(6A/Div)
LX
(9V/Div)
PGOOD
(2V/Div)
IL
(2A/Div)
LX
(9V/Div)
VIN = 12V, VOUT = 7V, EN = 2V
VIN = 12V, VOUT = 2V, EN = 2V
Time (50μs/Div)
Time (50μs/Div)
Under Voltage Protection
Under Voltage Protection
RT7238B
RT7238C
VOUT
(2V/Div)
VOUT
(4V/Div)
PGOOD
(2V/Div)
IL
(6A/Div)
PGOOD
(5V/Div)
IL
(6A/Div)
LX
(9V/Div)
VIN = 12V, EN1 = EN2 = 2V
Time (20μs/Div)
LX
(9V/Div)
VIN = 12V, EN = 2V
Time (20μs/Div)
Under Voltage Protection
RT7238D
VOUT
(1V/Div)
IL
(6A/Div)
PGOOD
(2V/Div)
LX
(9V/Div)
VIN = 12V, EN = 2V
Time (50μs/Div)
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RT7238B/C/D/E
Application Information
The RT7238B/C/D/E are high-performance 500kHz 8A stepdown regulators with internal power switches and
synchronous rectifiers. They feature an Advanced Constant
On-Time (ACOTTM) control architecture that provides
stable operation for ceramic output capacitors without
complicated external compensation, among other benefits.
The input voltage range are from 8V to 23V (RT7238B/C/
D/E). The output voltage are fixed 3.35V (RT7238B), 5.1V
(RT7238C), 5V (RT7238E) or adjustable from 0.9V to 5V
(RT7238D).
The proprietary ACOT TM control scheme improves
conventional constant on-time architectures, achieving
nearly constant switching frequency over line, load, and
output voltage ranges. Since there is no internal clock,
response to transients is nearly instantaneous and inductor
current can ramp quickly to maintain output regulation
without large bulk output capacitance.
The RT7238B/C/D/E includes 5V (RT7238C) and 3.3V
(RT7238B/D) linear regulators (LDO). The linear regulator
steps down input voltage to supply both internal circuitry
and gate drivers. The synchronous switch gate drivers are
directly powered by LDO. When VOUT rises above 3.1V
(RT7238B/D), 4.8V (RT7238C), 4.7V (RT7238E) an
automatic circuit disconnects the linear regulator and
allows the device to be powered by VOUT (RT7238B/C/
E) or via the BYP pin (RT7238D).
ACOTTM Control Architecture
Making the on-time proportional to VOUT and inversely
proportional to VIN is not sufficient to achieve good
constant-frequency behavior for several reasons. First,
voltage drops across the MOSFET switches and inductor
cause the effective input voltage to be less than the
measured input voltage and the effective output voltage to
be greater than the measured output voltage as sensing
input and output voltage from LX pin. When the load
change, the switch voltage drops change causing a
switching frequency variation with load current. Also, at
light loads if the inductor current goes negative, the switch
dead-time between the synchronous rectifier turn-off and
the high-side switch turn-on allows the switching node to
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16
time and causes the switching frequency to drop
noticeably.
One way to reduce these effects is to measure the actual
switching frequency and compare it to the desired range.
This has the added benefit eliminating the need to sense
the actual output voltage, potentially saving one pin
connection. ACOTTM uses this method, measuring the
actual switching frequency and modifying the on-time with
a feedback loop to keep the average switching frequency
in the desired range.
In order to achieve good stability with low-ESR ceramic
capacitors, ACOTTM uses a virtual inductor current ramp
generated inside the IC. This internal ramp signal replaces
the ESR ramp normally provided by the output capacitor's
ESR. The ramp signal and other internal compensations
are optimized for low-ESR ceramic output capacitors.
ACOTTM One-shot Operation
The RT7238B/C/D/E control algorithm is simple to
understand. The feedback voltage, with the virtual inductor
current ramp added, is compared to the reference voltage.
When the combined signal is less than the reference, the
on-time one-shot is triggered, as long as the minimum
off-time one-shot is clear and the measured inductor
current (through the synchronous rectifier) is below the
current limit. The on-time one-shot turns on the high-side
switch and the inductor current ramps up linearly. After
the on-time,
the high-side switch is turned off and the synchronous
rectifier is turned on and the inductor current ramps down
linearly. At the same time, the minimum off-time one-shot
is triggered to prevent another immediate on-time during
the noisy switching time and allow the feedback voltage
and current sense signals to settle. The minimum off-time
is kept short (200ns typical) so that rapidly-repeated ontimes can raise the inductor current quickly when needed.
Bypass Function
The RT7238B/C/D/E provide bypass function to improve
power conversion efficiency. When the bypass pin
voltage(RT7238D) or output voltage (RT7238B/C/E) rises
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RT7238B/C/D/E
above bypass switch turn-on threshold, the LDO regulator
will shut down and the LDO pin will be connected to the
bypass pin (RT7238D) or output pin (RT7238B/C/E) through
an internal switch. Because the internal switch has turnon resistor, there will be a naturally voltage drop of LDO
pin as bypass function working. In practical application,
the voltage drop of LDO pin should be considered.
Diode Emulation Mode
In diode emulation mode, the RT7238B/C/D/E
automatically reduces switching frequency at light load
conditions to maintain high efficiency. This reduction of
frequency is achieved smoothly. As the output current
decreases from heavy load condition, the inductor current
is also reduced, and eventually comes to the point that
its current valley touches zero, which is the boundary
between continuous conduction and discontinuous
conduction modes. To emulate the behavior of diodes,
the low-side MOSFET allows only partial negative current
to flow when the inductor free wheeling current becomes
negative. As the load current is further decreased, it takes
longer and longer time to discharge the output capacitor
to the level that requires the next “ON” cycle. In reverse,
when the output current increases from light load to heavy
load, the switching frequency increases to the preset value
as the inductor current reaches the continuous conduction.
The transition load point to the light load operation is shown
in Figure 1. and can be calculated as follows :
IL
IPEAK
ILOAD = IPEAK / 2
tON
t
Figure 1. Boundary Condition of CCM/DEM
(VIN  VOUT )
 tON
2L
where tON is the on-time.
ILOAD(SKIP) 
The switching waveforms may appear noisy and
asynchronous when light load causes diode emulation
operation. This is normal and results in high efficiency.
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During discontinuous switching, the on-time is immediately
increased to add “hysteresis” to discourage the IC from
switching back to continuous switching unless the load
increases substantially. The IC returns to continuous
switching as soon as an on-time is generated before the
inductor current reaches zero. The on-time is reduced back
to the length needed for 500kHz switching and encouraging
the circuit to remain in continuous conduction, preventing
repetitive mode transitions between continuous switching
and discontinuous switching.
Linear Regulators (LDO)
The RT7238B/C/D/E includes 5V (RT7238C/E) and 3.3V
(RT7238B/D) linear regulators (LDO). The regulators can
supply up to 70mA for external loads. When VOUT is
higher than the switch over threshold 3.1V (RT7238B/D),
4.8V (RT7238C), 4.7V (RT7238E) an internal 3Ω PMOSFET switch connects VOUT (RT7238B/C/E) or BYP
(RT7238D) to the LDO pin while simultaneously
disconnects the internal linear regulator.
Current Limit
Slope = (VIN - VOUT) / L
0
Trade offs in DEM noise vs. light load efficiency is made
by varying the inductor value. Generally, low inductor values
produce a broader efficiency vs. load curve, while higher
values result in higher full load efficiency (assuming that
the coil resistance remains fixed) and less output voltage
ripple. Penalties for using higher inductor values include
larger physical size and degraded load transient response
(especially at low input voltage levels).
The RT7238B/C/D/E current limit is fixed 9A (RT7238B/
C/E) or adjustable (8A,12A,16A) by ILMT pin (RT7238D)
and it is a cycle-by-cycle “valley” type, measuring the
inductor current through the synchronous rectifier during
the off-time while the inductor current ramps down. The
current is determined by measuring the voltage between
source and drain of the synchronous rectifier, adding
temperature compensation for greater accuracy. If the
current exceeds the current limit, the on-time one-shot is
inhibited until the inductor current ramps down below the
current limit. Thus, only when the inductor current is well
below the current limit, another on-time is permitted. If
the output current exceeds the available inductor current
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RT7238B/C/D/E
(controlled by the current limit mechanism), the output
voltage will drop. If it drops below the output under-voltage
protection level (see next section) the IC will stop
switching to avoid excessive heat.
The RT7238B/C/D/E also includes a negative current limit
to protect the IC against sinking excessive current and
possibly damaging the IC. If the voltage across the
synchronous rectifier indicates the negative current is too
high, the synchronous rectifier turns off until after the next
high-side on-time.
Output Over-voltage Protection and Under-voltage
Protection
The RT7238B/C/D/E include output over-voltage protection
(OVP). If the output voltage rises above the regulation
level, the high-side and low-side switch naturally remain
off. If the output voltage exceeds the OVP trip threshold
for longer than 20μs (typical), the IC's OVP is triggered.
The RT7238B/C/D/E also include output Under-Voltage
Protection (UVP). If the output voltage drops below the
UVP trip threshold for longer than 2μs (typical) the IC's
UVP is triggered. The RT7238B/C/D/E use latch-off mode
OVP and UVP. When the protection function is triggered,
the IC will shut down. The IC stops switching and is latched
off. To restart operation, toggle EN or power the IC off and
then on again.
Input Under-Voltage Lockout
In addition to the enable function, the RT7238B/C/D/E
feature an Under-Voltage Lockout (UVLO) function that
monitors the input voltage. To prevent operation without
fully-enhanced internal MOSFET switches, this function
inhibits switching when input voltage drops below the
UVLO-falling threshold. The IC resumes switching when
input voltage exceeds the UVLO-rising threshold.
Over-Temperature Protection
The RT7238B/C/D/E includes an Over-Temperature
Protection (OTP) circuitry to prevent overheating due to
excessive power dissipation. The OTP will shut down
switching operation when the junction temperature
exceeds 150°C. Once the junction temperature cools
down by approximately 25°C the IC will resume normal
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18
operation with a complete soft-start. For continuous
operation, provide adequate cooling so that the junction
temperature does not exceed 150°C.
Enable and Disable
The enable input (EN) has a logic-low level of 0.3V. When
VEN is below this level the IC enters shutdown mode and
supply current drops to less than 5μA.(typical) When VEN
exceeds its logic-high level of 0.8V the IC is fully
operational.
Soft-Start
The RT7238B/C/D/E provides an internal soft-start function
to prevent large inrush current and output voltage overshoot
when the converter starts up. The soft-start (SS)
automatically begins once the chip is enabled. During softstart, it clamps the ramping of internal reference voltage
which is compared with FB signal. The typical soft-start
duration is 0.8ms. A unique PWM duty limit control that
prevents output over-voltage during soft-start period is
designed specifically for FB floating.
Power Off
When EN is low or any protection function is triggered, an
internal discharging resistor about 50Ω will discharging
the residual charges of output capacitors to make sure
next soft start without any remaining charge.
Power Good Output (PGOOD)
The power good output is an open drain output that requires
a pull-up resistor. When the output voltage is 15% (typical)
below its set voltage, PGOOD will be pulled low. It is held
low until the output voltage returns to 91% of its set voltage
once more. During soft-start, PGOOD is actively held low
and only allowed to be pulled high after soft-start is over
and the output reaches 91% of its set voltage. There is a
2μs delay built into PGOOD circuitry to prevent false
transition.
External Bootstrap Capacitor (CBOOT)
Connect a 0.1μF low ESR ceramic capacitor between
BOOT pin and LX pin. This bootstrap capacitor provides
the gate driver supply voltage for the high-side N-MOSFET
switch.
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RT7238B/C/D/E
The internal power MOSFET switch gate driver is
optimized to turn the switch on fast enough for low power
loss and good efficiency, but also slow enough to reduce
EMI. Switch turn-on is when most EMI occurs since VLX
rises rapidly. During switch turn-off, LX is discharged
relatively slowly by the inductor current during the deadtime between high-side and low-side switch on-times. In
some cases it is desirable to reduce EMI further, at the
expense of some additional power dissipation. The switch
turn-on can be slowed by placing a small (<10Ω)
resistance between BOOT and the external bootstrap
capacitor. This will slow the high-side switch turn-on and
VLX's rise.
Output Voltage Setting (RT7238D)
Set the desired output voltage using a resistive divider
from the output to ground with the midpoint connected to
FB. The output voltage is set according to the following
equation :
VOUT(valley)  0.6V  (1 R1 )
R2
VOUT
R1
FB
RT7238D
R2
GND
Figure 2. Output Voltage Setting
Place the FB resistors within 5mm of the FB pin. Choose
R2 between 10kΩ and 100kΩ to minimize power
consumption without excessive noise pick-up and
calculate R1 as follows :
R2  (VOUT(valley)  0.6V)
R1 
0.6V
For output voltage accuracy, use divider resistors with 1%
or better tolerance.
Inductor Selection
Selecting an inductor involves specifying its inductance
and also its required peak current. The exact inductor value
is generally flexible and is ultimately chosen to obtain the
best mix of cost, physical size, and circuit efficiency.
Lower inductor values benefit from reduced size and cost
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and they can improve the circuit's transient response, but
they increase the inductor ripple current and output voltage
ripple and reduce the efficiency due to the resulting higher
peak currents. Conversely, higher inductor values increase
efficiency, but the inductor will either be physically larger
or have higher resistance since more turns of wire are
required and transient response will be slower since more
time is required to change current (up or down) in the
inductor. A good compromise between size, efficiency,
and transient response is to use a ripple current (ΔIL) about
20-50% of the desired full output load current. Calculate
the approximate inductor value by selecting the input and
output voltages, the switching frequency (f SW), the
maximum output current (IOUT(MAX)) and estimating a ΔIL
as some percentage of that current.
V
 (VIN  VOUT )
L  OUT
VIN  fSW  IL
Once an inductor value is chosen, the ripple current (ΔIL)
is calculated to determine the required peak inductor
current.
VOUT  (VIN  VOUT )
and
VIN  fSW  L
I
IL(PEAK)  IOUT(MAX)  L
2
IL 
To guarantee the required output current, the inductor
needs a saturation current rating and a thermal rating that
exceeds IL(PEAK). These are minimum requirements. To
maintain control of inductor current in overload and shortcircuit conditions, some applications may desire current
ratings up to the current limit value. However, the IC's
output under-voltage shutdown feature make this
unnecessary for most applications.
For best efficiency, choose an inductor with a low DC
resistance that meets the cost and size requirements.
For low inductor core losses some type of ferrite core is
usually best and a shielded core type, although possibly
larger or more expensive, will probably give fewer EMI
and other noise problems.
Input Capacitor Selection
High quality ceramic input decoupling capacitor, such as
X5R or X7R, with values greater than 20μF are
recommended for the input capacitor. The X5R and X7R
ceramic capacitors are usually selected for power regulator
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RT7238B/C/D/E
capacitors because the dielectric material has less
capacitance variation and more temperature stability.
Voltage rating and current rating are the key parameters
when selecting an input capacitor. Generally, selecting an
input capacitor with voltage rating 1.5 times greater than
the maximum input voltage is a conservatively safe design.
The input capacitor is used to supply the input RMS
current, which can be approximately calculated using the
following equation :
IRMS 
VOUT 
V
I 2 
 (1 OUT )  IOUT 2  L 
VIN 
VIN
12 
The next step is to select a proper capacitor for RMS
current rating. One good design uses more than one
capacitor with low Equivalent Series Resistance (ESR) in
parallel to form a capacitor bank. The input capacitance
value determines the input ripple voltage of the regulator.
The input voltage ripple can be approximately calculated
using the following equation :
VIN 
IOUT  VIN
V
 (1  OUT )
CIN  fSW  VOUT
VIN
The typical operating circuit is recommended to use two
10μF and low ESR ceramic capacitors on the input.
Output Capacitor Selection
The RT7238B/C/D/E are optimized for ceramic output
capacitors and best performance will be obtained using
them. The total output capacitance value is usually
determined by the desired output voltage ripple level and
transient response requirements for sag (undershoot on
positive load steps) and soar (overshoot on negative load
steps).
Output ripple at the switching frequency is caused by the
inductor current ripple and its effect on the output
capacitor's ESR and stored charge. These two ripple
components are called ESR ripple and capacitive ripple.
Since ceramic capacitors have extremely low ESR and
relatively little capacitance, both components are similar
in amplitude and both should be considered if ripple is
critical.
VRIPPLE  VRIPPLE(ESR)  VRIPPLE(C)
In addition to voltage ripple at the switching frequency,
the output capacitor and its ESR also affect the voltage
sag (undershoot) and soar (overshoot) when the load steps
up and down abruptly. The ACOT transient response is
very quick and output transients are usually small.
However, the combination of small ceramic output
capacitors (with little capacitance), low output voltages
(with little stored charge in the output capacitors), and
low duty cycle applications (which require high inductance
to get reasonable ripple currents with high input voltages)
increases the size of voltage variations in response to
very quick load changes. Typically, load changes occur
slowly with respect to the IC's 500kHz switching frequency.
But some modern digital loads can exhibit nearly
instantaneous load changes and the following section
shows how to calculate the worst-case voltage swings in
response to very fast load steps.
The amplitude of the ESR step up or down is a function of
the load step and the ESR of the output capacitor :
VESR_STEP  IOUT  RESR
The amplitude of the capacitive sag is a function of the
load step, the output capacitor value, the inductor value,
the input-to-output voltage differential, and the maximum
duty cycle. The maximum duty cycle during a fast transient
is a function of the on-time and the minimum off-time since
the ACOTTM control scheme will ramp the current using
on-times spaced apart with minimum off-times, which is
as fast as allowed. Calculate the approximate on-time
(neglecting parasitics) and maximum duty cycle for a given
input and output voltage as :
tON 
VOUT
tON
and DMAX 
VIN  fSW
tON  tOFF(MIN)
The actual on-time will be slightly longer as the IC
compensates for voltage drops in the circuit, but we can
neglect both of these since the on-time increase
compensates for the voltage losses. Calculate the output
voltage sag as :
VSAG 
L  (IOUT )2
2  COUT  ( VIN(MIN)  DMAX  VOUT )
VRIPPLE(ESR)  IL  RESR
VRIPPLE(C) 
IL
8  COUT  fSW
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RT7238B/C/D/E
The amplitude of the capacitive soar is a function of the
load step, the output capacitor value, the inductor value
and the output voltage :
VSOAR 
L  ( IOUT )
2  COUT  VOUT
2
The maximum power dissipation depends on the operating
ambient temperature for fixed T J(MAX) and thermal
resistance, θJA. The derating curve in Figure 3 allows the
designer to see the effect of rising ambient temperature
on the maximum power dissipation.
Most applications never experience instantaneous full load
steps and the RT7238B/C/D/E's high switching frequency
and fast transient response can easily control voltage
regulation at all times. Therefore, sag and soar are seldom
an issue except in very low-voltage CPU core or DDR
memory supply applications, particularly for devices with
high clock frequencies and quick changes into and out of
sleep modes. In such applications, simply increasing the
amount of ceramic output capacitor (sag and soar are
directly proportional to capacitance) or adding extra bulk
capacitance can easily eliminate any excessive voltage
transients.
In any application with large quick transients, it should
calculate soar and sag to make sure that over-voltage
protection and under-voltage protection will not be triggered.
Thermal Considerations
For continuous operation, do not exceed absolute
maximum junction temperature. The maximum power
dissipation depends on the thermal resistance of the IC
package, PCB layout, rate of surrounding airflow, and
difference between junction and ambient temperature. The
maximum power dissipation can be calculated by the
following formula :
Maximum Power Dissipation (W)1
3.6
For recommended operating condition specifications, the
maximum junction temperature is 125°C. The junction to
ambient thermal resistance, θJA, is layout dependent. For
UQFN-10L 3x3 (FC) package, the thermal resistance, θJA,
is 30°C/W on a standard JEDEC 51-7 four-layer thermal
test board. The maximum power dissipation at TA = 25°C
can be calculated by the following formula :
P D(MAX) = (125°C − 25°C) / (30°C/W) = 3.3W for
UQFN-10L 3x3 (FC) package
Copyright © 2015 Richtek Technology Corporation. All rights reserved.
DS7238B/C/D/E-01 April 2015
2.8
2.4
2.0
1.6
1.2
0.8
0.4
0.0
0
25
50
75
100
125
Ambient Temperature (°C)
Figure 3. Derating Curve of Maximum Power Dissipation
Layout Considerations
Layout is very important in high frequency switching
converter design. The PCB can radiate excessive noise
and contribute to converter instability with improper layout.
Certain points must be considered before starting a layout
using the RT7238B/C/D/E.

Make the traces of the main current paths as short and
wide as possible.

Put the input capacitor as close as possible to the device
pins (VIN and GND).

LX node encounters high frequency voltage swings so
it should be kept in a small area. Keep sensitive
components away from the LX node to prevent stray as
possible.

The GND pin should be connected to a strong ground
plane for heat sinking and noise protection.

Avoid using vias in the power path connections that have
switched currents (from CIN to GND and CIN to VIN) and
the switching node (LX).

An example of PCB layout guide is shown in Figure 4
for reference.
PD(MAX) = (TJ(MAX) − TA) / θJA
where TJ(MAX) is the maximum junction temperature, TA is
the ambient temperature, and θJA is the junction to ambient
thermal resistance.
Four-Layer PCB
3.2
is a registered trademark of Richtek Technology Corporation.
www.richtek.com
21
RT7238B/C/D/E
EN1
PGOOD
NC
VOUT
LDO
BOOT
CBOOT
3
4
5
1
EN2
7
LX
VIN
The output capacitor must
be placed near the IC.
LX
5
6
BYP
9
8
CIN
CIN
GND
GND
The input capacitor must be
placed as close to the IC as
possible.
(RT7238B)
(a) For UQFN-10L 3x3 (FC) Package
LX should be connected to
inductor by wide and short trace.
Keep sensitive components away
from this trace.
The input capacitor must be
placed as close to the IC as
possible.
(RT7238D)
(c) For UQFN-10L 3x3 (FC) Package
Figure 4. PCB Layout Guide
LX
The optional compensation
Compensation components
must be connected as close to
the IC as possible.
4
10
COUT
8
GND
The output capacitor must
be placed near the IC.
3
7
LX
9
2
L
10
COUT
CBOOT
optional
VOUT
6
L
CLDO
VIN
2
CFF
GND
1
R2
EN
PGOOD
ILMT
FB
LDO
BOOT
CLDO
VOUT
R1
The voltage divider and
compensation components
must be connected as close
to the IC as possible.
GND
LX
GND
The optional compensation
Compensation components
must be connected as close to
the IC as possible.
LX should be connected to
inductor by wide and short trace.
Keep sensitive components away
from this trace.
LX should be connected to
inductor by wide and short trace.
Keep sensitive components away
from this trace.
CVCC
EN
PGOOD
NC
VOUT
NC
BOOT
CBOOT
VOUT
1
2
3
4
5
6
7
L
LDO
CLDO
10
The output capacitor must
be placed near the IC.
9
8
VIN
GND
COUT
GND
LX
CIN
GND
The input capacitor must be
placed as close to the IC as
possible.
(RT7238C/E)
(b) For UQFN-10L 3x3 (FC) Package
Copyright © 2015 Richtek Technology Corporation. All rights reserved.
www.richtek.com
22
is a registered trademark of Richtek Technology Corporation.
DS7238B/C/D/E-01 April 2015
RT7238B/C/D/E
Outline Dimension
1
5
10
Symbol
Dimensions In Millimeters
Dimensions In Inches
Min.
Max.
Min.
Max.
A
0.500
0.600
0.020
0.024
A1
0.000
0.050
0.000
0.002
A3
0.100
0.175
0.004
0.007
b
0.150
0.250
0.006
0.010
b1
0.670
0.770
0.026
0.030
b2
0.505
0.605
0.020
0.024
b3
1.680
1.780
0.066
0.070
b4
0.150
0.250
0.006
0.010
b5
0.575
0.675
0.023
0.027
D
2.950
3.050
0.116
0.120
E
2.950
3.050
0.116
0.120
e
0.450
0.018
K
0.250
0.010
K1
0.300
0.012
K2
0.250
0.010
K3
0.175
0.007
K4
0.350
0.014
K5
0.725
0.029
L
0.350
0.450
0.014
0.018
L1
1.800
1.900
0.071
0.075
L2
2.225
2.325
0.088
0.092
L3
1.050
1.150
0.041
0.045
U-Type 10L QFN 3x3 (FC) Package
Copyright © 2015 Richtek Technology Corporation. All rights reserved.
DS7238B/C/D/E-01 April 2015
is a registered trademark of Richtek Technology Corporation.
www.richtek.com
23
RT7238B/C/D/E
Richtek Technology Corporation
14F, No. 8, Tai Yuen 1st Street, Chupei City
Hsinchu, Taiwan, R.O.C.
Tel: (8863)5526789
Richtek products are sold by description only. Richtek reserves the right to change the circuitry and/or specifications without notice at any time. Customers should
obtain the latest relevant information and data sheets before placing orders and should verify that such information is current and complete. Richtek cannot
assume responsibility for use of any circuitry other than circuitry entirely embodied in a Richtek product. Information furnished by Richtek is believed to be
accurate and reliable. However, no responsibility is assumed by Richtek or its subsidiaries for its use; nor for any infringements of patents or other rights of third
parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of Richtek or its subsidiaries.
www.richtek.com
24
DS7238B/C/D/E-01 April 2015